Electroplating liquid circulating system

Abstract

The utility model provides an electroplating liquid circulating system, and belongs to the technical field of electroplating equipment. The electroplating liquid circulating system comprises a mixing tank, an exhaust tank and a storage tank. The mixing tank is provided with a liquid inlet to receive the electroplating liquid from at least one electroplating tank, and the mixing tank is configured to be used for mixing the electroplating liquid with additives; the exhaust groove is communicated with the mixing groove through a first connecting pipeline, and the exhaust groove is constructed to be used for exhausting gas; and the storage tank is communicated with the exhaust groove through a second connecting pipeline, the storage tank is constructed to be used for storing the electroplating liquid, and the storage tank is provided with a liquid return opening so that the electroplating liquid can flow back to at least one electroplating tank.

Description

Technical Field

[0001] The present application relates to the technical field of electroplating equipment, and in particular to an electroplating liquid circulation system. Background Art

[0002] Electroplating refers to a process in which an electrolytic reaction occurs in a plating solution under the action of direct current, causing a metal layer or alloy layer to be deposited on the surface of a conductive body such as a metal or other material part, thereby preventing metal oxidation (such as rust) and improving wear resistance, conductivity, and reflectivity.

[0003] The electroplating solution in the electroplating tank is easily denatured during the circulation process. In view of this, how to improve the stability of the electroplating solution during the circulation process is an urgent problem to be solved in the industry. Utility Model Content

[0004] The present application aims to solve at least one of the technical problems in the background art. To this end, one object of the present application is to provide a plating solution circulation system to improve the stability of the plating solution during the circulation process.

[0005] The embodiment of the first aspect of the present application provides a plating solution circulation system, comprising a mixing tank, an exhaust tank and a storage tank. The mixing tank has a liquid inlet to receive the plating solution from at least one plating tank, and the mixing tank is configured to mix the plating solution with an additive; the exhaust tank is connected to the mixing tank through a first connecting pipeline, and the exhaust tank is configured to exhaust gas; the storage tank is connected to the exhaust tank through a second connecting pipeline, and the storage tank is configured to store the plating solution, and the storage tank has a liquid return port to reflux the plating solution to at least one plating tank.

[0006] In the technical solution of the embodiment of the present application, by using a mixing tank to receive the plating solution from the plating tank, mixing the plating solution with additives, the loss of the plating solution caused by the plating process can be supplemented; the exhaust tank discharges the gas in the plating solution after mixing in the mixing tank, which can effectively discharge the residual gas in the plating solution; the storage tank stores the plating solution after the gas is discharged from the exhaust tank, allowing long-term storage of the plating solution, and the plating solution is refluxed to at least one plating tank through the liquid return port, so that the electroplating work can be carried out continuously. The plating solution circulates between the plating tank and the plating solution circulation system, and the stability of the plating solution is improved by mixing with the mixture, removing the residual gas and allowing long-term storage.

[0007] In some embodiments, a plurality of baffles protruding from the inner wall of the mixing tank are arranged at different heights in the mixing tank, and the plurality of baffles are arranged in a staggered manner to form a circuitous fluid channel in the inner cavity of the mixing tank. By arranging staggered baffles in the mixing tank, the plating solution can flow from top to bottom by its own weight, and the plating solution and additives are effectively mixed while flowing, thereby avoiding the problem of uneven mixing of the plating solution. In addition, in this manner, the plating solution is not violently shaken or stirred, and the decomposition of the plating solution additives is not caused.

[0008] In some embodiments, at least one of an agitator and a liquid level detection device is provided in the exhaust tank. By providing an agitator in the exhaust tank, the discharge of residual gas in the electroplating solution can be accelerated, thereby shortening the processing time of the electroplating solution; by providing a liquid level detection device in the exhaust tank, the amount of the electroplating solution in the exhaust tank can be detected in time.

[0009] In some embodiments, the electroplating solution circulation system further comprises an exhaust device connected to the exhaust groove. By providing the exhaust device connected to the exhaust groove, the residual gas in the exhaust groove can be extracted in time, reducing the probability of the additive in the electroplating solution being oxidized by the gas.

[0010] In some embodiments, the storage tank further includes a bottom wall and a drain port, the drain port and the liquid return port are respectively located at two ends of the bottom wall, and the height of the bottom wall at one end at the liquid return port is higher than the height of the bottom wall at one end at the drain port. By setting the bottom wall of the storage tank such that the height of the bottom wall at one end at the liquid return port is higher than the height of the bottom wall at one end at the drain port, it is convenient to remove excess impurities from the drain port, thereby improving the convenience and practicality of the storage tank.

