Chip detection jig
By designing the heat dissipation structure of the heat conduction part and the heat dissipation part in the chip detection fixture, the problem of difficult to control the chip heating temperature in the prior art is solved, effective balance of the chip temperature is achieved, and chip function is protected.
Patent Information
- Application Number
- CN202420713066.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-08
- Publication Date
- 2025-04-18
- Estimated Expiration
- 2034-04-08
AI Technical Summary
When existing chip detection fixtures heat the chip, the temperature is difficult to effectively control, which can easily cause the chip temperature to be higher than its rated working temperature and damage the chip function.
A chip detection fixture is designed, including a first housing, a second housing and a heat dissipation structure. The heat dissipation structure includes a heat conducting part and a heat dissipation part. The heat conducting part is mounted on the first housing and can abut on the chip to conduct heat to the heat dissipation part.
The heat conducting part is directly in contact with the chip, and the heat on the chip is transmitted to the heat dissipation part, achieving a good thermal balance effect, avoiding the chip temperature too high and protecting the chip from damage.
Smart Images

Figure CN222774596U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of chip detection, in particular to a chip detection fixture. Background Art
[0002] The chip test fixture can clamp the chip in order to test the performance of the chip. In a sense, the chip test fixture is a connector that meets certain test requirements of the chip. It is a static connector between the PCB and the IC, which makes the replacement test of the chip more convenient. In order to simulate the heating condition of the chip during use, the chip test fixture in the related technology is generally equipped with a heating element to heat the chip. The heating element can heat the chip within a predetermined temperature so as to detect the operation status of the chip under different temperature environments.
[0003] However, when the detection fixture of the related technology heats the chip, the heating temperature is difficult to control, which can easily cause the temperature of the chip to be higher than its rated operating temperature. This can easily damage the chip and affect its function. Utility Model Content
[0004] Based on this, it is necessary to propose a chip detection fixture to ensure chip temperature balance in response to the above problems.
[0005] The present invention provides a chip detection tool, comprising:
[0006] a first shell;
[0007] A second housing is used to house the chip, and the second housing is movably connected to the first housing;
[0008] The heat dissipation structure comprises a heat dissipation part and a heat conduction part which are connected and arranged, wherein the heat conduction part can be installed on the first shell, and the heat conduction part can move with the first shell to abut against the chip, so that the chip is clamped between the heat conduction part and the second shell, and the heat on the chip can be transferred to the heat dissipation part through the heat conduction part and dissipated through the heat dissipation part.
[0009] In some embodiments, a driving structure is also included, which includes a driving member and a transmission plate. The transmission plate and the first shell are movably connected via a guide structure, the heat conducting part is connected to the transmission plate, and the driving member can drive the transmission plate to drive the heat conducting part to move.
[0010] In some embodiments, the driving member includes a driving plate and a knob that are connected to each other, the knob has an external thread, and the first shell has a connecting screw hole passing through it along the moving direction of the transmission plate. The knob can be threadedly connected to the connecting screw hole, and the transmission plate can be driven to move during rotation of the knob.
[0011] In some embodiments, the guide structure includes a first connecting pin and a first elastic member arranged between the first connecting pin and the first shell, one end of the first connecting pin can be inserted into the first shell along the moving direction of the transmission plate, and the other end of the first connecting pin can be fixedly connected to the transmission plate. In a free state, the first elastic member has a tendency to drive the first connecting pin to drive the transmission plate to move toward the knob.
[0012] In some embodiments, the first shell is penetrated by a first through-hole and a first movable hole connected to the first through-hole, the radial dimension of the first movable hole is larger than the radial dimension of the first through-hole, the first connecting nail includes a first connecting portion, a first penetrating portion and a first flange connected in sequence, the first connecting portion is connected to the transmission plate, the first penetrating portion is penetrated in the first through-hole, the first flange is located in the first movable hole, the first elastic member is sleeved outside the first penetrating portion, the first elastic member is located in the first movable hole, and is located between the first flange and the first shell.
[0013] In some embodiments, the knob and the drive plate are rotatably connected, and the drive plate is provided with a through slot around its rotation axis, and a positioning pin is provided in the through slot. The drive plate and the knob can be fixed by the positioning pin, and a scale is also provided on the first shell, and an indicator capable of pointing to the scale is also provided on the drive plate.
