Semiconductor target material size detection device
By designing a semiconductor target size detection device, using workbench rotation and electric push rod drive, combined with the marking function of the ring electronic artboard, the problems of repeated detection and wear in curved target detection are solved, and automatic detection and efficient production are achieved.
Patent Information
- Application Number
- CN202421647768.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-07-12
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-07-12
AI Technical Summary
In the prior art, when detecting curved targets, the operator needs to rotate the handheld test tool simultaneously, which can easily lead to repeated detection and product wear.
A semiconductor target size detection device is designed. Through the rotation of the workbench and the driving of the electric push rod, combined with the marking function of the ring electronic artboard, the automatic detection and marking of the curved target material is realized to avoid repeated detection.
Automatic detection of curved target materials is realized, product wear caused by repeated detection is avoided, and detection efficiency and product quality are improved.
Smart Images

Figure CN222761558U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of target material processing, in particular to a semiconductor target material size detection device. Background Art
[0002] The targets used in the semiconductor and solar energy industries are generally round targets, rectangular planar targets, and cylindrical rotating targets. These targets can be coated evenly on flat substrates, but cannot meet the requirements of preparing films with uniform film thickness and uniform photoelectric properties on curved substrates. Curved targets can achieve large-area uniform coating on curved substrates, improve the uniformity of coating, and improve the performance of targets. At present, the detection method for the curved surface structure of curved targets is operated by manually holding a curved surface gauge. Based on observation, it is judged whether there is a light-transmitting gap between the curved surface target and the curved surface gauge to determine whether the curved surface target product is a qualified product. The current manual detection method requires the operator to rotate the curved surface gauge synchronously with the gauge, which has a high firmness. Therefore, the detection method of rotating the curved surface target is usually adopted. Since the operator needs to rotate the curved surface target, it is easy to forget the starting detection position, resulting in repeated detection of the same area of the curved surface target by the curved surface gauge, resulting in increased wear on the curved surface of the product. Summary of the invention
[0003] The technical problem to be solved by the utility model is to provide a detection device capable of marking the area where the detection of the curved target material is completed, so as to avoid repeated detection of the curved surface area of the curved target material, which may cause an increase in the wear of the product.
[0004] In order to solve the above technical problems, the present invention is implemented through the following technical solutions: a semiconductor target size detection device, including a workbench, a carrier, a top plate, an electric push rod, a gauge, a pressure plate, a brush, a support ring, a transmission screw, a transmission sleeve, a limit clamp, a push plate, a support column, an annular electronic drawing board and a base, four support columns are fixedly installed on the base in a rectangular distribution, the top plate is fixedly installed on the top of the support column, the workbench is rotatably installed on the base, the cylinder body of the electric push rod is fixedly installed on the top plate, the pressure plate is fixedly installed on the actuator rod of the electric push rod, the pressure plate is fixedly connected to the center position of the gauge, the brush is fixedly installed on the left and right ends of the gauge, the support ring is fixedly installed on the workbench, and the annular electronic drawing board is fixedly embedded in the support ring The paintbrush can be pressed on the annular electronic drawing board in the card slot, and the carrier is fixedly mounted on the workbench, and the top of the limit clamp ring is provided with a limit protrusion in an annular array, and the top surface of the carrier is provided with a card slot matching the limit protrusion, the limit clamp ring is slidably mounted in the card slot set on the top surface of the carrier, and the bottom of the carrier is provided with a guide groove, the push plate is slidably mounted in the guide groove, and the push plate is also fixedly connected to the limit clamp ring, the transmission sleeve is fixedly mounted on the top of the workbench, and the transmission screw is threadedly installed in the transmission sleeve, and a ball bearing is fixedly mounted at the center position of the push plate, and the upper part of the transmission screw is fixedly connected to the rotating body of the ball bearing, the limit clamp ring, the support ring and the ball bearing are coaxially arranged, and the bottom surface of the inspection fixture is arranged as an arc-shaped test surface.
[0005] Preferably, a first guide rod is fixedly mounted on the bottom of the push plate, a first guide sleeve is fixedly mounted on the top surface of the workbench, and the first guide rod is slidably mounted in the first guide sleeve.
[0006] Preferably, a hand wheel is fixedly sleeved and installed on the bottom of the transmission screw.
[0007] Preferably, both side edges at the inlet of the support ring are arranged as a first bevel structure.
[0008] Preferably, a second guide rod is fixedly installed on the top of the pressure plate, a second guide sleeve is fixedly installed on the top plate, the second guide rod is slidably installed in the second guide sleeve, a limit stop ring is slidably installed on the second guide rod, a clamping bolt for clamping and fixing it on the second guide rod is threadedly installed on the limit stop ring, and the limit stop ring can contact and limit the second guide sleeve.
