Circuit board forming machine
By designing the circuit board forming machine, using automated feeding, positioning and bending mechanisms, the problems of manual bending inconsistent and long baking time are solved, and the efficiency and consistency of circuit board forming is achieved.
Patent Information
- Application Number
- CN202420587780.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-25
- Publication Date
- 2025-04-11
- Estimated Expiration
- 2034-03-25
AI Technical Summary
In the prior art, the consistency of forming cannot be guaranteed when manually bending the circuit board with fixed fixtures, and the heating, constant temperature and cooling process of the oven is long, resulting in low circuit board molding efficiency.
A circuit board forming machine is designed, including a workbench, a feeding mechanism, a positioning mechanism and a bending mechanism. Automatic molding of the circuit board is achieved through the thermally conductive carrier and driving member of the feeding mechanism, the heating assembly and driving member of the positioning mechanism, and the heating bending member of the bending mechanism.
Through automated molding, the consistency of circuit board molding is ensured, the heating time is shortened, and the efficiency of circuit board molding is improved.
Smart Images

Figure CN222750642U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of electrical component molding, in particular to a circuit board molding machine. Background Art
[0002] The circuit board is usually formed by placing the circuit board in a fixed fixture, then bending the circuit board with the fixed fixture, and finally placing the bent circuit board in a baking oven for heating and shaping. However, when the circuit board is bent manually using a fixed fixture, the consistency of the circuit board formation cannot be guaranteed, and the heating, constant temperature and cooling process of the baking oven takes a long time, resulting in low circuit board forming efficiency. Utility Model Content
[0003] In view of the above, it is necessary to provide a circuit board forming machine to improve the quality of the formed circuit board and the forming efficiency of the circuit board.
[0004] The present invention provides a circuit board forming machine, comprising:
[0005] A workbench, with a loading position and a processing position spaced apart along a first direction;
[0006] A feeding mechanism, comprising a feeding drive, a support seat and a bearing member, wherein the bearing member is movably arranged on the support seat along the first direction and a second direction perpendicular to the first direction and is used to bear the circuit board, and the bearing member is a heat-conducting member, and the feeding drive member is arranged on the workbench and connected to the support seat, and is used to drive the support seat to drive the bearing member to reciprocate between the loading position and the processing position;
[0007] A first positioning mechanism is provided at the processing position and comprises a first driving member, a first heating component and a first positioning member, wherein the first heating component is connected to the first positioning member and is used to heat the first positioning member, and the first driving member is provided at the workbench and connected to the first heating component, and is used to drive the first heating component to drive the first positioning member to abut the bearing member against the support seat along the first direction;
[0008] A second positioning mechanism is provided at the processing position and comprises a second driving member, a second heating component and a second positioning member, wherein the second heating component is connected to the second positioning member and is used to heat the second positioning member, and the second driving member is provided at the workbench and connected to the second heating component, and is used to drive the second heating component to drive the second positioning member to abut the bearing member against the support seat along the second direction;
[0009] The bending mechanism includes a bracket, a third driving member, a third heating component and a bending member, wherein the bracket is arranged on the workbench and located at the processing position, the bending member is a heat-conducting member, the third heating component is connected to the bending member and is used to heat the bending member, and the third driving member is arranged on the bracket and connected to the third heating component and is used to drive the third heating component to drive the bending member to press the circuit board to the second positioning member along a third direction perpendicular to the first direction and the second direction to form the circuit board.
[0010] In the above-mentioned circuit board forming machine, the first positioning member can hold the circuit board against the carrier along the first direction, the second positioning member can hold the circuit board against the carrier along the second direction, and the first positioning member and the second positioning member cooperate with the bending member to form a relatively fixed forming position, which can ensure the consistency of the formed circuit board, thereby improving the quality of the formed circuit board. In addition, the first heating component can heat the first positioning member, the second heating component can heat the second positioning member, and the third heating component can heat the bending member, so that the first positioning member, the second positioning member and the bending member can heat the circuit board from three different directions at the same time to form the circuit board, shortening the heating time, thereby improving the forming efficiency of the circuit board.
[0011] In some embodiments, the workbench is provided with a feed guide rail extending along the first direction, the support seat includes a sliding frame and a support member, the sliding frame is slidably provided on the feed guide rail along the first direction and is connected to the feed drive member, the support member is provided on the sliding frame and is provided with a support groove, and the supporting member is movably provided in the support groove along the first direction and the second direction respectively.