[0014] In some embodiments, the guide structure also includes a second connecting pin and a second elastic member arranged between the transmission plate and the heat conducting part, one end of the second connecting pin can be inserted into the heat conducting part, and the other end of the second connecting pin can be fixedly connected to the transmission plate, and in a free state, the second elastic member has a tendency to drive the heat conducting part to move away from the transmission plate.
[0015] In some embodiments, the heat conductive part is penetrated by a second through hole and a second movable hole connected to the second through hole, the radial dimension of the second movable hole is larger than the radial dimension of the second through hole, the second connecting nail includes a second connecting part, a second penetrating part and a second flange connected in sequence, the second connecting part is connected to the transmission plate, the second penetrating part is penetrated in the second through hole, the second flange is located in the second movable hole, and in a free state, the second flange abuts against the connection between the second through hole and the second movable hole of the heat conductive part.
[0016] In some embodiments, the heat dissipation structure includes a first heat dissipation member and a second heat dissipation member fixedly connected, the second heat dissipation member includes the heat dissipation portion and the heat conductive portion, two heat dissipation portions are spaced apart on the same side of the heat conductive portion, two ends of the first heat dissipation member are respectively connected to the two heat dissipation portions, a surrounding space is formed between the two heat dissipation portions, the heat conductive portion and the first heat dissipation member, and the first shell is penetrated into the surrounding space.
[0017] In some embodiments, the heat dissipation structure further includes a plurality of heat dissipation columns, and the plurality of heat dissipation columns can be respectively arranged at intervals on the first heat dissipation element and the heat dissipation portion.
[0018] The following beneficial effects are achieved by using the embodiments of the present invention:
[0019] According to the chip detection fixture in the above embodiment, by setting a heat dissipation structure on the first shell, when the first shell moves close to the second shell, the heat conducting part of the heat dissipation structure can be abutted against the chip. The heat conducting part can not only be used to limit the position of the chip, so that the chip is not easily offset during the detection process, but also because the heat conducting part is in direct contact with the chip, the heat on the chip can be transferred to the heat dissipation part, and the heat is dissipated by the heat dissipation part. In this way, during the process of heating the chip by the heating element, the heat conducting part can play a good thermal balance effect, so that the heat on the chip will not exceed the predetermined range of heat, so as to protect the chip from high temperature damage and ensure the quality of the chip during the detection process. By setting the heat conducting part to directly abut on the chip, the thermal conductivity effect can be increased to increase the temperature balance effect, so that the temperature of the chip heated by the heating element is not easy to exceed the maximum temperature that the chip can withstand. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0021] in:
[0022] Figure 1 A schematic diagram of the structure of a chip detection fixture provided by the utility model is shown;
[0023] Figure 2 A top view of a chip detection jig provided according to the utility model is shown;
[0024] Figure 3 Shown along Figure 2 Sectional view along line AA;
[0025] Figure 4 Shown along Figure 2 Sectional view along line BB.
[0026] Description of main component symbols:
[0027] 1. first housing; 11. buckle; 12. connecting screw hole; 13. first through hole; 14. first movable hole; 2. second housing; 21. placement groove; 22. buckle rod; 3. heat dissipation structure; 31. first heat dissipation element; 32. second heat dissipation element; 321. heat dissipation part; 322. heat conduction part; 3221. second through hole; 3222. second movable hole; 33. heat dissipation column; 4. driving structure; 41. transmission plate; 42. driving element; 421. driving plate; 421 1. Through slot; 4212. Positioning pin; 4213. Indicator; 4214. Plug-in portion; 422. Knob; 4221. Plug-in hole; 5. Guide structure; 51. First elastic member; 52. Second elastic member; 53. First connecting pin; 531. First penetration portion; 532. First connecting portion; 533. First flange; 54. Second connecting pin; 541. Second penetration portion; 542. Second connecting portion; 543. Second flange; 60. Cover plate; 70. Heating member. DETAILED DESCRIPTION
[0028] In order to facilitate the understanding of the present invention, the present invention will be described more comprehensively with reference to the accompanying drawings. The accompanying drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.
[0029] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0030] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.
