Chip surface gluing defect detection equipment

Abstract

The utility model relates to the technical field of chip detection equipment, in particular to chip surface gluing defect detection equipment which comprises a base, two detection channels, a clamping and jacking mechanism and a visual detection device, and each detection channel comprises a first mounting plate and a second mounting plate. The first mounting plate and the second mounting plate are each rotationally provided with a conveying belt, a clamping and jacking mechanism is arranged in each detection channel and located between the first mounting plate and the second mounting plate of the corresponding detection channel, each clamping and jacking mechanism comprises a base support, and the base supports can ascend and descend in the height direction of the base. The visual detection device comprises a 2D camera and a 3D camera, the visual detection device can move in the length direction and the width direction of the base, continuous production can still be achieved through the two detection channels when a certain conveying belt is damaged, products of the other specification can be debugged while detection is conducted, and production efficiency can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of chip detection equipment, and more specifically to a chip surface coating defect detection device. Background Art

[0002] In order to protect the chip from oxidation corrosion, moisture, vibration and heat dissipation, glue is usually applied on the surface of the chip. In order to detect whether the glue on the chip surface has overflowed, special equipment is usually required for detection.

[0003] Our company currently has a chip surface coating defect detection equipment, such as Figure 1 As shown, it includes a base 90, a first mounting plate 91, a second mounting plate 92, a 2D camera 93 and a 3D camera 94. The first mounting plate 91 and the second mounting plate 92 are arranged in parallel on the base 90. A conveyor belt 95 is rotatably installed on the first mounting plate 91 and the second mounting plate 92. The two conveyor belts 95 are synchronously driven. The 2D camera 93 and the 3D camera 94 are movably installed above the first mounting plate 91 and the second mounting plate 92. When detecting the glue-coated chips, multiple glue-coated chips are placed on a tray 96. The two sides of the tray 96 are placed on the first mounting plate 91 and On the conveyor belt 95 of the second mounting plate 92, when the two conveyor belts 95 make synchronous movement, the material tray 96 moves from one side of the base 90 to the other side. It should be noted that when the material tray 96 moves to the middle section of the base 90, the two conveyor belts 95 stand still for a predetermined time. At the same time, the 2D camera 93 and the 3D camera 94 move toward the material tray 96, and the 2D camera 93 and the 3D camera 94 scan and image the chips on the material tray 96 respectively and compare them. Finally, the chip numbers with obvious defects are presented on an external computer to facilitate the processing personnel to remove the defective chips later. However, since the movement of the material tray 96 is driven by the two conveyor belts 95, when one of the conveyor belts 95 is damaged, the chip surface coating defect detection equipment cannot work. In addition, before testing a chip of another specification, the equipment needs to be debugged. Since the chip surface coating defect detection equipment has only one set of channels for moving the material tray 96, debugging can only be started after the detection of this set of chips is completed, affecting production efficiency.

[0004] Therefore, there is a demand for a chip surface coating defect detection device that can continue production even when a conveyor belt is damaged, can debug another specification product while inspecting, and helps to improve production efficiency. Utility Model Content

[0005] The main purpose of the present application is to provide a chip surface coating defect detection device, wherein the chip surface coating defect detection device includes a base, two detection channels arranged at intervals, a plurality of clamping and lifting mechanisms and a visual inspection device, each of the detection channels includes a first mounting plate and a second mounting plate, a conveyor belt is rotatably installed on the opposite side of the first mounting plate and the second mounting plate, and the two conveyor belts rotate synchronously, the clamping and lifting mechanism is detachably connected to the base, each of the detection channels is provided with a clamping and lifting mechanism, each of the clamping and lifting mechanisms is located between the first mounting plate and the second mounting plate of the corresponding detection channel, and each of the clamping and lifting mechanisms includes a support, and the support is mounted on the base The visual inspection device is installed on the base in a liftable manner in the height direction of the base, the visual inspection device includes a 2D camera and a 3D camera, the visual inspection device is movably installed on the base in the length direction and the width direction of the base, and the visual inspection device is located above the two inspection channels. By setting the two inspection channels, when the conveyor belt on one inspection channel is damaged, the other inspection channel can be used to realize the transportation of the material tray. In addition, before the inspection of one inspection channel is about to be completed and another specification of chip needs to be inspected, debugging can be carried out in advance in the other inspection channel. Compared with the existing technology, it has the advantages of continuous production even after a conveyor belt is damaged, debugging of another specification of product during inspection, and help to improve production efficiency.

