Battery communication circuit

Abstract

The utility model provides a battery communication circuit, which belongs to the technical field of battery communication and comprises a first infrared light-sensing transceiving module, a second infrared light-sensing transceiving module, a BMS (battery management system) master control board and a BMS slave control board. The first infrared light sensing transceiver module is arranged on the BMS master control board, and the second infrared light sensing transceiver module is arranged on the BMS slave control board; the BMS master control board is in wired connection with the first infrared light-sensing transceiving module, the BMS slave control board is in wired connection with the second infrared light-sensing transceiving module, and the first infrared light-sensing transceiving module is in wireless communication connection with the second infrared light-sensing transceiving module; the BMS main control board carries out infrared light sensing wireless communication with the BMS slave control board through the first infrared light sensing transceiver module and the second infrared light sensing transceiver module, and wireless communication between the BMS main control board and the BMS slave control board is realized by adopting the first infrared light sensing transceiver module and the second infrared light sensing transceiver module, so that compared with other wireless communication modes, the cost is lower, and the communication efficiency is improved. And the loss of the battery is smaller.

Description

Technical Field

[0001] The utility model relates to the technical field of battery communication, in particular to a battery communication circuit. Background Art

[0002] The communication between the main control board and the slave control board of the Battery Management System (BMS) is mostly connected by CAN wired connection, and its communication medium is twisted pair, coaxial cable or optical fiber. In order to reduce the space occupied by the wire harness in the battery pack, wireless transmission has emerged. At present, wireless communication methods include WiFi, Bluetooth and Star Flash.

[0003] However, this type of wireless communication method is relatively expensive and requires a large amount of battery power, resulting in high battery consumption. Utility Model Content

[0004] The utility model provides a battery communication circuit, which is used to solve the defects of high battery wireless communication cost and large battery loss in the prior art.

[0005] The utility model provides a battery communication circuit, comprising: a first infrared light sensing transceiver module, a second infrared light sensing transceiver module, a BMS main control board and a BMS slave control board;

[0006] The first infrared light transceiver module is arranged on the BMS main control board, and the second infrared light transceiver module is arranged on the BMS slave control board;

[0007] The BMS main control board is connected to the first infrared light sensing transceiver module by wire, the BMS slave control board is connected to the second infrared light sensing transceiver module by wire, and the first infrared light sensing transceiver module is connected to the second infrared light sensing transceiver module by wireless communication;

[0008] The BMS main control board performs infrared light sensing wireless communication with the BMS slave control board through the first infrared light sensing transceiver module and the second infrared light sensing transceiver module.

[0009] According to a battery communication circuit provided by the utility model, the BMS slave control board includes a plurality of analog front-end chips;

[0010] The BMS main control board includes a signal conversion chip and a gateway chip;

[0011] After being connected in series, the multiple analog front-end chips are respectively connected to the signal conversion chip and the gateway chip for infrared light sensing communication, and the signal conversion chip is connected to the gateway chip for communication.

[0012] According to a battery communication circuit provided by the utility model, when each of the analog front-end chips is integrated on a corresponding PCB slave board, the analog front-end chips are connected by infrared light sensing communication.

[0013] According to a battery communication circuit provided by the utility model, the second infrared light sensing transceiver module on each PCB slave board includes: light-to-electricity TPL and electricity-to-light TPL;

[0014] The optical-to-electrical TPL is used for conversion between optical signals and electrical signals, and the electrical-to-optical TPL is used for conversion between electrical signals and optical signals.

[0015] According to a battery communication circuit provided by the utility model, when all the analog front-end chips are integrated into a PCB slave board, the analog front-end chips are connected to each other in a wired communication manner.

[0016] According to a battery communication circuit provided by the utility model, the second infrared light sensing transceiver module on the PCB slave board includes: light-to-electricity TPL, electricity-to-electricity TPL and electricity-to-light TPL;

[0017] The optical-to-electrical TPL and the electrical-to-optical TPL are used to communicate with the main control board;

[0018] The electrical-to-electrical TPL is used for internal communication within the PCB slave board.

[0019] According to a battery communication circuit provided by the utility model, when multiple analog front-end chips are integrated on multiple PCB slave boards, the analog front-end chips in the PCB slave boards are connected by wired communication, and the analog front-end chips between the PCB slave boards are connected by infrared light sensing communication.

