Thermal deformation control mechanism for substrate and Z shaft of additive equipment

Abstract

The utility model relates to the technical field of additive manufacturing, in particular to a thermal deformation control mechanism for a substrate and a Z axis of additive equipment, which comprises a heating plate arranged at the bottom of the substrate and a cooling plate arranged on the outer side of the heating plate, the cooling plate is in contact with the peripheral side of the substrate, and an air interlayer is formed between the cooling plate and the heating plate; the cooling plate is arranged on the outer side of the heating plate and makes contact with the peripheral side of the base plate, on one hand, the situation that the heating plate is circumferentially deformed and clamped with the forming cylinder after being heated is avoided through the air interlayer, on the other hand, the cooling plate lowers the temperature of the peripheral side of the base plate, the situation that the outer side of the base plate is circumferentially deformed and clamped with the forming cylinder after being heated is avoided, and the cylinder clamping problem is avoided; the heating plate is arranged at the bottom of the substrate to ensure that the substrate is heated stably and reliably, so that stable and reliable work is ensured, and actual production requirements are met.

Description

Technical Field

[0001] The utility model relates to the technical field of additive manufacturing, and in particular to a thermal deformation control mechanism for a substrate and a Z-axis of an additive manufacturing device. Background Art

[0002] Traditional 3D printing equipment usually requires preheating of the substrate supporting the molded parts. During the 3D printing process by laser melting metal powder, the substrate is placed in a forming cylinder and the metal powder will fall between the substrate and the forming cylinder. A heating plate is set at the bottom of the substrate.

[0003] For example, the Chinese invention patent application with publication number CN107486556A provides a metal 3D printing device, including a forming cylinder and a forming platform that moves up and down in the forming cylinder. The forming platform is also provided with a sealing ring, and a heating plate, a bottom plate and a substrate are sequentially arranged on the top, and metal powder is accumulated on the substrate.

[0004] During actual use, when the substrate is heated by the heating plate at the bottom, both the heating plate and the substrate will deform circumferentially, and the thermal conductivity of the metal powder is low, which will cause the side walls of the substrate and the heating plate to pass through the metal powder extrusion forming cylinder. At the same time, since the substrate and the heating plate will descend layer by layer during the printing process, the substrate and the heating plate will squeeze the metal powder and the inner wall of the forming cylinder when moving downward, causing the cylinder to get stuck, resulting in printing failure.

[0005] At the same time, laser sintering of the substrate during the forming process will cause the substrate to receive more heat, and the circumferential deformation of the substrate will become more serious. When the circumferential deformation is blocked, the Z-axis deformation of the substrate will increase, causing the part printing position height to change, affecting the printing quality. Utility Model Content

[0006] The utility model aims to provide a thermal deformation control mechanism for a substrate and a Z-axis of an additive device, so as to solve the problem of cylinder jamming caused by thermal deformation during the printing process.

[0007] The utility model is to achieve the above-mentioned technical solution:

[0008] A thermal deformation control mechanism for a substrate and a Z axis of an additive device comprises a heating plate arranged at the bottom of the substrate and a cooling plate arranged outside the heating plate, wherein the cooling plate contacts the peripheral side of the substrate, and an air layer is formed between the cooling plate and the heating plate.

[0009] It is further defined that the substrate is arranged on the top of the cooling plate, and the cooling plate is sleeved on the outer side of the heating plate.

[0010] It is further defined that the cooling plate is a concave structure, the groove of the cooling plate is opposite to the bottom of the substrate, and the heating plate is arranged in the groove.

[0011] It is further defined that a heat insulation plate is provided at the bottom of the heating plate and the bottom of the groove, and the top of the heating plate is in contact with the substrate.

[0012] It is further defined that the bottom of the heating plate is elastically connected to the groove or the heating plate is connected to the groove by bolts.

[0013] It is further defined that the peripheral side of the heating plate is elastically connected to the groove of the cooling plate.

[0014] It is further defined that the side wall of the base plate is located between the inner and outer side walls of the cooling plate.

[0015] It is further defined that the substrate is sealed and connected to the cooling plate. The substrate is sealed and connected to the cooling plate.

[0016] It is further defined that the base plate is sealedly connected to the cooling plate.