[0012] Therefore, the sliding frame is slidably connected to the feed guide rail, which can improve the stability of the support seat relative to the workbench. In addition, the support groove on the support member is conducive to improving the efficiency of placing the circuit board.
[0013] In some embodiments, the support member includes a support body, a stop body and an elastic body, the support groove is opened in the support body, the stop body is slidably disposed in the support groove along the second direction, and is abutted against the supporting member along the second direction, the elastomer is received in the support groove, and the two ends of the elastomer are respectively abutted against the stop body and the side walls of the support groove.
[0014] Therefore, the elastic body can form an elastic buffer for the supporting member in the second direction, thereby reducing damage to the circuit board during the bending process.
[0015] In some embodiments, the workbench is provided with a first positioning rail extending along the first direction. The first heating assembly includes a first heat insulating member, a first heat conducting member and a first heating member, the first heat insulating member is slidably provided on the first positioning rail along the first direction and connected to the first driving member, the first heat conducting member is respectively connected to the first heat insulating member and the first positioning member, and the first heating member is embedded in the first heat conducting member to heat the first heat conducting member.
[0016] Therefore, the first heat insulating member is slidably connected to the first positioning rail, which can improve the stability of the first heating component relative to the workbench, and the first heat insulating member can reduce the damage to the first driving member caused by the heat generated by the first heating member. In addition, the embedded structure of the first heating member and the first heat conducting member can improve the heating uniformity and heating efficiency of the first heat conducting member.
[0017] In some embodiments, the workbench is provided with a second positioning rail extending along the second direction. The second heating assembly includes a second heat insulating member, a second heat conducting member and a second heating member, the second heat insulating member is slidably arranged on the second positioning rail along the second direction and connected to the second driving member, the second heat conducting member is respectively connected to the second heat insulating member and the second positioning member, and the second heating member is embedded in the second heat conducting member to heat the second heat conducting member.
[0018] Therefore, the second heat insulating member is slidably connected to the second positioning rail, which can improve the stability of the second heating component moving relative to the workbench, and the second heat insulating member can reduce the damage to the second driving member caused by the heat generated by the second heating member. In addition, the embedded structure of the second heating member and the second heat conducting member can improve the heating uniformity and heating efficiency of the second heat conducting member.
[0019] In some embodiments, the third heating component includes a third heat insulating member, a third heat conductive member and a third heating member. The third heat insulating member is slidably disposed on the bracket along the third direction and connected to the third driving member. The third heat conductive member is respectively connected to the third heat insulating member and the bending member. The third heating member is embedded in the third heat conductive member to heat the third heat conductive member.
[0020] Therefore, the third heat insulating member is slidably connected to the bracket, which can improve the stability of the third heating component relative to the bracket, and the third heat insulating member can reduce the damage to the third driving member caused by the heat generated by the third heating member. In addition, the embedded structure of the third heating member and the third heat conducting member can improve the heating uniformity and heating efficiency of the third heat conducting member.
[0021] In some embodiments, the second positioning member is provided with a positioning slope on one side in the second direction, and the bending member is provided with a bending slope on one side in the second direction, and the bending slope is adapted to the positioning slope. Driven by the bending member, the bending slope presses the circuit board to the positioning slope to bend the circuit board.
[0022] Therefore, the efficiency of bending the circuit board can be improved by adapting the positioning bevel and the bending bevel.
[0023] In some embodiments, the circuit board forming machine further includes:
[0024] A flattening mechanism is arranged between the workbench and the third heating component, and the flattening mechanism includes a linkage part, a pressure part and a flattening driving part. The pressure part is connected to the linkage part, and the linkage part is slidably connected to the bracket along the second direction. The flattening driving part is arranged on the bracket and connected to the linkage part, and is used to drive the linkage part to drive the pressure part to flatten the circuit board along the second direction before the bending part presses the circuit board.
[0025] Therefore, the flattening mechanism can adjust the placement flatness of the circuit board in the second direction before the bending member presses the circuit board, which is beneficial to improving the accuracy of bending the circuit board.
[0026] In some embodiments, there are multiple carriers, multiple first positioning members, multiple second positioning members and multiple bending members, each of which is used to support one circuit board, and multiple carriers, multiple first positioning members, multiple second positioning members and multiple bending members correspond one to one.
