Laser grooving equipment for main roller of slicing machine

Abstract

The utility model provides a slicing machine main roller laser grooving device which comprises a positioning tool used for placing the ends of the two sides of a main roller, an X-axis sliding rail, a laser device and an optical lens set, and a roller shaft of the main roller is connected with a driving rotating shaft. The X-axis sliding rail is parallel to the main roller placed on the positioning tool, and an X-axis sliding plate capable of sliding along the X-axis sliding rail is arranged on the X-axis sliding rail; a Y-axis sliding rail perpendicular to the X-axis sliding rail is arranged on the X-axis sliding plate, and a Y-axis sliding plate capable of sliding along the Y-axis sliding rail is arranged on the Y-axis sliding rail; in the light path direction, a beam expander used for expanding incident laser beams from the laser and a lambda / 2 wave plate used for adjusting the polarization angle of the light beams are arranged in the optical lens set, and the light beams emitted from the optical lens set are reflected by the reflector, then enter the cutting head and are converged to the surface of the main roller through the cutting head. The reflecting mirror is fixed on the X-axis sliding plate; and the focusing and positioning module is used for automatic laser focusing and positioning on the main roller and is fixed on the Y-axis sliding plate.

Description

Technical Field

[0001] The utility model relates to the technical field of solar silicon slice or semiconductor wafer slicing, in particular to laser grooving equipment for a main roller of a slicer. Background Art

[0002] The main raw materials of crystalline silicon cells in the photovoltaic field are monocrystalline silicon wafers and polycrystalline silicon wafers, while those in the semiconductor field are mostly monocrystalline silicon wafers or silicon carbide wafers. The main processing method of the wafers is to cut them with a slicer. The silicon wafer slicer includes a main roller and a diamond wire. The main roller is provided with a groove for accommodating the diamond wire. The diamond wire is used to cut the silicon wafer. The diamond wire cutting method has the advantages of high processing efficiency, low silicon material loss, and stable quality of cut silicon wafers. It has been fully promoted in the field of monocrystalline silicon wafer manufacturing.

[0003] In the prior art, the slotting method for the receiving groove on the main roller mainly adopts a PCD slotting tool, and the processing program is set according to the preset slot trajectory to process the surface of the main roller. Since the main roller is mainly made of polyurethane or carbon fiber, which has a relatively high hardness, a main roller needs to repeat the program more than 5,000 times to open about 5,000 grooves. The tool wears a lot, resulting in the slot shape being prone to deviation and poor consistency. In addition, PCD tool slotting is a contact processing, and polyurethane has a certain elasticity. Contact processing will cause the slot shape to be distorted, asymmetrical, split, and the side wall roughness will increase, which will increase the friction resistance between the diamond wire and the receiving groove, reducing the quality of subsequent slicing. Utility Model Content

[0004] The technical problem to be solved by the utility model is to overcome the problems of distortion of main roller grooves, large groove side wall roughness, poor consistency, etc. processed by the existing PCD tool groove machine, and provide a laser groove opening device for the main roller of a slicer.

[0005] The technical problem to be solved can be implemented through the following technical solutions.

[0006] A laser slotting device for a main roller of a slicer, characterized by comprising:

[0007] A positioning fixture for placing the ends of both sides of the main roller, wherein the roller shaft of the main roller is connected to a rotating shaft that can drive the main roller to rotate; and

[0008] An X-axis slide rail, wherein the X-axis slide rail is parallel to the main roller placed on the positioning fixture, and an X-axis slide plate is provided on the X-axis slide rail and can slide along the X-axis slide rail; a Y-axis slide rail perpendicular to the X-axis slide rail is provided on the X-axis slide plate, and a Y-axis slide plate is provided on the Y-axis slide rail and can slide along the Y-axis slide rail; and

[0009] A laser and an optical lens group, along the optical path direction, the optical lens group is provided with at least a beam expander for expanding an incident laser beam from the laser and a λ / 2 wave plate for adjusting the polarization angle of the beam, the light beam emitted from the optical lens group is reflected by an outgoing beam reflector and then incident on a cutting head, and then converged by the cutting head and converged on the surface of the main roller; the outgoing beam reflector is fixed on the X-axis sliding plate;

[0010] It also includes a focusing and positioning module for laser automatic focusing and positioning of a set position point on the main roller, and the focusing and positioning module is fixed on the Y-axis sliding plate.

[0011] Furthermore, the optical lens assembly is also provided with a beam shaper which can shape the Gaussian spot emitted by the laser into a flat-top spot with uniform energy distribution or a π-shaped spot with high edge energy and low center energy.

[0012] Furthermore, along the optical path direction, the beam shaper is arranged in front of the λ / 2 wave plate.

[0013] Preferably, the optical lens assembly is further provided with a dove prism lens assembly for driving the laser beam to rotate along the optical axis direction. Along the optical path direction, the dove prism lens assembly is arranged in front of the beam shaper.