[0031] The utility model provides a chip detection fixture, which is used to clamp the chip to detect the quality of the chip. Figures 1 to 3 The chip detection fixture includes a first shell 1, a second shell 2 and a heat dissipation structure 3. The first shell 1 and the second shell 2 are movably connected, and the first shell 1 can move toward or away from the second shell 2, or the first shell 1 can also rotate relative to the second shell 2.
[0032] In the present application, the rotation of the first shell 1 relative to the second shell 2 is taken as an example for explanation. Specifically, one end of the first shell 1 is rotatably connected to one end of the second shell 2 through a rotating shaft. The first shell 1 is provided with a fastening member 11 at a position away from its rotation, and the second shell 2 is provided with a fastening rod 22 at a position away from its rotation. When the first shell 1 is rotated to be opposite to the second shell 2, the fastening member 11 can be fastened to the fastening rod 22 to achieve the fixation of the first shell 1 and the second shell 2.
[0033] An end of the second housing 2 facing the first housing 1 is provided with a placement groove 21 , and the chip can be placed in the placement groove 21 .
[0034] The heat dissipation structure 3 has a heat dissipation portion 321 and a heat conducting portion 322 which are connected and arranged. The heat conducting portion 322 can be installed at one end of the first housing 1 facing the chip. The heat conducting portion 322 can move with the first housing 1. When the first housing 1 rotates to face the second housing 2, the heat conducting portion 322 can abut against the chip, so that the chip is clamped between the heat conducting portion 322 and the second housing 2. The heat on the chip can also be transferred to the heat dissipation portion 321 through the heat conducting portion 322 for heat dissipation.
[0035] In addition, in order to simulate the temperature of the chip working environment, the chip detection fixture is also provided with a heating element 70. The heating element 70 can be a heating resistor, etc. When the heating element 70 is powered on, it can heat the chip so as to measure the state of the chip when working at different temperatures.
[0036] It should also be noted that in the present application, the heating element 70 is arranged in the heat-conducting part 322, and a groove is formed at the end of the heat-conducting part 322 that is opposite to the end that abuts the chip. The heating element 70 can be adapted in the groove and is fixedly connected to the heat-conducting part 322 by setting a cover plate 60. The heating element 70 can be fixed in the heat-conducting part 322, and the heat generated by the heating element 70 can be transferred to the chip through the heat-conducting part 322 for heating.
[0037] When measuring the chip, it is usually necessary to heat the chip using the heating element 70. The heating temperature has a predetermined range, which is also the range of heat generated by the chip in subsequent use. The maximum temperature of the predetermined range is also the rated temperature that the chip can withstand. That is, the heating element 70 can simulate the ambient temperature of the chip in subsequent use, and then determine whether the chip is qualified by detecting the working condition of the chip within the predetermined range.
[0038] By setting the heat dissipation structure 3 on the first shell 1, when the first shell 1 moves close to the second shell 2, the heat conducting part 322 of the heat dissipation structure 3 can be abutted against the chip. The heat conducting part 322 can not only be used to limit the position of the chip, so that the chip is not easily offset during the detection process, but also because the heat conducting part 322 is in direct contact with the chip, the heat on the chip can be transferred to the heat dissipation part 321, and the heat is dissipated by the heat dissipation part 321. In this way, during the heating process of the heating element 70 heating the chip, the heat conducting part 322 can play a good thermal balance effect, so that the heat on the chip will not exceed the predetermined range of heat, so as to protect the chip from being damaged by high temperature and ensure the quality of the chip during the detection process. By setting the heat conducting part 322 to directly abut against the chip, the heat conduction effect can be increased to increase the temperature balance effect, so that the temperature of the chip heated by the heating element 70 is not easy to exceed the maximum temperature that the chip can withstand.
[0039] In one embodiment, see Figures 1 to 4 When the first shell 1 and the second shell 2 are buckled and fixed, the relative position between the first shell 1 and the second shell 2 is fixed, that is, the position of the heat conducting part 322 is also relatively fixed. Under normal circumstances, the position of the heat conducting part 322 needs to be set so that its end face can just abut against the end of the chip located in the second shell 2 to fix the position of the chip.
[0040] However, the thickness of the chip (the dimension between the heat conducting part 322 and the second shell 2) may be different due to processing errors. When the same fixture is used to clamp different chips, if there is an error in the thickness of these chips, two situations may occur. One is that when the first shell 1 and the second shell 2 are fixed, the heat conducting part 322 may not contact the chip. The other is that because the chip is too thick, the heat conducting part 322 may contact the chip before the first shell 1 moves to the position where it is fixedly connected to the second shell 2, resulting in the failure of the first shell 1 and the second shell 2 to connect.