[0020] According to a battery communication circuit provided by the utility model, the second infrared light sensing transceiver module on the PCB slave board includes: light-to-electricity TPL, electricity-to-electricity TPL and electricity-to-light TPL;

[0021] The optical-to-electrical TPL and the electrical-to-optical TPL are used to communicate with the main control board and are also used for communication between the PCB slave boards;

[0022] The electrical-to-electrical TPL is used for internal communication within the PCB slave board.

[0023] According to a battery communication circuit provided by the utility model, the gateway chip includes: an optical TPL interface and an electrical TPL interface;

[0024] The optical TPL interface is connected to the BMS slave control board via infrared light sensing communication, and the electrical TPL interface is connected to the gateway chip via wired connection.

[0025] According to a battery communication circuit provided by the utility model, the first infrared light sensing transceiver module and the second infrared light sensing transceiver module both include: a light emitting diode and a photodiode;

[0026] The light emitting diode is used to convert the electrical signal into infrared light waves, and the photodiode is used to receive and convert the infrared light waves into electrical signals.

[0027] The utility model provides a battery communication circuit, comprising: a first infrared light sensing transceiver module, a second infrared light sensing transceiver module, a BMS main control board and a BMS slave control board; the first infrared light sensing transceiver module is arranged on the BMS main control board, and the second infrared light sensing transceiver module is arranged on the BMS slave control board; the BMS main control board is connected with the first infrared light sensing transceiver module by wire, the BMS slave control board is connected with the second infrared light sensing transceiver module by wire, and the first infrared light sensing transceiver module is connected with the second infrared light sensing transceiver module by wireless communication; the BMS main control board performs infrared light sensing wireless communication with the BMS slave control board through the first infrared light sensing transceiver module and the second infrared light sensing transceiver module, and since the first infrared light sensing transceiver module and the second infrared light sensing transceiver module are adopted to realize wireless communication between the BMS main control board and the BMS slave control board, compared with other wireless communication methods, the cost is lower and the battery loss is smaller. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the present invention or the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0029] Figure 1 It is a structural schematic diagram of a battery communication circuit provided by an embodiment of the utility model;

[0030] Figure 2 It is one of the circuit diagrams for communication between the BMS slave control board and the BMS master control board provided in this embodiment;

[0031] Figure 3 This is the second circuit diagram of the communication between the BMS slave control board and the BMS master control board provided in this embodiment;

[0032] Figure 4 This is the third circuit diagram of the communication between the BMS slave control board and the BMS master control board provided in this embodiment. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the utility model clearer, the technical solution of the utility model will be described clearly and completely in conjunction with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] Figure 1 It is a structural schematic diagram of a battery communication circuit provided by an embodiment of the utility model.

[0035] like Figure 1 As shown, the battery communication circuit provided in this embodiment includes: a first infrared light sensing transceiver module 1, a second infrared light sensing transceiver module 2, a BMS main control board 3 and a BMS slave control board 4; the first infrared light sensing transceiver module 1 is arranged on the BMS main control board 3, and the second infrared light sensing transceiver module 2 is arranged on the BMS slave control board 4; the BMS main control board 3 is connected to the first infrared light sensing transceiver module 1 by wire, the BMS slave control board 4 is connected to the second infrared light sensing transceiver module 2 by wire, and the first infrared light sensing transceiver module 1 is connected to the second infrared light sensing transceiver module 2 by wireless communication; the BMS main control board 3 performs infrared light sensing wireless communication with the BMS slave control board 4 through the first infrared light sensing transceiver module 1 and the second infrared light sensing transceiver module 2.