[0009] Preferably, the top of the inner surface of the limiting protrusion is arranged as a second bevel structure.
[0010] Compared with the prior art, the utility model has the following advantages: the detection device does not require the operator to hold a handheld inspection tool to detect the top curved surface of the target material, which has the advantage of labor-saving operation. After the target material is fixed, it is rotated 90° along with the workbench, and a 90° arc is drawn on the circular electronic drawing board with a brush, and the top curved surface of the target material is fully detected, which can avoid the problem of increased product wear caused by repeated detection of the top curved surface of the target material. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] The utility model is further described below in conjunction with the accompanying drawings.
[0012] Figure 1 It is a structural schematic diagram of the utility model.
[0013] Figure 2 yes Figure 1 Schematic diagram of the enlarged structure at M.
[0014] Figure 3 It is a structural schematic diagram of a limit clamp. DETAILED DESCRIPTION
[0015] The utility model is described in detail below in conjunction with specific implementation methods:
[0016] like Figures 1 to 3A semiconductor target size detection device shown in the figure includes a workbench 1, a carrier 2, a top plate 3, an electric push rod 31, a gauge 4, a pressure plate 41, a brush 43, a support ring 5, a transmission screw 6, a transmission sleeve 61, a limit clamp 63, a push plate 64, a support column 7, an annular electronic drawing board 8 and a base 9. Four support columns 7 are distributed in a rectangular shape and fixedly installed on the base 9. The top plate 3 is fixedly installed on the top of the support column 7. The workbench 1 is rotatably installed on the base 9. The cylinder body of the electric push rod 31 is fixedly installed on the top plate 3. The pressure plate 41 is fixedly installed on the execution rod of the electric push rod 31. The pressure plate 41 is fixedly connected to the center position of the gauge 4. The brush 43 is fixedly installed on the left and right ends of the gauge 4. The support ring 5 is fixedly installed on the workbench 1. The annular electronic drawing board 8 is fixedly embedded in the card slot of the support ring 5. 3 can be pressed on the annular electronic drawing board 8, the carrier 2 is fixedly installed on the workbench 1, the top of the limit snap ring 63 is provided with a limit protrusion 22 in an annular array, the top surface of the carrier 2 is provided with a groove matching the limit protrusion 22, the limit snap ring 63 is slidably installed in the groove provided on the top surface of the carrier 2, the bottom of the carrier 2 is provided with a guide groove 60, the push plate 64 is slidably installed in the guide groove 60, the push plate 64 is also fixedly connected with the limit snap ring 63, the transmission sleeve 61 is fixedly installed on the top of the workbench 1, the transmission screw 6 is threadedly installed in the transmission sleeve 61, and a ball bearing is fixedly installed at the center of the push plate 64. The upper part of the transmission screw 6 is fixedly connected to the rotating body of the ball bearing, the limit snap ring 63, the support ring 5 and the ball bearing are coaxially arranged, and the bottom surface of the inspection fixture 4 is arranged as an arc-shaped test surface.
[0017] A first guide rod 65 is fixedly installed at the bottom of the push plate 64, and a first guide sleeve 66 is fixedly installed on the top surface of the workbench 1. The first guide rod 65 is slidably installed in the first guide sleeve 66. The first guide rod 65 slides through the top surface of the workbench 1. The coordinated guiding effect of the first guide rod 65 and the first guide sleeve 66 improves the straightness of the push plate 64 and the limit clamp 63 assembly when moving up and down, avoiding the problem of jamming.
[0018] A hand wheel 62 is fixedly sleeved on the bottom of the transmission screw rod 6 , and the hand wheel 62 is used to facilitate the rotation operation of the transmission screw rod 6 .
[0019] The edges on both sides of the entrance of the support ring 5 are both set as a first bevel structure, and the first bevel structure can facilitate the annular electronic drawing board 8 to be easily embedded and installed in the card slot of the support ring 5.
[0020] A second guide rod 33 is fixedly mounted on the top of the pressure plate 41, a second guide sleeve is fixedly mounted on the top plate 3, the second guide rod 33 is slidably mounted in the second guide sleeve, a limit stop ring 34 is slidably mounted on the second guide rod 33, a clamping bolt for clamping and fixing the limit stop ring 34 on the second guide rod 33 is threadedly mounted, the limit stop ring 34 can be contacted and limited with the second guide sleeve, and the coordinated guiding action of the second guide rod 33 and the second guide sleeve can improve the straightness of the push plate 64 when it moves up and down with the electric push rod 31, thereby improving the position accuracy of the contact between the inspection fixture 4 and the target material 10.
[0021] The top of the inner surface of the limiting protrusion 22 is set as a second bevel structure 21, so that the target material 10 can be easily embedded in the limiting clamp ring 63 to form a limiting effect.
