Semiconductor plastic product mold convenient to cool and form

Abstract

The utility model discloses a semiconductor plastic product mould convenient to cool and form, which comprises a lower mould, a lower cooling cavity is arranged in the lower mould, a mounting sleeve is fixedly arranged in the lower cooling cavity, a connecting plate is fixedly arranged at the bottom of the mounting sleeve, a water inlet hole is arranged at the top of the connecting plate in a penetrating manner, and a water outlet hole is arranged at the bottom of the water inlet hole. A telescopic pipe is installed at the top of the connecting plate, an upper mold is installed at the top of the telescopic pipe, and an upper cooling cavity is formed in the upper mold. The water flow cools the lower mold, the upper mold and the formed semiconductor plastic product at the same time, so that the injection-molded semiconductor plastic product is conveniently cooled, and the formed semiconductor plastic product is higher in cooling speed; and the influence of the temperature of the upper mold on the cooling speed of the molded semiconductor plastic product due to the fact that the lower mold, the injection molded semiconductor plastic product and the upper mold need to be sequentially cooled by entering cooling water during cooling is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor plastic product molds, in particular to a mold for semiconductor plastic products which is convenient for cooling and forming. Background Art

[0002] Injection molding, also known as injection molding, is a molding method that combines injection and molding. The advantages of the injection molding method are fast production speed, high efficiency, automated operation, a wide variety of colors, shapes from simple to complex, sizes from large to small, and precise product size. The product is easy to update and can be made into parts with complex shapes. Injection molding is suitable for mass production and molding processing fields such as products with complex shapes. In the production process of semiconductor plastic products, injection molds are usually required to perform injection molding on semiconductor plastic products.

[0003] After the existing molds are used to injection mold the semiconductor plastic products, the molded semiconductor plastic products need to be cooled. However, when cooling the semiconductor plastic products, cooling water is usually transported to the lower mold. The molded semiconductor plastic products are cooled by the cooling water entering the lower mold. However, the upper mold will also absorb heat during the injection molding process, and the upper mold with too high a temperature will transfer the temperature to the semiconductor plastic product, thereby affecting the cooling of the semiconductor plastic product. Therefore, a mold for semiconductor plastic products that is easy to cool and mold is proposed. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides a mold for semiconductor plastic products that is easy to cool and form, and is used to solve the problems raised in the above-mentioned background technology.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A mold for semiconductor plastic products that is easy to cool and form, comprising a lower mold, a lower cooling cavity is opened inside the lower mold, a mounting sleeve is fixedly arranged inside the lower cooling cavity, a connecting plate is fixedly arranged at the bottom of the mounting sleeve, a water inlet hole is penetrated through the top of the connecting plate, a telescopic tube is installed on the top of the connecting plate, an upper mold is installed on the top of the telescopic tube, an upper cooling cavity is opened inside the upper mold, a water outlet hole is penetrated through the lower side wall of the upper cooling cavity, a water inlet pipe is fixedly arranged on the front side of the lower mold, and a water outlet pipe is fixedly arranged on the front side of the upper mold.

[0007] Preferably, the telescopic tube comprises a lower pipe, a middle pipe and an upper pipe, the lower pipe is fixedly mounted on the top of the connecting plate, the middle pipe is slidably arranged on the surface of the lower pipe, the middle pipe is slidably arranged on the surface of the middle pipe, and the upper pipe is fixedly mounted on the upper mold.

[0008] Preferably, an alignment column is fixedly provided at the bottom of the upper mold, and an alignment groove is opened at the top of the lower mold, and the alignment groove and the alignment column are matched.

[0009] Preferably, the water inlet pipe and the water outlet pipe are both made of metal material, the water inlet pipe is connected to the lower cooling cavity, and the water outlet pipe is connected to the upper cooling cavity.

[0010] Preferably, the inner diameter of the lower pipe is the same as the aperture of the water inlet hole, the aperture of the water inlet hole is the same as the aperture of the water outlet hole, and the lower pipe is vertically aligned with the water inlet hole and the water outlet hole.

[0011] Preferably, the number of the alignment posts and the number of the alignment grooves are both four, and the four alignment posts and the four alignment grooves are symmetrically distributed.

[0012] Preferably, there are two telescopic tubes, and the two telescopic tubes are symmetrically distributed, and the telescopic tubes are made of stainless steel.

[0013] Compared with the prior art, the beneficial effect of the utility model is that: when the molded semiconductor plastic product needs to be cooled, the mold for semiconductor plastic products that is easy to cool and form can transport cooling water to the lower cooling chamber through the water inlet pipe, and enter the upper cooling chamber through the water inlet hole, the telescopic tube and the water outlet hole, so that the water flow cools the lower mold, the upper mold and the molded semiconductor plastic product at the same time, thereby facilitating the cooling of the injection-molded semiconductor plastic product, making the molded semiconductor plastic product cool faster, and avoiding the need for the cooling water entering during cooling to cool the lower mold, the injection-molded semiconductor plastic product and the upper mold in turn, resulting in the temperature of the upper mold affecting the cooling speed of the molded semiconductor plastic product. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 It is the structural survey drawing of the utility model;

[0015] Figure 2 It is a schematic diagram of the longitudinal section of the structure of the utility model;

[0016] Figure 3 for Figure 2 A magnified view of the structure at A;

[0017] Figure 4 This is a schematic diagram of mold splitting of the structure mold of the utility model;

[0018] Figure 5 This is a schematic diagram of the telescopic tube structure of the utility model.

