Semiconductor high-temperature-resistant dustproof precision mold

Abstract

The utility model discloses a semiconductor high-temperature-resistant dustproof precision mold, which relates to the field of semiconductor molds and comprises a main body, a cavity is arranged in the main body, two air curtain machines are fixedly mounted at the top of the inner wall of the cavity, and the two air curtain machines are symmetrically distributed on the center line of the cavity. The air curtain machine, the air return pipe and the filter assembly are arranged, the air curtain machine forms an air curtain at the position where the cavity is in contact with the outside, external air is prevented from entering the cavity, the air in the cavity enters the cooling assembly through the air return pipe, the air in the cavity is reused, and the cooling effect is improved. The filtering assembly conducts drying and impurity removal treatment on the gas entering the equipment, so that the gas in the cavity does not contain water and impurities, the air curtain machine, the air return pipe and the filtering assembly are matched with one another, the impurity removal effect of the equipment is improved, and after the equipment is used for a long time, the gas in the cavity still does not contain water and impurities.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor molds, in particular to a semiconductor high temperature resistant and dustproof precision mold. Background Art

[0002] Semiconductors are materials with electrical conductivity between insulators and conductors. Their electrical conductivity is easily controlled and can be used as a component material for information processing. Semiconductors are very important from the perspective of science and technology or economic development. The core units of many electronic products, such as computers, mobile phones, and digital recorders, use the changes in the electrical conductivity of semiconductors to process information.

[0003] For example, a semiconductor high temperature resistant dustproof precision mold disclosed in Chinese patent (CN213454463U) includes a heat dissipation and dustproof cavity, an upper mold, a lower mold, a lower mold placement groove, a water-cooled heat dissipation component and a heat dissipation fan, wherein the upper mold is arranged at the top of the heat dissipation and dustproof cavity, the lower mold placement groove is arranged in the heat dissipation and dustproof cavity, the lower mold is arranged in the lower mold placement groove, the water-cooled heat dissipation component is arranged in the heat dissipation and dustproof cavity and connected to the lower mold placement groove, and the heat dissipation fan is arranged on the side wall of the heat dissipation and dustproof cavity. The utility model belongs to the field of semiconductor molds, and specifically is a semiconductor high temperature resistant and dustproof precision mold that can dissipate heat in time after the die pressing operation is completed by setting a water-cooled heat dissipation component, and improves the heat dissipation efficiency by a heat dissipation fan, and the setting of a magnetic heat dissipation plate can avoid the entry of dust, and is easy to clean.

[0004] In the above patent, a dustproof net is used to prevent dust from entering the equipment. In terms of dustproof effect, the dustproof net can only remove some impurities with larger particles, and cannot completely remove moisture and impurities in the gas entering the equipment. When the equipment is working, moisture may condense into water droplets and stay in the equipment for a long time. At the same time, impurities may float into the semiconductor under the action of the cooling fan, causing the semiconductor to be contaminated. When maintaining the equipment, the equipment needs to be shut down, and the workers will then remove the dust from the dustproof net. Maintenance cannot be performed without shutting down the equipment. Utility Model Content

[0005] In order to solve the above technical problems, a semiconductor high temperature resistant and dustproof precision mold is provided to solve the above-mentioned problems of poor impurity removal effect and inability to perform maintenance without stopping the machine.

[0006] In order to achieve the above purpose, the technical solution adopted by the utility model is:

[0007] A semiconductor high temperature resistant dustproof precision mold, comprising a main body, a chamber is opened inside the main body, two air curtains are fixedly installed on the top of the inner wall of the chamber, the two air curtains are symmetrically distributed about the center line of the chamber, a telescopic rod is fixedly installed at the center of the top of the inner wall of the chamber, a fixed plate is fixedly installed at the lower end of the telescopic rod, at least two guide rods are fixedly installed on the bottom surface of the fixed plate, at least two guide rods are symmetrically distributed about the center line of the fixed plate, an upper template is provided below the fixed plate, the upper template is slidably connected to the two guide rods, a fixed rod is fixedly installed at the bottom center of the inner wall of the chamber, a lower template corresponding to the upper template is fixedly installed on the upper end of the fixed rod, a cooling mechanism is fixedly installed at the bottom of the inner wall of the chamber, an air intake assembly is provided inside the chamber, and the cooling mechanism is connected to the lower template through the air intake assembly, a return air pipe is fixedly installed on the outside of the main body, a supercharger is provided inside the return air pipe, an air intake pipe is fixedly installed on the upper surface of the supercharger corresponding to the return air pipe, and a filter assembly is provided inside the air intake pipe.

[0008] Preferably, the cooling mechanism includes a first main board, a connecting groove is opened inside the first main board, and a plurality of first cooling plates and a plurality of second cooling plates are fixedly installed on the inner wall of the connecting groove, and the plurality of first cooling plates and the plurality of second cooling plates are spaced apart along the length direction of the connecting groove.

[0009] Preferably, the air intake assembly includes an air outlet pipe, one end of the air outlet pipe is connected to the connecting groove, the other end of the air outlet pipe is connected to a pipe elbow, the end of the elbow away from the air outlet pipe is connected to the air supply pipe, the other end of the air supply pipe is connected to a connecting pipe, and the end of the connecting pipe away from the air supply pipe is connected to the lower template.

[0010] Preferably, a buffer groove is opened inside the lower template, and a plurality of through grooves and a plurality of grooves are opened inside the lower template corresponding to the buffer groove, and the plurality of through grooves and the plurality of grooves are connected to each other in sequence. The buffer groove is connected to the groove on the left side of the lower template, and an air outlet groove is opened at the bottom of the inner wall of the groove on the right side of the lower template.

[0011] Preferably, the filter assembly includes a second main board, a filter bin is provided inside the second main board, a plurality of slide grooves are provided on the inner wall of the filter bin, the plurality of slide grooves are linearly distributed along the length direction of the filter bin, filter plates are provided inside the plurality of slide grooves, hanging ears are fixedly installed on the upper surfaces of the plurality of filter plates, and a sealing ring is fixedly installed on the inner wall of the filter bin corresponding to the filter plate.

[0012] Preferably, the air return pipe passes through the main body and the first main board and is connected to the connecting groove.

[0013] Preferably, springs are sleeved on the outer surfaces of the two guide rods, and two ends of the springs are fixedly connected to the bottom surface of the fixed plate and the upper surface of the upper template respectively.

[0014] Compared with the prior art, the utility model has the following advantages: the utility model is provided with an air curtain machine, an air return pipe and a filter assembly; the air curtain machine forms an air curtain at the position where the chamber contacts the outside to prevent external gas from entering the chamber; the gas in the chamber enters the cooling mechanism through the air return pipe to achieve the reuse of the gas in the chamber; the filter assembly dries and removes impurities from the gas entering the equipment to prevent the gas in the chamber from containing moisture and impurities; the air curtain machine, the air return pipe and the filter assembly cooperate with each other to improve the impurity removal effect of the equipment; after the equipment has been used for a long time, the gas in the chamber still does not contain moisture and impurities; at the same time, when the equipment is working, the staff can replace the filter plate in the filter assembly through the hanging ear, so that the equipment can be maintained without stopping. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0016] Figure 2 It is a three-dimensional structural schematic diagram of the utility model from another viewing angle;

[0017] Figure 3 This is a schematic diagram of the internal structure of the cooling mechanism in the utility model;

[0018] Figure 4 for Figure 1 A partial enlarged view of middle A;

[0019] Figure 5 This is a schematic diagram of the internal structure of the lower template in the utility model;

[0020] Figure 6 It is a schematic diagram of the internal structure of the filter assembly in the utility model.