[0041] In order to deal with the inconvenience caused by chip errors, the chip detection fixture also includes a driving structure 4, which includes a driving member 42 and a transmission plate 41. The transmission plate 41 and the first shell 1 are movably connected through a guide structure 5, and the heat conducting part 322 is connected to the transmission plate 41. The driving member 42 can drive the transmission plate 41 to drive the heat conducting part 322 to move. It should be noted here that when the first shell 1 and the second shell 2 are fixedly connected by the buckle 11, the heat conducting part 322 is arranged directly opposite to the chip, and the transmission plate 41 can move toward or away from the chip under the drive of the driving member 42, that is, the heat conducting part 322 can move toward or away from the chip.
[0042] In this way, when the thickness of the chip exceeds the standard thickness, the heat conducting portion 322 can be adjusted in advance to move away from the chip, so that when the first housing 1 rotates relative to the second housing 2, the heat conducting portion 322 will not abut on the chip in advance. After the first housing 1 and the second housing 2 are connected, the transmission plate 41 is driven to move toward the chip to drive the heat conducting portion 322 to abut on the chip.
[0043] When the thickness of the chip is smaller than the standard value, after the first housing 1 and the second housing 2 are connected by the fastener 11 , the transmission plate 41 is driven to move toward the chip, which can drive the heat conducting portion 322 to move to abut against the chip.
[0044] In a specific embodiment, the driving member 42 includes a driving plate 421 and a knob 422 which are connected and arranged. The knob 422 is a threaded column structure, and its outer peripheral wall has an external thread. The first housing 1 is penetrated with a connecting screw hole 12 along the moving direction of the transmission plate 41. The knob 422 can be threadedly connected to the connecting screw hole 12. It can be foreseen that when the knob 422 rotates clockwise or counterclockwise in the connecting screw hole 12, the knob 422 can move toward or away from the heat transfer portion 322. The knob 422 is configured to be able to drive the transmission plate 41 to move during the rotation process. By setting a threaded connection between the knob 422 and the first housing 1, the knob 422 can be moved when it is rotated to drive the transmission plate 41 to move. The threaded connection mode of the knob 422 can make the moving distance of the knob 422 more precise.
[0045] Specifically, the guide structure 5 includes a first connecting pin 53, and a first elastic member 51 arranged between the first connecting pin 53 and the first shell 1. One end of the first connecting pin 53 can be inserted into the first shell 1 along the moving direction of the transmission plate 41, and the other end of the first connecting pin 53 can be fixedly connected to the transmission plate 41. The cooperation between the first connecting pin 53 and the first shell 1 can guide the movement of the transmission plate 41, so that the moving direction of the transmission plate 41 is stable.
[0046] In the free state, the first elastic member 51 has a tendency to drive the first connecting nail 53 to drive the transmission plate 41 to move toward the knob 422. By utilizing the cooperation between the first elastic member 51 and the first connecting nail 53, it is not necessary to connect the transmission plate 41 to the knob 422 through a connecting structure. The first connecting nail 53 can be driven to move in the first housing 1 by utilizing the elastic force of the first elastic member 51, until the first connecting nail 53 drives the transmission plate 41 to move toward the knob 422 and abuts against the end of the knob 422. The driving plate 421 is connected to one end of the knob 422, and the transmission plate 41 abuts against the end of the knob 422 facing away from the driving plate 421. Rotating the driving plate 421 can drive the knob 422 to move toward or away from the driving plate 41.
[0047] It is worth mentioning that when the transmission plate 41 abuts against the end of the knob 422 , the first elastic member 51 is in a compressed state, or the first elastic member 51 is just in a normal state.
[0048] In a specific embodiment, the first housing 1 is penetrated by a second through hole 3221 and a second movable hole 3222 connected to the second through hole 3221, and the second through hole 3221 and the second movable hole 3222 are both opened along the moving direction of the transmission plate 41. The radial dimension of the second movable hole 3222 is greater than the radial dimension of the second through hole 3221, so that a stepped channel is formed between the second movable hole 3222 and the second through hole 3221.