[0011] In some embodiments, the storage tank is located below the mixing tank and the exhaust tank. By setting the storage tank below the mixing tank and the exhaust tank, the electroplating solution can be refluxed from the mixing tank and the exhaust tank to the storage tank only by gravity, thereby improving the efficiency of the electroplating solution circulation.

[0012] In some embodiments, the electroplating solution circulation system further includes an aeration device connected to the storage tank. By providing the aeration device connected to the storage tank in the electroplating solution circulation system, an inert gas can be charged into the storage tank to reduce the probability of the additive in the electroplating solution reacting with air, thereby reducing the probability of the electroplating solution being consumed during storage.

[0013] In some embodiments, the plating solution circulation system further includes at least one plating tank, each plating tank including a liquid inlet and a liquid discharge port located at the bottom of the plating tank, the liquid inlet is connected to the liquid return port of the storage tank, the liquid discharge port is connected to the liquid inlet of the mixing tank, and the mixing tank is located below at least one plating tank. The plating solution circulation system can cooperate with multiple electroplating production lines, improve the consistency of the plating solutions of multiple electroplating production lines, and facilitate product batch consistency. It also improves the integration of the plating solution circulation system and the electroplating production line, saves the cost and time of plating solution processing and maintenance, and is conducive to large-scale mass production.

[0014] In some embodiments, a filter pump is provided on at least one of the first connecting pipeline and the second connecting pipeline. By providing a filter pump on at least one of the first connecting pipeline and the second connecting pipeline, foreign matter in the electroplating solution can be fully filtered, so that the quality of the electroplating solution is effectively improved, and at the same time, the service life of the electroplating solution can be extended, and the production cost can be reduced.

[0015] In some embodiments, the electroplating solution circulation system further comprises a material adding device connected to the mixing tank for adding additives to the mixing tank. By adding additives to the mixing tank through the material adding device connected to the mixing tank, the main components of the electroplating solution and the electroplating solution additives can be replenished in time, thereby improving the stability of the electroplating solution.

[0016] In some embodiments, the plating solution circulation system further includes a plating solution component analyzer, which is connected to the mixing tank, the exhaust tank and the storage tank. The plating solution component analyzer can be used to analyze the components of the plating solution in the mixing tank, the exhaust tank and the storage tank to monitor the stability of the plating solution.

[0017] In some embodiments, the plating solution circulation system further includes a plating solution controller, which is at least electrically connected to the plating solution component analyzer. By setting up the plating solution controller, the components of the plating solution can be further controlled and adjusted in a timely manner, thereby further improving the stability of the components of the plating solution.

[0018] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In the accompanying drawings, unless otherwise specified, the same reference numerals throughout the multiple drawings represent the same or similar parts or elements. These drawings are not necessarily drawn to scale. It should be understood that these drawings only depict some embodiments disclosed in the present application and should not be regarded as limiting the scope of the present application.

[0020] Figure 1 Schematic diagram of the electroplating solution circulation system of some embodiments of the present application Figure 1 ;

[0021] Figure 2 Schematic diagram of the electroplating solution circulation system of some embodiments of the present application Figure 2 .

[0022] Description of reference numerals:

[0023] 100. Electroplating liquid circulation system;

[0024] 110, mixing tank; 120, exhaust tank; 130, storage tank; 140, electroplating tank; 150, exhaust device; 160, charging device; 170, material adding device; 180, plating solution component analyzer; 190, plating solution controller;

[0025] 111, liquid inlet; 112, partition; 121, agitator; 122, liquid level detection device; 131, liquid return port; 132, bottom wall; 133, sewage outlet; 141, liquid inlet; 142, liquid outlet;

[0026] 210, first connecting pipeline; 220, second connecting pipeline; 230, filter pump; 240, reflux pump. DETAILED DESCRIPTION

[0027] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0029] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two, unless otherwise clearly and specifically defined.

[0030] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0031] In the description of the embodiments of the present application, the term "and / or" is only a description of the association relationship of the associated objects, indicating that there may be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0032] In the description of the embodiments of the present application, the term "multiple" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).

[0033] In the description of the embodiments of the present application, the technical terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, which are only for the convenience of describing the embodiments of the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the embodiments of the present application.

[0034] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0035] Electroplating refers to a process in which an electrolytic reaction occurs in a plating solution under the action of direct current, so that a metal layer or alloy layer is deposited on the surface of a conductive body such as a metal or other material workpiece, thereby preventing metal oxidation (such as rust) and improving wear resistance, conductivity, reflectivity, etc. The plating solution is usually placed in a plating tank for electroplating. During the electroplating process, the purity of the plating solution directly affects the effect of electroplating. However, as the electroplating process proceeds, the plating solution is prone to denaturation (for example, residual gas will gradually increase, and / or additives will be consumed), which will affect the quality of the formed coating.