[0021] The numbers in the figure are: 1. main body; 2. chamber; 3. air curtain; 4. telescopic rod; 5. fixed plate; 6. guide rod; 7. upper template; 8. fixed rod; 9. lower template; 10. cooling mechanism; 11. air intake assembly; 12. return air pipe; 13. supercharger; 14. air intake pipe; 15. filter assembly; 16. first main board; 17. connecting groove; 18. first cooling plate; 19. second cooling plate; 20. outlet pipe; 21. elbow; 22. air supply pipe; 23. connecting pipe; 24. buffer groove; 25. through groove; 26. groove; 27. air outlet groove; 28. second main board; 29. ​​filter compartment; 30. slide groove; 31. filter plate; 32. hanging ear; 33. sealing ring; 34. spring. DETAILED DESCRIPTION

[0022] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments described below are only examples, and those skilled in the art may think of other obvious variations.

[0023] Reference Figure 1-6 As shown, a semiconductor high-temperature resistant and dust-proof precision mold includes a main body 1, a chamber 2 is opened inside the main body 1, two air curtain machines 3 are fixedly installed on the top of the inner wall of the chamber 2, and the two air curtain machines 3 are symmetrically distributed about the center line of the chamber 2. The two air curtain machines 3 prevent external air from entering the chamber 2, and can also prevent external impurities from entering the chamber 2. A telescopic rod 4 is fixedly installed at the center of the top of the inner wall of the chamber 2, and a fixed plate 5 is fixedly installed at the lower end of the telescopic rod 4. At least two guide rods 6 are fixedly installed on the bottom surface of the fixed plate 5. The at least two guide rods 6 are symmetrically distributed about the center line of the fixed plate 5. An upper template 7 is provided below the fixed plate 5, and the upper template 7 is slidably connected to the two guide rods 6. A fixed rod 8 is fixedly installed at the center of the bottom of the inner wall of the chamber 2. The fixed rod A lower template 9 corresponding to the upper template 7 is fixedly installed on the upper end of 8, and the telescopic rod 4 pushes the upper template 7 to cooperate with the lower template 9 to complete the processing of the semiconductor. A cooling mechanism 10 is fixedly installed on the bottom of the inner wall of the chamber 2, and an air intake component 11 is provided inside the chamber 2. The cooling mechanism 10 is connected with the lower template 9 through the air intake component 11. The cooling mechanism 10 reduces the temperature of the gas entering the lower template 9. A return air pipe 12 is fixedly installed on the outer side of the main body 1, and a supercharger 13 is provided inside the return air pipe 12. The supercharger 13 increases the speed of the pressurized gas circulation. An air intake pipe 14 is fixedly installed on the upper surface of the supercharger 13 corresponding to the return air pipe 12, and a filter component 15 is provided inside the air intake pipe 14. The filter component 15 dries and filters the external air entering the equipment.

[0024] like Figure 3 As shown, the cooling mechanism 10 includes a first main board 16, a connecting groove 17 is opened inside the first main board 16, and a plurality of first cooling plates 18 and a plurality of second cooling plates 19 are fixedly installed on the inner wall of the connecting groove 17. The first cooling plates 18 and the second cooling plates 19 are both externally connected to a power source. The plurality of first cooling plates 18 and the plurality of second cooling plates 19 are spaced apart along the length direction of the connecting groove 17. The spaced apart distribution prolongs the time that the gas stays in the connecting groove 17, and at the same time, the first cooling plates 18 and the second cooling plates 19 cool the gas more fully.

[0025] like Figure 4As shown, the air intake assembly 11 includes an air outlet pipe 20, one end of the air outlet pipe 20 is connected to the connecting groove 17, the other end of the air outlet pipe 20 is connected to the pipe elbow 21, the end of the elbow 21 away from the air outlet pipe 20 is connected to the air supply pipe 22, the other end of the air supply pipe 22 is connected to the connecting pipe 23, the end of the connecting pipe 23 away from the air supply pipe 22 is connected to the lower template 9, and the gas after cooling is completed passes through the air outlet pipe 20, the elbow 21, the air supply pipe 22 and the connecting pipe 23 in turn into the lower template 9.