[0006] Another object of the present application is to provide a chip surface coating defect detection device, wherein the second mounting plate of each detection channel is slidably mounted on the base and close to or away from the first mounting plate, and each detection channel also includes a second rotating motor, a spline shaft and two pulleys, the second rotating motor is fixedly mounted on the first mounting plate, the spline shaft is connected to the rotating shaft of the second rotating motor and rotates with it, one pulley is fixedly mounted on one end of the spline shaft close to the second rotating motor, and the other pulley has a spline groove, and the spline shaft passes through the spline groove, and a conveyor belt is wound around each pulley, and the spline shaft is set to avoid motion interference between the second mounting plate and the spline shaft when it moves.

[0007] In order to achieve at least one of the above-mentioned invention purposes, the present application provides a chip surface glue coating defect detection device, including a base, wherein the chip surface glue coating defect detection device also includes:

[0008] Two detection channels arranged at intervals, each of the detection channels comprises a first mounting plate and a second mounting plate, a conveyor belt is rotatably mounted on one side opposite to the first mounting plate and the second mounting plate, and the two conveyor belts rotate synchronously; and

[0009] A plurality of clamping and lifting mechanisms, each of which is detachably connected to the base, each of which is provided with a clamping and lifting mechanism, each of which is located between the first mounting plate and the second mounting plate of the corresponding detection channel, and each of which includes a support, which is movably mounted on the base in a height direction of the base; and

[0010] A visual inspection device, comprising a 2D camera and a 3D camera, is movably mounted on the base in the length direction and the width direction of the base, and is located above the two inspection channels.

[0011] In one or more embodiments of the present application, the second mounting plate of each of the detection channels is slidably mounted on the base and is close to or away from the first mounting plate.

[0012] In one or more embodiments of the present application, each of the detection channels includes a first rotating motor and a first screw rod, the first screw rod is spirally connected to the second mounting plate, the first rotating motor is arranged on the first mounting plate, and the rotating shaft of the first rotating motor is connected to the first screw rod, and when the first rotating motor rotates, the second mounting plate approaches or moves away from the first mounting plate.

[0013] In one or more embodiments of the present application, the base also includes a slide, two first guide rails and two second guide rails, the two first guide rails are arranged in parallel on the base, the two ends of the slide are slidably set on the two first guide rails, the two detection channels are symmetrically arranged on the slide, and the second mounting plates on the two detection channels are close to each other, the two second guide rails are arranged in parallel on the slide, and the two ends of each second mounting plate are slidably set on the two second guide rails.

[0014] In one or more embodiments of the present application, each of the detection channels also includes a second rotating motor, a spline shaft and two pulleys, the second rotating motor is fixedly mounted on the first mounting plate, the spline shaft is connected to the rotating shaft of the second rotating motor and rotates accordingly, one of the pulleys is fixedly mounted on one end of the spline shaft close to the second rotating motor, the other of the pulleys has a spline groove, the spline shaft passes through the spline groove, and a conveyor belt is wound around each of the pulleys.

[0015] In one or more embodiments of the present application, the visual detection device further includes a shading plate, and the shading plate is located between the 2D camera and the 3D camera.

[0016] In one or more embodiments of the present application, the visual inspection device also includes a sliding plate, a first linear module and a second linear module, the first linear module and the second linear module are arranged vertically, and the first linear module and the inspection channel are arranged parallel, the sliding plate is fixedly connected to the slider of the first linear module, the first linear module and the slider of the second linear module are fixedly connected, the second linear module is fixedly installed on the base, and the second linear module is located on the side of the first linear module away from the inspection channel, and the 2D camera, the 3D camera and the shading plate are all installed on one side of the sliding plate.