[0027] Therefore, the plurality of the carriers, the plurality of the first positioning members, the plurality of the second positioning members and the plurality of the bending members correspond one to one, so that the circuit board forming machine can form a plurality of circuit boards at the same time, thereby improving the forming efficiency of the circuit boards.
[0028] In some embodiments, the circuit board forming machine further includes:
[0029] A protective cover is arranged on the workbench and is provided with a storage cavity, a side of the storage cavity facing the material loading position is provided with a feeding window, and the first positioning mechanism, the second positioning mechanism and the bending mechanism are all stored in the storage cavity;
[0030] A safety grating is connected to the protective cover and is arranged at one side of the feeding window, and is used to detect whether there is an object in the feeding window.
[0031] Therefore, the protective cover can prevent external components from colliding with the first positioning mechanism, the second positioning mechanism and the bending mechanism, which is beneficial to improving the service life of the circuit board forming machine. In addition, when the safety grating detects an object at the feeding window, it can trigger the relevant components in the circuit board forming machine to stop the circuit board forming machine, thereby improving the operating safety of the circuit board forming machine. BRIEF DESCRIPTION OF THE DRAWINGS
[0032] Figure 1 It is a schematic structural diagram of a circuit board and a carrier applicable to an embodiment of the utility model.
[0033] Figure 2 It is a structural schematic diagram of a circuit board forming machine according to an embodiment of the utility model.
[0034] Figure 3 for Figure 2 The schematic diagram of the structure of part of the circuit board forming machine and the circuit board is shown.
[0035] Figure 4 for Figure 3 The enlarged schematic diagram of the circuit board forming machine and the circuit board at point A is shown.
[0036] Figure 5 for Figure 3 The schematic diagram of the exploded view of the feeding guide and feeding mechanism in the circuit board forming machine shown.
[0037] Figure 6 for Figure 5 An enlarged schematic diagram of the feeding mechanism at B is shown.
[0038] Figure 7 for Figure 3 The schematic diagram of the structure of the first positioning rail and the first positioning mechanism in the circuit board forming machine is shown.
[0039] Figure 8 for Figure 3 The schematic diagram of the structure of the second positioning rail and the second positioning mechanism in the circuit board forming machine is shown.
[0040] Fig. 9 for Figure 3 The schematic diagram of the structure of the bending mechanism and the flattening mechanism in the circuit board forming machine is shown.
[0041] Main component symbols
[0042] Circuit board forming machine 100
[0043] Workbench 110
[0044] Loading position 110a
[0045] Processing position 110b
[0046] Feeding rail 111
[0047] The first positioning rail 112
[0048] The second positioning rail 113
[0049] Feeding mechanism 120
[0050] Feed drive 121
[0051] Support seat 122
[0052] Sliding rack 1221
[0053] Support 1222
[0054] Support groove 1222a
[0055] Support body 1222b
[0056] Stopper 1222c
[0057] Elastomer 1222d
[0058] Carrier 123
[0059] The first positioning mechanism 130
[0060] The first driving member 131
[0061] The first heating element 132
[0062] The first heat insulation member 1321
[0063] The first heat conducting member 1322
[0064] The first heating element 1323
[0065] First positioning member 133
[0066] The second positioning mechanism 140
[0067] The second driving member 141
[0068] The second heating assembly 142
[0069] Second thermal insulation member 1421
[0070] The second heat conducting member 1422
[0071] The second heating element 1423
[0072] Second positioning member 143
[0073] Positioning slope 143a
[0074] Bending mechanism 150
[0075] Bracket 151
[0076] The third driving member 152
[0077] The third heating component 153
[0078] The third thermal insulation member 1531
[0079] The third heat conducting member 1532
[0080] The third heating element 1533
[0081] Bending parts 154
[0082] Bending slope 154a
[0083] Flattening mechanism 160
[0084] Linkage 161
[0085] Pressing member 162
[0086] Flattening drive 163
[0087] Protective cover 170
[0088] Storage chamber 170a
[0089] Feeding window 170b
[0090] Safety light curtain 180
[0091] Circuit board 200 DETAILED DESCRIPTION
[0092] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.
