Heat dissipation device, refrigeration device and reagent storage system

Abstract

The utility model relates to a heat dissipation device, a refrigeration device and a reagent storage system. The heat dissipation device is arranged on one side of a reagent storage device and used for adjusting the temperature of a stored reagent, the heat dissipation device comprises a shell, the shell is provided with an air inlet and an air outlet, and the air inlet and the air outlet are arranged at intervals in the extending direction of the shell and form a heat dissipation air channel; a containing cavity used for containing the semiconductor refrigeration unit is formed in the shell, and at least part of the containing cavity is located in the heat dissipation air channel. The air inlet mechanism is arranged at the air inlet and used for sucking environmental air into the heat dissipation air duct through the air inlet, so that the environmental air dissipates heat of the hot end of the semiconductor refrigeration unit through the containing cavity; the air supply mechanism is arranged at the air outlet and used for discharging heat of the hot end of the semiconductor refrigeration unit through the air outlet. According to the scheme, ventilation and heat dissipation can be conducted on the semiconductor refrigeration unit through the environment temperature, and the refrigeration effect of the semiconductor refrigeration unit can be greatly improved.

Description

Technical Field

[0001] The present application relates to the technical field of immunoassay equipment, and in particular to a heat dissipation device, a refrigeration device and a reagent storage system. Background Art

[0002] Since the reagents used for chemiluminescence immunoassay detection need to be refrigerated and kept warm, a refrigeration device is usually required to cool and dissipate heat in the reagent compartment. Semiconductor refrigeration chips are usually used to cool the reagents. The semiconductor refrigeration chip has a heating end and a cooling end. When powered on, the cooling end will cool and the heating end will heat. However, if the heating end cannot take out the heat in time, the cooling effect of the cooling end will be seriously reduced. Therefore, optimizing the heat dissipation of the refrigeration device is the key to improving the cooling effect of the semiconductor refrigeration chip.

[0003] In the related technology, the heat dissipation device includes a shell, in which a semiconductor refrigeration plate and a fan are arranged. The fan is arranged at the heating end of the semiconductor refrigeration plate. The heat at the heating end of the semiconductor refrigeration plate is transferred to the heat dissipation fins. The heat on the heat dissipation fins is blown out by the action of the fan to achieve heat dissipation of the semiconductor refrigeration plate.

[0004] However, the above scheme mainly utilizes the air inside the shell to dissipate heat from the semiconductor refrigeration chip. When the temperature inside the shell is often higher than the ambient temperature, this will greatly reduce the heat dissipation effect of the semiconductor refrigeration chip, resulting in the refrigeration effect of the semiconductor refrigeration chip cannot be fully exerted. Utility Model Content

[0005] In order to solve or partially solve the problems existing in the related art, the present application provides a heat dissipation device, a refrigeration device and a reagent storage system, which can use the ambient temperature to ventilate and dissipate heat for the semiconductor refrigeration unit, thereby greatly improving the refrigeration effect of the semiconductor refrigeration unit.

[0006] In a first aspect, the present application provides a heat dissipation device, which is arranged on one side of a reagent storage device and is used to adjust the temperature of the stored reagent. The heat dissipation device includes:

[0007] A housing, wherein the housing has an air inlet and an air outlet, wherein the air inlet and the air outlet are arranged at intervals along the extension direction of the housing and form a heat dissipation duct; and the housing has a receiving cavity for receiving a semiconductor refrigeration unit, wherein at least a part of the receiving cavity is located in the heat dissipation duct;

[0008] An air inlet mechanism, which is disposed at the air inlet and is used to draw ambient air into the heat dissipation air duct through the air inlet, so that the ambient air dissipates heat to the hot end of the semiconductor refrigeration unit through the accommodating cavity;

[0009] An air supply mechanism is arranged at the air outlet and is used to discharge the heat of the hot end of the semiconductor refrigeration unit through the air outlet.

[0010] As an optional embodiment, the shell further has a mounting opening, and the mounting opening is communicated with the heat dissipation duct to form the accommodating cavity.

