Heat pipe type heat conduction plastic radiator
By using a heat-tube radiator made of thermally conductive plastic, the phase transition between hollow structure fins and heat dissipation working fluid is solved, and the existing metal radiator has limited thermal conductivity and low thermal radiation efficiency is achieved, achieving efficient and light heat dissipation effect.
Patent Information
- Application Number
- CN202420666573.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-02
- Publication Date
- 2025-04-15
- Estimated Expiration
- 2034-04-02
AI Technical Summary
Existing metal-based radiators have bottlenecks in thermal management, with limited thermal conductivity and low thermal radiation efficiency, making it difficult to meet the growing heat dissipation needs.
The heat-tube radiator made of thermally conductive plastic material quickly transfers heat through the phase transition between the hollow structure fins and the heat-dissipating working fluid, and uses the air convection effect at the end of the fins to improve the heat dissipation efficiency.
It achieves a heat dissipation effect with simple structure, light weight and high heat dissipation efficiency, and has higher design freedom and lower cost than metal heat pipe radiators.
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Figure CN222764149U_ABST
Abstract
Description
Technical Field
[0001] The present application belongs to the field of heat dissipation, and specifically relates to a heat pipe type thermally conductive plastic heat sink. Background Art
[0002] With the development of science and technology, the heat generated by electronic components, chips, LED light sources and other parts is getting higher and higher, which puts more stringent requirements on the thermal management of heat sources. Based on cost considerations, current thermal management mostly adopts the solution of adding a heat sink to the heat source. The heat sink transfers the heat emitted by the heat source to the surface of the heat sink and exchanges it to the environment to achieve the purpose of reducing the temperature of the heat source. In order to achieve more efficient heat exchange, the heat sink generally has a large heat dissipation area, and the typical shape is a multi-fin structure, which causes the heat to travel a long path from the heat source to the far end of the fin.
[0003] Most of today's radiators are made of metal, including copper, aluminum, iron, etc., with a thermal conductivity of about 100~400W / m•K, high density and low thermal radiation efficiency, which has reached a bottleneck under the current growing demand for heat dissipation.
[0004] Heat pipe technology has also been greatly developed in the field of heat transfer. Since there is actually phase change and convection inside the heat pipe, the comprehensive thermal conductivity of the heat pipe is much higher than that of the metal itself. Currently, many heat dissipation systems use heat pipe heat transfer plus fin heat dissipation. However, due to the limitations of metal processing capabilities, fins are mostly in the form of aluminum or copper sheets, and cannot be made into heat pipe fins. Summary of the invention
[0005] In order to overcome the above problems existing in the prior art, the purpose of this application is to provide a thermally conductive plastic heat sink with simple structure, light weight and high heat dissipation efficiency, which is specifically achieved through the following technical solutions:
[0006] A heat pipe type thermally conductive plastic radiator comprises a base plate attached to a heat source and a heat dissipation portion made of a thermally conductive plastic material and arranged on the base plate, wherein the heat dissipation portion is provided with fins with a hollow structure, and the hollow structures of the base plate and the fins are connected to form a closed cavity, wherein the cavity is filled with a heat dissipation medium.
[0007] Optionally, a capillary structure is provided in the cross-sectional direction of the inner wall of the fin.
[0008] Optionally, the capillary structure is a micro groove perpendicular to the cross-sectional direction of the fin.
[0009] Optionally, the base plate is made of metal or heat-conducting plastic, and the base plate and the heat dissipation part are connected by welding or sealing with a sealant.
[0010] Optionally, the cavity is filled with sintered copper powder or foamed metal, and the sintered copper powder or foamed metal is laid on the bottom wall of the cavity to form a capillary liquid absorption core layer.
[0011] Optionally, the heat dissipation portion further includes a side wall, and the heat dissipation portion is fixedly connected to the bottom plate via the side wall.
[0012] Optionally, a filling pipe is provided on the side wall for vacuuming and / or filling with heat dissipating medium.
[0013] Optionally, the heat dissipation part is integrally formed by an injection molding process.
[0014] Optionally, the heat dissipation medium includes one or more of water, ethanol, propanol, isopropanol, acetic acid, and acetone.
[0015] Optionally, the cavity is a hollow structure connecting multiple fins.