[0049] The first connecting nail 53 includes a first connecting portion 532, a first penetration portion 531 and a first flange 533 which are connected in sequence. The first connecting portion 532 has an external thread and can be threadedly connected to the transmission plate 41. The first penetration portion 531 is penetrated by the second through hole 3221. The circumferential size of the first flange 533 is adapted to the second movable hole 3222 and is larger than the second through hole 3221. The first flange 533 is located in the second movable hole 3222.
[0050] The first elastic member 51 is preferably a spring. The first elastic member 51 is sleeved outside the first penetration portion 531. The first elastic member 51 is located in the second movable hole 3222 and between the first flange 533 and the first shell 1. More specifically, one end of the first elastic member 51 abuts against the step formed between the second movable hole 3222 and the second through hole 3221, and the other end abuts against the first flange 533.
[0051] The first connecting nail 53 can be connected to the transmission plate 41 through the first connecting portion 532, and the transmission plate 41 can move along the movement path defined between the first penetration portion 531 and the second through hole 3221 by providing the first penetration portion 531. The first protruding edge 533 can be used to cooperate with the first elastic member 51, so that the first connecting nail 53 can squeeze the first elastic member 51 through the first protruding edge 533 when moving.
[0052] It should be noted that, in order to make the moving path of the transmission plate 41 more stable, a plurality of first connecting pins 53 may be provided between the transmission plate 41 and the first housing 1 , and the plurality of first connecting pins 53 may be evenly distributed.
[0053] In a specific embodiment, in order to be able to intuitively observe the distance moved by the knob 422, it can be achieved by setting the cooperation between the driving plate 421 and the first housing 1. Specifically, the first housing 1 is also provided with a scale, and the scale is arranged around the rotation axis of the knob 422. The driving plate 421 is also provided with an indicator 4213 that can point to the scale. The indicator 4213 is preferably directly in contact with the scale, so that the moving distance of the knob 422 can be judged by the difference between the scale values indicated by the initial and final positions of the indicator 4213.
[0054] In addition, the knob 422 and the driving plate 421 are rotatably connected. A plug-in hole 4221 is opened on the knob 422 along its axis. The plug-in hole 4221 is a cylindrical hole coaxially arranged with the rotating shaft of the knob 422. The driving plate 421 is arranged in a disc as a whole. A plug-in portion 4214 is convexly provided on the driving plate 421 and can be plugged and adapted with the cylindrical hole.
[0055] The driving plate 421 is also provided with a through slot 4211 around its rotation axis, and a positioning pin 4212 is provided in the through slot 4211, and the driving plate 421 and the knob 422 can be fixed by the positioning pin 4212. The positioning pin 4212 can be threadedly connected to the knob 422, and a circle of protrusions is convexly provided along the path of the inner wall of the through slot 4211, and during the process of rotating the positioning pin 4212 and threading the knob 422, the end of the positioning pin 4212 can be abutted against the protrusion, and when the positioning pin 4212 is tightened, the protrusion is clamped between the knob 422 and the positioning pin 4212, so that the driving plate 421 and the knob 422 are fixed.
[0056] By providing an arc-shaped through groove 4211 on the driving plate 421, the positioning pin 4212 is inserted into the through groove 4211, and the positioning pin 4212 can fix the driving plate 421 and the knob 422. When the positioning pin 4212 is loosened, the driving plate 421 can rotate relative to the knob 422. At this time, the indicator 4213 also rotates with the driving plate 421 to adjust the initial position of the indicator 4213, or adjust the indicator 4213 to eliminate the error indicated by the indicator 4213 and make the indicator 4213 face the scale.
[0057] In another embodiment, please refer to Figures 1 to 4The guide structure 5 also includes a second connecting pin 54 and a second elastic member 52 arranged between the transmission plate 41 and the heat conducting portion 322. One end of the second connecting pin 54 can be inserted into the heat conducting portion 322, and the other end of the second connecting pin 54 can be fixedly connected to the transmission plate 41. In a free state, the second elastic member 52 has a tendency to drive the heat conducting portion 322 to move away from the transmission plate 41.