[0017] In one or more embodiments of the present application, the chip surface glue coating defect detection device further includes an ion fan, and the ion fan is fixedly mounted on a side of the sliding plate away from the shading plate.

[0018] In one or more embodiments of the present application, each of the conveyor belts is an anti-static conveyor belt.

[0019] In an embodiment of the present application, a chip surface coating defect detection device includes a base, two detection channels, a plurality of clamping and lifting mechanisms and a visual detection device, each detection channel includes a first mounting plate and a second mounting plate, a conveyor belt is rotatably mounted on one side opposite to the first mounting plate and the second mounting plate, and the two conveyor belts rotate synchronously, a clamping and lifting mechanism is provided in each detection channel, the clamping and lifting mechanism is located between the first mounting plate and the second mounting plate of the corresponding detection channel, each clamping and lifting mechanism includes a support, and the support is liftably mounted on the base in the height direction of the base, and the visual detection device includes a A 2D camera and a 3D camera, the visual inspection device is movably installed on the base in the length direction and the width direction of the base, and the visual inspection device is located above the two inspection channels. By setting up two inspection channels, when the conveyor belt on one inspection channel is damaged, the other inspection channel can be used to realize the transportation of the material tray. In addition, before one inspection channel is about to complete the inspection and another specification of chip needs to be inspected, debugging can be carried out in advance in the other inspection channel. Compared with the existing technology, it has the advantages of continuous production after a conveyor belt is damaged, debugging of another specification product during inspection, and help to improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] These and / or other aspects and advantages of the present application will become clearer and easier to understand from the following detailed description of the embodiments of the present application in conjunction with the accompanying drawings, in which:

[0021] Figure 1 The figure shows a schematic diagram of the structure of an existing chip surface glue defect detection device;

[0022] Figure 2The figure shows a schematic structural diagram of a chip surface glue defect detection device of the present application;

[0023] Figure 3 The figure shows a schematic diagram of the structure of the feed tray;

[0024] Figure 4 The figure shows a schematic diagram of the structure at a detection channel;

[0025] Figure 5 The figure shows a schematic diagram of the structure of the visual detection device;

[0026] Figure 6 The figure shows a schematic structural diagram of the clamping and lifting mechanism. DETAILED DESCRIPTION

[0027] The terms and words used in the following specification and claims are not limited to the literal meanings, but are merely used by the inventor to enable a clear and consistent understanding of the present application. Therefore, it will be apparent to those skilled in the art that the following description of various embodiments of the present application is provided for illustrative purposes only and not for the purpose of limiting the present application as defined by the appended claims and their equivalents.

[0028] It is to be understood that the term "one" should be understood as "at least one" or "one or more", that is, in one embodiment, the number of an element may be one, while in another embodiment, the number of the element may be multiple, and the term "one" should not be understood as a limitation on the quantity.

[0029] Although ordinals such as "first," "second," and the like will be used to describe various components, those components are not limited herein. The term is used only to distinguish one component from another. For example, a first component may be referred to as a second component, and likewise, a second component may be referred to as a first component without departing from the teachings of the utility model concept. The term "and / or" as used herein includes any and all combinations of one or more associated listed items.

[0030] The terms used herein are only used for the purpose of describing various embodiments and are not intended to be limiting. As used herein, singular forms are intended to also include plural forms, unless the context clearly indicates an exception. In addition, it will be understood that the terms "including" and / or "having" when used in this specification specify the presence of the described features, numbers, steps, operations, components, elements or combinations thereof, without excluding the presence or addition of one or more other features, numbers, steps, operations, components, elements or groups thereof.

[0031] Application Overview

[0032] The existing chip surface coating defect detection equipment, since the movement of the material tray is driven by the two conveyor belts, when one of the conveyor belts is damaged, the chip surface coating defect detection equipment cannot work. In addition, before testing chips of another specification, the equipment needs to be debugged. Since the chip surface coating defect detection equipment has only one set of channels for moving the material tray, debugging can only be started after the inspection of this set of chips is completed, affecting production efficiency.

