Portable rapid heat dissipation patch

Abstract

The utility model discloses a portable rapid heat dissipation paster, which comprises a heat conduction gel layer, a radiation heat dissipation layer, a heat pipe, a structure reinforcing layer and a phase change material layer, and is characterized in that the heat conduction gel layer is used for being attached to an equipment shell and leading out heat of the equipment shell; the radiation heat dissipation layer is used for releasing heat outwards to dissipate heat; the heat pipe is provided with an evaporation section and a condensation section, the evaporation section is embedded in the heat conduction gel layer, the condensation section abuts against the radiation heat dissipation layer, and the heat pipe is used for transferring heat of the heat conduction gel layer to the radiation heat dissipation layer; the structure reinforcing layer is arranged between the heat conduction gel layer and the radiation heat dissipation layer. The side, close to the radiation heat dissipation layer, of the condensation section is exposed out of the structure reinforcing layer and abuts against the radiation heat dissipation layer. The phase change material layer is arranged between the heat conduction gel layer and the structure reinforcing layer and used for absorbing heat of the heat conduction gel layer. The portable rapid heat dissipation patch has the advantages of being small in size, free of an external power source and convenient to use, and the operation experience of mobile game fans can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation tools, in particular to a convenient and fast heat dissipation patch. Background Art

[0002] With the development of smart electronics, there are increasingly higher requirements for lightweight products. At the same time, the memory occupied by smart control apps is getting larger and larger. E-sports, as a competitive form with electronic games as competitive events, has rapidly emerged and become popular in recent years. Game competitions have become a real sporting event, attracting the enthusiastic participation of a large number of spectators and fans.

[0003] With the development of e-sports, gaming laptops, mobile phones, etc. are running faster and faster, and the heat is getting higher and higher. Mobile phones, as the preferred tools for mobile games, have limited heat dissipation space. Currently, they mainly rely on thermal conductive silicone sheets or thermal conductive gels to transfer heat to the outer shell. Currently, mobile phone shells are mainly made of polymer plastic shells, which causes the heat to diffuse outward more slowly, making the temperature of the mobile phone shell too high, affecting the user experience.

[0004] Furthermore, mobile electronic devices now pursue efficient charging and use high-power chargers, which causes the temperature of the equipment to rise sharply, seriously affecting the service life of the equipment and causing great safety hazards.

[0005] In the related art, the device casing is actively cooled mainly by means of an external radiator.

[0006] However, although the radiator has an obvious cooling effect, the radiator device is large in size and requires an external power supply, which seriously affects the operating experience of mobile game enthusiasts. Utility Model Content

[0007] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a convenient fast heat dissipation patch, which has the advantages of small size, no need for external power supply, and easy use, and can improve the operating experience of mobile game enthusiasts.

[0008] A convenient and quick heat dissipation patch according to the first aspect of the utility model includes: a thermally conductive gel layer, which is used to be attached to a device housing and to conduct heat from the device housing; a radiation heat dissipation layer, which is used to release heat outward to dissipate heat; a heat pipe, which has an evaporation section and a condensation section, the evaporation section is embedded in the thermally conductive gel layer, the condensation section abuts the radiation heat dissipation layer, and the heat pipe is used to transfer the heat of the thermally conductive gel layer to the radiation heat dissipation layer; a structural reinforcement layer, which is arranged between the thermally conductive gel layer and the radiation heat dissipation layer, and is used to support and fix the condensation section, and the side of the condensation section close to the radiation heat dissipation layer is exposed outside the structural reinforcement layer and abuts against the radiation heat dissipation layer; a phase change material layer, which is arranged between the thermally conductive gel layer and the structural reinforcement layer, and is used to absorb the heat of the thermally conductive gel layer.

[0009] A convenient fast heat dissipation patch according to an embodiment of the utility model has at least the following beneficial effects:

[0010] 1. The utility model provides a thermally conductive gel layer, which is used to be attached to the device housing and conduct heat from the device housing, so that the heat dissipation patch has self-adhesiveness and can be attached to the device housing through the thermally conductive gel layer, making the use of the heat dissipation patch more convenient. At the same time, the thermally conductive gel layer can conduct heat from the device housing, improve the heat absorption efficiency of the heat dissipation patch on the device housing, and accelerate the cooling speed of the device housing.