[0026] like Figure 5 As shown, a buffer groove 24 is provided inside the lower template 9, and a plurality of through grooves 25 and a plurality of grooves 26 are provided inside the lower template 9 corresponding to the buffer groove 24, and the plurality of through grooves 25 and the plurality of grooves 26 are connected to each other in sequence, the buffer groove 24 is connected to the groove 26 on the left side of the lower template 9, and an air outlet groove 27 is provided at the bottom of the inner wall of the groove 26 on the right side of the lower template 9, which prolongs the residence time of the gas at a high temperature in the lower template 9, thereby making the cooling of the lower template 9 more sufficient.

[0027] like Figure 6 As shown, the filter assembly 15 includes a second main board 28, a filter bin 29 is provided inside the second main board 28, a plurality of chutes 30 are provided on the inner wall of the filter bin 29, the plurality of chutes 30 are linearly distributed along the length direction of the filter bin 29, filter plates 31 are provided inside the plurality of chutes 30, the filter plates 31 dry and remove impurities for the gas entering the device, and hanging ears 32 are fixedly installed on the upper surfaces of the plurality of filter plates 31, and the staff can replace the filter plates 31 through the hanging ears 32, and a sealing ring 33 is fixedly installed on the inner wall of the filter bin 29 corresponding to the filter plate 31, and the sealing ring 33 prevents external gas from entering the device through the chute 30.

[0028] like Figure 1-6 As shown, the return air pipe 12 passes through the main body 1 and the first main board 16 and is connected to the connecting groove 17, so that part of the gas in the chamber 2 enters the cooling mechanism 10 through the return air pipe 12, thereby extending the service life of the filter plate 31 in the filter assembly 15.

[0029] like Figure 1-6 As shown, springs 34 are sleeved on the outer surfaces of the two guide rods 6, and the two ends of the springs 34 are fixedly connected to the bottom surface of the fixed plate 5 and the upper surface of the upper mold plate 7 respectively. The springs 34 play a buffering role when the upper mold plate 7 and the lower mold plate 9 are closed to prevent the mold from being damaged due to excessive pressure.

[0030] Working principle: The supercharger 13 drives the air flow in the equipment, and the external air enters the filter assembly 15 through the air inlet pipe 14. The filter plate 31 dries and removes impurities from the external air. The dried and impurity-removed gas and the gas in the chamber 2 enter the cooling mechanism 10 through the return air pipe 12. The first cooling plate 18 and the second cooling plate 19 in the cooling mechanism 10 fully cool the gas in the connecting groove 17. The cooled gas enters the lower template 9 through the air outlet pipe 20, the elbow 21, the air supply pipe 22 and the connecting pipe 23 in turn. The cooled gas enters the chamber 2 along the buffer groove 24, the through groove 25, the groove 26 and the air outlet groove 27. At the same time, the through groove 25 and the groove 26 extend the residence time of the temperature-angled gas in the lower template 9, thereby making the cooling of the lower template 9 more sufficient.

[0031] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and the specification only describe the principles of the utility model. The utility model may be subject to various changes and improvements without departing from the spirit and scope of the utility model. These changes and improvements fall within the scope of the utility model to be protected. The scope of protection claimed by the utility model is defined by the attached claims and their equivalents.