[0033] Based on the above technical problems, the present application proposes a chip surface coating defect detection device, wherein the chip surface coating defect detection device has a simple structure, does not involve complex manufacturing processes and expensive materials, and has high economic efficiency. At the same time, for manufacturers, the chip surface coating defect detection device provided by the present application is easy to produce and low-cost, which is more conducive to controlling production costs and further conducive to product promotion and use.

[0034] Schematic chip surface glue defect detection equipment,

[0035] refer to Figures 2 to 6 According to a preferred embodiment of the present invention, a chip surface coating defect detection device is provided. Figure 2 As shown, it includes a base 10, two detection channels 20 arranged at intervals, a plurality of clamping and lifting mechanisms 30 and a visual detection device 40.

[0036] Specifically, Figure 2 As shown, each of the detection channels 20 includes a first mounting plate 201 and a second mounting plate 202, and a conveyor belt 2011 is rotatably mounted on one side opposite to the first mounting plate 201 and the second mounting plate 202, and the two conveyor belts 2011 rotate synchronously.

[0037] In addition, if Figure 2 As shown, the clamping and lifting mechanism 30 is detachably connected to the base 10, and each of the detection channels 20 is provided with a clamping and lifting mechanism 30. Each of the clamping and lifting mechanisms 30 is located between the first mounting plate 201 and the second mounting plate 202 of the corresponding detection channel 20. Each of the clamping and lifting mechanisms 30 includes a support 301, and the support 301 is mounted on the base 10 in a liftable manner in the height direction of the base 10.

[0038] In addition, if Figure 2As shown, the visual inspection device 40 includes a 2D camera 401 and a 3D camera 402. The visual inspection device 40 is movably installed on the base 10 in the length direction and the width direction of the base 10, and the visual inspection device 40 is located above the two inspection channels 20. The 2D camera 401 and the 3D camera 402 are both connected to the external defect detection system circuit. Since the external defect detection system technology is mature and widely used in the market, the specific structure and model of the external defect detection system are not described here. The external defect detection system includes but is not limited to the defect detection system disclosed in the patent document (CN111402251B) that can perform image acquisition, analysis and detection, and data processing through a camera.

[0039] It should be noted that, during detection, a plurality of chips are placed on a tray 80 in a rectangular arrangement, and the two sides of the tray 80 are placed at one end of the two conveyor belts 2011 of the detection channel 20. Subsequently, when the two conveyor belts 2011 are in motion, the tray 80 follows and gradually approaches the clamping and lifting mechanism 30. When the tray 80 moves to directly above the clamping and lifting mechanism 30, the two conveyor belts 2011 stop working, and the two ends of the tray 80 are clamped by the clamping and lifting mechanism 30. At the same time, the tray 80 is moved upward a predetermined distance by the clamping and lifting mechanism 30. Subsequently, the 2D camera 401 moves toward the tray 80, and the lens of the 2D camera 401 is directed to the first chip to be inspected in the first row on the tray 80. More specifically, in the embodiment of the present application, refer to Figure 3, 5 rows and 16 columns of chips to be inspected are arranged on the tray 80. After the image of the first chip to be inspected is captured, the 2D camera 401 moves along the length direction of the base 10 until the first batch of chips to be inspected on the tray 80 are captured. Then, the 2D camera 401 moves a predetermined distance in the width direction of the base 10, and makes the lens of the 2D camera 401 face the last chip to be inspected in the second row. Then, the 2D camera 401 moves along the length direction of the base 10 toward the other end of the tray 80, and repeats the above steps. That is, during the whole process, the 2D camera 401 moves in a serpentine manner until the two-dimensional surface image of each chip to be inspected is captured and compared with the standard image by the external defect detection system. The external defect detection system detects the suspected surface coating defects. The chip is marked, and then the suspected chips are three-dimensionally scanned one by one through the 3D camera 402, so that the external defect system can obtain the surface glue height of the suspected chip. If the surface glue height exceeds the predetermined value, that is, the suspected chip has a glue overflow defect, the defective chip number is recorded by the external defect detection system, and the corresponding glue overflow height value is recorded, and the processing personnel can subsequently remove the defective chip by number; when each of the chips is detected by the visual inspection device 40, the clamping and lifting mechanism 30 moves downward and resets, and when the two sides of the material tray 80 are placed back on the two conveyor belts 2011, the clamping and lifting mechanism 30 releases the material tray 80, the two conveyor belts 2011 move, and drive the material tray 80 to move further in the original direction until it moves to the other end of the base 10 to complete the discharge.