[0014] Preferably, the laser is connected to the rotating shaft in a linkage manner so that laser pulses can be triggered at equal intervals according to the rotation distance.

[0015] Furthermore, an online detection module for online detection of groove type data of the processed groove is provided, and the online detection module is positioned on the Y-axis sliding plate.

[0016] Furthermore, the laser emission wavelength of the laser is 343nm-1080nm, and the pulse width is ≤100ns.

[0017] Preferably, it also includes a dust hood, which is externally connected to a vacuum cleaner for promptly sucking away dust generated during grooving; the dust hood is arranged at the adjacent end of the cutting head.

[0018] Preferably, the beam expander is a programmable electrically adjustable beam expander.

[0019] The laser grooving equipment of the utility model utilizes the advantages of laser non-contact processing, no wear, good processing consistency, and easy integration to achieve automated processing. It can solve the problems of main roller groove distortion, large groove side wall roughness, and poor consistency in existing PCD tool grooving machines.

[0020] Compared with the existing equipment, the utility model has the following advantages:

[0021] 1. The laser slotting equipment of the utility model adopts laser non-contact processing, which has the advantages of no wear, good processing consistency, and easy integration to realize automated processing, and can effectively improve the main roller groove quality and subsequent slicing quality.

[0022] 2. This equipment uses laser processing, and the focused spot can be adjusted to the micron level, which is beneficial to reduce the groove pitch on the main roller.

[0023] 3. This equipment can realize the processing of different groove types when using customized optical input group. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 This is a structural schematic diagram of the laser slotting equipment for the main roller of the slicer of the utility model;

[0025] Figure 2 This is a schematic diagram of the structure of the optical lens assembly of the utility model;

[0026] In the figure:

[0027] 1. Laser;

[0028] 2. Optical lens group; 20. Entrance hole; 21. Beam expander; 22. λ / 2 wave plate; 23. Beam shaper; 24. Dove prism lens group; 25. First reflector; 26. Second reflector; 27. Third reflector; 28. Sealed box; 29. ​​Exit hole;

[0029] 3. Reflector; 4. Cutting head; 5. Dust hood; 6. Online detection module; 7. Focus and positioning module; 8. Main roller;

[0030] 9. X-axis slide rail; 91. X-axis sliding plate;

[0031] 10. Y-axis slide rail; 101. Y-axis sliding plate;

[0032] 11. Rotating axis; 12. Support seat; 13. Tooling; 14. Marble platform; DETAILED DESCRIPTION

[0033] The specific implementation of the utility model is further described in detail below with reference to the accompanying drawings.

[0034] Reference Figure 1 and Figure 2 As shown, the laser grooving equipment for the main roller of a slicer provided by the utility model mainly includes a laser 1, an optical lens group 2, a reflector 3, a cutting head 4, a dust hood 5, an online detection module 6, a focusing and positioning module 7, a main roller 8, an X-axis slide rail 9, a Y-axis slide rail 10, a rotating shaft 11, a support seat 12, a tooling 13 and a marble platform 14.

[0035] The two ends of the main roller 8 to be slotted are fixed by the tooling 13 respectively, one end of the main roller 8 is connected to the rotating shaft 11 that can drive the main roller 8 to rotate by the tooling 13, and the other end is placed on the support seat 12 by the tooling 13. The marble platform 14 is used as the base of the entire slotting equipment, and the base is also provided with an X-axis slide rail 9 parallel to the main roller 8, and the X-axis slide rail 9 is provided with an X-axis slide plate 91 that can slide along it. The X-axis slide plate 91 is provided with a Y-axis slide rail 10 perpendicular to the X-axis slide rail 9, and the Y-axis slide rail 10 is provided with a Y-axis slide plate 101 that can slide along it. The reflector 3 is fixed on the X-axis slide plate 91 and can slide and shift along the X-axis slide rail 9; the cutting head 4, the dust cover 5, the online detection module 6 and the focusing and positioning module 7 are fixed on the Y-axis slide plate 101 and can slide and shift along the Y-axis slide rail 10.

[0036] The laser beam emitted by the laser 1 enters the beam expander 21 in the optical lens group 2 from the incident hole 20 provided on the sealed box 28 of the optical lens group 2 for beam expansion, and then passes through the λ / 2 wave plate 22 to adjust the beam polarization angle, and then passes through the beam shaper 23 to shape the Gaussian spot emitted by the laser into a flat-top spot with uniform energy distribution or a π-shaped spot with high edge energy and low center energy; the optical lens group 2 also adds a dove prism lens group 24 to rotate the laser beam along the optical axis, reduce the impact of the roundness deviation of the laser spot, and improve the grooving efficiency. Finally, after being reflected by the first reflector 25, the second reflector 26 and the third reflector 27, it is emitted from the exit hole 29. The light beam emitted after adjusting the position and angle of the light beam from the optical lens group 2 is reflected by the reflector 3 and then incident on the cutting head 4. After being focused by the cutting head 4, it converges on the surface of the main roller 8 for processing; the dust hood 5 is externally connected to a vacuum cleaner to promptly absorb the dust generated by the processing; the X-axis slide rail 9 and the Y-axis slide rail 10 are cross-shaped, with the Y-axis slide rail on the top and the X-axis slide rail on the bottom; the online detection module 6 is installed at a height that is confocal with the cutting head 4 and is used for online detection of the processing groove type data; the focusing and positioning module 7 is used for laser automatic focusing and the first and last point positioning of the main roller 8; the tooling 13 on both sides is respectively installed on the rotating shaft (i.e., the rotating shaft 11) and the support seat 12, and is used to fix the main roller 8.