[0011] As an optional embodiment, the semiconductor refrigeration unit includes a semiconductor refrigeration sheet and heat dissipation fins, wherein the cold end of the semiconductor refrigeration sheet faces the installation port, and the hot end faces the heat dissipation duct and is connected to the heat dissipation fins.

[0012] As an optional embodiment, the heat dissipation fins are arranged along the air flow direction in the heat dissipation duct.

[0013] As an optional embodiment, the semiconductor refrigeration units are provided in plurality, the plurality of semiconductor refrigeration units are arranged along the air flow direction in the heat dissipation duct, and the cold sides of the plurality of semiconductor refrigeration units are closely attached to the bottom of the reagent storage device.

[0014] As an optional embodiment, the air inlet mechanism includes a first fan, and the air suction side of the first fan is arranged toward the air inlet; and / or the air supply mechanism includes a second fan, and the air outlet side of the second fan is arranged toward the air outlet.

[0015] As an optional embodiment, the air inlet mechanism also includes a dustproof structure, which includes a dustproof cover arranged on the air inlet and a dustproof net movably arranged in the dustproof cover; and / or, the air supply mechanism also includes a guide cover, which is arranged on the air outlet and is used to guide the heat of the air outlet away from the air inlet.

[0016] A second aspect of the present application provides a refrigeration device, comprising:

[0017] A heat dissipation device, wherein the heat dissipation device is the heat dissipation device described above;

[0018] A semiconductor refrigeration unit is accommodated in the accommodating cavity.

[0019] A third aspect of the present application provides a reagent storage system, comprising:

[0020] Reagent storage device;

[0021] A refrigeration device, wherein the refrigeration device is the refrigeration device described above, and the cold end of the semiconductor refrigeration unit is arranged on one side of the reagent storage device.

[0022] As an alternative embodiment:

[0023] The bottom of the reagent storage device is connected to a flow guide pipe;

[0024] The heat dissipation device also includes a condensed water collection box, which is arranged on the side wall of the shell, and a collection port of the condensed water collection box is arranged opposite to the guide pipe to collect condensed water generated by the reagent storage device.

[0025] The technical solution provided by this application may have the following beneficial effects:

[0026] The present application forms a heat dissipation duct with a certain extension length inside the shell between the air inlet and the air outlet by setting air inlets and air outlets spaced apart along the extension direction on the shell, so that the wind direction in the heat dissipation duct is unidirectional, the air flow is continuous and unimpeded, and is not affected by air flow in other directions, which can greatly improve the heat dissipation effect; then an air inlet mechanism and an air supply mechanism are respectively set at the air inlet and the air outlet, and the ambient air is sucked into the heat dissipation duct through the air inlet through the air inlet mechanism, so that the ambient air dissipates the heat of the hot end of the semiconductor refrigeration unit through the accommodating cavity, and then the heat of the hot end of the semiconductor refrigeration unit is discharged through the air outlet through the air supply mechanism, so as to achieve the heat dissipation of the hot end of the semiconductor refrigeration unit. Therefore, the present application can use the ambient temperature to ventilate and dissipate the heat of the semiconductor refrigeration unit, which can greatly improve the refrigeration effect of the semiconductor refrigeration unit.

[0027] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The above and other objects, features and advantages of the present application will become more apparent by describing in more detail exemplary embodiments of the present application in conjunction with the accompanying drawings, wherein the same reference numerals generally represent the same components in the exemplary embodiments of the present application.

[0029] Figure 1 is an exploded diagram of a reagent storage system shown in an embodiment of the present application;

[0030] Figure 2 is a schematic diagram of the structure of a reagent storage system shown in an embodiment of the present application;

[0031] Figure 3 yes Figure 2 Section view in the AA direction;

[0032] Figure 4 yes Figure 2 Cross-sectional view in the middle BB direction;

[0033] Figure 5 yes Figure 2 Right view of .