[0011] 2. The utility model provides a radiation heat dissipation layer, which is used to release heat outward to dissipate heat, thereby increasing the speed at which the heat dissipation patch releases heat into the air, and further increasing the heat dissipation efficiency of the heat dissipation patch.

[0012] 3. The utility model provides a heat pipe, which has an evaporation section and a condensation section. The evaporation section is embedded in the thermally conductive gel layer, and the condensation section abuts the radiation heat dissipation layer. The heat pipe is used to transfer the heat of the thermally conductive gel layer to the radiation heat dissipation layer. It can be understood that the heat of the thermally conductive gel layer is transferred to the liquid wick and the working fluid liquid therein through the tube wall of the evaporation section. The increase in the temperature of the working fluid liquid causes the working fluid liquid to evaporate, and the vapor flows from the evaporation section to the condensation section, and condenses in the condensation section, releasing latent heat of vaporization. The heat released by the condensation section quickly diffuses into the air through the radiation heat dissipation layer, thereby improving the heat transfer efficiency between the thermally conductive gel layer and the radiation heat dissipation layer. The working fluid liquid condensed in the condensation section is returned to the evaporation section by the internal liquid wick through capillary action, forming a cycle.

[0013] 4. The utility model sets a structural reinforcement layer between the thermally conductive gel layer and the radiation heat dissipation layer. The structural reinforcement layer is used to support and fix the condensation section. One side of the condensation section close to the radiation heat dissipation layer is exposed outside the structural reinforcement layer and abuts against the radiation heat dissipation layer, thereby facilitating the fixation of the condensation section and making the condensation section abut against the radiation heat dissipation layer for heat conduction.

[0014] 5. The utility model provides a phase change material layer between the thermally conductive gel layer and the structural reinforcement layer to absorb the heat of the thermally conductive gel layer. It can be understood that when the heat pipe fails to extract the heat from the thermally conductive gel layer in time, the heat of the thermally conductive gel layer can be transferred to the phase change material layer, prompting the phase change material of the phase change material layer to undergo a phase change, so that the phase change material layer absorbs a large amount of heat from the thermally conductive gel layer, thereby improving the heat dissipation stability of the heat sink and reducing the surface temperature of the device casing.

[0015] 6. The utility model arranges a thermally conductive gel layer, a radiation heat dissipation layer, a heat pipe, a structural reinforcement layer, and a phase change material layer on the heat dissipation patch, so that the heat dissipation patch becomes a patch-type product which is self-adhesive and can quickly conduct heat from the device casing for heat dissipation. Compared with existing radiator devices, the heat dissipation patch has the advantages of small size, no need for external power supply, easy to carry and easy to use, thereby improving the operating experience of mobile game enthusiasts.

[0016] According to some embodiments of the present invention, the heat pipe is U-shaped, and the evaporation section and the condensation section are arranged in parallel.

[0017] According to some embodiments of the present invention, the evaporation section and the condensation section are parallel to the thermally conductive gel layer and the radiation heat dissipation layer, respectively.

[0018] According to some embodiments of the present invention, a receiving groove is provided on a side of the structural reinforcement layer close to the radiation heat dissipation layer, and the receiving groove receives the condensation section.

[0019] According to some embodiments of the present invention, the structural reinforcement layer is one of silicone, rubber, epoxy resin, and polyurethane.

[0020] According to some embodiments of the present invention, the material of the phase change material layer is solid-solid phase change material.

[0021] According to some embodiments of the present invention, the radiation heat dissipation layer is a graphene heat dissipation paint, a carbon fiber heat dissipation paint, a carbon nanotube heat dissipation paint or a metal heat dissipation paint.

[0022] According to some embodiments of the present invention, the thermally conductive gel layer is a two-component thermally conductive gel.

[0023] According to some embodiments of the present invention, a surface protection layer is further included, and the surface protection layer is adhered to a side of the thermally conductive gel layer away from the radiation heat dissipation layer to protect the attached surface of the thermally conductive gel layer.

[0024] According to some embodiments of the present invention, the surface protection layer is a release film.