[0036] Based on the above considerations, the present application proposes a plating solution circulation system, which uses a mixing tank to receive the plating solution from the plating tank, mixes the plating solution with additives, and can replenish the plating solution loss caused by the plating process; the exhaust tank discharges the gas in the plating solution after mixing in the mixing tank, and can effectively discharge the residual gas in the plating solution; the storage tank stores the plating solution after the gas is discharged from the exhaust tank, allowing long-term storage of the plating solution, and refluxes the plating solution to at least one plating tank through the liquid return port, so that the electroplating work can be carried out continuously. The plating solution circulates between the plating tank and the plating solution circulation system, and improves the stability of the plating solution by mixing with the mixture, removing residual gas and allowing long-term storage.

[0037] Figure 1 A schematic diagram of a plating solution circulation system provided in an embodiment of the present application Figure 1 ,like Figure 1 As shown, the plating solution circulation system 100 includes a mixing tank 110, an exhaust tank 120 and a storage tank 130. The mixing tank 110 has a liquid inlet 111 to receive the plating solution from at least one plating tank 140, and the mixing tank 110 is configured to mix the plating solution with an additive; the exhaust tank 120 is connected to the mixing tank 110 through a first connecting pipe 210, and the exhaust tank 120 is configured to exhaust gas; the storage tank 130 is connected to the exhaust tank 120 through a second connecting pipe 220, and the storage tank 130 is configured to store the plating solution, and the storage tank 130 has a liquid return port 131 to reflux the plating solution to at least one plating tank 140.

[0038] In an example, the plating solution circulation system 100 may include a mixing tank 110, an exhaust tank 120, and a storage tank 130. The mixing tank 110 receives the plating solution from the plating tank 140 through the liquid inlet 111. Since the plating solution received by the mixing tank 110 has undergone the electroplating process, the amount of the plating solution will be reduced compared to before the electroplating, and the additives in the plating solution may also be reduced. Therefore, additives can be added to the mixing tank 110. The additives may include plating solution additives and plating solution, such as hydrogen peroxide and activated carbon powder. The mixing tank 110 is configured to mix the plating solution and the additives, and the mixing tank 110 may be provided with components or devices for mixing the plating solution and the additives. Exemplarily, a plurality of partitions 112 protruding from the inner wall of the mixing tank 110 may be disposed at different heights in the mixing tank 110 , and the plurality of partitions 112 are staggered to form a circuitous fluid channel in the inner cavity of the mixing tank 110 , so that the plating solution and the additive are mixed evenly.

[0039] In the example, the exhaust groove 120 is connected to the mixing groove 110 through the first connecting pipe 210, and the plating solution mixed evenly in the mixing groove 110 can flow into the exhaust groove 120 through the first connecting pipe 210. There will be a certain amount of gas in the inner cavity of the exhaust groove 120, and at the same time, the plating solution will also contain bubbles. In order to avoid the oxidation and decomposition of the additives of the plating solution by the gas, the exhaust groove 120 is configured to exhaust the gas, that is, the exhaust groove 120 can exhaust the residual gas in the plating solution. The excess gas in the exhaust groove 120 can be exhausted by setting a suction device 150 connected to the exhaust groove 120. In addition, a filter pump 230 can be set on the first connecting pipe 210 to filter impurities in the plating solution; a valve can also be set on the first connecting pipe 210 to control the discharge of the plating solution.

[0040] In the example, the storage tank 130 is connected to the exhaust tank 120 through the second connecting pipeline 220, and the plating liquid that discharges excess gas in the exhaust tank 120 can flow into the storage tank 130 through the second connecting pipeline 220. The storage tank 130 can store the plating liquid and ensure that the additives of the plating liquid are not consumed during long-term storage. In addition, the storage tank 130 also has a liquid return port 131, which can be connected to the liquid inlet 111 of the electroplating tank 140 to reflux the plating liquid into the electroplating tank 140 to achieve the circulation of the plating liquid. In order to make the plating liquid return to the electroplating tank 140 more smoothly, a reflux pump 240 can also be connected to the liquid return port 131 of the storage tank 130. In addition, a filter pump 230 can be set on the second connecting pipeline 220 to filter impurities in the plating liquid; a valve can also be set on the second connecting pipeline 220 to control the discharge of the plating liquid.

[0041] In the example, the volumes of the mixing tank 110 , the exhaust tank 120 , and the storage tank 130 can be determined according to the flow rates on the corresponding connecting pipelines and the amount of the electroplating solution, and no excessive restrictions are imposed herein.

