Computer case cooling device for big data management

Abstract

The utility model discloses a computer case heat dissipation device for big data management, which relates to the technical field of computer accessories and comprises a bottom frame, the bottom frame sinks inwards to form a containing cavity used for placing a computer case, the bottom of the containing cavity is a permeable plate, and a bearing plate is fixedly connected below the inner side wall of the bottom frame. A gap is formed between the permeable plate and the bearing plate; the space below the bottom frame divides the space below the bearing plate into a cold cavity and a hot cavity through the partition plate, the differential temperature power generation ring generates power through the temperature difference between cold air generated by the semiconductor chilling plate and hot air generated in the case, the cold air can be conveyed and stored in an external storage battery, and heat energy which is wasted originally is effectively recycled and utilized.

Description

Technical Field

[0001] The utility model relates to the technical field of computer accessories, in particular to a computer case heat dissipation device for big data management. Background Art

[0002] The patent document with announcement number CN220962357U discloses a computer heat dissipation device, which relates to the field of computer heat dissipation technology, including a base plate, a mounting assembly fixedly connected to the top of the base plate near the four corners, and a heat dissipation assembly fixedly connected to the top of the base plate near the center; a heat dissipation assembly, the heat dissipation assembly including a mounting plate, and the mounting plate is fixedly connected to the top of the base plate.

[0003] Big data management involves the processing and analysis of massive amounts of data, which requires computers to be in a high-load operating state for a long time. Components such as the CPU, memory, and hard disk will generate a lot of heat under high load. In the above-mentioned prior art, the fan 304 blows the upward airflow through multiple heat dissipation pipes 206 to cool the rising airflow, forming a relatively cold airflow that enters the computer body for heat dissipation and cooling. In addition, the device fails to recover the heat energy generated inside the computer case, fails to effectively utilize the heat energy, and causes energy waste. Utility Model Content

[0004] Therefore, in order to solve the above-mentioned deficiencies, the utility model provides a computer chassis heat dissipation device for big data management.

[0005] The utility model is implemented in this way: a computer case heat dissipation device for big data management is constructed, the device includes a bottom frame, the bottom frame is inwardly recessed to form a receiving cavity for placing the computer case, and the bottom of the receiving cavity is a breathable plate, a receiving plate is fixedly connected to the lower side wall of the bottom frame, and there is a distance between the breathable plate and the receiving plate; the space below the bottom frame is divided into a cold cavity and a hot cavity by a partition plate, the bottom of the bottom frame below the cold cavity is provided with a filter screen, and the bottom of the bottom frame below the hot cavity is provided with a breathable hole; the inner wall of the partition plate is provided with a filter screen, and the inner wall of the bottom frame ... A semiconductor refrigeration plate is embedded, the cold end of the semiconductor refrigeration plate faces the cold cavity, and the hot cavity of the semiconductor refrigeration plate faces the hot cavity. A suction machine is fixedly connected in the cold cavity, the air inlet end of the suction machine is fixedly connected to the air guide cover, the other end of the air guide cover is fixedly connected to the outer shell, the inner wall of the outer shell and the outer wall of the differential temperature power generation ring are wrapped to form a hot air cavity, the air outlet end of the air guide cover is connected to the central cavity in the differential temperature power generation ring, the air in the air guide cover passes through the outer shell through the air outlet at the upper end of the cavity in the differential temperature power generation ring, enters between the air permeable plate and the receiving plate, and is transmitted upward to the accommodating cavity.

[0006] In a feasible implementation, a second suction machine is fixedly connected to the heat chamber, and an air inlet of the second suction machine is connected to the flow guide pipe through a flow guide cover.

[0007] In a feasible implementation, the other end of the flow guide pipe is communicated with the hot air cavity in the shell, and the other end of the hot air cavity is connected to the suction pipe.

[0008] In a feasible implementation, the other end of the suction pipe passes through the side wall of the bottom frame and is connected to the plug-in telescopic pipe, and the plug-in telescopic pipe can be inserted into the interior of the chassis to extract air from the chassis.