[0025] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0027] Figure 1 This is a schematic diagram of the structure of a convenient and quick heat dissipation patch before assembly according to an embodiment of the utility model;

[0028] Figure 2 This is a schematic diagram of the structure of a convenient and fast heat dissipation patch after assembly according to an embodiment of the utility model;

[0029] Figure 3 for Figure 2 A top view is shown;

[0030] Figure 4 for Figure 3 AA cross-sectional view shown;

[0031] Figure 5 for Figure 3 BB cross-sectional view is shown.

[0032] Figure numerals: 100 - thermally conductive gel layer, 110 - radiation heat dissipation layer, 120 - heat pipe, 130 - evaporation section, 140 - condensation section, 150 - structure reinforcement layer, 160 - phase change material layer, 170 - receiving groove, 180 - surface protection layer. DETAILED DESCRIPTION

[0033] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0034] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0035] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0036] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0037] A convenient and fast heat dissipation patch according to an embodiment of the utility model is described below in conjunction with the accompanying drawings.

[0038] Reference Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 A convenient and fast heat dissipation patch according to an embodiment of the utility model includes a thermally conductive gel layer 100 , a radiation heat dissipation layer 110 , a heat pipe 120 , a structural reinforcement layer 150 and a phase change material layer 160 .

[0039] The thermally conductive gel layer 100 is used to be attached to the device housing and to conduct heat from the device housing, thereby making the heat dissipation patch self-adhesive and able to be attached to the device housing through the thermally conductive gel layer 100, making the use of the heat dissipation patch more convenient. At the same time, the thermally conductive gel layer 100 can conduct heat from the device housing, thereby improving the heat absorption efficiency of the heat dissipation patch on the device housing and accelerating the cooling speed of the device housing.

[0040] In some specific embodiments, the thermally conductive gel layer 100 is a two-component thermally conductive gel.

[0041] It can be understood that the two-component thermally conductive gel includes component A and component B. When in use, component A and component B can be mixed and cured at room temperature or heated to accelerate curing, thereby facilitating the filling of the thermally conductive gel on the outer surface of the evaporation section 130 of the heat pipe 120 and between the evaporation section 130 and the phase change material layer 160, thereby eliminating the gap between the evaporation section 130 and the phase change material layer 160. At the same time, the two-component thermally conductive gel becomes an elastomer after curing and has a certain degree of adhesion, so that the thermally conductive gel layer 100 has self-adhesiveness, which facilitates the attachment of the heat sink to the device casing, making the use of the heat sink easier.

[0042] Specifically, the thermally conductive gel layer 100 is coated on the outer surface of the evaporation section 130 of the heat pipe 120 and between the evaporation section 130 and the phase change material layer 160 by smearing or dispensing, and is bonded to the heat pipe 120 and the phase change material layer 160 by natural curing or thermal curing.

[0043] In some specific embodiments, a surface protection layer 180 is further included, and the surface protection layer 180 is adhered to a side of the thermally conductive gel layer 100 away from the radiation heat dissipation layer 110 to protect the attachment surface of the thermally conductive gel layer 100. Therefore, before the heat dissipation patch is used, the surface protection layer 180 is adhered to a side of the thermally conductive gel layer 100 away from the radiation heat dissipation layer 110, so that the surface protection layer 180 can protect the attachment surface of the thermally conductive gel layer 100 and prevent the attachment surface of the thermally conductive gel layer 100 from being contaminated and affecting the adhesion of the attachment surface of the thermally conductive gel layer 100.

[0044] Furthermore, the surface protection layer 180 is a release film, so that the surface protection layer 180 can be easily peeled off when the heat sink patch is used, thereby facilitating the pasting operation of the heat sink patch.

[0045] As for the radiation heat dissipation layer 110, the radiation heat dissipation layer 110 is used to release heat outward to dissipate heat, thereby increasing the speed at which the heat dissipation patch releases heat into the air, and further increasing the heat dissipation efficiency of the heat dissipation patch.

[0046] In some specific embodiments, the radiation heat dissipation layer 110 is a graphene heat dissipation coating, a carbon fiber heat dissipation coating, a carbon nanotube heat dissipation coating or a metal heat dissipation coating, thereby ensuring that the radiation heat dissipation layer 110 has a good heat dissipation effect while being easy to purchase materials on the market.