[0058] By arranging a second connecting nail 54 between the heat conducting part 322 and the transmission plate 41, the heat conducting part 322 can move relative to the transmission plate 41. By arranging the second elastic member 52, the relative movement between the heat conducting part 322 and the transmission plate 41 is an elastic movement, that is, when the external force moves the heat conducting part 322 toward the transmission plate 41, the second elastic member 52 can be squeezed, so that the second elastic member 52 applies an elastic force to the heat conducting part 322. When the external force on the heat conducting part 322 disappears, the elastic force can drive the heat conducting part 322 to move toward its original position.
[0059] Specifically, the heat conducting portion 322 is penetrated with a first through hole 13 and a first movable hole 14 connected to the first through hole 13 along the direction toward the transmission plate 41. The radial dimension of the first movable hole 14 is larger than the radial dimension of the first through hole 13, so that a stepped passage is formed between the first movable hole 14 and the first through hole 13. The second connecting nail 54 includes a second connecting portion 542, a second penetrating portion 541 and a second flange 543 connected in sequence. The second connecting portion 542 is threadedly connected to the transmission plate 41, the second penetrating portion 541 is penetrated in the first through hole 13, the second flange 543 is located in the first movable hole 14, and the circumferential dimension of the second flange 543 is adapted to the first movable hole 14 and is larger than the first through hole 13.
[0060] A groove structure is provided at the positions opposite to the heat conducting part 322 and the transmission plate 41. The second elastic member 52 is preferably a spring. The two ends of the second elastic member 52 are respectively placed in the groove structures opposite to the heat conducting part 322 and the transmission plate 41. In the free state, the second elastic member 52 is in a compressed state or in a normal state, and the second protrusion 543 abuts against the connection between the first through hole 13 and the first movable hole 14 of the heat conducting part 322.
[0061] By providing the cooperation of the second connecting nail 54 and the second elastic member 52, the distance between the heat conducting portion 322 and the transmission plate 41 can be automatically adjusted, that is, when the thickness of the chip is greater than the standard thickness, the heat conducting portion 322 will abut the chip in advance during the rotation of the first shell 1 relative to the second shell 2, but at this time, it is only necessary to continue to rotate the first shell 1. Under the pressure of the chip, the heat conducting portion 322 can move toward the transmission plate 41 along the path of the second penetration portion 541 to make way, so that the first shell 1 can be smoothly rotated to face the second shell 2, thereby realizing a fixed connection between the first shell 1 and the second shell 2.
[0062] Therefore, when setting the position of the heat conducting part 322, it can be slightly closer to the chip than the normal position, so that the thickness difference of the chip with a thickness smaller than the standard thickness can be compensated, and at the same time, the heat conducting part 322 can move toward the transmission plate 41, so that the chip with a thickness thicker than the standard thickness can be adapted. If the thickness of the chip exceeds the upper limit of the movable distance between the heat conducting part 322 and the transmission plate 41, the position of the transmission plate 41 can be adjusted by rotating the driving plate 421 to eliminate the thickness error.
[0063] In one embodiment, see Figures 1 to 4 The heat dissipation structure 3 includes a first heat dissipation member 31 and a second heat dissipation member 32 that are fixedly connected. The second heat dissipation member 32 includes a heat dissipation portion 321 and a heat conduction portion 322. In a preferred embodiment, the second heat dissipation member 32 has two heat dissipation portions 321, and the two heat dissipation portions 321 are spaced apart and arranged on the same side of the heat conduction portion 322. The two ends of the first heat dissipation member 31 are respectively connected to the two heat dissipation portions 321. At this time, a surrounding space is formed between the two heat dissipation portions 321, the heat conduction portion 322 and the first heat dissipation member 31, and the first housing 1 is arranged in the surrounding space.
[0064] In order to increase the heat dissipation effect of the heat dissipation structure 3 , the heat dissipation structure 3 further includes a plurality of heat dissipation columns 33 . The plurality of heat dissipation columns 33 can be respectively arranged at intervals on the first heat dissipation element 31 and the heat dissipation portion 321 .
[0065] The heat dissipation column 33 may be a cuboid, a cube or a hemisphere, etc. The heat dissipation column 33 is convexly arranged on the surface of the heat dissipation portion 321 and the first heat dissipation element 31, and the heat dissipation columns 33 are arranged in a matrix on the first heat dissipation element 31 and the heat dissipation portion 321. By providing a plurality of heat dissipation columns 33 on the heat dissipation portion 321 and the first heat dissipation element 31, the area in contact with the air can be increased, thereby increasing the heat dissipation effect.
