Cooling device and automobile

Abstract

The utility model belongs to the technical field of automobiles, and particularly relates to a cooling device and an automobile. According to the cooling device, the multiple cooling modules are arranged at intervals in the first direction, the cooling areas are formed between every two adjacent cooling modules, and when the electronic elements are placed in the cooling areas, the two sides of the electronic elements can make contact with the cooling modules correspondingly, so that the two sides of the electronic modules can be cooled; meanwhile, the multiple cooling modules can be arranged at intervals in the first direction, so that when multiple electronic elements need to be cooled, the number of the cooling areas can be designed to be the same as the types of the electronic elements, and double-face cooling can be conducted on the multiple different types of electronic elements at the same time.

Description

Technical Field

[0001] The present invention relates to the field of automobile technology, and more particularly to a cooling device and an automobile. Background Art

[0002] In the control of automobiles, the cooling of electronic components is involved so that the electronic components can have a better working environment. These electronic components can be semiconductor components, such as insulated gate bipolar transistors (IGBTs) or capacitors. When cooling these electronic components, the existing solutions usually adopt a single-sided cooling solution or set these electronic components in a cavity. When single-sided cooling is used for electronic components, the cooling rate of this cooling method is low. At the same time, the single-sided cooling solution also makes the overall temperature distribution of the electronic components uneven, affecting the working efficiency of the electronic components; when the electronic components are set in the cavity, the number of cavity settings of this device is limited, which limits the cooling number of electronic components. Utility Model Content

[0003] An object of the invention of the present application is to provide a cooling device that can achieve double-sided cooling of multiple electronic components at the same time, thereby providing the electronic components with a better working environment.

[0004] Another invention object of the present application is to provide a vehicle comprising the cooling device.

[0005] According to an embodiment of the present application, a first aspect provides a cooling device for cooling an electronic component, the cooling device comprising:

[0006] A plurality of cooling modules are arranged at intervals along a first direction, a cooling zone is formed between two adjacent cooling modules, wherein each cooling zone is used to cool a type of electronic component, wherein when a type of electronic component is placed in the cooling zone, two opposite sides of the electronic component are respectively in contact with the corresponding cooling modules and are cooled by heat absorption by the cooling modules;

[0007] Each of the cooling modules comprises an inlet for the cooling liquid to enter and an outlet for the cooling liquid to flow out. When the cooling liquid enters the cooling module, the cooling module can absorb heat and cool the electronic components.

[0008] In one embodiment, a plurality of heat-conducting columns are disposed on the inner wall of the cooling module, and the coolant contacts the heat-conducting columns when flowing in the cooling module.

[0009] In one embodiment, the cooling module includes a side plate and a shell, the side plate closes the shell, and the inner wall of the shell is provided with the heat-conducting column facing the side plate.

[0010] In one embodiment, in the second direction, the cooling module includes a first cavity and a second cavity that are alternately arranged, the first cavity is communicated with the second cavity, and a cross-sectional size of the first cavity is greater than a cross-sectional size of the second cavity.

[0011] In one embodiment, the number of the cooling modules is 4. In the first direction, the cooling zones formed in sequence between two adjacent cooling modules are respectively a first cooling zone, a second cooling zone and a third cooling zone. The first cooling zone is used to cool the first type of electronic components, the second cooling zone is used to cool the second type of electronic components, and the third cooling zone is used to cool the third type of electronic components.

[0012] In one embodiment, the space size of the first cooling zone and the space size of the third cooling zone are both smaller than the space size of the second cooling zone.

[0013] In one embodiment, the cooling device comprises a liquid inlet and a liquid outlet, the liquid inlet is communicated with the inlet of each cooling module, and the liquid outlet is communicated with the outlet of each cooling module respectively.

[0014] In one embodiment, the cooling module is made of aluminum alloy.

[0015] According to an embodiment of the present application, a second aspect provides a car, comprising the cooling device.

[0016] In one embodiment, in the first direction, the cooling module is formed with three cooling zones, two of which are used to cool semiconductor elements, and the other cooling zone is used to cool capacitors.

[0017] In the cooling device of the present application, a plurality of cooling modules are arranged at intervals along a first direction, and a cooling zone is formed between two adjacent cooling modules. When an electronic component is placed in the cooling zone, both sides of the electronic component can contact the cooling module respectively, so that both sides of the electronic module can be cooled. At the same time, since a plurality of cooling modules can be arranged at intervals along the first direction in the present application, when multiple electronic components need to be cooled, the number of cooling zones can be designed to be the same as the type of electronic components, so that multiple different types of electronic components can be cooled on both sides at the same time. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the top view of the cooling device in one embodiment of the present application;

[0019] Figure 2 This is a schematic diagram of the structure of a cooling module in one embodiment of the present application;

[0020] Figure 3It is a schematic structural diagram of a cooling device in another embodiment of the present application.

