Chip testing device with temperature control function

Abstract

The utility model relates to a chip testing device with a temperature control function, which comprises a vortex tube, a flow controller and a testing seat, a cold air end and a hot air end of the vortex tube are connected with an air inlet end of the flow controller through air pipes, a heat exchange sheet is slidably connected in the testing seat, and guide columns are arranged at four corners of the heat exchange sheet. A plurality of grooves are formed in the upper end face of the heat exchange piece, a spring is arranged between the guide column and the testing base, the upper end face of the testing base is in threaded connection with a rotary knob, the lower end of the rotary knob abuts against the upper end face of the heat exchange piece, and a flow guide pipe is arranged between the rotary knob and the air outlet end of the flow controller. The chip testing device has the advantages that cold air and hot air generated by the vortex tube are mixed in proportion through the vortex tube and the flow controller, the heat exchange sheet is heated or refrigerated, the chip testing device is suitable for testing requirements of chips at different environment temperatures, and the chip testing device is simple and compact in structure, small in temperature fluctuation and stable in testing data.

Description

Technical Field

[0001] The utility model relates to the field of chip testing equipment, in particular to a chip testing device with a temperature control function. Background Art

[0002] As the chip demand environment continues to change, the ambient temperature of chip testing has become more and more stringent. In the fields of chip reliability verification, aging testing, etc., the use of adjustable temperature testing equipment has become more and more common.

[0003] Existing high and low temperature equipment generally uses a fluid circulation system, which is large in size, not easy to move, and takes up space. Or it uses an air compressor to create the test environment temperature, which is inefficient and time-consuming. It is necessary to develop a temperature-adjustable chip test device that can meet high and low temperature tests and is easy to control. Utility Model Content

[0004] The purpose of the utility model is to provide a chip testing device with a temperature control function. Through a vortex tube and a flow controller, the cold air and hot air generated by the vortex tube are mixed in proportion, and the heat exchange plate is heated or cooled to meet the testing requirements of different ambient temperatures of the chip. The utility model has a simple and compact structure, smaller temperature fluctuations, and more stable test data.

[0005] In order to achieve the above-mentioned purpose, the utility model provides the following technical solutions: a chip testing device with temperature control function, comprising a vortex tube, a flow controller and a test seat, the cold air end and the hot air end of the vortex tube are connected to the air inlet end of the flow controller through an air pipe, a heat exchange plate is slidably connected in the test seat, and guide pillars are provided at the four corners of the heat exchange plate. The guide pillars and the heat exchange plate are slidably connected to the test seat, and a plurality of grooves are provided on the upper end surface of the heat exchange plate. A spring is provided between the guide pillar and the test seat, and a knob is threadedly connected to the upper end surface of the test seat, and the lower end of the knob is abutted against the upper end surface of the heat exchange plate, a guide tube is provided between the knob and the air outlet end of the flow controller, and a bump is provided on the lower end surface of the heat exchange plate.

[0006] Furthermore, elastic buckles are hinged on both sides of the test seat, and a temperature sensor is arranged inside the test seat.

[0007] Furthermore, ventilation grooves are provided on both sides of the heat exchange plate on both sides of the test seat, and the ventilation grooves are connected to the grooves.

[0008] Furthermore, a through hole is provided in the middle of the knob, the flow guide tube is rotatably connected to the through hole, and the flow guide tube is communicated with the groove.

[0009] The beneficial effects of the utility model are as follows: through the vortex tube and the flow controller, the cold air and hot air generated by the vortex tube are mixed in proportion, the heat exchange plate is heated or cooled, and the test requirements of different ambient temperatures of the chip are met. The structure is simple and compact, the temperature fluctuation is smaller, and the test data is more stable. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 This is a schematic diagram of a chip testing device with temperature control function from a first perspective according to the present invention.

[0011] Figure 2 This is a schematic diagram of a chip testing device with temperature control function from a second viewing angle of the present invention.

[0012] Figure 3 The utility model is a schematic diagram of the internal structure of a test socket of a chip testing device with a temperature control function.

[0013] In the figure: 1. vortex tube; 2. flow controller; 3. test seat; 301. buckle; 4. heat exchange plate; 5. knob; 6. guide tube. DETAILED DESCRIPTION

[0014] In order to make the purpose, technical solution and advantages of the utility model more clear, the utility model is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the utility model and are not used to limit the utility model.