[0019] In the figure: 1. lower mold; 2. lower cooling chamber; 3. mounting sleeve; 4. connecting plate; 5. water inlet hole; 6. telescopic tube; 61. lower pipe; 62. middle pipe; 63. upper pipe; 7. upper mold; 8. upper cooling chamber; 9. water outlet hole; 10. water inlet pipe; 11. water outlet pipe; 12. alignment column; 13. alignment groove. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] Reference Figure 1-5A semiconductor plastic product mold that is easy to cool and form, comprising a lower mold 1, a lower cooling cavity 2 is opened inside the lower mold 1, a mounting sleeve 3 is fixedly arranged inside the lower cooling cavity 2, a connecting plate 4 is fixedly arranged at the bottom of the mounting sleeve 3, a water inlet hole 5 is penetrated at the top of the connecting plate 4, a telescopic pipe 6 is installed on the top of the connecting plate 4, the telescopic pipe 6 comprises a lower pipe 61, a middle pipe 62 and an upper pipe 63, the inner diameter of the lower pipe 61 is the same as the aperture of the water inlet hole 5, the aperture of the water inlet hole 5 is the same as the aperture of the water outlet hole 9, the lower pipe 61 is vertically aligned with the water inlet hole 5 and the water outlet hole 9, so that the cooling water in the lower cooling cavity 2 enters the upper cooling cavity 8, so as to cool the upper mold 7 and the lower mold 1 at the same time, so that the formed semiconductor plastic The cooling speed of the material product is faster, the lower pipe 61 is fixedly installed on the top of the connecting plate 4, the surface of the lower pipe 61 is slidably provided with a middle pipe 62, the surface of the middle pipe 62 is slidably provided with a middle pipe 62, and the upper pipe 63 is fixedly installed on the upper mold 7, and the lower pipe 61 is contracted to the inside of the middle pipe 62, and the middle pipe 62 is contracted to the inside of the upper pipe 63, so that the upper pipe 63 is inserted into the installation sleeve 3, so that the upper mold 7 and the lower mold 1 are convenient for mold closing, and the lower pipe 61 is moved out of the middle pipe 62, and the middle pipe 62 is moved out of the upper pipe 63, so that the upper mold 7 and the lower mold 1 are convenient for mold separation, so that the semiconductor plastic product after cooling and molding is conveniently taken out from the lower mold 1, and the upper mold is installed on the top of the telescopic tube 6 The upper mold 7 is provided with an upper cooling cavity 8, the number of telescopic tubes 6 is two, and the two telescopic tubes 6 are symmetrically distributed, the telescopic tubes 6 are made of stainless steel, and the water flow in the lower cooling cavity 2 can quickly enter the upper cooling cavity 8 through the arrangement of the two telescopic tubes 6, so as to facilitate the rapid cooling of the molded semiconductor plastic product, the lower side wall of the upper cooling cavity 8 is penetrated with a water outlet hole 9, the front side of the lower mold 1 is fixedly provided with a water inlet pipe 10, and the front side of the upper mold 7 is fixedly provided with a water outlet pipe 11, the water inlet pipe 10 and the water outlet pipe 11 are both made of metal, the water inlet pipe 10 is connected with the lower cooling cavity 2, and the water outlet pipe 11 is connected with the upper cooling cavity 8, and the metal water inlet pipe 10 and the water outlet pipe 11 are not easy to be deformed and broken The molded semiconductor plastic product is preferably molded into a mold having a plurality of molds, and the ...

[0022] Specifically, an alignment post 12 is fixedly provided at the bottom of the upper mold 7, and an alignment groove 13 is opened at the top of the lower mold 1. The alignment groove 13 is adapted to the alignment post 12. The number of the alignment posts 12 and the alignment groove 13 is four, and the four alignment posts 12 and the four alignment grooves 13 are symmetrically distributed. Through the arrangement of the alignment grooves 13 and the alignment posts 12, it is convenient to position the upper mold 7 and the lower mold 1, thereby avoiding errors in the upper mold 7 and the lower mold 1 when the upper mold 7 and the lower mold 1 are closed, resulting in errors in the injection-molded semiconductor plastic products. In addition, the four alignment posts 12 and the four alignment grooves 13 make the positions of the upper mold 7 and the lower mold 1 more stable after the alignment and closing, thereby avoiding the displacement of the upper mold 7 and the lower mold 1 during the injection molding process.