[0036] In a specific implementation process, the first infrared light sensing transceiver module 1 and the second infrared light sensing transceiver module 2 use the same transceiver device, both of which are VCND2040SLX02 models, which integrate an 850nm infrared light emitting device and a photodiode module, and its packaging size is 4.4*2.25*1.2. The first infrared light sensing transceiver module 1 is connected to the IRTXL, IRRXL, IRRXH, IRTXH pins of the BMS main control board 3, and the second infrared light sensing transceiver module 2 is connected to the IRTXL, IRRXL, IRRXH, IRTXH pins of the BMS slave control board 4. The first infrared light sensing module is set on the BMS main control board 3 to realize wireless communication transmission between the BMS main control board 3 and the outside, and the second infrared light sensing module is set on the BMS slave control board 4 to realize wireless communication transmission between the BMS slave control board 4 and the outside. The first infrared light sensing transceiver module 1 and the second infrared light sensing transceiver module 2 are arranged correspondingly to ensure effective wireless data transmission between the first infrared light sensing transceiver module 1 and the second infrared light sensing transceiver module 2, thereby ensuring effective wireless data transmission between the BMS main control board 3 and the BMS slave control board 4. Among them, when the first infrared light sensing transceiver module 1 and the second infrared light sensing transceiver module 2 are arranged relatively, and the distance is relatively close, both can automatically realize the reception and transmission of signals. When the distance between the two is relatively large, the optical signal can be aggregated by a convex lens to ensure long-distance optical signal transmission. When the distance between the two is far and not a straight line, optical data transmission can be carried out through an optical conduit. The material of the optical conduit is polycarbonate, and the diameter covers the first infrared light sensing transceiver module and the second infrared light sensing transceiver module 2. It mainly rectifies the optical signal so that the optical signal can be transmitted under non-linear conditions, and realizes turning transmission through the reflection principle.

[0037] The working principle is that after the BMS main control board 3 sends out an electrical signal, the electrical signal is decoded and converted into an infrared light wave of specific frequency and wavelength by the first infrared light sensing transceiver module 1, and then the signal is analyzed after receiving the specific infrared light wave by the second infrared light sensing transceiver module 2, and transmitted to the BMS slave control board 4 to complete the wireless transmission of communication, and finally realize the wireless data transmission between the BMS main control board 3 and the BMS slave control board 4.

[0038] The use of infrared light sensing communication not only reduces the size of the wireless communication equipment, but also reduces the size of the board, and can eliminate the problem of loose wired plug-ins failing. It has high reliability, lower cost, and requires less power consumption.

[0039] Furthermore, based on the above embodiments, the BMS slave control board 4 in this embodiment includes multiple analog front-end chips; the BMS main control board 3 includes a signal conversion chip and a gateway chip; after the multiple analog front-end chips are connected in series, they are respectively connected to the signal conversion chip and the gateway chip for infrared light communication, and the signal conversion chip is connected to the gateway chip for communication.

[0040] Specifically, multiple battery cells are connected in series, which involves multiple analog front-end chips. Different analog front-end chips can be integrated on one PCB board or on multiple PCB boards. Similarly, each PCB slave control board will be integrated with a signal conversion unit. The BMS main control board 3 includes a signal conversion chip and a gateway chip to realize signal conversion. Ultimately, infrared light-sensing wireless communication between the BMS main control board 3 and the BMS slave control board 4 is guaranteed.

[0041] Figure 2 This is one of the circuit diagrams for communication between the BMS slave control board and the BMS master control board provided in this embodiment.

[0042] Furthermore, when each analog front-end chip is integrated into a corresponding PCB slave board, the analog front-end chips are connected by infrared light sensing communication.

[0043] Specifically, when each PCB slave uses an analog front-end chip, the analog front-end chips between each PCB slave adopt infrared light sensing communication, such as Figure 2 As shown in A. Among them, the second infrared light sensing transceiver module 2 on each PCB slave board includes: light-to-electric TPL and electric-to-light TPL; the light-to-electric TPL is used for conversion between optical signals and electric signals, and the electric-to-light TPL is used for conversion between electric signals and optical signals. A light-to-light TPL is also integrated inside the PCB slave board to complete the encoding and decoding functions of optical communication. The communication between PCB slave boards is achieved through the light-to-light TPL, and the communication between the BMS slave board and the BMS main board is achieved through the electric-to-light TPL and the light-to-electric TPL. Thereby, while ensuring the internal wireless communication between the BMS slave control boards 4, the wireless communication between the BMS slave control boards 4 and the BMS main control board 3 is also guaranteed, as shown in Figure 2 As shown in B.

[0044] Figure 3 This is the second circuit diagram of the communication between the BMS slave control board and the BMS master control board provided in this embodiment.

[0045] Furthermore, when all analog front-end chips are integrated into a PCB slave board, the analog front-end chips are connected to each other by wired communication.