[0017] It is further defined that a heating wire is arranged on the heating plate, and the heating wire is close to the substrate.

[0018] Beneficial effects of the utility model:

[0019] 1. The utility model arranges a cooling plate on the outer side of the heating plate and makes the cooling plate contact with the circumferential side of the substrate. On the one hand, the air interlayer prevents the heating plate from being deformed circumferentially and being stuck in the forming cylinder after being heated. On the other hand, the cooling plate reduces the temperature of the circumferential side of the substrate, thereby preventing the outer side of the substrate from being deformed circumferentially and being stuck in the forming cylinder due to heating, thereby avoiding the cylinder sticking problem. The heating plate is arranged at the bottom of the substrate to ensure that the substrate is heated stably and reliably, thereby ensuring stable and reliable operation and meeting actual production needs.

[0020] 2. The utility model provides a groove on the cooling plate to facilitate the installation of the heating plate, and at the same time uses the insulation plate to prevent the heating plate from directly contacting the cooling plate, thereby preventing the heat of the heating plate from diffusing to the cooling plate, ensuring that the heating plate continuously, stably and efficiently supplies heat to the substrate.

[0021] 3. The utility model elastically connects the heating plate to the peripheral side of the groove, so that the position of the heating plate in the groove is stably set in the groove after the heating plate is deformed circumferentially, thereby avoiding contact between the heating plate and the cooling plate.

[0022] 4. By elastically connecting the bottom of the heating plate with the groove, when the heating plate is heated and deformed in the Z-axis direction, the influence of the deformation of the substrate in the Z-axis direction is avoided by changing the distance between the heating plate and the bottom of the groove, thereby ensuring the printing quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 This is a schematic diagram of the overall structure of the thermal deformation control mechanism for the substrate and Z-axis of the additive equipment of the utility model;

[0024] In the figure: 10 - substrate; 20 - heating plate; 21 - elastic connecting member; 22 - heating wire; 30 - cooling plate; 31 - air interlayer; 32 - cooling channel; 40 - heat insulation board; 41 - elastic supporting member; 50 - forming cylinder; 51 - sealing member. DETAILED DESCRIPTION

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present utility model in conjunction with the drawings in the embodiments of the present utility model. Obviously, the described embodiments are only part of the embodiments of the present utility model, not all of the embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present utility model.

[0026] Example 1

[0027] refer to Figure 1 The present embodiment provides a thermal deformation control mechanism for a substrate and a Z-axis of an additive device, which is arranged in a forming cylinder 50 and includes a heating plate 20 and a cooling plate 30, wherein the heating plate 20 is arranged at the bottom of the substrate 10 for heating the substrate 10 during operation, and the cooling plate 30 is arranged on the outside of the heating plate 20, and an air sandwich 31 is formed between the cooling plate 30 and the heating plate 20, for example, the cooling plate 30 is arranged around, at the bottom, or around and at the bottom of the heating plate 20, and the corresponding air sandwich 31 is located at the circumferential side, at the bottom, or at the circumferential side and at the bottom of the heating plate 20; on the one hand, the heating plate 20 is prevented from being contacted and engaged with the forming cylinder 50 after being circumferentially deformed by heat, and on the other hand, the contact between the cooling plate 30 and the circumferential side of the substrate 10 can cool the circumferential side of the substrate 10, reduce the circumferential deformation degree of the substrate 10, thereby preventing the substrate 10 from being stuck with the forming cylinder 50, and at the same time, the cooling plate 30 has a low temperature and a small deformation, which further prevents the forming cylinder 50 from being stuck, so that the printing work can be completed smoothly and the printing quality is guaranteed.

[0028] Specifically, in order to avoid leakage of metal powder and protective gas, a seal 51 is selected to be set on the outer side of the cooling plate 30. The seal 51 is set between the cooling plate 30 and the forming cylinder 50. At the same time, the top of the cooling plate 30 is sealed and connected to the bottom of the substrate 10 to avoid leakage of metal powder between the cooling plate 30 and the heating plate 20, causing circumferential deformation of the heating plate 20 and extrusion of the cooling plate 30.