[0042] In the embodiment of the present application, the mixing tank 110 is used to receive the plating solution from the plating tank 140, and the plating solution and the additive are mixed, so that the plating solution loss caused by the plating solution during the plating process can be supplemented; the exhaust tank 120 discharges the gas in the plating solution after mixing in the mixing tank 110, and the residual gas in the plating solution can be effectively discharged; the storage tank 130 stores the plating solution after the gas is discharged from the exhaust tank 120, allowing the long-term storage of the plating solution, and the plating solution is refluxed to at least one plating tank 140 through the liquid return port 131, so that the electroplating work can be carried out continuously. The plating solution circulates between the plating tank 140, the mixing tank 110, the exhaust tank 120 and the storage tank 130, and the stability of the plating solution is improved by mixing with the mixture, removing the residual gas and allowing long-term storage.

[0043] According to some embodiments of the present application, a plurality of partitions 112 protruding from the inner wall of the mixing tank 110 are disposed at different heights in the mixing tank 110 , and the plurality of partitions 112 are staggered to form a circuitous fluid channel in the inner cavity of the mixing tank 110 .

[0044] In the example, the mixing tank 110 is mainly used to mix the plating solution and the additive. In the related art, the mixing of the plating solution and the additive can be carried out by shaking or stirring vigorously, and the use of these two methods may cause the decomposition of the additive in the plating solution. In order to allow the plating solution and the additive to be fully mixed and the additive will not be decomposed, in the embodiment of the present application, a plurality of partitions 112 protruding from the inner wall of the mixing tank 110 can be provided at different heights in the mixing tank 110, and the area of ​​the partition 112 is smaller than the cross-sectional area of ​​the mixing tank 110, so that there is a gap between the partition 112 and the inner wall of the mixing tank 110, so that the plating solution and the mixture can flow through the gap.

[0045] In the example, a plurality of baffles 112 are staggeredly arranged in the inner cavity of the mixing tank 110, and the plurality of baffles 112 form a circuitous fluid channel in the inner cavity of the mixing tank 110, and the plating solution and the additive can flow through the circuitous fluid channel, so that the plating solution and the additive can be mixed evenly in the mixing tank 110. For example, Figure 1 As shown, three partitions 112 protruding from the inner wall of the mixing tank 110 are arranged at different heights in the mixing tank 110 , and the three partitions 112 are staggered to form a tortuous fluid channel in the inner cavity of the mixing tank 110 .

[0046] In some embodiments, four, five or other numbers of partitions 112 may be disposed in the inner cavity of the mixing tank 110 . The specific number may be determined according to actual design requirements and no excessive restrictions are imposed herein.

[0047] In the embodiment of the present application, by arranging staggered partitions 112 in the mixing tank 110, the plating solution can flow from top to bottom by relying on its own weight, and the plating solution and additives are effectively mixed during the flow, thereby avoiding the problem of uneven mixing of the plating solution. In addition, in this way, the plating solution is not violently shaken or stirred, which will not cause decomposition of the plating solution additives.

[0048] According to some embodiments of the present application, at least one of an agitator 121 and a liquid level detection device 122 is disposed in the exhaust groove 120 .

[0049] In the example, the liquid level detection device 122 is used to detect the height of the electroplating liquid level in the exhaust groove 120, so as to timely understand the amount of the electroplating liquid in the exhaust groove 120. The liquid level detection device 122 can be a liquid level meter or a liquid level sensor.

[0050] In the example, when the plating liquid passes through the first connecting pipe 210 from the mixing tank 110 through the pipeline into the exhaust tank 120, the liquid level detection device 122 can detect the liquid level height of the plating liquid in the exhaust tank 120. When the liquid level height of the plating liquid exceeds a preset threshold, the first pipeline can be closed.

[0051] In the example, the plating solution contains bubbles, and the gas in the bubbles may oxidize and decompose the additives of the plating solution. In order to avoid the oxidation and decomposition of the additives of the plating solution by the gas in the bubbles, the plating solution can be stirred by the stirrer 121 provided in the exhaust groove 120 to discharge the gas in the plating solution. The stirring speed of the stirrer 121 is usually set to be slow, which can be 3 to 10 revolutions per minute, so as to ensure the stirring of the plating solution and avoid the decomposition of the additives caused by high-speed stirring.

[0052] In one embodiment, an agitator 121 and a liquid level detection device 122 may be disposed in the exhaust groove 120 at the same time.

[0053] In the embodiment of the present application, by arranging an agitator 121 in the exhaust groove 120, the discharge of residual gas in the plating solution can be accelerated, thereby shortening the processing time of the plating solution; by arranging a liquid level detection device 122 in the exhaust groove 120, the amount of the plating solution in the exhaust groove 120 can be detected in time.

[0054] According to some embodiments of the present application, the electroplating solution circulation system 100 further includes an exhaust device 150 connected to the exhaust groove 120 .

[0055] In an example, the gas extraction device 150 is used to extract residual gas, such as oxygen, etc. in the exhaust groove 120 to prevent the gas from reacting with additives in the electroplating solution. The gas extraction device 150 can be a gas transmission pump or a gas capture pump.