[0034] Reference numerals:

[0035] 1. Shell; 10. Air inlet; 11. Air outlet; 12. Heat dissipation duct; 13. Accommodation cavity; 14. Installation port; 2. Semiconductor refrigeration unit; 20. Semiconductor refrigeration sheet; 21. Heat dissipation fin; 3. Air inlet mechanism; 30. First fan; 31. Dust-proof structure; 310. Dust cover; 311. Dust net; 4. Air supply mechanism; 40. Second fan; 41. Air guide cover; 5. Reagent storage device; 50. Air guide pipe; 6. Condensate collection box. DETAILED DESCRIPTION

[0036] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0037] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0038] In the description of the present application, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship, are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0039] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0040] In the related technology, the heat dissipation device includes a shell, in which a semiconductor refrigeration plate and a fan are arranged. The fan is arranged at the heating end of the semiconductor refrigeration plate. The heat at the heating end of the semiconductor refrigeration plate is transferred to the heat dissipation fins. The heat on the heat dissipation fins is blown out by the action of the fan to achieve heat dissipation of the semiconductor refrigeration plate.

[0041] However, the above scheme mainly utilizes the air inside the shell to dissipate heat from the semiconductor refrigeration chip. When the temperature inside the shell is often higher than the ambient temperature, this will greatly reduce the heat dissipation effect of the semiconductor refrigeration chip, resulting in the refrigeration effect of the semiconductor refrigeration chip cannot be fully exerted.

[0042] In view of the above problems, an embodiment of the present application provides a heat dissipation device that can utilize the ambient temperature to ventilate and dissipate heat for a semiconductor refrigeration unit, thereby greatly improving the refrigeration effect of the semiconductor refrigeration unit.

[0043] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0044] Figure 1 is an exploded diagram of a reagent storage system shown in an embodiment of the present application; Figure 2 is a schematic diagram of the structure of a reagent storage system shown in an embodiment of the present application; Figure 3 yes Figure 2 Section view along AA direction.

[0045] See also Figures 1 to 3 The embodiment of the present application provides a heat dissipation device, which is arranged on one side of a reagent storage device 5 and is used to adjust the temperature of the stored reagent; and the heat dissipation device includes a shell 1, an air inlet mechanism 3 and an air supply mechanism 4, the shell 1 has an air inlet 10 and an air outlet 11, the air inlet 10 and the air outlet 11 are arranged at intervals along the extension direction of the shell 1 and form a heat dissipation duct 12; and the shell 1 has a accommodating cavity 13 for accommodating a semiconductor refrigeration unit 2, and the accommodating cavity 13 is at least partially located in the heat dissipation duct 12; the air inlet mechanism 3 is arranged at the air inlet 10, and is used to suck ambient air into the heat dissipation duct 12 through the air inlet 10, so that the ambient air dissipates the heat of the hot end of the semiconductor refrigeration unit 2 through the accommodating cavity 13; the air supply mechanism 4 is arranged at the air outlet 11, and is used to discharge the heat of the hot end of the semiconductor refrigeration unit 2 through the air outlet 11.

[0046] The heat dissipation device in the embodiment of the present application can be arranged at the bottom of the reagent storage device 5 to adjust the temperature of the stored reagents without affecting the taking and placing of the stored reagents.

[0047] The housing 1 in the embodiment of the present application may include a base and a shell cover, the shell cover is arranged on the base, and an inner cavity is formed between the shell cover and the base, the base is provided with an air inlet 10 and an air outlet 11, the air inlet 10 and the air outlet 11 are arranged at intervals along the extension direction of the base, and are connected to the inner cavity. The inner cavity between the air inlet 10 and the air outlet 11 forms a heat dissipation duct 12.

[0048] The accommodating chamber 13 in the shell 1 of the embodiment of the present application is at least partially located in the heat dissipation duct 12. The accommodating chamber 13 may be located between the air inlet 10 and the air outlet 11, or may be located upstream of the air inlet 10 or downstream of the air outlet 11. The present application does not limit the position of the accommodating chamber 13, but the space of the accommodating chamber 13 at least partially overlaps with the space of the heat dissipation duct 12, so that the airflow in the heat dissipation duct 12 can pass through the semiconductor refrigeration unit 2 in the accommodating chamber 13 to dissipate heat to the semiconductor refrigeration unit 2.