[0037] The laser 1 is linked with the rotating shaft 11 to achieve the triggering of laser pulses at equal intervals according to the rotation distance. The beam expander 21 in the optical lens group 2 is a programmable electrically adjustable beam expander, which adjusts the beam expansion ratio in real time through program compensation to reduce the influence of beam divergence in the flying light path. The laser emits a laser wavelength of 343nm to 1080nm, and the pulse width is ≤100ns.

[0038] The following is a specific application example.

[0039] In this application example, the laser wavelength is 1064nm, the pulse width is 20ps, the pulse frequency is 1-2000KHz, the spot diameter is 3mm, the beam quality factor is ≤1.3, the power stability is ≤3%, and the polarization type is horizontally polarized linear polarized light.

[0040] The beam expander is a fixed-magnification beam expander with a beam expansion ratio of 4 times.

[0041] The effective focal length of the cutting head is EFL = 100 mm.

[0042] The λ / 2 wave plate is an air-gap zero-order wave plate with a phase delay accuracy of λ / 300.

[0043] The beam shaper homogenizes the beam, and the spot energy uniformity is ≥95%.

Claims

1. A laser grooving device for a main roller of a slicer, characterized in that: include: A positioning fixture for placing the ends of both sides of the main roller, wherein the roller shaft of the main roller is connected to a rotating shaft that can drive it to rotate; and An X-axis slide rail, wherein the X-axis slide rail is parallel to the main roller placed on the positioning fixture, and an X-axis slide plate is provided on the X-axis slide rail and can slide along the X-axis slide rail; a Y-axis slide rail perpendicular to the X-axis slide rail is provided on the X-axis slide plate, and a Y-axis slide plate is provided on the Y-axis slide rail and can slide along the Y-axis slide rail; and A laser and an optical lens group, along the optical path direction, the optical lens group is provided with at least a beam expander for expanding an incident laser beam from the laser and a λ / 2 wave plate for adjusting the polarization angle of the beam, the light beam emitted from the optical lens group is reflected by an outgoing beam reflector and then incident on a cutting head, and then converged by the cutting head and converged on the surface of the main roller; the outgoing beam reflector is fixed on the X-axis sliding plate; It also includes a focusing and positioning module for laser automatic focusing and positioning of a set position point on the main roller, and the focusing and positioning module is fixed on the Y-axis sliding plate.

2. The laser grooving equipment for the main roller of a slicer according to claim 1, characterized in that: The optical lens assembly is also provided with a beam shaper which can shape the Gaussian light spot emitted by the laser into a flat-top light spot with uniform energy distribution or a π-shaped light spot with high edge energy and low center energy.

3. The laser grooving equipment for the main roller of a slicer according to claim 2, characterized in that: Along the optical path direction, the beam shaper is arranged in front of the λ / 2 wave plate.

4. The laser grooving equipment for the main roller of a slicer according to claim 2 or 3, characterized in that: The optical lens group is also provided with a Dove prism lens group for driving the laser beam to rotate along the optical axis direction.

5. The laser grooving equipment for the main roller of a slicer according to claim 4, characterized in that: Along the optical path direction, the dove prism lens assembly is arranged in front of the beam shaper.

6. The laser grooving equipment for the main roller of a slicer according to claim 1, characterized in that: The laser is connected to the rotating shaft in a linkage manner so that laser pulses can be triggered at equal intervals according to the rotation distance.

7. The laser grooving equipment for the main roller of a slicer according to claim 1, characterized in that: An online detection module for online detection of groove type data of the processed groove is also provided, and the online detection module is positioned on the Y-axis sliding plate.

8. The laser grooving equipment for the main roller of a slicer according to claim 1, characterized in that: The laser emission wavelength of the laser is 343nm-1080nm, and the pulse width is ≤100ns.

9. The laser grooving equipment for the main roller of a slicer according to claim 1, characterized in that: It also includes a dust hood, which is externally connected to a vacuum cleaner for promptly sucking away dust generated during grooving; the dust hood is arranged at the adjacent end of the cutting head.

10. The laser grooving equipment for the main roller of a slicer according to claim 1, characterized in that: The beam expander is a programmable electrically adjustable beam expander.

Images