[0056] In one embodiment, the exhaust tank 120 may be provided with an agitator 121 and a liquid level detection device 122 at the same time. When the plating solution enters the exhaust tank 120 from the mixing tank 110 through the first pipeline, in order to prevent the plating solution from being extracted by the exhaust device 150, when the liquid level detection device 122 detects that the liquid level of the plating solution reaches 90% of the exhaust tank 120, the first connecting pipeline 210 may be closed, and the agitator 121 may be turned on to stir the plating solution. In one example, the stirring speed of the agitator 121 is usually set to be slow, 3 to 10 revolutions per minute, which can reduce the probability of decomposition of the additive due to high-speed stirring while ensuring the stirring of the plating solution. At the same time, the plating solution circulation system 100 also includes an exhaust device 150 connected to the exhaust tank 120, which can be turned on to apply a certain negative pressure to the cavity of the exhaust tank 120. In one example, the pressure can be set to 0.1 kPa to 100 kPa, which can effectively exhaust the bubbles in the plating solution and the gas in the inner cavity of the exhaust groove 120, and can reduce the probability of gas oxidative decomposition of the plating solution additives. This exhaust method is particularly suitable for production lines using insoluble anode electroplating.

[0057] In another embodiment, activated carbon and hydrogen peroxide can be used to remove organic matter in the electroplating solution. The exhaust device 150 and the stirrer 121 of the exhaust tank 120 can discharge the hydrogen peroxide remaining in the electroplating solution reaction, which can shorten the electroplating solution processing time. At this time, the faster the stirring rate of the stirrer 121, the more conducive it is to discharge the hydrogen peroxide. In one example, the stirring rate can be greater than 10 revolutions per minute.

[0058] In the embodiment of the present application, by providing a gas extraction device 150 connected to the exhaust groove 120, the residual gas in the exhaust groove 120 can be extracted in time, thereby reducing the probability of the additive in the electroplating solution being oxidized by the gas.

[0059] According to some embodiments of the present application, the storage tank 130 also includes a bottom wall 132 and a sewage outlet 133, the sewage outlet 133 and the liquid return outlet 131 are respectively located at two ends of the bottom wall 132, and the height of one end of the bottom wall 132 at the liquid return outlet 131 is higher than the height of one end of the bottom wall 132 at the sewage outlet 133.

[0060] In the example, the storage tank 130 includes a bottom wall 132, a drain port 133 and a liquid return port 131, the drain port 133 and the liquid return port 131 are respectively located at the two ends of the bottom wall 132, the drain port 133 can be used to discharge crystals in the plating liquid, etc., and the liquid return port 131 is normally closed; the liquid return port 131 is used to return the plating liquid in the storage tank 130 to the plating tank 140.

[0061] In the example, the height of one end of the bottom wall 132 at the liquid return port 131 is higher than the height of one end of the bottom wall 132 at the sewage outlet 133. That is to say, the bottom wall 132 of the storage tank 130 is set in a slope shape, and the angle of the slope can be set between 5 degrees and 30 degrees. After long-term storage or multiple cycles of use, the electroplating solution will produce crystals, and the crystals will be deposited on the bottom wall 132 of the storage tank 130. Since the height of one end of the bottom wall 132 at the liquid return port 131 is higher than the height of one end of the bottom wall 132 at the sewage outlet 133, the crystals produced in the electroplating solution will move along the bottom wall 132 to the sewage outlet 133, and the crystals in the electroplating solution can be discharged through the sewage outlet 133. After the crystals in the electroplating solution are discharged, the electroplating solution can flow back to the electroplating tank 140 through the liquid return port 131, so that the diversion and discharge effect of the crystals and the electroplating solution can be achieved.

[0062] In the embodiment of the present application, by setting the bottom wall 132 of the storage tank 130 so that the height of one end of the bottom wall 132 at the liquid return port 131 is higher than the height of one end of the bottom wall 132 at the sewage outlet 133, it is convenient to remove excess impurities from the liquid discharge port 142, thereby improving the convenience and practicality of the storage tank 130.

[0063] According to some embodiments of the present application, the storage tank 130 is located below the mixing tank 110 and the exhaust tank 120 .

[0064] In one example, the storage tank 130 , the mixing tank 110 , and the exhaust tank 120 may be arranged in a manner that the mixing tank 110 and the exhaust tank 120 are arranged adjacent to each other in a transverse direction, and the storage tank 130 is located below the mixing tank 110 and the exhaust tank 120 .

[0065] In another example, the mixing tank 110 , the exhaust tank 120 , and the storage tank 130 may be arranged in sequence and spaced apart in the vertical direction.