[0066] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0067] The above-mentioned embodiments only express several implementation methods of the utility model, and the description is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent application. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.
Claims
1. A chip detection fixture, characterized in that: include: a first shell; A second housing is used to house the chip, and the second housing is movably connected to the first housing; The heat dissipation structure comprises a heat dissipation part and a heat conduction part which are connected and arranged, wherein the heat conduction part can be installed on the first shell, and the heat conduction part can move with the first shell to abut against the chip, so that the chip is clamped between the heat conduction part and the second shell, and the heat on the chip can be transferred to the heat dissipation part through the heat conduction part and dissipated through the heat dissipation part.
2. The chip detection fixture according to claim 1, characterized in that: It also includes a driving structure, which includes a driving member and a transmission plate. The transmission plate and the first shell are movably connected via a guide structure. The heat conducting part is connected to the transmission plate. The driving member can drive the transmission plate to drive the heat conducting part to move.
3. The chip detection jig according to claim 2, characterized in that: The driving member includes a driving plate and a knob which are connected to each other. The knob has an external thread. A connecting screw hole passes through the first shell along the moving direction of the transmission plate. The knob can be threadedly connected to the connecting screw hole. The transmission plate can be driven to move during the rotation of the knob.
4. The chip detection jig according to claim 3, characterized in that: The guide structure includes a first connecting pin and a first elastic member arranged between the first connecting pin and the first shell, one end of the first connecting pin can be inserted into the first shell along the moving direction of the transmission plate, and the other end of the first connecting pin can be fixedly connected to the transmission plate. In a free state, the first elastic member has a tendency to drive the first connecting pin to drive the transmission plate to move toward the knob.
5. The chip detection jig according to claim 4, characterized in that: The first shell is penetrated by a first through hole and a first movable hole connected to the first through hole, the radial dimension of the first movable hole is larger than the radial dimension of the first through hole, the first connecting nail includes a first connecting portion, a first penetrating portion and a first flange connected in sequence, the first connecting portion is connected to the transmission plate, the first penetrating portion is penetrated in the first through hole, the first flange is located in the first movable hole, the first elastic member is sleeved outside the first penetrating portion, the first elastic member is located in the first movable hole, and is located between the first flange and the first shell.
6. The chip detection jig according to claim 3, characterized in that: The knob is rotatably connected to the drive plate. The drive plate is provided with a through slot around its rotation axis. A positioning pin is provided in the through slot. The drive plate and the knob can be fixed by the positioning pin. A scale is also provided on the first shell, and an indicator capable of pointing to the scale is also provided on the drive plate.
7. The chip detection jig according to claim 4 or 5, characterized in that: The guide structure also includes a second connecting pin and a second elastic member arranged between the transmission plate and the heat conducting part, one end of the second connecting pin can be inserted into the heat conducting part, and the other end of the second connecting pin can be fixedly connected to the transmission plate, and in a free state, the second elastic member has a tendency to drive the heat conducting part to move away from the transmission plate.
8. The chip detection jig according to claim 7, characterized in that: The heat conducting part is penetrated by a second through hole and a second movable hole connected to the second through hole, the radial dimension of the second movable hole is larger than the radial dimension of the second through hole, the second connecting nail comprises a second connecting part, a second penetrating part and a second convex edge connected in sequence, the second connecting part is connected to the transmission plate, the second penetrating part is penetrated in the second through hole, the second convex edge is located in the second movable hole, and in a free state, the second convex edge abuts against the connecting part between the second through hole and the second movable hole of the heat conducting part.
9. The chip detection jig according to claim 1, characterized in that: The heat dissipation structure includes a first heat dissipation member and a second heat dissipation member fixedly connected, the second heat dissipation member includes the heat dissipation portion and the heat conductive portion, two heat dissipation portions are arranged at intervals on the same side of the heat conductive portion, two ends of the first heat dissipation member are respectively connected to the two heat dissipation portions, a surrounding space is formed between the two heat dissipation portions, the heat conductive portion and the first heat dissipation member, and the first shell is penetrated in the surrounding space.
10. The chip detection jig according to claim 9, characterized in that: The heat dissipation structure further includes a plurality of heat dissipation columns, and the plurality of heat dissipation columns can be respectively arranged at intervals on the first heat dissipation element and the heat dissipation portion.