[0015] refer to Figure 1-Figure 3 A chip testing device with temperature control function shown in the figure comprises a vortex tube 1, a flow controller 2 and a test seat 3, the cold air end and the hot air end of the vortex tube 1 are connected to the air inlet end of the flow controller 2 through an air pipe, a heat exchange plate 4 is slidably connected in the test seat 3, and guide pillars are provided at the four corners of the heat exchange plate 4, the guide pillars and the heat exchange plate 4 are slidably connected to the test seat 3, a plurality of grooves are provided on the upper end surface of the heat exchange plate 4, a spring is provided between the guide pillars and the test seat 3, a knob 5 is threadedly connected to the upper end surface of the test seat 3, the lower end of the knob 5 is abutted against the upper end surface of the heat exchange plate 4, a guide tube 6 is provided between the knob 5 and the air outlet end of the flow controller 2, and a bump is provided on the lower end surface of the heat exchange plate 4.

[0016] The two sides of the test socket 3 are hinged with elastic buckles 301 , which are provided to facilitate the insertion of the test socket 3 on the chip carrier. A temperature sensor is provided in the test socket, and the temperature sensor is used to monitor the temperature of the heat exchange plate 4 .

[0017] Ventilation grooves are provided on both sides of the test seat 3 and the heat exchange fins 4 . The venting grooves are connected to the grooves to increase the contact area between the airflow and the heat exchange fins 4 and improve the heat exchange efficiency.

[0018] A through hole is provided in the middle of the knob 5, and the guide pipe 6 is rotatably connected to the through hole. The guide pipe 6 is communicated with the groove, and the guide pipe 6 can directly transport cold air or hot air to the heat exchange plate 4 to achieve temperature regulation of the chip test environment.

[0019] The working principle of the utility model is: when the utility model is in use, the test seat 3 is buckled on the chip carrier, and then the knob is turned to make the protrusion at the lower end of the heat exchange plate 4 pass through the hole groove on the chip carrier and press down on the chip, and then compressed gas is introduced into the vortex tube 1. The compressed gas will form high-temperature and low-temperature gases through the vortex tube and separate from the two ends. After the gas enters the flow controller 2, the flow controller controls the intake of cold air and hot air to transport cold air or hot air to the heat exchange plate 4. The gas contacts the heat exchange plate 4 and heats or cools the chip through heat transfer. During the detection process, the temperature of the heat exchange plate 4 is detected by the temperature sensor, and heating or cooling is performed through the flow controller 2 according to the real-time temperature to ensure that the experimental temperature reaches the set value.

[0020] The above embodiments are used to further illustrate the present invention, but the present invention is not limited to these specific implementations. Any modification, equivalent replacement and improvement made within the spirit and principle of the present invention should be understood to be within the protection scope of the present invention.

Claims

1. A chip testing device with temperature control function, characterized in that: The invention comprises a vortex tube (1), a flow controller (2) and a test seat (3), wherein the cold air end and the hot air end of the vortex tube (1) are connected to the air inlet end of the flow controller (2) through an air pipe, a heat exchange plate (4) is slidably connected inside the test seat (3), guide pillars are provided at the four corners of the heat exchange plate (4), the guide pillars and the heat exchange plate (4) are slidably connected to the test seat (3), a plurality of grooves are provided on the upper end surface of the heat exchange plate (4), a spring is provided between the guide pillars and the test seat (3), a knob (5) is threadedly connected to the upper end surface of the test seat (3), the lower end of the knob (5) is abutted against the upper end surface of the heat exchange plate (4), a guide pipe (6) is provided between the knob (5) and the air outlet end of the flow controller (2), and a protrusion is provided on the lower end surface of the heat exchange plate (4).

2. A chip testing device with temperature control function according to claim 1, characterized in that: Elastic buckles (301) are hinged on both sides of the test seat (3), and a temperature sensor is arranged inside the test seat (3).

3. A chip testing device with temperature control function according to claim 1, characterized in that: Ventilation grooves are provided on both sides of the test seat (3) and located on both sides of the heat exchange plate (4), and the venting grooves are communicated with the grooves.

4. The chip testing device with temperature control function according to claim 1, characterized in that: A through hole is provided in the middle of the knob (5), the flow guide tube (6) is rotatably connected to the through hole, and the flow guide tube (6) is in communication with the groove.

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