[0040] It should also be noted that, compared with the prior art, the embodiment of the present application sets two detection channels 20. When the conveyor belt 2011 on one detection channel 20 is broken or fails, the material tray 80 can be placed on the conveyor belt 2011 of the other detection channel 20; in addition, when a chip to be inspected of one specification is about to complete the glue overflow detection on one detection channel 20, and the factory needs to perform glue overflow detection on another chip to be inspected at the same time, the processing personnel can pre-debug the positions of the first mounting plate 201 and the second mounting plate 202 on the other detection channel 20, so that after the previous chip to be inspected is completed, the glue overflow detection of the other chip to be inspected can be continuously carried out. Under the premise of using a set of the visual inspection device 40, it helps to improve the continuity and stability of the processing. Compared with the prior art, it has the advantages of continuous production even after a conveyor belt is damaged, debugging of another specification product during inspection, and helping to improve production efficiency.

[0041] Furthermore, when the size of the chip changes, the width of the tray 80 on which the chip is placed also changes. In order to enable each of the detection channels 20 to transport the trays 80 of various widths, in an embodiment of the present application, the second mounting plate 202 of each of the detection channels 20 is slidably mounted on the base 10 and is close to or away from the first mounting plate 201.

[0042] Specifically, Figure 4 As shown, each of the detection channels 20 includes a first rotating motor 203 and a first screw rod 204, the first screw rod 204 is spirally connected to the second mounting plate 202, the first rotating motor 203 is arranged on the first mounting plate 201, and the rotating shaft of the first rotating motor 203 is connected to the first screw rod 204, when the first rotating motor 203 rotates, the second mounting plate 202 approaches or moves away from the first mounting plate 201.

[0043] Furthermore, in order to guide the second mounting plate 202, as shown in FIG. Figure 2 and Figure 4 As shown, the base 10 also includes a slide 101, two first guide rails 102 and two second guide rails 103, the two first guide rails 102 are arranged in parallel on the base 10, the two ends of the slide 101 are slidably set on the two first guide rails 102, the two detection channels 20 are symmetrically arranged on the slide 101, and the second mounting plates 202 on the two detection channels 20 are close to each other, the two second guide rails 103 are arranged in parallel on the slide 101, and the two ends of each second mounting plate 202 are slidably set on the two second guide rails 103.

[0044] It should be noted that, by threading the first screw rod 204 and the second mounting plate 202, and sliding the second mounting plate 202 on the second guide rail 103, the first screw rod 204 and the second mounting plate 202 are spirally connected; by installing the two detection channels 20 on the slide 101, the detection channels 20 are moved closer to or away from the visual detection device 40 by sliding the slide 101. When the 2D camera 401 or the 3D camera 402 needs to be inspected, the maintenance personnel can slide the slide 101 in the direction away from the 2D camera 401 to make room for maintenance by the maintenance personnel.