[0093] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the term "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0094] The following describes in detail various embodiments of the present invention in conjunction with the accompanying drawings.
[0095] See also Figure 1 , Figure 1 1 is a schematic diagram of the structure of the carrier and the circuit board applicable to the embodiment of the utility model. Specifically, one end of the circuit board 200 is fixed in the carrier 123, and the other end of the circuit board 200 extends out of the carrier 123. The circuit board 200 can be a flexible circuit board, and the carrier 123 can be an open-close structure, so as to fix one end of the circuit board 200.
[0096] For ease of description, Figures 2 to 9 A three-dimensional coordinate system is added to the . Specifically, the X-axis direction is the first direction, the Y-axis direction is the second direction, and the Z-axis direction is the third direction. The X-axis direction, the Y-axis direction, and the Z-axis direction are perpendicular to each other.
[0097] See also Figure 2 and Figure 3 The embodiment of the utility model provides a circuit board forming machine 100 for bending and heating a circuit board 200 to form the circuit board 200. The circuit board forming machine 100 includes a workbench 110, a feeding mechanism 120, a first positioning mechanism 130, a second positioning mechanism 140 and a bending mechanism 150.
[0098] Please also see Figures 4 to 7The workbench 110 is provided with a loading position 110a and a processing position 110b at intervals along the X-axis direction. The feeding mechanism 120 includes a feeding driving member 121, a supporting seat 122 and a bearing member 123. The bearing member 123 is movably provided on the supporting seat 122 along the X-axis direction and the Y-axis direction and is used to carry the circuit board 200. The bearing member 123 is a heat-conducting member. The feeding driving member 121 is provided on the workbench 110 and connected to the supporting seat 122, and is used to drive the supporting seat 122 to drive the bearing member 123 to reciprocate between the loading position 110a and the processing position 110b. The first positioning mechanism 130 is disposed at the processing position 110b and includes a first driving member 131, a first heating component 132 and a first positioning member 133. The first heating component 132 is connected to the first positioning member 133 and is used to heat the first positioning member 133. The first driving member 131 is disposed at the workbench 110 and is connected to the first heating component 132. It is used to drive the first heating component 132 to drive the first positioning member 133 to abut the carrier 123 along the X-axis direction to the support seat 122. The second positioning mechanism 140 is disposed at the processing position 110b and includes a second driving member 141, a second heating component 142 and a second positioning member 143. The second heating component 142 is connected to the second positioning member 143 and is used to heat the second positioning member 143. The second driving member 141 is disposed at the workbench 110 and is connected to the second heating component 142. It is used to drive the second heating component 142 to drive the second positioning member 143 to abut the carrier 123 along the Y-axis direction to the support seat 122. The bending mechanism 150 includes a bracket 151, a third driving member 152, a third heating component 153 and a bending member 154. The bracket 151 is arranged on the workbench 110 and is located at the processing position 110b. The bending member 154 is a heat-conducting component. The third heating component 153 is connected to the bending member 154 and is used to heat the bending member 154. The third driving member 152 is arranged on the bracket 151 and is connected to the third heating component 153, and is used to drive the third heating component 153 to drive the bending member 154 to press the circuit board 200 to the second positioning member 143 along the Z-axis direction to form the circuit board 200.
[0099] In this embodiment, the feeding drive 121, the first drive 131, the second drive 141 and the third drive 152 can all be transmission components composed of rollers, conveyor belts and servo motors, and the number of corresponding rollers, conveyor belts and servo motors can be set based on the layout and needs, and are not limited here. In some other embodiments, the aforementioned drive components can also be other drive combinations, such as chain transmission, etc. This application does not specifically limit the selection of each drive component, and it can be flexibly selected according to actual conditions during implementation.
[0100] In the above-mentioned circuit board forming machine 100, the first positioning member 133 can press the fixed body 210 of the circuit board 200 to the carrier 123 along the X-axis direction, and the second positioning member 143 can press the fixed body 210 of the circuit board 200 to the carrier 123 along the Y-axis direction. The first positioning member 133 and the second positioning member 143 cooperate with the bending member 154 to form a relatively fixed forming position, which can ensure the consistency of the formed circuit board 200, thereby improving the quality of the formed circuit board 200. In addition, the first heating component 132 can heat the first positioning member 133, the second heating component 142 can heat the second positioning member 143, and the third heating component 153 can heat the bending member 154, so that the first positioning member 133, the second positioning member 143 and the bending member 154 can heat the circuit board 200 from three different directions at the same time to form the circuit board 200, shortening the heating time, thereby improving the forming efficiency of the circuit board 200.