[0049] The embodiment of the present application forms a heat dissipation duct 12 with a certain extension length inside the shell 1 between the air inlet 10 and the air outlet 11 by setting an air inlet 10 and an air outlet 11 spaced apart along the extension direction on the shell 1, so that the wind direction in the heat dissipation duct 12 is unidirectional, the air flow is continuous and unimpeded, and is not affected by air flow in other directions, which can greatly improve the heat dissipation effect; an air inlet mechanism 3 and an air supply mechanism 4 are respectively set at the air inlet 10 and the air outlet 11, and the ambient air is sucked into the heat dissipation duct 12 through the air inlet 10 by the air inlet mechanism 3, so that the ambient air dissipates the heat of the hot end of the semiconductor refrigeration unit 2 through the accommodating cavity 13, and then the heat of the hot end of the semiconductor refrigeration unit 2 is discharged through the air outlet 11 by the air supply mechanism 4, so as to achieve the heat dissipation of the hot end of the semiconductor refrigeration unit 2. Therefore, the embodiment of the present application can use the ambient temperature to ventilate and dissipate the heat of the semiconductor refrigeration unit 2, which can greatly improve the refrigeration effect of the semiconductor refrigeration unit.

[0050] As an alternative embodiment, see Figure 1 and Figure 3 The housing 1 further has a mounting opening 14 , which is connected to the heat dissipation duct 12 to form an accommodating cavity 13 .

[0051] The installation opening 14 of the embodiment of the present application is preferably opposite to the heat dissipation duct 12, that is, the installation opening 14 is located between the air inlet 10 and the air outlet 11, and the space of the accommodating cavity 13 and the space of the heat dissipation duct 12 are basically completely overlapped, which can more fully realize the heat dissipation of the semiconductor refrigeration unit 2.

[0052] As a preferred embodiment, see Figure 4 The semiconductor refrigeration unit 2 includes a semiconductor refrigeration sheet 20 and a heat dissipation fin 21 . The cold end of the semiconductor refrigeration sheet 20 faces the installation opening 14 , and the hot end faces the heat dissipation duct 12 , and is connected to the heat dissipation fin 21 .

[0053] Semiconductor cooling chips are also called thermoelectric cooling chips, which have a hot end and a cold end. When powered on, the cold end will cool, while the hot end will generate heat. In the embodiment of the present application, the cold end of the semiconductor cooling chip 20 is directed toward the mounting port 14, so that the cold end of the semiconductor cooling chip 20 is connected to a device to be cooled, such as a reagent storage device 5, so as to cool the reagent storage device 5; the heat generated by the hot end is transferred by arranging the heat dissipation fin 21 at the hot end of the semiconductor cooling chip 20, and the heat dissipation fin 21 is placed in the heat dissipation air duct 12, and the airflow in the heat dissipation air duct 12 takes away the heat on the heat dissipation fin 21, thereby achieving heat dissipation of the hot end of the semiconductor cooling chip 20 and improving the heat dissipation efficiency.

[0054] As a preferred embodiment, the heat dissipation fins 21 are arranged along the air flow direction in the heat dissipation duct 12 .

[0055] See Figure 3 The airflow direction in the heat dissipation duct 12 flows from left to right, and the heat dissipation fins 21 are also distributed from left to right, thereby increasing the contact area between the heat dissipation fins 21 and the airflow in the heat dissipation duct 12, further improving the heat dissipation efficiency.

[0056] As an optional embodiment, a plurality of semiconductor refrigeration units 2 are provided, and the plurality of semiconductor refrigeration units 2 are arranged along the air flow direction in the heat dissipation duct 12 , and the cold sides of the plurality of semiconductor refrigeration units 2 are closely attached to the bottom of the reagent storage device 5 .

[0057] The embodiment of the present application realizes efficient regulation of the temperature of the stored reagent in the reagent storage device 5 by providing a plurality of semiconductor refrigeration units.