[0046] Specifically, when a single PCB slave uses multiple analog front-end chips for acquisition, the analog front-end chips in the PCB slave use wired connections, such as Figure 3 As shown in C, the PCB uses infrared light sensing communication from outside the board, such as Figure 3 As shown in B.

[0047] Among them, the second infrared light sensing transceiver module 2 on the PCB slave board includes light-to-electricity TPL, electricity-to-electricity TPL and electricity-to-light TPL; the light-to-electricity TPL and electricity-to-optical TPL are used to communicate with the main control board to realize the encoding and decoding functions of optical communication between the BMS slave control board 4 and the BMS main control board 3, and the electricity-to-electricity TPL is used for internal communication of the PCB slave board.

[0048] Figure 4 This is the third circuit diagram of the communication between the BMS slave control board and the BMS master control board provided in this embodiment.

[0049] Furthermore, when multiple analog front-end chips are integrated on multiple PCB slave boards, the analog front-end chips in the PCB slave boards are connected to each other by wired communication, such as Figure 4 As shown in Figure C, the analog front-end chips between the PCB slave boards are connected using infrared light sensing communication, such as Figure 4 As shown in A.

[0050] Among them, the second infrared light sensing transceiver module 2 on the PCB slave board includes: light-to-electricity TPL, electricity-to-electricity TPL and electricity-to-light TPL; the light-to-electricity TPL and electricity-to-optical TPL are used to communicate with the main control board and also for communication between PCB slave boards; the electricity-to-electricity TPL is used for internal communication of the PCB slave board.

[0051] Figure 2 , Figure 3 and Figure 4 The three schemes are three parallel implementation methods. When the analog front-end chip is located on the same PCB slave board, the communication connection is directly carried out through wired means to simplify the process and facilitate the design of the PCB slave board. When the analog front-end chip is located on different PCB slave boards, the communication between different PCB slave boards adopts infrared light communication to reduce the space occupied by the wiring harness. Regardless of the integration method, the communication between the BMS slave control board 4 and the BMS main control board 3 is achieved through infrared light communication, which mainly includes a signal conversion chip and a gateway chip to realize the conversion of optical signals into electrical signals and transmit them to the main board. About Figure 2 Figure 3 and Figure 4 The connection relationship and working principle of other parts will not be described in detail.

[0052] The gateway chip includes: an optical TPL interface and an electrical TPL interface; the optical TPL interface is connected to the BMS slave control board 4 by infrared light sensing communication, and the electrical TPL interface is connected to the gateway chip by wire. The optical TPL interface is used to convert the signal from the BMS slave control board 4 into an electrical signal, and the electrical TPL interface is used to receive the electrical signal converted by the signal conversion chip, and finally the infrared light sensing wireless communication between the BMS slave control board 4 and the BMS main control board 3 is realized.

[0053] Furthermore, based on the above embodiments, the first infrared light sensing transceiver module 1 and the second infrared light sensing transceiver module 2 in this embodiment both include: a light emitting diode and a photodiode; the light emitting diode is used to convert electrical signals into infrared light waves, and the photodiode is used to receive and convert infrared light waves into electrical signals.

[0054] Specifically, the mutual conversion of photoelectric signals is realized through the light-emitting diode and the photodiode, and the signal transmission is completed efficiently. A resistor is connected in series in the light-emitting diode circuit, and the resistor is selected within 1k-10kΩ to limit the circuit current and protect the light-emitting diode. In order to prevent the voltage abnormality in the external circuit, a diode is added to the photodiode circuit to ensure the flow of the decoding circuit.

[0055] By adopting an easily integrated infrared light sensing transceiver module integrated on the PCB slave board, it occupies less volume space and consumes less energy, and realizes the communication connection between the BMS slave control board 4 and the BMS main control board 3 through optical signals, which ensures the stability and reliability of communication while saving costs.

[0056] like Figure 2-Figure 4 As shown, the connection relationship between the BMS main control board and the BMS slave control board through the infrared light transceiver module is divided into two parts. The second infrared light sensor module in the BMS slave control board is connected to the IRTXL, IRRXL, IRRXH, and IRTXH pins of the 1#AFE chip MC33774AO. The connection relationship between the first infrared light sensor module in the BMS main control board and the MCU is realized through the bridge IC chip MC33665AO. The first infrared light sensor module is connected to the P12 pin and P13 pin of the MC33665AO chip. At the same time, the connection relationship between the second infrared light sensor module in the lower half of the figure and the n#AFE is the same as that of the 1#AFE, while the first infrared light sensor module is connected to the P10 pin and P11 pin of the MC33665AO chip through the MC33777 chip.