[0021] Description of Figure Numbers:

[0022] 100, cooling module; 110, heat conducting column; 120, side plate; 130, housing; 140, first cavity; 150, second cavity;

[0023] 200, cooling zone; 210, first cooling zone; 220, second cooling zone; 230, third cooling zone;

[0024] 310, first type of electronic component; 320, second type of electronic component; 330, third type of electronic component; 410, liquid inlet; 420, liquid outlet. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0026] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention.

[0027] The structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology, and are not used to limit the conditions under which the present invention can be implemented. Any structural modification, change in proportion or adjustment of size should still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0028] The directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "middle", "longitudinal", "lateral", "horizontal", "inner", "outer", "radial", "circumferential" and the like in this specification are based on the directions or positional relationships shown in the drawings and are only for the convenience of simplifying the description. They do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0029] In the control of automobiles, the cooling of electronic components is involved so that the electronic components can have a better working environment. These electronic components can be semiconductor components, such as insulated gate bipolar transistors (IGBTs) or capacitors. When cooling these electronic components, the existing solutions usually adopt a single-sided cooling solution or set these electronic components in a cavity. When single-sided cooling is used for electronic components, the cooling rate of this cooling method is low. At the same time, the single-sided cooling solution also makes the overall temperature distribution of the electronic components uneven, affecting the working efficiency of the electronic components; when the electronic components are set in the cavity, the number of cavity settings of this device is limited, which limits the cooling number of electronic components. In order to better solve this problem, the researchers of this application proposed a cooling device, which forms multiple cooling zones by arranging multiple cooling modules at intervals along a first direction. An electronic component can be placed in each cooling zone. When the electronic component is placed in a cooling zone, the two opposite sides of the electronic component can contact the cooling module respectively, thereby realizing double-sided cooling of the electronic component and improving the cooling efficiency of the electronic component. At the same time, since multiple cooling modules are arranged at intervals along the first direction, when multiple electronic components need to be cooled, the number of cooling zones can be set to be the same as the type of electronic components, so that multiple electronic components can be cooled. Furthermore, this application also proposes a car including the cooling device.

[0030] like Figure 1 As shown, Figure 1 The top view of the cooling device in one embodiment of the present application is a schematic diagram of the structure. The cooling device in this embodiment can cool multiple electronic components on both sides at the same time to ensure that the electronic components work within a normal temperature range.

[0031] Specifically, the cooling device includes: a plurality of cooling modules 100 spaced apart along a first direction, the first direction can refer to Figure 1 In the direction indicated by the arrow a, a cooling zone 200 is formed between two adjacent cooling modules 100, wherein each cooling zone 200 is used to cool an electronic component, wherein when an electronic component is placed in the cooling zone 200, the two opposite sides of the electronic component are respectively in contact with the corresponding cooling modules 100 and are cooled down by the cooling modules 100 while absorbing heat; each cooling module 100 includes an inlet for the entry of coolant and an outlet for the exit of coolant, and when the coolant enters the cooling module 100, the cooling module 100 can absorb heat from the electronic component and cool it down. It should be noted that the cooling module 100 itself can transfer a heat source, that is, when the electronic component is in contact with the cooling module 100, the cooling module 100 can absorb the heat from the electronic component. The cooling module 100 can be made of metal, for example, the cooling module 100 can be made of aluminum alloy. In addition, the attached Figure 1The cooling zone 200 indicated in the figure should be understood as the space between two adjacent cooling modules 100 being the cooling zone 200 .

[0032] In this embodiment, when it is necessary to cool multiple electronic components, the number of cooling zones 200 formed by cooling modules 100 arranged at intervals along the first direction is set to be the same as the type of electronic components. When multiple electronic components are placed in the cooling zones 200 in a one-to-one correspondence, both sides of the electronic components can contact both sides of the cooling modules 100. When the coolant flows in the cooling modules 100, the cooling modules 100 can absorb heat and cool both sides of the electronic components, thereby achieving double-sided cooling of the multiple electronic components.