[0058] As an alternative embodiment, see Figure 1 and Figure 3 The air inlet mechanism 3 includes a first fan 30 , and the air suction side of the first fan 30 is arranged toward the air inlet 10 .

[0059] The first fan 30 in the embodiment of the present application includes a housing and blades disposed in the housing. The front and back of the housing are respectively an air outlet side and an air suction side. The air suction side generates negative pressure toward the air inlet 10 to suck ambient air into the housing through the air inlet 10, and the air outlet side faces the heat dissipation duct 12 to blow ambient air from the air outlet side into the heat dissipation duct 12.

[0060] As a preferred embodiment, see Figure 1 The air inlet mechanism 3 also includes a dustproof structure 31 , which includes a dustproof cover 310 disposed on the air inlet 10 , and a dustproof net 311 movably disposed in the dustproof cover 310 .

[0061] Since the suction side of the first fan 30 can generate a relatively large negative pressure suction, dust in the external environment will also be sucked in. In order to prevent the inhalation of dust, the embodiment of the present application sets a dustproof structure 31 at the air inlet 10, and prevents dust from entering the air inlet 10 through a dustproof net 311; and the dustproof net 311 is movably arranged in the dustproof cover 310, which is convenient for removing the dustproof net 311 for cleaning, thereby avoiding the problem of clogging of the dustproof cover 310 and poor ventilation caused by long-term use of the air inlet 10.

[0062] As an alternative embodiment, see Figure 1 and Figure 3 The air supply mechanism 4 includes a second fan 40 , and the air outlet side of the second fan 40 is arranged toward the air outlet 11 .

[0063] The second fan 40 in the embodiment of the present application includes a housing and blades arranged in the housing. The front and back of the housing are respectively an air outlet side and an air suction side. The air suction side faces the heat dissipation air duct 12 to absorb the heat at the hot end of the semiconductor refrigeration unit 2 into the housing, and the air outlet side faces the air outlet 11 to discharge the heat at the hot end of the semiconductor refrigeration unit 2 through the air outlet 11.

[0064] As a preferred embodiment, see Figures 1 to 3 The air supply mechanism 4 further includes a guide cover 41 , which is disposed at the air outlet 11 and is used to guide the heat of the air outlet 11 in a direction away from the air inlet 10 .

[0065] In the embodiment of the present application, a deflector 41 is provided to guide the heat of the air outlet 11 away from the air inlet 10, thereby preventing the hot air blown out from the air outlet 11 from being sucked into the air inlet mechanism 3 and affecting the heat dissipation of the hot end of the semiconductor refrigeration unit 2.

[0066] Corresponding to the aforementioned application function implementation device embodiment, the present application also provides a refrigeration device and corresponding embodiments.

[0067] The present application embodiment provides a refrigeration device, see Figures 1 to 3 , including a heat dissipation device and a semiconductor refrigeration unit 2, the heat dissipation device is the aforementioned heat dissipation device, and the semiconductor refrigeration unit 2 is accommodated in the accommodating cavity 13.

[0068] The refrigeration device of the embodiment of the present application performs refrigeration through the semiconductor refrigeration unit 2, and dissipates heat from the semiconductor refrigeration unit 2 through the heat dissipation device. The semiconductor refrigeration unit 2 is accommodated in the accommodating cavity 13 of the heat dissipation device. When in use, the cold end of the semiconductor refrigeration unit 2 is placed close to the equipment to be refrigerated, such as the reagent storage device 5, to refrigerate the reagent storage device 5. Since the hot end of the semiconductor refrigeration unit 2 generates heat during the refrigeration process, the embodiment of the present application dissipates heat from the hot end of the semiconductor refrigeration unit 2 through the heat dissipation device. Specifically, an air inlet 10 and an air outlet 11 can be arranged on the housing 1 at intervals along its extension direction, so as to form a heat dissipation duct 12 with a certain extension length inside the housing 1 between the air inlet 10 and the air outlet 11, so that the wind direction in the heat dissipation duct 12 is unidirectional, the air flow is continuous and unimpeded, and is not affected by airflow in other directions, which can greatly improve the heat dissipation effect; then an air inlet mechanism 3 and an air supply mechanism 4 are respectively arranged at the air inlet 10 and the air outlet 11, and the ambient air is sucked into the heat dissipation duct 12 through the air inlet 10 through the air inlet mechanism 3, so that the ambient air dissipates the heat of the hot end of the semiconductor refrigeration unit 2 through the accommodating cavity 13, and then the heat of the hot end of the semiconductor refrigeration unit 2 is discharged through the air outlet 11 through the air supply mechanism 4, so as to achieve the heat dissipation of the hot end of the semiconductor refrigeration unit 2. Therefore, the embodiment of the present application can use the ambient temperature to ventilate and dissipate the heat of the semiconductor refrigeration unit 2, which can greatly improve the refrigeration effect of the semiconductor refrigeration unit.