[0101] See also Figure 3 and Figure 5 In some embodiments, a feed guide rail 111 extending along the X-axis direction is provided on the workbench 110, and the support seat 122 includes a sliding frame 1221 and a support member 1222. The sliding frame 1221 is slidably provided on the feed guide rail 111 along the X-axis direction and is connected to the feed driving member 121. The support member 1222 is provided on the sliding frame 1221 and is provided with a support groove 1222a. The bearing member 123 is movably provided in the support groove 1222a along the X-axis direction and the Y-axis direction respectively.
[0102] In this embodiment, there may be three feeding guide rails 111, which are spaced apart along the Y-axis direction, and the sliding frame 1221 is slidably connected to the three feeding guide rails 111 respectively along the X-axis direction. In some other embodiments, the number of feeding guide rails 111 may also be 2 or 4 or more, which may be flexibly set according to actual conditions, and the present application does not impose any specific restrictions on the number of feeding guide rails 111.
[0103] Therefore, the sliding frame 1221 is slidably connected to the feeding guide rail 111, which can improve the stability of the support seat 122 moving relative to the workbench 110. In addition, the supporting groove 1222a on the supporting member 1222 is conducive to improving the efficiency of placing the circuit board 200.
[0104] See also Figure 5 and Figure 6In some embodiments, the support member 1222 includes a support body 1222b, a stopper 1222c and an elastic body 1222d. The support groove 1222a is provided in the support body 1222b, the stopper 1222c is slidably disposed in the support groove 1222a along the Y-axis direction, and is abutted against the carrier 123 along the Y-axis direction, the elastic body 1222d is received in the support groove 1222a, and the two ends of the elastic body 1222d are respectively abutted against the stopper 1222c and the side wall of the support groove 1222a. In this embodiment, the elastic body 1222d can be a spring. In some other embodiments, the elastic body 1222d can also be a component with good elasticity such as a shrapnel or a silicone body, which can be flexibly set according to actual conditions.
[0105] Therefore, the elastic body 1222d can form an elastic buffer for the carrier 123 in the Y-axis direction, thereby reducing the damage to the circuit board 200 during the bending process.
[0106] See also Figure 3 and Figure 7 In some embodiments, a first positioning rail 112 extending along the X-axis direction is provided on the workbench 110. The first heating assembly 132 includes a first heat insulating member 1321, a first heat conducting member 1322 and a first heating member 1323. The first heat insulating member 1321 is slidably provided on the first positioning rail 112 along the X-axis direction and connected to the first driving member 131. The first heat conducting member 1322 is respectively connected to the first heat insulating member 1321 and the first positioning member 133. The first heating member 1323 is embedded in the first heat conducting member 1322 to heat the first heat conducting member 1322. In this embodiment, the first heating member 1323 is a combination of a heating rod and a thermocouple. The first heat conducting member 1322 heats up under the heating action of the first heating member 1323 and transfers heat to the first positioning member 133, and the temperature of the first positioning member 133 is not higher than 120°C.
[0107] Therefore, the first heat insulating member 1321 is slidably connected to the first positioning rail 112, which can improve the stability of the movement of the first heating component 132 relative to the workbench 110, and the first heat insulating member 1321 can reduce the damage to the first driving member 131 caused by the heat generated by the first heating member 1323. In addition, the embedded structure of the first heating member 1323 and the first heat conducting member 1322 can improve the heating uniformity and heating efficiency of the first heat conducting member 1322.
[0108] See also Figure 3 and Figure 8In some embodiments, a second positioning rail 113 extending along the Y-axis direction is provided on the workbench 110. The second heating assembly 142 includes a second heat insulating member 1421, a second heat conducting member 1422 and a second heating member 1423. The second heat insulating member 1421 is slidably provided on the second positioning rail 113 along the Y-axis direction and connected to the second driving member 141. The second heat conducting member 1422 is respectively connected to the second heat insulating member 1421 and the second positioning member 143. The second heating member 1423 is embedded in the second heat conducting member 1422 to heat the second heat conducting member 1422. In this embodiment, the second heating member 1423 is a combination of a heating rod and a thermocouple. The second heat conducting member 1422 heats up under the heating action of the second heating member 1423 and transfers heat to the second positioning member 143, and the temperature of the second positioning member 143 is not higher than 120°C.