[0009] The utility model has the following advantages: The utility model provides a computer chassis heat dissipation device for big data management through improvement, which has the following improvements compared with similar devices:

[0010] The utility model discloses a computer case heat dissipation device for big data management. The differential temperature power generation ring generates electricity by utilizing the temperature difference between the cold air generated by the semiconductor refrigeration sheet and the hot air generated in the case, and can transmit the electricity to be stored in an external storage battery, thereby effectively recovering and utilizing heat energy that would otherwise be wasted. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0012] Figure 2 It is a bottom view of the utility model;

[0013] Figure 3 It is a schematic diagram of the lower structure inside the bottom frame of the utility model;

[0014] Figure 4 This is a schematic diagram of the connection relationship between the suction machine and the second suction machine of the utility model.

[0015] Figure 5 The utility model Figure 4 A in the figure is an enlarged structural diagram.

[0016] Among them: bottom frame -1, accommodating cavity -2, air permeable plate -3, receiving plate -4, partition -5, semiconductor refrigeration plate -6, cold cavity -7, filter screen -71, hot cavity -8, air vent -81, suction machine -9, guide cover -10, shell -11, hot air cavity -12, differential temperature power generation ring -13, cold air cavity -14, guide pipe -15, suction pipe -16, second suction machine -17, plug-in telescopic pipe -18. DETAILED DESCRIPTION

[0017] The following will be combined with the attached Figure 1-Figure 5The utility model is described in detail, and the technical solutions in the embodiments of the utility model are made clear. The complete description is obvious. The described embodiments are only part of the embodiments of the utility model, not all of them. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] It should be noted that when a component is referred to as being "fixed to" another component, it may be directly on the other component or there may also be a component centered. When a component is considered to be "connected to" another component, it may be directly connected to the other component or there may also be a component centered. When a component is considered to be "set on" another component, it may be directly set on the other component or there may also be a component centered. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0019] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0020] See also Figures 1 to 5 The utility model discloses a heat dissipation device for a computer case for big data management, comprising a bottom frame 1, which is recessed inward to form a receiving cavity 2 for placing a computer case, and the computer case for big data management can be placed in the receiving cavity 2 for heat dissipation, and the power cord is inserted into the power socket of the computer case. The server or storage device in the case needs to be connected to the data network through a network interface for data transmission and communication, and the bottom of the receiving cavity 2 is a breathable plate 3, and the surface has a plurality of through holes to facilitate the upward transmission of air below, and a receiving plate 4 is fixedly connected to the lower side wall of the bottom frame 1, and there is a distance between the breathable plate 3 and the receiving plate 4, and the space below the bottom frame 1 is divided into a cold cavity 7 and a hot cavity 8 by a partition plate 5, and a filter screen 71 is provided at the bottom of the bottom frame 1 below the cold cavity 7, and a breathable hole 81 is provided at the bottom of the bottom frame 1 below the hot cavity 8.

[0021] Specifically, a semiconductor refrigeration sheet 6 is embedded in the partition 5, the cold end of the semiconductor refrigeration sheet 6 faces the cold cavity 7, the hot cavity of the semiconductor refrigeration sheet 6 faces the hot cavity 8, and a suction machine 9 is fixedly connected to the cold cavity 7. The air inlet end of the suction machine 9 is fixedly connected to the air guide cover 10, and the other end of the air guide cover 10 is fixedly connected to the outer shell 11. The inner wall of the outer shell 11 and the outer wall of the differential temperature power generation ring 13 are wrapped to form a hot air cavity 12. The air outlet end of the air guide cover 10 is communicated with the central cavity in the differential temperature power generation ring 13. The air in the air guide cover 10 passes through the air outlet at the upper end of the cavity in the differential temperature power generation ring 13 and passes through the outer shell 11 to enter the air permeable The cold air is transmitted between the plate 3 and the receiving plate 4 and upwards to the accommodating cavity 2; when the chassis is placed on the accommodating cavity 2 and then needs to be cooled, the semiconductor refrigeration plate 6 is controlled to operate, and the cold air generated by the semiconductor refrigeration plate 6 is transported to the cold cavity 7, and then the cold air in the interior is transmitted to the inner wall of the differential temperature power generation ring 13 in the outer shell 11 through the suction machine 9, and is transmitted upwards to between the air permeable plate 3 and the receiving plate 4, and then enters the accommodating cavity 2 through the air permeable plate 3, the cold air contacts the side wall of the chassis placed in the accommodating cavity 2, and is transmitted upwards along the outer wall of the chassis to absorb heat, and the plug-in telescopic tube 18 is inserted into the chassis.