[0045] Furthermore, in order to realize the movement of the two conveyor belts 2011 in each detection channel 20, as Figure 4As shown, each of the detection channels 20 also includes a second rotating motor 205, a spline shaft 206 and two pulleys (not marked in the figure), the second rotating motor 205 is fixedly mounted on the first mounting plate 201, the spline shaft 206 is connected to the rotating shaft of the second rotating motor 205 and rotates with it, one of the pulleys is fixedly mounted on the spline shaft 206 at one end close to the second rotating motor 205, and its fixed mounting method includes but is not limited to welding, the other pulley is rotatably mounted on the second mounting plate 202, and the pulley mounted on the second mounting plate 202 has a spline groove 207, the spline shaft 206 passes through the spline groove 207, and the key surface on the spline shaft 206 is in contact with the groove surface of the spline groove 207, and each of the pulleys is wound with a conveyor belt 2011.

[0046] It should be noted that when the shaft of the second rotating motor 205 rotates, the spline shaft 206 connected to the shaft rotates synchronously and drives the pulley near the second rotating motor 205 to rotate. Since the other pulley is sleeved on the other end of the spline shaft 206 in a spline-matching manner, the other pulley rotates accordingly. Since the conveyor belt 2011 is wound around each pulley, the two conveyor belts 2011 move. It should also be emphasized that since the pulley near the second mounting plate 202 is spline-connected with the spline shaft 206, that is, when the spline shaft 206 rotates, the pulley with the spline groove 207 rotates. At the same time, the pulley is movable in the axial direction of the spline shaft 206, thereby avoiding the second mounting plate 202 from interfering with the spline shaft 206 when it approaches or moves away from the first mounting plate 201.

[0047] Furthermore, in order to avoid interference between the light sources of the 2D camera 401 and the 3D camera 402, Figure 2 As shown, the visual inspection device 40 further includes a shading plate 403 , and the shading plate 403 is located between the 2D camera 401 and the 3D camera 402 .

[0048] Furthermore, in order to realize the movement of the 2D camera 401, the 3D camera 402 and the shading plate 403 in the length direction and the width direction of the base 10, as shown in FIG. Figure 5As shown, the visual inspection device 40 also includes a sliding plate 404, a first linear module 405 and a second linear module 406, the first linear module 405 and the second linear module 406 are arranged vertically, and the first linear module 405 and the inspection channel 20 are arranged in parallel, the sliding plate 404 is fixedly connected to the slider of the first linear module 405, and the fixed connection method includes but is not limited to welding or threaded connection, the first linear module 405 and the slider of the second linear module 406 are fixedly connected by bolt connection, the second linear module 406 is fixedly installed on the base 10, and the second linear module 406 is located on the side of the first linear module 405 away from the inspection channel 20, and the 2D camera 401, the 3D camera 402 and the shading plate 403 are all installed on one side of the sliding plate 404.

[0049] Furthermore, in order to eliminate the static electricity of the chip to be tested, Figure 2 and Figure 5 As shown, the chip surface glue defect detection device further includes an ion fan 50, which is fixedly mounted on the side of the sliding plate 404 away from the light shielding plate 403 by bolt connection. In addition, each of the conveyor belts 2011 is an anti-static conveyor belt.

[0050] Furthermore, if Figure 6 As shown, the clamping and lifting mechanism 30 also includes a lifting drive device 302 and two clamping cylinders 303. The lifting drive device 302 is fixedly mounted on the base 10. The push rod of the lifting drive device 302 is fixedly connected to the seat support 301. The fixed connection method includes but is not limited to welding or bolt connection. The two clamping cylinders 303 are located at both ends of the seat support 301, and the push rods of the two clamping cylinders 303 are both facing the central plane of the seat support 301. It should be noted that when the tray 80 moves onto the seat support 301, the clamping or loosening of the tray 80 is achieved by the push rod action of the two clamping cylinders 303, and the tray 80 is moved up and down by the lifting drive device 302. The lifting drive device 302 includes but is not limited to an electric push rod.

[0051] In summary, the chip surface coating defect detection equipment based on the embodiment of the present application is explained, which provides the chip surface coating defect detection equipment with advantages such as continuous production when a conveyor belt is damaged, debugging of another specification product during inspection, and helping to improve production efficiency.