[0016] Compared with the prior art, the present application uses thermally conductive plastic to make the heat dissipation part of the heat pipe radiator, which fully utilizes the characteristics that the thermal conductivity efficiency of plastic materials is lower than that of metals, but the thermal radiation efficiency is higher than that of metals. Fins with hollow structures are provided, and the heat absorbed by the base plate from the heat source is quickly transferred to the fins, especially the ends of the fins, through the phase change of the heat dissipation medium, and the advantage of the good air convection effect at the ends of the fins is utilized to further improve the heat dissipation effect near the ends of the fins. The heat dissipation efficiency of the radiator is greatly improved. Compared with metal heat pipe radiators, the present application scheme has the advantages of simple structure, high design freedom, light weight, and high heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 is a schematic diagram of the cross-sectional structure of Example 1;
[0018] Figure 2 is a schematic diagram of the cross-sectional structure during the processing of Example 1;
[0019] Figure 3 This is an enlarged view of a partial cross section from the top of the fin to the root of the fin in Example 1;
[0020] Figure 4 is a schematic diagram of the cross-sectional structure of Example 2;
[0021] In the figure, the reference numerals are: heat dissipation part 1, bottom plate 2, fin 3, cavity 4, liquid absorption core layer 5, side wall 6, filling tube 7, capillary structure 8, heat dissipation medium 9. DETAILED DESCRIPTION
[0022] The specific implementation methods of the present application are described in detail below through examples, but the specific implementation of the present application does not serve as a limitation on the technical solution of the present application. Any non-substantial changes such as replacing common technical solutions in the field with the technical solutions described in the examples of the present application are within the scope of protection of the present application.
[0023] Unless otherwise specified, the term "disposed in" in this application indicates a positional relationship and does not mean that they are independent components. Those skilled in the art can make two parts of a component according to actual needs, or can separate the two components into two parts according to needs and fix them in a fixing manner.
[0024] Unless otherwise specified, the fixing and fixed connection mentioned in this application refer to the positional relationship. Fixation includes conventional adhesive, bolts, buckles and other structural fixation, as well as integral molding as an integral component, and also includes detachable fixation, etc., which only requires the relative position to be limited when completed or in use. Connection includes fixed connection and detachable connection. Example 1
[0025] like Figure 1~Figure 3 A heat pipe type thermally conductive plastic radiator is shown, comprising a base plate 2 bonded to a heat source and a heat dissipation portion 1 made of a thermally conductive plastic material and arranged on the base plate 2, wherein the heat dissipation portion 1 is provided with fins 3 with a hollow structure, and the hollow structures of the base plate 2 and the fins 3 are connected to form a closed cavity 4, wherein the cavity 4 is filled with a heat dissipation medium 9.
[0026] The hollow fin 3 is provided, and the heat absorbed by the bottom plate 2 from the heat source is quickly transferred to the fin 3, especially the end of the fin 3, through the phase change of the heat dissipation medium 9, and the advantage of the good air convection effect at the end of the fin 3 is used to further improve the heat dissipation effect near the end of the fin 3. The heat dissipation efficiency of the radiator is greatly improved. Compared with the metal heat pipe radiator, the present application scheme has the advantages of simple structure, high design freedom, light weight and high heat dissipation efficiency.
[0027] Specifically in this embodiment, a capillary structure 8 is provided in the cross-sectional direction of the inner wall of the fin 3. The capillary structure 8 is a micro-groove perpendicular to the cross-sectional direction of the height of the fin 3, which can quickly return the liquid heat dissipation medium 9 cooled at the top of the fin 3 to the bottom plate 2 through the capillary structure 8, thereby improving the overall heat dissipation efficiency. Figure 3 As shown, it is a diagram from the top of the fin 3 to the root direction, and the shape of the capillary structure 8 can be seen. And the capillary structure 8 arranged in this direction is conducive to demoulding. In this embodiment, the cross section of the micro groove is a partial edge structure of a quadrilateral. In other embodiments, those skilled in the art can also set it to a triangle, other polygonal shapes, etc. according to needs.
[0028] Specifically in this embodiment, the bottom plate 2 is made of heat-conducting plastic material, and in other embodiments, metal material can also be used. The bottom plate 2 and the heat dissipation part 1 are connected by welding or sealing with sealant. The use of heat-conducting plastic material can improve the connection firmness with the heat dissipation part 1.
[0029] Specifically in this embodiment, the heat dissipation part 1 further includes a side wall 6, and the heat dissipation part 1 is fixedly connected to the bottom plate 2 through the side wall 6. The design of the side wall 6 is conducive to forming a cavity 4 of a specific space, and the integrity and airtightness are higher. Due to the existence of the side wall 6, the heat sink cannot be extruded by metal or plastic materials, highlighting the advantages of using thermal conductive plastic materials in terms of high design freedom, higher processing efficiency and low cost compared to metal materials.