[0047] Specifically, the radiation heat dissipation layer 110 is sprayed on the condensation section 140 exposed on the surface of the structure reinforcement layer 150 and the surface of the structure reinforcement layer 150 .

[0048] The heat pipe 120 has an evaporation section 130 and a condensation section 140 . The evaporation section 130 is embedded in the thermally conductive gel layer 100 , and the condensation section 140 abuts against the radiation heat dissipation layer 110 . The heat pipe 120 is used to transfer the heat of the thermally conductive gel layer 100 to the radiation heat dissipation layer 110 .

[0049] It can be understood that the heat of the thermally conductive gel layer 100 is transferred to the wick and the working fluid liquid therein through the tube wall of the evaporation section 130. The increase in the temperature of the working fluid liquid causes the working fluid liquid to evaporate. The vapor flows from the evaporation section 130 to the condensation section 140, and condenses in the condensation section 140, releasing the latent heat of vaporization. The heat released by the condensation section 140 quickly diffuses into the air through the radiation heat dissipation layer 110, thereby improving the heat transfer efficiency between the thermally conductive gel layer 100 and the radiation heat dissipation layer 110. The working fluid liquid condensed in the condensation section 140 is returned to the evaporation section 130 by the internal wick through capillary action, forming a cycle.

[0050] In some specific embodiments, the heat pipe 120 is U-shaped, and the evaporation section 130 is arranged in parallel with the condensation section 140, so that the extension directions of the evaporation section 130 and the condensation section 140 are parallel, so that the height of the heat pipe 120 is smaller, which is beneficial to reduce the thickness of the heat sink, making the heat sink smaller and easier to use.

[0051] Furthermore, the evaporation section 130 and the condensation section 140 are parallel to the thermally conductive gel layer 100 and the radiation heat dissipation layer 110, respectively, so that the contact area between the evaporation section 130 and the thermally conductive gel layer 100 and the contact area between the condensation section 140 and the radiation heat dissipation layer 110 are larger, thereby making the thermal conductivity between the thermally conductive gel layer 100 and the evaporation section 130 and between the condensation section 140 and the radiation heat dissipation layer 110 higher.

[0052] As for the structural reinforcement layer 150, the structural reinforcement layer 150 is arranged between the thermally conductive gel layer 100 and the radiation heat dissipation layer 110, and the structural reinforcement layer 150 is used to support and fix the condensation section 140. The side of the condensation section 140 close to the radiation heat dissipation layer 110 is exposed outside the structural reinforcement layer 150 and abuts against the radiation heat dissipation layer 110, thereby facilitating the fixing of the condensation section 140 and making the condensation section 140 abut against the radiation heat dissipation layer 110 for heat conduction.

[0053] In some specific embodiments, a receiving groove 170 is provided on one side of the structural reinforcement layer 150 close to the radiation heat dissipation layer 110, and the receiving groove 170 accommodates the condensation section 140, so that the receiving groove 170 can limit the side and bottom surfaces of the condensation section 140, thereby making the support of the structural reinforcement layer 150 to the condensation section 140 more stable.

[0054] Furthermore, the structural reinforcement layer 150 is one of silicone, rubber, epoxy resin, and polyurethane. Thus, the structural reinforcement layer 150 is made of common materials on the market, which is convenient for material acquisition and processing.

[0055] Specifically, the structural reinforcement layer 150 is poured into the condensation section 140 of the heat pipe 120 by pouring, and the structural reinforcement layer 150 is bonded to the condensation section 140 of the heat pipe 120 by natural curing or thermal curing.

[0056] As for the phase change material layer 160 , the phase change material layer 160 is disposed between the thermally conductive gel layer 100 and the structural reinforcement layer 150 , and the phase change material layer 160 is used to absorb the heat of the thermally conductive gel layer 100 .

[0057] It is understandable that when the heat pipe 120 fails to extract the heat from the thermally conductive gel layer 100 in a timely manner, the heat of the thermally conductive gel layer 100 can be transferred to the phase change material layer 160, causing the phase change material of the phase change material layer 160 to undergo a phase change, so that the phase change material layer 160 absorbs a large amount of heat from the thermally conductive gel layer 100, thereby improving the heat dissipation stability of the heat sink and reducing the surface temperature of the device casing.