[0109] Therefore, the second heat insulating member 1421 is slidably connected to the second positioning rail 113, which can improve the stability of the second heating component 142 relative to the workbench 110, and the second heat insulating member 1421 can reduce the damage to the second driving member 141 caused by the heat generated by the second heating member 1423. In addition, the embedded structure of the second heating member 1423 and the second heat conducting member 1422 can improve the heating uniformity and heating efficiency of the second heat conducting member 1422.
[0110] See also Figure 3 and Fig. 9 In some embodiments, the third heating assembly 153 includes a third heat insulating member 1531, a third heat conducting member 1532 and a third heating member 1533. The third heat insulating member 1531 is slidably disposed on the bracket 151 along the Z-axis direction and connected to the third driving member 152. The third heat conducting member 1532 is respectively connected to the third heat insulating member 1531 and the bending member 154. The third heating member 1533 is embedded in the third heat conducting member 1532 to heat the third heat conducting member 1532. In this embodiment, the third heating member 1533 is a combination of a heating rod and a thermocouple. The third heat conducting member 1532 heats up under the heating action of the third heating member 1533 and transfers heat to the bending member 154, and the temperature of the bending member 154 is not higher than 150°C.
[0111] Therefore, the third heat insulating member 1531 is slidably connected to the bracket 151, which can improve the stability of the movement of the third heating component 153 relative to the bracket 151, and the third heat insulating member 1531 can reduce the damage of the heat generated by the third heating member 1533 to the third driving member 152. In addition, the embedded structure of the third heating member 1533 and the third heat conducting member 1532 can improve the heating uniformity and heating efficiency of the third heat conducting member 1532.
[0112] See also Figure 8 and Fig. 9In some embodiments, a positioning slope 143a is provided on one side of the second positioning member 143 in the Y-axis direction, and a bending slope 154a is provided on one side of the bending member 154 in the Y-axis direction. The bending slope 154a is adapted to the positioning slope 143a. Driven by the bending member 154, the bending slope 154a presses the circuit board 200 to the positioning slope 143a to bend the circuit board 200.
[0113] Therefore, the efficiency of bending the circuit board 200 can be improved by adapting the positioning inclined surface 143 a and the bending inclined surface 154 a.
[0114] See also Figure 3 and Fig. 9 In some embodiments, the circuit board forming machine 100 further includes a flattening mechanism 160. The flattening mechanism 160 is disposed between the workbench 110 and the third heating assembly 153. The flattening mechanism 160 includes a linkage member 161, a pressing member 162, and a flattening driving member 163. The pressing member 162 is connected to the linkage member 161. The linkage member 161 is slidably connected to the bracket 151 along the Y-axis direction. The flattening driving member 163 is disposed on the bracket 151 and connected to the linkage member 161. The flattening driving member 163 is used to drive the linkage member 161 to drive the pressing member 162 to flatten the circuit board 200 along the Y-axis direction before the bending member 154 presses the circuit board 200.
[0115] Therefore, the flattening mechanism 160 can adjust the placement flatness of the circuit board 200 in the Y-axis direction before the bending member 154 presses the circuit board 200 , which is helpful to improve the bending accuracy of the circuit board 200 .
[0116] In some embodiments, there are multiple carriers 123, first positioning members 133, second positioning members 143 and bending members 154, each carrier 123 is used to support a circuit board 200, and multiple carriers 123, multiple first positioning members 133, multiple second positioning members 143 and multiple bending members 154 correspond to each other. Correspondingly, there are multiple supporting grooves 1222a, each supporting groove 1222a receives a carrier 123 and is provided with an elastic body 1222d, there are multiple pressing members 162, multiple pressing members 162 are arranged at intervals along the Y-axis direction, and each pressing member 162 can flatten two circuit boards 200 at the same time.
[0117] Therefore, the multiple carriers 123 , the multiple first positioning members 133 , the multiple second positioning members 143 and the multiple bending members 154 are all in one-to-one correspondence, so that the circuit board forming machine 100 can form multiple circuit boards 200 at the same time, thereby improving the forming efficiency of the circuit boards 200 .
