MLCC structure capable of preventing plate from bending and cracking

By setting buffer electrode gaskets on the ceramic sheet and reducing the contact area of ​​the inner and outer electrodes, the crack problems caused by plate bending and thermal expansion stress of MLCC are solved, and the bending and crack resistance of MLCC is significantly improved.

CN222762809UActive Publication Date: 2025-04-15JIANGSU XINSHENG MICROELECTRONICS TECH CO LTD
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Patent Information

Application Number
CN202421499165.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-06-27
Publication Date
2025-04-15
Estimated Expiration
2034-06-27

AI Technical Summary

Technical Problem

During use, MLCC is prone to cracks due to plate bending, and the difference in thermal expansion coefficient between ceramic materials and metal electrodes makes it difficult to withstand mechanical stress, resulting in bending and cracking of components.

Method used

A plurality of buffer electrode gaskets are provided on the ceramic sheet to form a buffer layer to absorb stress, and by reducing the contact area between the inner electrode and the outer electrode, the connection is concentrated in the central position to ensure that the outer electrode is thicker to enhance bending ability.

Benefits of technology

It effectively absorbs internal stress, promotes heat dissipation, reduces the generation of thermal stress, and provides expansion space for the components under the difference in thermal expansion coefficient, significantly improving the bending and crack resistance of MLCC.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses an MLCC structure capable of preventing a plate from bending and cracking, which relates to the technical field of MLCC structures, and is characterized in that the MLCC structure comprises a shell, terminals symmetrically mounted at two ends of the shell, and an energy storage body mounted in the shell, and the energy storage body comprises a plurality of inner electrodes and ceramic chips which are arranged in a staggered and laminated manner; the two ends of the energy storage body are both ceramic chips, the contact surface of each ceramic chip is provided with a plurality of buffer electrode gaskets, the outer electrodes are installed in the two terminals respectively, and each outer electrode is connected with a plurality of inner electrodes, so that the effects of facilitating heat dissipation in the MLCC structure, reducing generation of thermal stress and improving the reliability of the MLCC structure are achieved. And meanwhile, an expansion interval can be provided for the internal elements of the MLCC under the condition that the thermal expansion coefficients of the ceramic material and the metal electrode are different, so that the stress of the MLCC structure can be better eliminated.
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Description

Technical Field

[0001] The utility model relates to the technical field of MLCC structures, and more specifically, to an MLCC structure for preventing plate bending cracks. Background Art

[0002] Multilayer ceramic capacitors (MLCCs) are capacitors made of ceramic dielectric diaphragms with printed electrodes (inner electrodes) stacked in an offset manner. As electronic components, they are widely used in electronic devices, especially in scenarios that require efficient energy storage and fast charging and discharging. However, since the main body of MLCC is ceramic material, its ductility is very low. When subjected to excessive stress, the ceramic body is prone to breakage. In addition, during the use of MLCC, when the PCB is bent, the ceramic body is also prone to cracks.

[0003] The Chinese utility model patent application number: CN202321658367.3 discloses a laminated structure for improving the bending resistance of MLCC. Based on the conventional internal electrode laminated structure, the application adds a buffer electrode layer between the top and bottom electrode layers and the upper and lower protective layers, which can effectively absorb the concentrated stress here, reduce the risk of short circuit failure caused by cracks across the electrodes, and improve the bending resistance of MLCC. However, MLCC will generate heat inside when working, and there is a difference in the thermal expansion coefficients of ceramic materials and metal electrodes. The buffer electrode layer is difficult to disperse the mechanical stress generated by thermal expansion, and the buffer electrode layer is not conducive to the dissipation of heat between the internal electrode and the ceramic sheet.