[0069] Corresponding to the aforementioned application function implementation device embodiment, the present application also provides a reagent storage system and corresponding embodiments.

[0070] The present application embodiment provides a reagent storage system, see Figures 1 to 3 , including a reagent storage device 5 and a refrigeration device, the refrigeration device is the aforementioned refrigeration device, and the cold end of the semiconductor refrigeration unit 2 is arranged on one side of the reagent storage device 5.

[0071] The reagent storage system of the embodiment of the present application includes a reagent storage device 5 and a refrigeration device, and the reagent storage device 5 is refrigerated by the refrigeration device to maintain the reagent storage temperature. Among them, the cold end of the semiconductor refrigeration unit 2 in the refrigeration device is connected to the reagent storage device 5, and the reagent storage device 5 is refrigerated by the cold energy generated by the cold end of the semiconductor refrigeration unit 2. Since the hot end of the semiconductor refrigeration unit 2 generates heat during the refrigeration process, the embodiment of the present application dissipates heat from the hot end of the semiconductor refrigeration unit 2 through a heat dissipation device. Specifically, an air inlet 10 and an air outlet 11 can be arranged on the housing 1 at intervals along its extension direction, so as to form a heat dissipation duct 12 with a certain extension length inside the housing 1 between the air inlet 10 and the air outlet 11, so that the wind direction in the heat dissipation duct 12 is unidirectional, the air flow is continuous and unimpeded, and is not affected by airflow in other directions, which can greatly improve the heat dissipation effect; then an air inlet mechanism 3 and an air supply mechanism 4 are respectively arranged at the air inlet 10 and the air outlet 11, and the ambient air is sucked into the heat dissipation duct 12 through the air inlet 10 through the air inlet mechanism 3, so that the ambient air dissipates the heat of the hot end of the semiconductor refrigeration unit 2 through the accommodating cavity 13, and then the heat of the hot end of the semiconductor refrigeration unit 2 is discharged through the air outlet 11 through the air supply mechanism 4, so as to achieve the heat dissipation of the hot end of the semiconductor refrigeration unit 2. Therefore, the embodiment of the present application can use the ambient temperature to ventilate and dissipate the heat of the semiconductor refrigeration unit 2, which can greatly improve the refrigeration effect of the semiconductor refrigeration unit.

[0072] In addition, the heat dissipation device in the embodiment of the present application can be arranged at the bottom of the reagent storage device 5 to adjust the temperature of the stored reagent without affecting the taking and placing of the stored reagent.

[0073] As an alternative embodiment, see Figure 5 The bottom of the reagent storage device 5 is connected to a guide tube 50; the heat dissipation device also includes a condensed water collection box 6, which is arranged on the side wall of the shell 1, and the collection port of the condensed water collection box 6 is arranged opposite to the guide tube 50 to collect the condensed water generated by the reagent storage device 5.

[0074] As the semiconductor refrigeration unit 2 cools the reagent storage device 5, condensed water will be generated in the reagent storage device 5. The condensed water will gather at the bottom and then be discharged into the condensed water collection box 6 through the guide pipe 50, so as to collect the condensed water, prevent the condensed water from dripping and affecting the equipment, and avoid affecting the stability of the reagent in the reagent storage device 5.