[0118] See also Figure 2In some embodiments, the circuit board forming machine 100 further includes a protective cover 170 and a safety grating 180. The protective cover 170 is disposed on the workbench 110 and is provided with a storage cavity 170a. A feeding window 170b is provided on the side of the storage cavity 170a facing the material loading position 110a. The first positioning mechanism 130, the second positioning mechanism 140 and the bending mechanism 150 are all stored in the storage cavity 170a. The safety grating 180 is connected to the protective cover 170 and is disposed on one side of the feeding window 170b, and is used to detect whether there is an object in the feeding window 170b.
[0119] Therefore, the protective cover 170 can prevent external components from colliding with the first positioning mechanism 130, the second positioning mechanism 140 and the bending mechanism 150, which is beneficial to improving the service life of the circuit board forming machine 100. In addition, when the safety grating 180 detects an object at the feeding window 170b, it can trigger the relevant components in the circuit board forming machine 100 to stop the circuit board forming machine 100, thereby improving the operating safety of the circuit board forming machine 100.
[0120] Here, taking a single carrier 123 and a single circuit board 200 as an example, the working process of the circuit board forming machine 100 is roughly as follows:
[0121] First, the carrier 123 carrying the circuit board 200 is placed in the support groove 1222a of the feeding mechanism 120 at the loading position 111a, and the feeding drive 121 drives the sliding frame 1221 to drive the support 1222 to move from the loading position 111a to the processing position 111b;
[0122] Secondly, the first driving member 131 drives the first heating component 132 to drive the first positioning member 133 to move along the X-axis, so that the first positioning member 133 abuts the carrier 123 along the X-axis direction to the side wall of the supporting groove 1222a, and the second driving member 141 drives the second heating component 142 to drive the second positioning member 143 to move along the Y-axis, so that the second positioning member 143 abuts the carrier 123 along the Y-axis direction to the side wall of the supporting groove 1222a;
[0123] Then, the flattening driving member 163 drives the linkage member 161 to drive the pressing member 162 to flatten the circuit board 200 along the Y-axis direction;
[0124] Subsequently, the third driving member 152 drives the third heating assembly 153 to drive the bending member 154 to move along the Z-axis direction, so that the bending slope 154a of the bending member 154 presses the circuit board 200 onto the positioning slope 143a of the second positioning member 143;
[0125] Finally, the first heating element 1323 heats the first heat conductive element 1322 to heat the first positioning element 133 to a preset temperature, and transfers the temperature to the circuit board 200 through the carrier 123. The second heating element 1423 heats the second heat conductive element 1422 to heat the second positioning element 143 to a preset temperature, and transfers the temperature to the circuit board 200 through the carrier 123. The third heating element 1533 heats the third heat conductive element 1532 to heat the bending element 154 to a preset temperature. The bent circuit board 200 is heated in the X-axis direction, the Y-axis direction and the Z-axis direction respectively until the bent circuit board 200 is formed.
[0126] It should be noted that the heating process of the first positioning member 133 and the second positioning member 143 can be performed before they contact the carrier 123 , and the heating process of the bending member 154 can be completed before they contact the circuit board 200 .
[0127] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention.
[0128] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model is described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the spirit and scope of the technical solution of the utility model.
Claims
1. A circuit board forming machine, characterized in that: include: A workbench, with a loading position and a processing position spaced apart along a first direction; A feeding mechanism, comprising a feeding drive, a support seat and a bearing member, wherein the bearing member is movably arranged on the support seat along the first direction and a second direction perpendicular to the first direction and is used to bear the circuit board, and the bearing member is a heat-conducting member, and the feeding drive member is arranged on the workbench and connected to the support seat, and is used to drive the support seat to drive the bearing member to reciprocate between the loading position and the processing position; A first positioning mechanism is provided at the processing position and comprises a first driving member, a first heating component and a first positioning member, wherein the first heating component is connected to the first positioning member and is used to heat the first positioning member, and the first driving member is provided at the workbench and connected to the first heating component, and is used to drive the first heating component to drive the first positioning member to abut the bearing member against the support seat along the first direction; A second positioning mechanism is provided at the processing position and comprises a second driving member, a second heating component and a second positioning member, wherein the second heating component is connected to the second positioning member and is used to heat the second positioning member, and the second driving member is provided at the workbench and connected to the second heating component, and is used to drive the second heating component to drive the second positioning member to abut the bearing member to the support seat along the second direction; The bending mechanism includes a bracket, a third driving member, a third heating component and a bending member, wherein the bracket is arranged on the workbench and located at the processing position, the bending member is a heat-conducting member, the third heating component is connected to the bending member and is used to heat the bending member, and the third driving member is arranged on the bracket and connected to the third heating component and is used to drive the third heating component to drive the bending member to press the circuit board to the second positioning member along a third direction perpendicular to the first direction and the second direction to form the circuit board.