[0022] The transmission screw 6 is rotated to push the assembly of the push plate 64 and the limiting clamp ring 63 upward, so that the limiting protrusion 22 of the limiting clamp ring 63 exceeds the top surface of the carrier 2 by 2-3 cm. The target 10 is placed on the top surface of the carrier 2 and is limited by the limiting protrusion 22. The electric push rod 31 is started to push the assembly of the pressing plate 41 and the inspection fixture 4 downward until the arc-shaped test surface of the inspection fixture 4 contacts the top surface of the target 10. The rotating workbench 1 drives the target 10 to rotate synchronously, and the operator observes the inspection fixture 4. Check whether there is a light-transmitting gap between the arc-shaped test surface and the top curved surface of the target material 10. Observe that after the brush 43 draws a 90° arc on the annular electronic drawing board 8, the comprehensive inspection of the top curved surface of the target material 10 is completed. Rotate the transmission screw 6 to push the push plate 64 and the limiting clamp 63 combination to move downward, release the limiting effect of the limiting clamp 63 on the target material 10, so as to facilitate the removal of the target material 10, press the reset button of the annular electronic drawing board 8, and eliminate the arc drawn by the brush 43 on the annular electronic drawing board 8.
Claims
1. A semiconductor target size detection device, characterized in that: The invention comprises a workbench (1), a carrier (2), a top plate (3), an electric push rod (31), a check fixture (4), a pressure plate (41), a brush (43), a support ring (5), a transmission screw (6), a transmission sleeve (61), a limit clamp (63), a push plate (64), a support column (7), an annular electronic drawing board (8) and a base (9), wherein four support columns (7) are arranged in a rectangular shape and fixedly mounted on the base (9), the top plate (3) is fixedly mounted on the top of the support columns (7), and the workbench (1) The electric push rod (31) is rotatably mounted on the base (9), the cylinder of the electric push rod (31) is fixedly mounted on the top plate (3), the pressing plate (41) is fixedly mounted on the actuator rod of the electric push rod (31), the pressing plate (41) is fixedly connected to the center position of the inspection fixture (4), the paintbrush (43) is fixedly mounted on the left and right ends of the inspection fixture (4), the support ring (5) is fixedly mounted on the workbench (1), the annular electronic drawing board (8) is fixedly embedded in the card slot of the support ring (5), and the paintbrush ( 43) can be pressed on the annular electronic drawing board (8), the carrier (2) is fixedly installed on the workbench (1), the top of the limit clamp ring (63) is provided with a limit protrusion (22) in an annular array, the top surface of the carrier (2) is provided with a clamping groove that matches the limit protrusion (22), the limit clamp ring (63) is slidably installed in the clamping groove provided on the top surface of the carrier (2), the bottom of the carrier (2) is provided with a guide groove (60), and the push plate (64) is slidably installed in the guide groove (60), The push plate (64) is also fixedly connected to the limit snap ring (63), the transmission sleeve (61) is fixedly mounted on the top of the workbench (1), the transmission screw (6) is threadedly mounted in the transmission sleeve (61), a ball bearing is fixedly mounted at the center of the push plate (64), the upper part of the transmission screw (6) is fixedly connected to the rotating body of the ball bearing, the limit snap ring (63), the support ring (5) and the ball bearing are coaxially arranged, and the bottom surface of the inspection fixture (4) is arranged as a circular arc test surface.
2. The semiconductor target size detection device according to claim 1, characterized in that: A first guide rod (65) is fixedly mounted on the bottom of the push plate (64), a first guide sleeve (66) is fixedly mounted on the top surface of the workbench (1), and the first guide rod (65) is slidably mounted in the first guide sleeve (66).
3. The semiconductor target size detection device according to claim 1, characterized in that: A hand wheel (62) is fixedly sleeved and mounted on the bottom of the transmission screw rod (6).
4. The semiconductor target size detection device according to claim 1, characterized in that: The edges on both sides of the inlet of the support ring (5) are both arranged as a first bevel structure.
5. The semiconductor target size detection device according to claim 1, characterized in that: A second guide rod (33) is fixedly mounted on the top of the pressure plate (41), a second guide sleeve is fixedly mounted on the top plate (3), the second guide rod (33) is slidably mounted in the second guide sleeve, a limit stop ring (34) is slidably mounted on the second guide rod (33), a clamping bolt for clamping and fixing the limit stop ring (34) on the second guide rod (33) is threadedly mounted, and the limit stop ring (34) can contact and limit the position of the second guide sleeve.
6. The semiconductor target size detection device according to claim 1, characterized in that: The top of the inner surface of the limiting protrusion (22) is arranged as a second bevel structure (21).