[0004] Therefore, in order to solve the above technical problems, the present application proposes an MLCC structure for preventing board bending cracks. Utility Model Content

[0005] In view of the deficiencies in the prior art, the purpose of the utility model is to provide an MLCC structure that prevents board bending cracks.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solution: an MLCC structure for preventing board bending cracks, comprising:

[0007] A housing, with terminals symmetrically mounted at both ends of the housing;

[0008] An energy storage body installed in the shell, the energy storage body includes a plurality of inner electrodes and ceramic sheets arranged in a staggered stack, and both ends of the energy storage body are ceramic sheets, and a plurality of buffer electrode pads are arranged on the contact surface of each ceramic sheet;

[0009] The external electrodes are respectively installed in the two terminals, and each of the external electrodes is connected to the plurality of internal electrodes.

[0010] Preferably, a buffer pad is provided at a position corresponding to the external electrode in each of the terminals.

[0011] Preferably, each of the buffer electrode gaskets is elastic.

[0012] Preferably, two surfaces of each terminal that contact each other are designed with rounded corners.

[0013] Preferably, the curvature of the two surfaces of each terminal that contact each other is 35 to 45 degrees.

[0014] Preferably, the widths of the ends of the plurality of inner electrodes contacting the outer electrode are reduced, and the plurality of inner electrodes are connected to the middle of the outer electrode;

[0015] Compared with the traditional method, the contact area between the inner electrode and the outer electrode is reduced, and the ineffective contact area is reduced, which can effectively avoid the bending area of ​​the product plate, reduce the damage to the whole due to the bending of the plate, and concentrate the connection at the central position to ensure that the outer electrode at the connection is thicker, which can enhance the overall bending ability.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] 1. In the utility model, a buffer layer can be formed between the ceramic sheet and the internal electrode by arranging a plurality of buffer electrode pads on the ceramic sheet, which can not only absorb the stress generated inside, but also facilitate the heat dissipation inside the MLCC structure and reduce the generation of thermal stress. At the same time, when there is a difference in the thermal expansion coefficient between the ceramic material and the metal electrode, an expansion range can be provided to the internal components of the MLCC, thereby achieving better stress elimination for the MLCC structure, thereby solving the problem in the prior art that the heat generated inside the MLCC easily leads to unbearable mechanical stress between the ceramic material with a difference in thermal expansion coefficient and the metal electrode, causing the components to bend and crack.

[0018] 2. In the present invention, by setting the two contacting surfaces of the terminal to be rounded and making the curvature of the terminals 35 to 45 degrees, stress concentration can be reduced and the crack resistance of the structure can be improved.

[0019] 3. In the utility model, by reducing the contact area between the inner electrode and the outer electrode and reducing the ineffective contact area, the bending area of ​​the product plate can be effectively avoided, the damage to the whole due to the bending of the plate can be reduced, and the connection is concentrated in the central position to ensure that the outer electrode at the connection is thicker, which can enhance the overall bending ability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present application. The exemplary embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention. In the drawings:

[0021] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0022] Figure 2 It is a schematic diagram of the structure of the energy storage body in the utility model;

[0023] Figure 3 It is a schematic diagram of the structure of the ceramic sheet in the utility model;

[0024] Figure 4 It is a schematic diagram of the inner electrode connection structure in the utility model.

[0025] 1. Terminal; 2. Shell; 3. Ceramic sheet; 4. Inner electrode; 5. Outer electrode; 6. Buffer electrode gasket; 7. Buffer pad; 8. Energy storage body. DETAILED DESCRIPTION

[0026] like Figure 1-3 As shown, the utility model provides an MLCC structure for preventing board bending cracks, comprising a housing 2, with terminals 1 symmetrically mounted at both ends of the housing 2;

[0027] An energy storage body 8 installed in the housing 2, the energy storage body 8 includes a plurality of inner electrodes 4 and ceramic sheets 3 arranged in a staggered stack, and both ends of the energy storage body 8 are ceramic sheets 3, and a plurality of buffer electrode pads 6 are arranged on the contact surface of each ceramic sheet 3;

[0028] External electrodes 5 are respectively installed in the two terminals 1, and each external electrode 5 is connected to a plurality of internal electrodes 4;