[0022] Specifically, a second suction machine 17 is fixedly connected in the heat chamber 8, and an air inlet of the second suction machine 17 is communicated with a guide pipe 15 through a guide cover 10, and the other end of the guide pipe 15 is communicated with a hot air chamber 12 in the shell 11, and the other end of the hot air chamber 12 is connected with a suction pipe 16, and the suction pipe 16 is made of a heat-insulating material, and the other end of the suction pipe 16 passes through the side wall of the bottom frame 1 and is communicated with a plug-in telescopic pipe 18, and the plug-in telescopic pipe 18 can be inserted into the inside of the chassis to extract the air in the chassis, and at the same time, the second suction machine 17 is turned on, and the second suction machine 17 extracts the air in the guide pipe 15 and the suction pipe 16, and the suction pipe 16 extracts the hot air in the inside of the chassis 1 into the hot air chamber 12 through the plug-in telescopic pipe 18, and then discharges it outward through the air vents 81, and the hot air accelerates the heat dissipation rate of the hot end of the semiconductor refrigeration plate 6;

[0023] The differential temperature power generation ring 13 generates electricity by utilizing the temperature difference between the cold air generated by the semiconductor refrigeration sheet 6 and the hot air generated in the chassis, and can transmit the electricity to be stored in an external storage battery, thereby effectively recovering and utilizing heat energy that would otherwise be wasted.

[0024] The above shows and describes the basic principle, main features and advantages of the utility model, and the standard parts used in the utility model can be purchased from the market, and special-shaped parts can be customized according to the description and the drawings. The specific connection methods of each part adopt mature conventional means such as bolts, rivets, welding, etc. in the prior art. Machinery, parts and equipment all adopt conventional models in the prior art, and the circuit connection adopts the conventional connection method in the prior art, which will not be described in detail here.

[0025] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A computer case heat dissipation device for big data management, comprising a bottom frame, the bottom frame is inwardly recessed to form a receiving cavity for placing the computer case, and the bottom of the receiving cavity is a breathable plate, a receiving plate is fixedly connected to the lower side wall of the bottom frame, and there is a distance between the breathable plate and the receiving plate; Features: The space below the bottom frame is divided into a cold chamber and a hot chamber by a partition, a filter is provided at the bottom of the bottom frame below the cold chamber, and an air hole is provided at the bottom of the bottom frame below the hot chamber; A semiconductor refrigeration plate is embedded in the partition, the cold end of the semiconductor refrigeration plate faces the cold cavity, and the hot cavity of the semiconductor refrigeration plate faces the hot cavity. A suction machine is fixedly connected in the cold cavity, the air inlet end of the suction machine is fixedly connected to the air guide cover, the other end of the air guide cover is fixedly connected to the outer shell, the inner wall of the outer shell and the outer wall of the differential temperature power generation ring are wrapped to form a hot air cavity, the air outlet end of the air guide cover is connected to the central cavity in the differential temperature power generation ring, the air in the air guide cover passes through the outer shell through the air outlet at the upper end of the cavity in the differential temperature power generation ring, enters between the air permeable plate and the receiving plate, and is transmitted upward to the accommodating cavity.

2. A computer chassis heat dissipation device for big data management according to claim 1, characterized in that: A second suction machine is fixedly connected in the heat chamber, and an air inlet of the second suction machine is communicated with the flow guide pipe through a flow guide cover.

3. A computer chassis heat dissipation device for big data management according to claim 2, characterized in that: The other end of the flow guide pipe is communicated with the hot air cavity in the shell, and the other end of the hot air cavity is connected with the suction pipe.

4. A computer case heat dissipation device for big data management according to claim 3, characterized in that: The other end of the suction pipe passes through the side wall of the bottom frame and is communicated with the plug-in telescopic pipe, and the plug-in telescopic pipe can be inserted into the interior of the chassis to extract air in the chassis.

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