[0052] It is worth mentioning that in the embodiment of the present application, the chip surface coating defect detection device has a simple structure, does not involve complex manufacturing processes and expensive materials, and has high economic efficiency. At the same time, for manufacturers, the chip surface coating defect detection device provided by the present application is easy to produce and has low cost, which is more conducive to controlling production costs and further conducive to product promotion and use.

[0053] It should be understood by those skilled in the art that the embodiments of the present invention described above and shown in the accompanying drawings are only examples and do not limit the present invention. The purpose of the present invention has been fully and effectively achieved. The functional and structural principles of the present invention have been demonstrated and explained in the embodiments, and the embodiments of the present invention may be deformed or modified in any way without departing from the principles.

Claims

1. A chip surface glue defect detection device, comprising a base, characterized in that: The chip surface glue coating defect detection device also includes Two detection channels arranged at intervals, each of the detection channels comprises a first mounting plate and a second mounting plate, a conveyor belt is rotatably mounted on one side opposite to the first mounting plate and the second mounting plate, and the two conveyor belts rotate synchronously; and A plurality of clamping and lifting mechanisms, each of which is detachably connected to the base, each of which is provided with a clamping and lifting mechanism, each of which is located between the first mounting plate and the second mounting plate of the corresponding detection channel, and each of which includes a support, which is movably mounted on the base in a height direction of the base; and A visual inspection device, comprising a 2D camera and a 3D camera, is movably mounted on the base in the length direction and the width direction of the base, and is located above the two inspection channels.

2. The chip surface glue defect detection device according to claim 1, characterized in that: The second mounting plate of each detection channel is slidably mounted on the base and is close to or away from the first mounting plate.

3. The chip surface glue defect detection device according to claim 2, characterized in that: Each of the detection channels includes a first rotating motor and a first screw rod, the first screw rod is spirally connected to the second mounting plate, the first rotating motor is arranged on the first mounting plate, and the rotating shaft of the first rotating motor is connected to the first screw rod, when the first rotating motor rotates, the second mounting plate approaches or moves away from the first mounting plate.

4. The chip surface glue defect detection device according to claim 2, characterized in that: The base also includes a slide, two first guide rails and two second guide rails, the two first guide rails are arranged in parallel on the base, the two ends of the slide are slidably set on the two first guide rails, the two detection channels are symmetrically arranged on the slide, and the second mounting plates on the two detection channels are close to each other, the two second guide rails are arranged in parallel on the slide, and the two ends of each second mounting plate are slidably set on the two second guide rails.

5. The chip surface glue defect detection device according to any one of claims 2 to 4, characterized in that: Each of the detection channels also includes a second rotating motor, a spline shaft and two pulleys, the second rotating motor is fixedly mounted on the first mounting plate, the spline shaft is connected to the rotating shaft of the second rotating motor and rotates accordingly, one of the pulleys is fixedly mounted on one end of the spline shaft close to the second rotating motor, the other of the pulleys has a spline groove, the spline shaft passes through the spline groove, and a conveyor belt is wound around each of the pulleys.

6. The chip surface glue defect detection device according to claim 5, characterized in that: The visual detection device further includes a shading plate, and the shading plate is located between the 2D camera and the 3D camera.

7. The chip surface glue defect detection device according to claim 6, characterized in that: The visual inspection device also includes a sliding plate, a first linear module and a second linear module, the first linear module and the second linear module are arranged vertically, and the first linear module and the inspection channel are arranged parallel, the sliding plate is fixedly connected to the slider of the first linear module, the first linear module and the slider of the second linear module are fixedly connected, the second linear module is fixedly installed on the base, and the second linear module is located on the side of the first linear module away from the inspection channel, and the 2D camera, the 3D camera and the shading plate are all installed on one side of the sliding plate.

8. The chip surface glue defect detection device according to claim 7, characterized in that: The chip surface glue coating defect detection device also includes an ion fan, which is fixedly installed on a side of the sliding plate away from the shading plate.

9. The chip surface glue defect detection device according to claim 5, characterized in that: Each of the conveyor belts is an antistatic conveyor belt.

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