[0058] In some specific embodiments, the phase change material layer 160 is made of solid-solid phase change material.

[0059] It can be understood that solid-solid phase change material is a type of material that can change its physical state within a specific temperature range. This state change does not involve the transition from liquid to gaseous state, but occurs directly between solid states. By using solid-solid phase change material to make the phase change material layer 160, the phase change material layer 160 does not involve the generation of liquid or gaseous state during the phase change process, so that the phase change material layer 160 has no leakage risk, is non-corrosive, and has a small volume change during the phase change process.

[0060] Specifically, the material of the phase change material layer 160 may be, but is not limited to, inorganic salts, polyols, cross-linked high-density polyethylene, layered perovskite or polymer cross-linked substances.

[0061] In this embodiment, a heat conductive gel layer 100, a radiation heat dissipation layer 110, a heat pipe 120, a structural reinforcement layer 150, and a phase change material layer 160 are arranged on the heat dissipation patch, so that the heat dissipation patch is formed into a patch-type product which is self-adhesive and can quickly conduct heat from the device housing for heat dissipation. Compared with existing radiator devices, the heat dissipation patch has the advantages of small size, no need for external power supply, easy to carry and convenient to use, thereby improving the operating experience of mobile game enthusiasts.

[0062] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0063] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A convenient and fast heat dissipation patch, characterized in that: include: A thermally conductive gel layer (100), used for being attached to a device housing and conducting heat away from the device housing; A radiation heat dissipation layer (110) is used to release heat to the outside to dissipate heat; A heat pipe (120) comprising an evaporation section (130) and a condensation section (140), wherein the evaporation section (130) is embedded in the thermally conductive gel layer (100), and the condensation section (140) abuts against the radiation heat dissipation layer (110); and the heat pipe (120) is used to transfer heat from the thermally conductive gel layer (100) to the radiation heat dissipation layer (110); a structural reinforcement layer (150) disposed between the thermally conductive gel layer (100) and the radiation heat dissipation layer (110) and used to support and fix the condensation section (140), wherein a side of the condensation section (140) close to the radiation heat dissipation layer (110) is exposed outside the structural reinforcement layer (150) and abuts against the radiation heat dissipation layer (110); The phase change material layer (160) is arranged between the thermally conductive gel layer (100) and the structural reinforcement layer (150) and is used to absorb heat from the thermally conductive gel layer (100).

2. A portable fast heat dissipation patch according to claim 1, characterized in that: The heat pipe (120) is U-shaped, and the evaporation section (130) and the condensation section (140) are arranged in parallel.

3. A portable fast heat dissipation patch according to claim 2, characterized in that: The evaporation section (130) and the condensation section (140) are respectively parallel to the thermally conductive gel layer (100) and the radiation heat dissipation layer (110).

4. A portable fast heat dissipation patch according to claim 1, characterized in that: A receiving groove (170) is provided on one side of the structural reinforcement layer (150) close to the radiation heat dissipation layer (110), and the receiving groove (170) accommodates the condensation section (140).

5. A portable fast heat dissipation patch according to claim 1, characterized in that: The structural reinforcement layer (150) is one of silica gel, rubber, epoxy resin and polyurethane.

6. A portable fast heat dissipation patch according to claim 1, characterized in that: The material of the phase change material layer (160) is a solid-solid phase change material.

7. A portable fast heat dissipation patch according to claim 1, characterized in that: The radiation heat dissipation layer (110) is a graphene heat dissipation paint, a carbon fiber heat dissipation paint, a carbon nanotube heat dissipation paint or a metal heat dissipation paint.

8. A portable fast heat dissipation patch according to claim 1, characterized in that: The thermally conductive gel layer (100) is a two-component thermally conductive gel.

9. A portable fast heat dissipation patch according to claim 1, characterized in that: It also comprises a surface protection layer (180), wherein the surface protection layer (180) is adhered to a side of the thermal conductive gel layer (100) away from the radiation heat dissipation layer (110) to protect the attached surface of the thermal conductive gel layer (100).

10. A portable fast heat dissipation patch according to claim 9, characterized in that: The surface protection layer (180) is a release film.

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