[0033] Specifically, for example, when three types of electronic components need to be cooled, the number of cooling zones 200 can be set to 3, and the number of cooling zones 200 can be changed by increasing or decreasing the number of cooling modules 100, and each type of electronic component can be placed in the cooling zone 200 accordingly. When each electronic component is placed in the cooling zone 200, the opposite sides of each electronic component can be in contact with the cooling module 100 respectively, and when the coolant flows in the cooling module 100, the cooling module 100 can cool the opposite sides of the electronic component. Similarly, when there are multiple types of electronic components, the arrangement of the cooling module 100 in the first direction can be adopted, so that the number of cooling zones 200 is the same as the type of electronic components, so that double-sided cooling of multiple electronic components can be achieved.

[0034] In one embodiment, see Figure 2 As shown, a plurality of heat-conducting pillars 110 are disposed on the inner wall of the cooling module 100 , and the coolant contacts the heat-conducting pillars 110 when flowing in the cooling module 100 .

[0035] In this embodiment, the researchers set a plurality of heat-conducting columns 110 in the inner wall of the cooling module 100. When the coolant flows inside the cooling module 100, the heat-conducting columns 110 can come into contact with the coolant, thereby increasing the contact area between the cooling module 100 and the coolant, allowing the coolant to better absorb the temperature of the cooling module 100, ensuring that the cooling module 100 better absorbs the temperature of the electronic components.

[0036] Further, in one embodiment, see Figure 2 As shown, the cooling module 100 includes a side plate 120 and a shell 130 , wherein the side plate 120 closes the shell 130 , and the inner wall of the shell 130 is provided with a heat conducting column 110 facing the side plate 120 .

[0037] In this embodiment, the researchers set the cooling module 100 to a structure composed of a side plate 120 and a shell 130, so that when manufacturing the cooling module 100, the heat-conducting column 110 can be first set on the side of the shell 130, and then the shell 130 can be closed by the side plate 120. In addition, the heat-conducting column 110 is set on the side facing the side plate 120, so that when the side of the shell 130 where the heat-conducting column 110 is set contacts with the electronic component, the heat transferred by the electronic component can be quickly transferred to the heat-conducting column 110, thereby accelerating the cooling rate of the cooling module 100.

[0038] In one embodiment, see Figure 3 As shown, in the second direction, the second direction can refer to Figure 3 In the direction pointed by the middle arrow b, the cooling module 100 includes alternately arranged first cavities 140 and second cavities 150 , the first cavities 140 are connected to the second cavities 150 , and the cross-sectional size of the first cavities 140 is greater than the cross-sectional size of the second cavities 150 .

[0039] In this embodiment, the larger cross-sectional size of the first cavity 140 significantly reduces the resistance of the coolant during the flow process, allowing the coolant to pass quickly with lower pressure loss. Through this design, the researchers effectively improved the overall flow efficiency of the coolant, ensuring that the coolant can cover the entire cooling module 100 more quickly. On the other hand, due to its smaller cross-sectional size, the second cavity 150 will generate a higher local flow velocity when the coolant passes through. This high flow velocity can cause stronger turbulence in the cavity, enhancing the heat exchange efficiency between the coolant and the cavity wall.

[0040] Specifically, when the coolant enters the second cavity 150 from the first cavity 140, the sudden decrease in cross-sectional size causes the flow rate to increase, and the generated turbulence significantly increases the heat exchange rate between the coolant and the cavity wall. In the turbulent state, the heat transfer capacity of the coolant is greatly enhanced, thereby accelerating the absorption and dissipation of heat by the coolant.

[0041] In one embodiment, see Figure 1 and Figure 3 As shown, the number of cooling modules 100 is 4. In the first direction, the cooling zones 200 formed in sequence between two adjacent cooling modules 100 are respectively the first cooling zone 210, the second cooling zone 220 and the third cooling zone 230. The first cooling zone 210 is used to cool the first type of electronic components 310, the second cooling zone 220 is used to cool the second type of electronic components 320, and the third cooling zone 230 is used to cool the third type of electronic components 330.

[0042] In this embodiment, the researchers set the number of cooling modules 100 to 4, so that a first cooling zone 210, a second cooling zone 220 and a third cooling zone 230 can be formed in the first direction, wherein the first cooling zone 210 can place the first type of electronic components 310, the second cooling zone 220 can place the second type of electronic components 320, and the third cooling zone 230 can place the third type of electronic components 330. In this way, double-sided cooling of the three types of electronic components can be achieved.

[0043] Furthermore, in one embodiment, the space size of the first cooling zone 210 and the space size of the third cooling zone 230 are both smaller than the space size of the second cooling zone 220 .