[0066] In the embodiment of the present application, the storage tank 130 is set below the mixing tank 110 and the exhaust tank 120, and the plating solution can be refluxed from the mixing tank 110 and the exhaust tank 120 to the storage tank 130 only by gravity, thereby improving the efficiency of the plating solution circulation.

[0067] According to some embodiments of the present application, the electroplating solution circulation system 100 further includes an aeration device 160 communicated with the storage tank 130 .

[0068] In an example, the inflator 160 may be any one of a gas compressor, an air pump, a hydraulic pump, etc. The inflator 160 may be used to inflate a gas such as carbon dioxide or nitrogen into the storage tank 130 to replace the air inside the storage tank 130 .

[0069] In the example, when the electroplating line stops running, the electroplating solution will be stored in the storage tank 130. Since the electroplating solution includes additives, the additives will react with components in the air, which will cause the additives in the electroplating solution to be consumed. The inflator 160 can be used to fill the storage tank with inert gas to reduce the probability of the additives reacting with air and being consumed when the electroplating solution is stored for a long time.

[0070] In the embodiment of the present application, by providing an aeration device 160 connected to the storage tank 130 in the plating solution circulation system 100, an inert gas can be filled into the storage tank 130 to reduce the probability of the additive in the plating solution reacting with the air, thereby reducing the probability of the plating solution being consumed during the storage process.

[0071] According to some embodiments of the present application, the plating liquid circulation system 100 also includes at least one plating tank 140, each plating tank 140 includes a liquid inlet 141 and a liquid discharge port 142 located at the bottom of the plating tank 140, the liquid inlet 141 is connected to the liquid return port 131 of the storage tank 130, and the liquid discharge port 142 is connected to the liquid inlet 111 of the mixing tank 110, and the mixing tank 110 is located below at least one plating tank 140.

[0072] In an example, a plurality of plating tanks 140 may be included in the plating solution circulation system 100. The plurality of plating tanks 140 may use the same plating solution.

[0073] In the example, the electroplating tank 140 includes a liquid inlet 141 and a liquid discharge port 142 located at the bottom of the electroplating tank 140. The liquid inlet 141 is connected to the liquid return port 131 of the storage tank 130, and the liquid discharge port 142 is connected to the liquid inlet 111 of the mixing tank 110. That is to say, during electroplating, the plating solution can continuously enter the electroplating production line electroplating tank 140 from the liquid storage tank. The electroplating solution after electroplating can flow into the mixing tank 110 through the liquid discharge port 142 located at the bottom of the electroplating tank 140 and the liquid inlet 111 of the mixing tank 110, and the plating solution will be processed through the mixing tank 110, the exhaust tank 120 and the storage tank 130. The processed plating solution can flow back to the plating tank 140 through the liquid return port 131 of the storage tank 130 and the liquid inlet 111 of the plating tank 140, thereby realizing the circulation of the plating solution.

[0074] In an example, the mixing tank 110 is located below at least one electroplating tank 140 , and the electroplating solution can flow back from the electroplating tank 140 to the mixing tank 110 only by gravity.

[0075] In the embodiment of the present application, the plating solution circulation system 100 can cooperate with multiple electroplating production lines, improve the consistency of the plating solutions of the multiple electroplating production lines, and facilitate the consistency of product batches. It also improves the integration of the plating solution circulation system 100 and the electroplating production line, saves the cost and time of plating solution processing and maintenance, and is conducive to large-scale mass production.

[0076] According to some embodiments of the present application, a filter pump 230 is disposed on at least one of the first connecting pipeline 210 and the second connecting pipeline 220 .

[0077] In an example, the filter pump 230 may be used to filter suspended impurities in the electroplating solution.

[0078] In one embodiment, a filter pump 230 can be provided in the first pipeline connecting the mixing tank 110 and the exhaust tank 120 and in the second pipeline connecting the exhaust tank 120 and the storage tank 130 at the same time, so that the suspended impurities in the electroplating solution can be effectively filtered. Compared with the conventional circulation filtration in a single tank, the mixing tank 110, the exhaust tank 120 and the storage tank 130 are jointly processed, and the electroplating solution is filtered more thoroughly. In addition, the filter element in the filter pump 230 can be replaced with an activated carbon filter element, and with hydrogen peroxide, the organic matter in the electroplating solution can be removed, and the electroplating solution can be periodically treated without setting up a separate electroplating solution periodic treatment system. The electroplating solution circulation system 100 is also suitable for the periodic treatment of electroplating solution using activated carbon powder, hydrogen peroxide and cotton filter elements, so that the electroplating solution circulates multiple times in the mixing tank 110, the exhaust tank 120 and the storage tank 130, and the activated carbon particles and organic additives in the electroplating solution are completely removed.