2. The circuit board forming machine according to claim 1, characterized in that: The workbench is provided with a feeding guide rail extending along the first direction, the supporting seat includes a sliding frame and a supporting member, the sliding frame is slidably provided on the feeding guide rail along the first direction and is connected to the feeding driving member, the supporting member is provided on the sliding frame and is provided with a supporting groove, and the bearing member is movably provided in the supporting groove along the first direction and the second direction respectively.
3. The circuit board forming machine according to claim 2, characterized in that: The support member includes a support body, a stop body and an elastic body. The support groove is opened in the support body. The stop body is slidably arranged in the support groove along the second direction and abuts against the supporting member along the second direction. The elastic body is received in the support groove, and the two ends of the elastic body abut against the stop body and the side walls of the support groove respectively.
4. The circuit board forming machine according to claim 1, characterized in that: The workbench is provided with a first positioning guide rail extending along the first direction; The first heating component includes a first heat insulating member, a first heat conductive member and a first heating member. The first heat insulating member is slidably disposed on the first positioning guide rail along the first direction and is connected to the first driving member. The first heat conductive member is respectively connected to the first heat insulating member and the first positioning member. The first heating member is embedded in the first heat conductive member to heat the first heat conductive member.
5. The circuit board forming machine according to claim 1, characterized in that: The workbench is provided with a second positioning guide rail extending along the second direction; The second heating component includes a second thermal insulation member, a second heat conductive member and a second heating member. The second thermal insulation member is slidably disposed on the second positioning guide rail along the second direction and is connected to the second driving member. The second heat conductive member is respectively connected to the second thermal insulation member and the second positioning member. The second heating member is embedded in the second heat conductive member to heat the second heat conductive member.
6. The circuit board forming machine according to claim 1, characterized in that: The third heating component includes a third heat insulating member, a third heat conductive member and a third heating member. The third heat insulating member is slidably disposed on the bracket along the third direction and is connected to the third driving member. The third heat conductive member is respectively connected to the third heat insulating member and the bending member. The third heating member is embedded in the third heat conductive member to heat the third heat conductive member.
7. The circuit board forming machine according to claim 1, characterized in that: The second positioning member is provided with a positioning inclined surface on one side in the second direction, and the bending member is provided with a bending inclined surface on one side in the second direction. The bending inclined surface is adapted to the positioning inclined surface, and the bending inclined surface presses the circuit board to the positioning inclined surface under the drive of the bending member to bend the circuit board.
8. The circuit board forming machine according to claim 1, characterized in that: The circuit board forming machine also includes: A flattening mechanism is arranged between the workbench and the third heating component, and the flattening mechanism includes a linkage part, a pressure part and a flattening driving part. The pressure part is connected to the linkage part, and the linkage part is slidably connected to the bracket along the second direction. The flattening driving part is arranged on the bracket and connected to the linkage part, and is used to drive the linkage part to drive the pressure part to flatten the circuit board along the second direction before the bending part presses the circuit board.
9. The circuit board forming machine according to claim 1, characterized in that: There are multiple carriers, multiple first positioning members, multiple second positioning members and multiple bending members, each of which is used to support one circuit board, and multiple carriers, multiple first positioning members, multiple second positioning members and multiple bending members correspond to each other one by one.
10. The circuit board forming machine according to claim 1, characterized in that: The circuit board forming machine also includes: A protective cover is arranged on the workbench and is provided with a storage cavity, a side of the storage cavity facing the material loading position is provided with a feeding window, and the first positioning mechanism, the second positioning mechanism and the bending mechanism are all stored in the storage cavity; A safety grating is connected to the protective cover and is arranged at one side of the feeding window, and is used to detect whether there is an object in the feeding window.