[0075] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the various embodiments have their own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application can be adjusted in order, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.

[0076] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A heat dissipation device, arranged on one side of a reagent storage device (5), for adjusting the temperature of the stored reagent, characterized in that: The heat dissipation device comprises: A shell (1), the shell (1) having an air inlet (10) and an air outlet (11), the air inlet (10) and the air outlet (11) being arranged at intervals along the extension direction of the shell (1) to form a heat dissipation duct (12); and the shell (1) having a receiving cavity (13) for receiving a semiconductor refrigeration unit (2), the receiving cavity (13) being at least partially located in the heat dissipation duct (12); An air inlet mechanism (3), the air inlet mechanism (3) being arranged at the air inlet (10) and being used to draw ambient air into the heat dissipation air duct (12) via the air inlet (10), so that the ambient air dissipates heat from the hot end of the semiconductor refrigeration unit (2) via the accommodating cavity (13); An air supply mechanism (4), the air supply mechanism (4) being arranged at the air outlet (11) and being used for discharging heat from the hot end of the semiconductor refrigeration unit (2) through the air outlet (11).

2. The heat dissipation device according to claim 1, characterized in that: The housing (1) further comprises a mounting opening (14), wherein the mounting opening (14) is in communication with the heat dissipation air duct (12) and forms the accommodating cavity (13).

3. The heat dissipation device according to claim 2, characterized in that: The semiconductor refrigeration unit (2) comprises a semiconductor refrigeration sheet (20) and a heat dissipation fin (21); the cold end of the semiconductor refrigeration sheet (20) faces the installation opening (14), the hot end faces the heat dissipation air duct (12), and is connected to the heat dissipation fin (21).

4. The heat dissipation device according to claim 3, characterized in that: The heat dissipation fins (21) are arranged along the air flow direction in the heat dissipation air duct (12).

5. The heat dissipation device according to claim 1, characterized in that: The semiconductor refrigeration units (2) are provided in plurality, and the plurality of semiconductor refrigeration units (2) are arranged along the air flow direction in the heat dissipation air duct (12), and the cold sides of the plurality of semiconductor refrigeration units (2) are closely attached to the bottom of the reagent storage device (5).

6. The heat dissipation device according to claim 1, characterized in that: The air inlet mechanism (3) comprises a first fan (30), the air suction side of the first fan (30) being arranged toward the air inlet (10); and / or the air supply mechanism (4) comprises a second fan (40), the air outlet side of the second fan (40) being arranged toward the air outlet (11).

7. The heat dissipation device according to claim 6, characterized in that: The air inlet mechanism (3) further comprises a dustproof structure (31), wherein the dustproof structure (31) comprises a dustproof cover (310) arranged on the air inlet (10), and a dustproof net (311) movably arranged in the dustproof cover (310); and / or the air supply mechanism (4) further comprises a guide cover (41), wherein the guide cover (41) is arranged on the air outlet (11) and is used to guide the heat of the air outlet (11) in a direction away from the air inlet (10).

8. A refrigeration device, characterized in that: include: A heat dissipation device, wherein the heat dissipation device is the heat dissipation device according to any one of claims 1 to 7; A semiconductor refrigeration unit (2), wherein the semiconductor refrigeration unit (2) is accommodated in the accommodating cavity (13).

9. A reagent storage system, characterized in that: include: Reagent storage device (5); A refrigeration device, wherein the refrigeration device is the refrigeration device according to claim 8, and the cold end of the semiconductor refrigeration unit (2) is arranged on one side of the reagent storage device (5).

10. The reagent storage system according to claim 9, characterized in that: The bottom of the reagent storage device (5) is connected to a flow guide tube (50); The heat dissipation device also includes a condensed water collection box (6), which is arranged on the side wall of the shell (1), and the collection port of the condensed water collection box (6) is arranged opposite to the guide pipe (50) to collect the condensed water generated by the reagent storage device (5).

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