[0023] The mold for the semiconductor plastic product that is easy to cool and form is connected to a 220V mains power supply, and the main controller can be a conventional known device such as a computer for control.

[0024] During use: when it is necessary to perform injection molding of the semiconductor plastic product through the lower mold 1 and the upper mold 7, the upper mold 7 is pushed downward by an external drive setting, so that the upper mold 7 pushes the alignment column 12 to insert into the alignment groove 13, so that the lower pipe 61 shrinks into the middle pipe 62, and the middle pipe 62 shrinks into the upper pipe 63, so that the upper pipe 63 is inserted into the installation sleeve 3, so that the middle pipe 62 and the upper pipe 63 are in contact with the top of the connecting plate 4, and the molten raw material is transported to the lower mold 1 through the injection pipe on the front side of the lower mold 1, and then the cooling water is transported to the lower cooling chamber 2 through the water inlet pipe 10, and the internal water flow entering the lower cooling chamber 2 cools the lower mold 1 and the molded semiconductor plastic product. At the same time, the water flows into the lower pipe 61 through the water inlet hole 5, and enters the upper cooling chamber 8 through the lower pipe 61 and the water outlet hole 9. The internal water flow entering the upper cooling chamber 8 cools the upper mold 7 and the semiconductor plastic product, and the molded semiconductor plastic product can be cooled.

[0025] To sum up, the mold for semiconductor plastic products that is easy to cool and form, when the molded semiconductor plastic product needs to be cooled, the cooling water is transported to the lower cooling chamber 2 through the water inlet pipe 10, and enters the upper cooling chamber 8 through the water inlet hole 5, the telescopic tube 6 and the water outlet hole 9, so that the water flow cools the lower mold 1, the upper mold 7 and the molded semiconductor plastic product at the same time, thereby facilitating the cooling of the injection-molded semiconductor plastic product, so that the molded semiconductor plastic product is cooled faster, avoiding the need for the cooling water entering during cooling to cool the lower mold 1, the injection-molded semiconductor plastic product and the upper mold 7 in turn, resulting in the temperature of the upper mold 7 affecting the cooling speed of the molded semiconductor plastic product, and is used to solve the problems raised in the above-mentioned background technology.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0027] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A mold for semiconductor plastic products that is easy to cool and form, comprising a lower mold (1), characterized in that: The lower mold (1) has a lower cooling cavity (2) formed inside, a mounting sleeve (3) is fixedly arranged inside the lower cooling cavity (2), a connecting plate (4) is fixedly arranged at the bottom of the mounting sleeve (3), a water inlet hole (5) is penetrated through the top of the connecting plate (4), a telescopic tube (6) is installed on the top of the connecting plate (4), an upper mold (7) is installed on the top of the telescopic tube (6), an upper cooling cavity (8) is formed inside the upper mold (7), a water outlet hole (9) is penetrated through the lower side wall of the upper cooling cavity (8), a water inlet pipe (10) is fixedly arranged on the front side of the lower mold (1), and a water outlet pipe (11) is fixedly arranged on the front side of the upper mold (7).

2. A mold for semiconductor plastic products that is easy to cool and form according to claim 1, characterized in that: The telescopic pipe (6) comprises a lower pipe (61), a middle pipe (62) and an upper pipe (63); the lower pipe (61) is fixedly mounted on the top of the connecting plate (4); the middle pipe (62) is slidably arranged on the surface of the lower pipe (61); the middle pipe (62) is slidably arranged on the surface of the middle pipe (62); and the upper pipe (63) is fixedly mounted on the upper mold (7).

3. A mold for semiconductor plastic products that is easy to cool and form according to claim 1, characterized in that: The bottom of the upper mold (7) is fixedly provided with an alignment column (12), and the top of the lower mold (1) is provided with an alignment groove (13), and the alignment groove (13) and the alignment column (12) are matched.

4. A mold for semiconductor plastic products that is easy to cool and form according to claim 1, characterized in that: The water inlet pipe (10) and the water outlet pipe (11) are both made of metal material; the water inlet pipe (10) is connected to the lower cooling chamber (2), and the water outlet pipe (11) is connected to the upper cooling chamber (8).

5. A mold for semiconductor plastic products that is easy to cool and form according to claim 2, characterized in that: The inner diameter of the lower pipe (61) is the same as the aperture of the water inlet hole (5), the aperture of the water inlet hole (5) is the same as the aperture of the water outlet hole (9), and the lower pipe (61) is vertically aligned with the water inlet hole (5) and the water outlet hole (9).

6. A mold for semiconductor plastic products that is easy to cool and form according to claim 3, characterized in that: The number of the alignment posts (12) and the number of the alignment slots (13) are both four, and the four alignment posts (12) and the four alignment slots (13) are all symmetrically distributed.

7. A mold for semiconductor plastic products that is easy to cool and form according to claim 1, characterized in that: The number of the telescopic tubes (6) is two, and the two telescopic tubes (6) are symmetrically distributed. The telescopic tubes (6) are made of stainless steel.

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