[0029] In summary, the existing technical problem that the heat generated inside the MLCC easily leads to the generation of unbearable mechanical stress between the ceramic material with different thermal expansion coefficients and the metal electrode, causing the components to bend and crack, the present application forms a buffer layer between the ceramic sheet 3 and the internal electrode 4 by setting a plurality of buffer electrode gaskets 6 on the ceramic sheet 3, which can not only absorb the stress generated inside, but also facilitate the heat dissipation inside the MLCC structure, reduce the generation of thermal stress, and at the same time, provide an expansion range for the internal components of the MLCC when there is a difference in the thermal expansion coefficients of the ceramic material and the metal electrode, thereby achieving better stress elimination for the MLCC structure;

[0030] Each buffer electrode gasket 6 is elastic and can provide space for the inner electrode 4 and the ceramic sheet 3 to expand;

[0031] It should be noted that a buffer pad 7 is provided at a position corresponding to the external electrode 5 in each terminal 1, and the terminal 1 is in contact with the PCB board. When the PCB board transmits external force, the buffer pad 7 can further reduce the impact of the external force transmitted from the terminal 1 to the internal energy storage body 8;

[0032] It is worth noting that the two surfaces of each terminal 1 that contact each other are designed with rounded corners, and the curvature of the two surfaces of each terminal 1 that contact each other is 35 to 45 degrees. The curvature of 35 to 45 degrees can not only facilitate the production, but also reduce the concentration of stress and improve the crack resistance of the structure, further enhancing the ability of MLCC itself to prevent bending and cracking;

[0033] The widths of the ends of the plurality of inner electrodes that are in contact with the outer electrodes are all reduced, and the inner electrodes are connected to the middle of the outer electrodes;

[0034] Compared with the traditional method, the contact area between the inner electrode and the outer electrode is reduced, and the ineffective contact area is reduced, which can effectively avoid the bending area of ​​the product plate, reduce the damage to the whole due to the bending of the plate, and concentrate the connection at the central position to ensure that the outer electrode at the connection is thicker, which can enhance the overall bending ability.

[0035] The above description is only a preferred embodiment of the utility model and does not limit the utility model in any form. Any ordinary technician in the industry can smoothly implement the utility model as shown in the drawings of the specification and described above. However, any equivalent changes, modifications and evolutions made by technicians familiar with the profession without departing from the scope of the technical solution of the utility model using the technical content disclosed above are all equivalent embodiments of the utility model. At the same time, any equivalent changes, modifications and evolutions made to the above embodiments based on the essential technology of the utility model are still within the protection scope of the technical solution of the utility model.

Claims

1. An MLCC structure for preventing board bending cracks, characterized in that: include: A housing (2), with terminals (1) symmetrically mounted on both ends of the housing (2); An energy storage body (8) installed in a housing (2), the energy storage body (8) comprising a plurality of internal electrodes (4) and ceramic sheets (3) arranged in a staggered stack, with both ends of the energy storage body (8) being ceramic sheets (3), and a plurality of buffer electrode pads (6) being arranged on the contact surface of each ceramic sheet (3); External electrodes (5) are respectively installed in the two terminals (1), and each of the external electrodes (5) is connected to a plurality of internal electrodes (4).

2. The MLCC structure for preventing board bending cracks according to claim 1, characterized in that: A buffer pad (7) is provided at a position corresponding to the external electrode (5) in each terminal (1).

3. The MLCC structure for preventing board bending cracks according to claim 1, characterized in that: Each buffer electrode gasket (6) is elastic.

4. The MLCC structure for preventing board bending cracks according to claim 3, characterized in that: The two surfaces of each terminal (1) that contact each other are both designed with rounded corners.

5. The MLCC structure for preventing board bending cracks according to claim 4, characterized in that: The curvature of the two surfaces of each terminal (1) that contact each other is 35 to 45 degrees.

6. An MLCC structure for preventing board bending cracks according to any one of claims 1 to 5, characterized in that: The widths of the ends of the multiple inner electrodes that are in contact with the outer electrodes are all reduced, and the multiple inner electrodes are all connected to the middle positions of the outer electrodes.

Citation Information

Patent Citations

  • Laminated structure for improving bending resistance of MLCC

    CN220041606U