[0057] The infrared connection between the AFEs between the PCB slave boards is also connected through the IRTXL, IRRXL, IRRXH, IRTXH pins. Therefore, the connection between all AFE chips and infrared light sensing modules will not be described one by one. Similarly, the connection relationship and principle of the MCU, CAN bus, SBC power IC and LDO components inside the BMS main control board will not be described in detail, and the circuit connection relationship is the same as that of the BMS main control board inside the existing vehicle.

[0058] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.

[0059] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, it can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.

[0060] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the utility model.

Claims

1. A battery communication circuit, characterized in that: include: A first infrared light transceiver module, a second infrared light transceiver module, a BMS main control board and a BMS slave control board; The first infrared light transceiver module is arranged on the BMS main control board, and the second infrared light transceiver module is arranged on the BMS slave control board; The BMS main control board is connected to the first infrared light sensing transceiver module by wire, the BMS slave control board is connected to the second infrared light sensing transceiver module by wire, and the first infrared light sensing transceiver module is connected to the second infrared light sensing transceiver module by wireless communication; The BMS main control board performs infrared light sensing wireless communication with the BMS slave control board through the first infrared light sensing transceiver module and the second infrared light sensing transceiver module.

2. The battery communication circuit according to claim 1, characterized in that: The BMS slave control board includes a plurality of analog front-end chips; The BMS main control board includes a signal conversion chip and a gateway chip; After being connected in series, the multiple analog front-end chips are respectively connected to the signal conversion chip and the gateway chip for infrared light sensing communication, and the signal conversion chip is connected to the gateway chip for communication.

3. The battery communication circuit according to claim 2, characterized in that: When each of the analog front-end chips is integrated on a corresponding PCB slave board, the analog front-end chips are connected by infrared light sensing communication.

4. The battery communication circuit according to claim 3, characterized in that: The second infrared light sensing transceiver module on each PCB slave board includes: light-to-electricity TPL and electricity-to-light TPL; The optical-to-electrical TPL is used for conversion between optical signals and electrical signals, and the electrical-to-optical TPL is used for conversion between electrical signals and optical signals.

5. The battery communication circuit according to claim 2, characterized in that: When all the analog front-end chips are integrated into a PCB slave board, the analog front-end chips are connected to each other by wired communication.

6. The battery communication circuit according to claim 5, characterized in that: The second infrared light sensing transceiver module on the PCB slave board includes: light-to-electricity TPL, electricity-to-electricity TPL and electricity-to-light TPL; The optical-to-electrical TPL and the electrical-to-optical TPL are used to communicate with the main control board; The electrical-to-electrical TPL is used for internal communication within the PCB slave board.

7. The battery communication circuit according to claim 2, characterized in that: When multiple analog front-end chips are integrated on multiple PCB slave boards, the analog front-end chips within the PCB slave boards are connected by wired communication, and the analog front-end chips between the PCB slave boards are connected by infrared light communication.

8. The battery communication circuit according to claim 7, characterized in that: The second infrared light sensing transceiver module on the PCB slave board includes: light-to-electricity TPL, electricity-to-electricity TPL and electricity-to-light TPL; The optical-to-electrical TPL and the electrical-to-optical TPL are used to communicate with the main control board and are also used for communication between the PCB slave boards; The electrical-to-electrical TPL is used for internal communication within the PCB slave board.

9. The battery communication circuit according to any one of claims 2 to 8, characterized in that: The gateway chip includes: an optical TPL interface and an electrical TPL interface; The optical TPL interface is connected to the BMS slave control board via infrared light sensing communication, and the electrical TPL interface is connected to the gateway chip via wired connection.

10. The battery communication circuit according to any one of claims 2 to 8, characterized in that: The first infrared light sensing transceiver module and the second infrared light sensing transceiver module both include: a light emitting diode and a photodiode; The light emitting diode is used to convert the electrical signal into infrared light waves, and the photodiode is used to receive and convert the infrared light waves into electrical signals.

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