[0079] In another embodiment, the filter pump 230 may be provided only in the first connecting pipeline 210. In yet another embodiment, the filter pump 230 may be provided only in the second pipeline.

[0080] In the embodiment of the present application, by providing a filter pump 230 on at least one of the first connecting pipeline 210 and the second connecting pipeline 220, foreign matter in the electroplating liquid can be fully filtered, so that the quality of the electroplating liquid is effectively improved. At the same time, the service life of the electroplating liquid can be extended and the production cost can be reduced.

[0081] According to some embodiments of the present application, the electroplating solution circulation system 100 further includes a material adding device 170 connected to the mixing tank 110 for adding additives to the mixing tank 110 .

[0082] In an example, the additive may be a main component of the electroplating solution and an additive to the electroplating solution, such as hydrogen peroxide and activated carbon powder, etc. The components of the additive may be adjusted according to actual needs.

[0083] In the embodiment of the present application, by adding additives to the mixing tank 110 through the material adding device 170 connected to the mixing tank 110, the main components of the plating solution and the plating solution additives can be replenished in time, thereby improving the stability of the plating solution.

[0084] According to some embodiments of the present application, the electroplating solution circulation system 100 further includes a plating solution component analyzer 180 , which is in communication with the mixing tank 110 , the exhaust tank 120 , and the storage tank 130 .

[0085] In an example, the plating solution component analyzer 180 is used to analyze the components of the electroplating solution. The plating solution component analyzer 180 can be connected to the mixing tank 110, the exhaust tank 120 and the storage tank 130 through a small-diameter pipeline.

[0086] In the embodiment of the present application, the plating solution component analyzer 180 can be used to analyze the components of the plating solution in the mixing tank 110, the exhaust tank 120 and the storage tank 130 to monitor the stability of the plating solution.

[0087] According to some embodiments of the present application, the electroplating solution circulation system 100 further includes a plating solution controller 190 , and the plating solution controller 190 is at least electrically connected to the plating solution component analyzer 180 .

[0088] In an example, the plating solution controller 190 may be electrically connected to the plating solution component analyzer 180 to obtain a result of whether the component of the plating solution is abnormal.

[0089] Figure 2 Schematic diagram of the electroplating solution circulation system of some embodiments of the present application Figure 2 .like Figure 2 As shown, the mixing tank 110 may also have a liquid return port 131, and the liquid return port 131 is connected to a reflux pump 240. The liquid return port 131 of the mixing tank 110 and the liquid return port 131 of the storage tank 130 are both connected to the liquid inlet 141 of the electroplating tank 140. The plating solution controller 190 may be electrically connected to the reflux pump 240 connected to the liquid return port 131 of the mixing tank 110 and the reflux pump 240 connected to the liquid return port 131 of the storage tank 130. When the plating solution component analyzer 180 analyzes that the components of the plating solution are abnormal, the plating solution controller 190 may control the reflux pump 240 to reflux the plating solution to the mixing tank 110, thereby adjusting the components of the plating solution.

[0090] In some embodiments, the exhaust groove 120 may also have a liquid return port 131 , and the liquid return port 131 may be provided with a reflux pump 240 .

[0091] In the embodiment of the present application, by providing a plating solution controller 190, the components of the plating solution can be further controlled and adjusted in a timely manner, thereby further improving the stability of the components of the plating solution.

[0092] The technical solution of the present application is further described below by means of a specific embodiment. Figure 1 to Figure 2 shown.

[0093] The plating solution circulation system 100 includes a mixing tank 110, an exhaust tank 120, a storage tank 130 and at least one plating tank 140. The mixing tank 110 has a liquid inlet 111 to receive the plating solution from at least one plating tank 140. A plurality of partitions 112 protruding from the inner wall of the mixing tank 110 are arranged at different heights in the mixing tank 110. The plurality of partitions 112 are staggered to form a circuitous fluid channel in the inner cavity of the mixing tank 110. The mixing tank 110 is configured to mix the plating solution with additives. The exhaust tank 120 is connected to the mixing tank 110 through a first connecting pipeline 210. A filter pump 230 is arranged on the first connecting pipeline 210. A stirrer 121 and a liquid level detection device 122 are arranged in the exhaust tank 120. The exhaust tank 120 is configured to exhaust gas. The storage tank 130 is connected to the exhaust tank 120 through the second connecting pipe 220, and a filter pump 230 is provided on the second connecting pipe 220. The storage tank 130 is configured to store the electroplating solution, and the storage tank 130 has a liquid return port 131 to return the electroplating solution to at least one electroplating tank 140. The storage tank 130 also includes a bottom wall 132 and a sewage outlet 133. The sewage outlet 133 and the liquid return port 131 are respectively located at both ends of the bottom wall 132, and the height of one end of the bottom wall 132 at the liquid return port 131 is higher than the height of one end of the bottom wall 132 at the sewage outlet 133. The storage tank 130 is located below the mixing tank 110 and the exhaust tank 120.