[0044] The researchers proposed that in the process of using the cooling device, the cooling of semiconductors and capacitors is involved. Since the size of the capacitor is larger than the size of the semiconductor, the space size of the second cooling zone 220 is set to be larger than the space size of the first cooling zone 210 and the space size of the third cooling zone 230. It should be noted that when changing the space size of the cooling zone 200, the space size can be changed by changing the spacing between the relative cooling modules 100.

[0045] In one embodiment, see Figure 3 As shown, the cooling device includes a liquid inlet 410 and a liquid outlet 420 , wherein the liquid inlet 410 is communicated with the inlet of each cooling module 100 , and the liquid outlet 420 is communicated with the outlet of each cooling module 100 , respectively.

[0046] In this embodiment, the liquid inlet 410 set by the researchers can simultaneously deliver coolant to the inlets of multiple cooling modules 100, and the liquid outlet 420 is connected to the outlet of each cooling module 100, so that the coolant flowing out of each cooling module 100 can flow out uniformly through the liquid outlet 420. It should be noted that the liquid inlet 410 can be connected to the inlet of each cooling module 100 through a pipeline, and similarly, the liquid outlet 420 can be connected to the outlet of each cooling module 100 through a pipeline.

[0047] In one embodiment, the researchers also proposed a car, wherein the car includes the above-mentioned cooling device.

[0048] For further information, see Figure 1 As shown, in one embodiment, in a first direction, the cooling module 100 is formed with three cooling zones 200 , wherein two cooling zones 200 are respectively used for cooling semiconductor elements, and another cooling zone 200 is used for cooling capacitors.

[0049] In this embodiment, by installing the cooling device in the automobile, double-sided cooling of the semiconductor element and the capacitor can be achieved simultaneously, so that the electronic element can work normally.

[0050] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0051] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A cooling device for cooling electronic components, characterized in that: The cooling device comprises: A plurality of cooling modules (100) are arranged at intervals along a first direction, a cooling zone (200) is formed between two adjacent cooling modules (100), wherein each cooling zone (200) is used to cool a type of electronic component, and when a type of electronic component is placed in the cooling zone (200), two opposite sides of the electronic component are respectively in contact with the corresponding cooling modules (100) and are cooled by heat absorption by the cooling modules (100); Each cooling module (100) comprises an inlet for cooling liquid to enter and an outlet for cooling liquid to flow out; when the cooling liquid enters the cooling module (100), the cooling module (100) can absorb heat and cool the electronic components.

2. The cooling device according to claim 1, characterized in that: The inner wall of the cooling module (100) is provided with a plurality of heat-conducting columns (110), and the cooling liquid contacts the heat-conducting columns (110) when flowing in the cooling module (100).

3. The cooling device according to claim 2, characterized in that: The cooling module (100) comprises a side plate (120) and a shell (130), wherein the side plate (120) closes the shell (130), and the inner wall of the shell (130) is provided with the heat-conducting column (110) facing the side plate (120).

4. The cooling device according to claim 1, characterized in that: In the second direction, the cooling module (100) comprises a first cavity (140) and a second cavity (150) which are alternately arranged, the first cavity (140) is connected to the second cavity (150), and the cross-sectional size of the first cavity (140) is greater than the cross-sectional size of the second cavity (150).

5. The cooling device according to claim 1, characterized in that: The number of the cooling modules (100) is four. In the first direction, the cooling zones (200) formed in sequence between two adjacent cooling modules (100) are respectively a first cooling zone (210), a second cooling zone (220), and a third cooling zone (230). The first cooling zone (210) is used to cool down a first type of electronic component (310), the second cooling zone (220) is used to cool down a second type of electronic component (320), and the third cooling zone (230) is used to cool down a third type of electronic component (330).

6. The cooling device according to claim 5, characterized in that: The spatial size of the first cooling zone (210) and the spatial size of the third cooling zone (230) are both smaller than the spatial size of the second cooling zone (220).

7. The cooling device according to claim 1, characterized in that: The cooling device comprises a liquid inlet (410) and a liquid outlet (420), wherein the liquid inlet (410) is connected to the inlet of each cooling module (100), and the liquid outlet (420) is respectively connected to the outlet of each cooling module (100).

8. The cooling device according to claim 1, characterized in that: The cooling module (100) is made of aluminum alloy.

9. A car, characterized in that: A cooling device comprising the cooling device according to any one of claims 1 to 8.

10. The automobile according to claim 9, characterized in that: In the first direction, the cooling module (100) is formed with three cooling zones (200), two of which are used to cool semiconductor elements, and the other cooling zone (200) is used to cool capacitors.

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