[0030] Specifically in this embodiment, a filling pipe 7 is provided on the side wall 6 for vacuuming and / or filling the heat dissipation medium 9. Figure 2 The schematic diagram of the production process can be used by those skilled in the art to pinch off and seal the filling tube 7 as required. The filling tube 7 can be retained or pinched off from the root of the side wall 6 as required to obtain the following: Figure 1 Finished product shown. Figure 1 The examples are only examples and are not limiting. Figure 1 The similar finished product may have a filling tube 7 structure. The filling tube 7 can be one or more, respectively used for vacuuming and filling the heat dissipation medium 9, and those skilled in the art can select according to actual conditions.
[0031] Specifically in this embodiment, the heat dissipation part 1 is integrally formed by injection molding. Compared with the extrusion molding method commonly used for metal heat pipes, the structure of this embodiment can reasonably design various irregular shapes according to the existing structure of the heat source and other components to achieve the purpose of compatibility or replacement of existing metal radiators, and the design freedom is greatly improved.
[0032] Specifically in this embodiment, the heat dissipation medium 9 is acetone. In other embodiments, it may also be one or more of water, ethanol, propanol, isopropanol, and acetic acid.
[0033] Specifically in this embodiment, the cavity 4 is a hollow structure connecting multiple fins 3. When in use, since the heat source is often generated in a concentrated manner, compared with the space separation in each fin 3, when the bottom plate 2 is locally heated, the heat dissipating medium 9 is heated and converted into gaseous state and can be dispersed to the cavity 4 in each fin 3 for cooling, and the overall heat dissipation effect is better. Example 2
[0034] like Figure 4The heat pipe type heat conductive plastic radiator shown is the same as the other structures of Example 1, except that, in this embodiment, the cavity 4 is filled with sintered copper powder, and the sintered copper powder is laid on the wall of the bottom plate 2 in the cavity 4 to form a capillary liquid absorption core layer 5. In other embodiments, it can also be foamed metal. The heat of the bottom plate 2 is transferred to the heat dissipation medium 9 around the liquid absorption core layer 5 more quickly through the capillary liquid absorption core layer 5, thereby increasing the phase change rate of the heat dissipation medium 9, thereby improving the overall heat dissipation efficiency of the radiator.
[0035] In this embodiment, the bottom plate 2 is made of metal, and in other embodiments, a heat-conducting plastic material may also be used. The bottom plate 2 and the heat dissipation part 1 are connected by welding or sealing with a sealant. The use of metal material can further utilize the advantages of metal heat transfer performance and further improve the overall heat dissipation efficiency of the radiator.
[0036] It should be noted that the components and names used in the above embodiments can be selected or replaced by those skilled in the art according to their needs, and this does not exceed the protection scope of this application.
Claims
1. A heat pipe type thermally conductive plastic radiator, characterized in that: It includes a bottom plate attached to the heat source and a heat dissipation part made of heat-conducting plastic material arranged on the bottom plate. The heat dissipation part is provided with fins with a hollow structure. The hollow structures of the bottom plate and the fins are connected to form a closed cavity, and the cavity is filled with a heat dissipation medium.
2. The heat pipe type thermally conductive plastic radiator according to claim 1, characterized in that: A capillary structure is provided in the cross-sectional direction of the inner wall of the fin.
3. The heat pipe type thermally conductive plastic radiator according to claim 2, characterized in that: The capillary structure is a micro groove perpendicular to the cross-sectional direction of the fin.
4. The heat pipe type thermally conductive plastic radiator according to claim 1, characterized in that: The bottom plate is made of metal or heat-conducting plastic material, and the bottom plate and the heat dissipation part are connected by welding or sealing with sealant.
5. The heat pipe type thermally conductive plastic radiator according to claim 1, characterized in that: The cavity is filled with sintered copper powder or foamed metal, and the sintered copper powder or foamed metal is laid on the bottom plate wall in the cavity to form a capillary liquid absorption core layer.
6. The heat pipe type thermally conductive plastic radiator according to claim 1, characterized in that: The heat dissipation part further includes a side wall, and the heat dissipation part is fixedly connected to the bottom plate via the side wall.
7. The heat pipe type thermally conductive plastic radiator according to claim 6, characterized in that: The side wall is provided with a filling pipe for vacuuming and / or filling with heat dissipating medium.
8. The heat pipe type thermally conductive plastic radiator according to claim 6, characterized in that: The heat dissipation part is integrally formed by an injection molding process.
9. The heat pipe type thermally conductive plastic heat sink according to claim 1, characterized in that: The heat dissipation medium includes one or more of water, ethanol, propanol, isopropanol, acetic acid, and acetone.
10. The heat pipe type thermally conductive plastic heat sink according to claim 1, characterized in that: The cavity is connected to the hollow structures of the plurality of fins.