[0029] To further explain, the cooling plate 30 can be optionally a hollow columnar structure arranged on the circumferential side of the heating plate 20. In this case, the cooling plate 30 is selected to be sleeved on the circumferential side of the bottom of the substrate 10 and is sealed with the circumferential side of the substrate 10. The bottom of the cooling plate 30 extends downward to the bottom of the substrate 10 and is sleeved on the outer side of the heating plate 20. The heating plate 20 contacts the bottom of the substrate 10. At this time, the air interlayer 31 is located on the circumferential side of the heating plate 20, and the air interlayer 31 can meet the circumferential deformation of the heating plate 20.

[0030] Preferably, the cooling plate 30 is a concave structure, and a groove is formed at the upper end of the cooling plate 30 .

[0031] Specifically, it is preferred that the transverse cross-sectional shape of the cooling plate 30 is the same as the transverse cross-sectional shape of the substrate 10 , and the substrate 10 and the cooling plate 30 are coaxially arranged.

[0032] The notch of the groove is opposite to the bottom of the substrate 10, the outer ring part of the bottom of the substrate 10 contacts the top of the cooling plate 30, the heating plate 20 is placed in the groove, the heating plate 20 contacts the bottom of the substrate 10, and can provide stable and continuous heating to the substrate 10. The heating plate 20 is placed at the bottom of the groove.

[0033] In order to avoid heat waste caused by heat exchange between the heating plate 20 and the cooling plate 30, a heat insulation plate 40 is preferably provided at the bottom of the grooves of the heating plate 20 and the cooling plate 30, so that the heat generated by the heating plate 20 can stably and reliably provide heat to the substrate 10, thereby improving the heating efficiency of the substrate 10.

[0034] The size of the heating plate 20 is smaller than the diameter of the groove, and an air sandwich 31 is formed between the circumference of the heating plate 20 and the circumference of the groove to buffer the circumferential deformation of the heating plate 20 .

[0035] The size of the substrate 10 is between the size of the cooling plate 30 and the size of the groove, that is, the circumferential side of the substrate 10 is located between the circumferential side of the cooling plate 30 and the circumferential side of the groove, thereby increasing the distance between the substrate 10 and the forming cylinder 50, so that when the substrate 10 produces circumferential deformation, it will not directly contact the forming cylinder 50 to cause cylinder jamming, further ensuring normal printing.

[0036] Preferably, in order to avoid uneven circumferential deformation of the heating plate 20 resulting in the deformation of any side of the heating plate 20 being greater than the thickness of the air layer 31, so that the corresponding side of the heating plate 20 contacts the cooling plate 30 and causes heat loss, the circumferential side of the heating plate 20 is preferably elastically connected to the circumferential side of the groove. Specifically, an elastic connecting member 21 is provided in the air layer 31, and the elastic connecting member 21 is transversely arranged between the circumferential side of the heating plate 20 and the circumferential side of the groove. When the circumferential side of the heating plate 20 is deformed unevenly, the elastic connecting member 21 causes the heating plate 20 to shift to the side with smaller deformation, thereby ensuring that the heating plate 20 can be placed reliably in the groove.

[0037] The elastic connecting member 21 may be heat-resistant rubber or a spring, and preferably the spring can adjust the horizontal position of the heating plate 20 .

[0038] Similarly, in order to prevent the heating plate 20 from deforming in the Z-axis direction due to heat and the substrate 10 from deforming in the Z-axis direction, which may affect the position of the substrate 10 and further affect the printing quality, the bottom of the heating plate 20 is preferably elastically connected to the bottom of the groove of the cooling plate 30.

[0039] Specifically, the heating plate 20 is elastically connected to the bottom of the groove or the heating plate 20 is elastically connected to the groove through the heat insulation plate 40 .

[0040] When the heating plate 20 is elastically connected to the bottom of the groove, the heat insulation plate 40 is connected to the bottom of the groove by bolts, and the bottom of the heating plate 20 is connected one-to-one with the boss on the groove through the elastic support member 41, that is, the elastic support members 41 are also arranged in multiples and in an array, so that when the heating plate 20 and the substrate 10 are deformed in the Z-axis direction, the elastic support members 41 are squeezed to avoid affecting the substrate 10, thereby ensuring the printing quality.