[0094] Each electroplating tank 140 includes a liquid inlet 141 and a liquid discharge port 142 located at the bottom of the electroplating tank 140, the liquid inlet 141 is connected to the liquid return port 131 of the storage tank 130, and the liquid discharge port 142 is connected to the liquid inlet 111 of the mixing tank 110, and the mixing tank 110 is located below at least one electroplating tank 140. The storage tank 130 also includes a bottom wall 132 and a sewage discharge port 133, the sewage discharge port 133 and the liquid return port 131 are respectively located at both ends of the bottom wall 132, and the height of one end of the bottom wall 132 at the liquid return port 131 is higher than the height of one end of the bottom wall 132 at the sewage discharge port 133.

[0095] The electroplating solution circulation system 100 further includes an exhaust device 150 connected to the exhaust tank 120 , an aeration device 160 connected to the storage tank 130 , and a material adding device 170 connected to the mixing tank 110 for adding additives to the mixing tank 110 .

[0096] The electroplating solution circulation system 100 further includes a plating solution component analyzer 180 and a plating solution controller 190 . The plating solution component analyzer 180 is connected to the mixing tank 110 , the exhaust tank 120 and the storage tank 130 . The plating solution controller 190 is at least electrically connected to the plating solution component analyzer 180 .

[0097] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application, and they should all be included in the scope of the claims and specification of the present application. In particular, as long as there is no structural conflict, the various technical features mentioned in the various embodiments can be combined in any way. The present application is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

Claims

1. A plating solution circulation system, characterized in that: include: A mixing tank (110) having a liquid inlet (111) for receiving a plating solution from at least one plating tank (140), wherein the mixing tank (110) is configured to mix the plating solution with an additive; an exhaust groove (120), connected to the mixing groove (110) via a first connecting pipe (210), the exhaust groove (120) being configured to exhaust gas; A storage tank (130) is connected to the exhaust tank (120) via a second connecting pipe (220), the storage tank (130) is configured to store the electroplating solution, and the storage tank (130) has a liquid return port (131) for returning the electroplating solution to the at least one electroplating tank (140).

2. The system according to claim 1, characterized in that A plurality of partitions (112) protruding from the inner wall of the mixing tank (110) are arranged at different heights in the mixing tank (110), and the plurality of partitions (112) are arranged in a staggered manner to form a circuitous fluid channel in the inner cavity of the mixing tank (110).

3. The system according to claim 1 or 2, characterized in that: At least one of an agitator (121) and a liquid level detection device (122) is disposed in the exhaust groove (120).

4. The system according to any one of claims 1 to 3, characterized in that The system further comprises an exhaust device (150) in communication with the exhaust slot (120).

5. The system according to any one of claims 1 to 4, characterized in that The storage tank (130) further comprises a bottom wall (132) and a sewage outlet (133), wherein the sewage outlet (133) and the liquid return outlet (131) are respectively located at two ends of the bottom wall (132), and the height of one end of the bottom wall (132) at the liquid return outlet (131) is higher than the height of one end of the bottom wall (132) at the sewage outlet (133).

6. The system according to any one of claims 1 to 5, characterized in that The storage tank (130) is located below the mixing tank (110) and the exhaust tank (120).

7. The system according to any one of claims 1 to 6, characterized in that The system also includes an inflation device (160) in communication with the storage tank (130).

8. The system according to any one of claims 1 to 7, characterized in that The system further comprises at least one electroplating tank (140), each of the electroplating tanks (140) comprising a liquid inlet (141) and a liquid discharge port (142) located at the bottom of the electroplating tank (140), the liquid inlet (141) being connected to a liquid return port (131) of the storage tank (130), the liquid discharge port (142) being connected to a liquid inlet (111) of the mixing tank (110), and the mixing tank (110) being located below the at least one electroplating tank (140).

9. The system according to any one of claims 1 to 8, characterized in that A filter pump (230) is provided on at least one of the first connecting pipeline (210) and the second connecting pipeline (220).

10. The system according to any one of claims 1 to 9, characterized in that The system further comprises a material adding device (170) in communication with the mixing tank (110) for adding the additive into the mixing tank (110).

11. The system according to any one of claims 1 to 10, characterized in that The system further comprises a plating solution component analyzer (180), wherein the plating solution component analyzer (180) is in communication with the mixing tank (110), the exhaust tank (120) and the storage tank (130).

12. The system according to claim 11, characterized in that The system further comprises a plating solution controller (190), wherein the plating solution controller (190) is at least electrically connected to the plating solution component analyzer (180).

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