Claims

1. A semiconductor high temperature resistant and dustproof precision mold, comprising a main body (1), characterized in that: A chamber (2) is provided inside the main body (1), two air curtain machines (3) are fixedly installed on the top of the inner wall of the chamber (2), and the two air curtain machines (3) are symmetrically distributed about the center line of the chamber (2). A telescopic rod (4) is fixedly installed at the center of the top of the inner wall of the chamber (2), a fixed plate (5) is fixedly installed at the lower end of the telescopic rod (4), and at least two guide rods (6) are fixedly installed on the bottom surface of the fixed plate (5), and at least two guide rods (6) are symmetrically distributed about the center line of the fixed plate (5). An upper template (7) is provided below the fixed plate (5), and the upper template (7) is slidably connected to the two guide rods (6). The bottom of the inner wall of the chamber (2) is fixedly installed with a fixed plate (5) at the lower end of the fixed plate (5). A fixing rod (8) is fixedly installed at the center of the main body (1), a lower template (9) corresponding to the upper template (7) is fixedly installed on the upper end of the fixing rod (8), a cooling mechanism (10) is fixedly installed at the bottom of the inner wall of the chamber (2), an air intake assembly (11) is provided inside the chamber (2), the cooling mechanism (10) is connected to the lower template (9) through the air intake assembly (11), a return air pipe (12) is fixedly installed on the outer side of the main body (1), a supercharger (13) is provided inside the return air pipe (12), an air intake pipe (14) is fixedly installed on the upper surface of the supercharger (13) corresponding to the return air pipe (12), and a filter assembly (15) is provided inside the air intake pipe (14).

2. A semiconductor high temperature resistant and dustproof precision mold according to claim 1, characterized in that: The cooling mechanism (10) comprises a first main board (16), a connecting groove (17) is provided inside the first main board (16), a plurality of first cooling plates (18) and a plurality of second cooling plates (19) are fixedly mounted on the inner wall of the connecting groove (17), and the plurality of first cooling plates (18) and the plurality of second cooling plates (19) are distributed at intervals along the length direction of the connecting groove (17).

3. A semiconductor high temperature resistant and dustproof precision mold according to claim 1, characterized in that: The air intake assembly (11) comprises an air outlet pipe (20), one end of the air outlet pipe (20) is connected to the connecting groove (17), the other end of the air outlet pipe (20) is connected to a pipe elbow (21), the end of the pipe elbow (21) away from the air outlet pipe (20) is connected to an air supply pipe (22), the other end of the air supply pipe (22) is connected to a connecting pipe (23), and the end of the connecting pipe (23) away from the air supply pipe (22) is connected to the lower template (9).

4. A semiconductor high temperature resistant and dustproof precision mold according to claim 1, characterized in that: A buffer groove (24) is provided inside the lower template (9), and a plurality of through grooves (25) and a plurality of grooves (26) are provided inside the lower template (9) corresponding to the buffer groove (24), and the plurality of through grooves (25) and the plurality of grooves (26) are connected in sequence, the buffer groove (24) is connected to the groove (26) on the left side of the lower template (9), and an air outlet groove (27) is provided at the bottom of the inner wall of the groove (26) on the right side of the lower template (9).

5. The semiconductor high temperature resistant and dustproof precision mold according to claim 1, characterized in that: The filter assembly (15) comprises a second main board (28), a filter chamber (29) is provided inside the second main board (28), a plurality of slide grooves (30) are provided on the inner wall of the filter chamber (29), the plurality of slide grooves (30) are linearly distributed along the length direction of the filter chamber (29), a filter plate (31) is provided inside each of the plurality of slide grooves (30), a plurality of hanging ears (32) are fixedly mounted on the upper surfaces of the plurality of filter plates (31), and a sealing ring (33) is fixedly mounted on the inner wall of the filter chamber (29) corresponding to the filter plate (31).

6. A semiconductor high temperature resistant and dustproof precision mold according to claim 5, characterized in that: The air return pipe (12) passes through the main body (1) and the first main board (16) and is connected to the connecting groove (17).

7. The semiconductor high temperature resistant and dustproof precision mold according to claim 1, characterized in that: The outer surfaces of the two guide rods (6) are sleeved with springs (34), and the two ends of the springs (34) are respectively fixedly connected to the bottom surface of the fixing plate (5) and the upper surface of the upper template (7).

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