[0041] When the heating plate 20 is elastically connected to the groove through the insulation plate 40, the heating plate 20 and the insulation plate 40 are connected by bolts, the boss of the groove is connected to the bottom of the elastic support member 41, and the elastic support member 41 passes through the corresponding limiting holes on the insulation plate 40 and is connected to the limiting holes or the bottom of the heating plate 20. When the heating plate 20 and the substrate 10 are deformed in the Z-axis direction, the extrusion of the elastic support member 41 eliminates the Z-axis deformation of the heating plate 20 and the substrate 10, thereby ensuring the printing quality.

[0042] The elastic support members 41 may be heat-resistant rubber or springs, preferably springs.

[0043] Further explanation, in order to improve the heating efficiency of the heating plate 20 to the substrate 10, a heating wire 22 is selected to be set on the heating plate 20 so that the heating wire 22 is close to the substrate 10; wherein, the heating wire 22 can be selected to be set above the inside of the heating plate 20 or on the upper surface of the heating plate 20.

[0044] At the same time, a temperature sensor is provided in the heating plate 20 to obtain the heating temperature of the heating plate 20 , thereby facilitating obtaining the temperature state of the heating plate 20 .

[0045] In order to prevent the cooling plate 30 from being deformed due to heating, a cooling channel 32 is selected to be opened in the cooling plate 30. The cooling channel 32 can be selected to be set as a concave structure so that the cooling channel 32 is located around the groove, thereby improving the water cooling effect and ensuring the printing quality.

[0046] The cooling channel 32 may be injected with flowing cooling water, low-temperature oil or other coolant, or injected with flowing low-temperature gas to cool the cooling plate 30 .

[0047] The above is the embodiment of the present application. The above embodiment and the specific parameters in the embodiment are only for clearly describing the verification process of the application, and are not used to limit the patent protection scope of the present application. The patent protection scope of the present application is still based on its claims. All equivalent structural changes made using the description and drawings of the present application should be included in the protection scope of the present application.

Claims

1. A thermal deformation control mechanism for a substrate and a Z-axis of an additive device, characterized in that: It comprises a heating plate (20) arranged at the bottom of a substrate (10) and a cooling plate (30) arranged outside the heating plate (20), wherein the cooling plate (30) is in contact with the peripheral side of the substrate (10), and an air interlayer (31) is formed between the cooling plate (30) and the heating plate (20).

2. The thermal deformation control mechanism for the substrate and Z-axis of the additive equipment according to claim 1, characterized in that: The substrate (10) is arranged on the top of a cooling plate (30), and the cooling plate (30) is sleeved on the outside of the heating plate (20).

3. The thermal deformation control mechanism for the substrate and Z-axis of the additive equipment according to claim 2, characterized in that: The cooling plate (30) is a concave structure, the concave groove of the cooling plate (30) is opposite to the bottom of the substrate (10), and the heating plate (20) is arranged in the concave groove.

4. The thermal deformation control mechanism for the substrate and Z-axis of the additive equipment according to claim 3, characterized in that: A heat insulation plate (40) is provided at the bottom of the heating plate (20) and the bottom of the groove of the cooling plate (30), and the top of the heating plate (20) is in contact with the substrate (10).

5. The thermal deformation control mechanism for the substrate and Z-axis of the additive equipment according to claim 3, characterized in that: The bottom of the heating plate (20) is elastically connected to the groove, or the heating plate (20) is connected to the groove via bolts.

6. The thermal deformation control mechanism for the substrate and Z-axis of the additive equipment according to claim 3, characterized in that: The peripheral side of the heating plate (20) is elastically connected to the groove of the cooling plate (30).

7. The thermal deformation control mechanism for the substrate and Z-axis of the additive equipment according to any one of claims 1 to 6, characterized in that: The side wall of the substrate (10) is located between the inner and outer side walls of the cooling plate (30).

8. The thermal deformation control mechanism for the substrate and Z-axis of the additive equipment according to claim 7, characterized in that: The base plate (10) is sealed and connected to the cooling plate (30).

9. The thermal deformation control mechanism for the substrate and Z-axis of the additive equipment according to claim 8, characterized in that: The outer side of the cooling plate (30) is provided with a sealing member (51) which is sealedly connected to the forming cylinder (50).

10. The thermal deformation control mechanism for the substrate and Z-axis of the additive equipment according to claim 9, characterized in that: A heating wire (22) is provided on the heating plate (20), and the heating wire (22) is close to the substrate (10).

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