Phase change working medium auxiliary cooling device and computing equipment

Abstract

The utility model relates to a phase change working medium auxiliary cooling device and computing equipment, and the phase change working medium auxiliary cooling device comprises at least two working medium storages which are arranged on at least two heat sources in a one-to-one correspondence manner; a working medium steam inlet of the working medium condensing unit is connected to a working medium steam outlet of the working medium storer through a working medium steam conveying pipe, and a supercooled working medium outlet of the working medium condensing unit is connected to a supercooled working medium inlet of the working medium storer through a supercooled working medium conveying pipe; a circulation path of a phase change working medium is formed in the space inside the at least two working medium storages, the working medium steam conveying pipe, the working medium condensing unit and the supercooled working medium conveying pipe; and the working medium liquid level height control unit is communicated with the at least two working medium storages so as to balance the liquid level heights of the liquid-phase working media in the at least two working medium storages. The heat dissipation device is simple in structure and can be arranged in a case of the computing device, and the purpose of improving the heat dissipation capacity of the computing device in a compact space is achieved with low cost.

Description

Technical Field

[0001] The present disclosure relates to the technical field of heat dissipation equipment, and in particular to a phase-change medium auxiliary cooling device and a computing device. Background Art

[0002] The operation of computing devices generates a large amount of heat, which requires the assistance of heat dissipation equipment to dissipate the heat generated inside the computing devices to the surrounding environment in a timely manner.

[0003] In a computer room where a large number of computing devices are arranged, the heat dissipation requirements for the computing devices are relatively high, because the computer room may need to accommodate as many computing devices as possible and the heat dissipation devices are required to have a high heat dissipation capacity in the smallest possible space. Utility Model Content

[0004] In view of this, the present disclosure provides a phase change medium auxiliary cooling device and a computing device, so as to help further improve the heat dissipation capacity of the computing device under limited space conditions.

[0005] The technical solution of the present disclosure is achieved as follows:

[0006] According to one aspect of an embodiment of the present disclosure, a phase-change working medium auxiliary cooling device is provided, comprising:

[0007] At least two working fluid storages, the at least two working fluid storages are arranged on at least two heat sources in a one-to-one correspondence, each of the working fluid storages has a working fluid vapor outlet and a supercooled working fluid inlet, and the position of the working fluid vapor outlet is higher than the position of the supercooled working fluid inlet;

[0008] A working fluid steam delivery pipe, one end of which is connected to the working fluid steam outlet;

[0009] A supercooled working medium delivery pipe, one end of which is connected to the supercooled working medium inlet;

[0010] A working fluid condensing unit having a working fluid vapor inlet and a subcooled working fluid outlet, wherein the working fluid vapor inlet is connected to the other end of the working fluid vapor delivery pipe, and the subcooled working fluid outlet is connected to the other end of the subcooled working fluid delivery pipe, wherein a circulation path of a phase-change working fluid is formed in the spaces inside the at least two working fluid storage devices, the working fluid vapor delivery pipe, the working fluid condensing unit, and the subcooled working fluid delivery pipe; and

[0011] A working fluid liquid level control unit is connected to the at least two working fluid storage units to balance the liquid levels of the liquid phase working fluids in the at least two working fluid storage units.

[0012] In a possible implementation manner, the phase-change working fluid auxiliary cooling device further includes:

[0013] a control unit; and

[0014] A working fluid delivery pump is installed on the supercooled working fluid delivery pipe and is used to pump the supercooled working fluid to the at least two working fluid storages under the control of the control unit.

[0015] In a possible implementation manner, the phase-change working fluid auxiliary cooling device further includes:

[0016] A flow meter is installed on the supercooling medium delivery pipe and coupled to the control unit.

[0017] In a possible implementation manner, the phase-change working fluid auxiliary cooling device further includes:

[0018] At least two liquid level sensors are installed in the at least two working fluid storage devices in a one-to-one correspondence and coupled to the control unit.

[0019] In a possible implementation manner, the working fluid condensing unit is an air-cooled condensing unit or a liquid-cooled condensing unit.

[0020] In a possible implementation manner, the at least two working fluid storage devices are installed inside a computing device, and the working fluid condensing unit is installed on a chassis of the computing device.

[0021] In one possible embodiment, the working fluid liquid level control unit is a connecting tube, wherein the position of the pipe openings connecting the at least two working fluid storage devices and the connecting tube are lower than the liquid level of the liquid-phase working fluid in the at least two working fluid storage devices, and the position of the connecting tube is lower than the liquid level of the liquid-phase working fluid in the at least two working fluid storage devices.

[0022] In one possible implementation, the working fluid level height control unit includes:

[0023] A liquid level sensing sensor, wherein the liquid level sensing sensor is disposed in the at least two working fluid storage devices;

[0024] A liquid level balancing pump is coupled to the liquid level sensing sensor and connected between the at least two working fluid storages through a connecting pipe.

[0025] In one possible implementation, the heat source is a chip.

[0026] According to another aspect of an embodiment of the present disclosure, a computing device is provided, comprising the phase-change working fluid auxiliary cooling device as described in any one of the above items.

[0027] It can be seen from the above scheme that in the phase-change working fluid auxiliary cooling device and computing device disclosed in the present invention, the working fluid circulates between at least two working fluid storage devices and working fluid condensation units through the working fluid vapor delivery pipe and the supercooled working fluid delivery pipe, thereby achieving heat dissipation of at least two heat sources. The phase-change working fluid auxiliary cooling device has a simple structure and can be arranged in the chassis of the computing device. Compared with the cabinet-level or computer room-level phase-change heat dissipation system in the related art, it does not need to change the original facilities of the data center and the computer room. Compared with the liquid-assisted heat dissipation device in the related art, the PUE of the phase-change working fluid auxiliary cooling device is lower, and the device cost at least does not increase significantly. The phase-change working fluid auxiliary cooling device and computing device disclosed in the present invention achieve the purpose of helping to improve the heat dissipation capacity of the computing device in a compact space without high investment costs. In the phase-change working fluid auxiliary cooling device and computing device disclosed in the present invention, the pump-driven phase-change cooling system is concentrated to the single machine level, which helps to improve the upper limit of air-cooled heat dissipation at the whole machine level of the computing device, and is particularly suitable for heat dissipation of high-power chipsets. The phase-change working fluid auxiliary cooling device disclosed in the present invention has a simple structure, is not prone to leakage, is reliable and durable, helps to control the temperature of related chips in computing devices to be consistent, and helps to avoid the situation where the chip temperature is low at the beginning and high at the end caused by liquid cooling or air cooling solutions in related technologies. In the embodiment disclosed in the present invention, only a small amount of phase-change working fluid is needed to achieve good heat dissipation of a single computing device, and it is compatible with conventional chassis structures and infrastructures, with low cost of use. Moreover, compared with cabinet-level or computer room-level phase-change heat dissipation systems, the use and arrangement of the phase-change working fluid auxiliary cooling device after the size reduction is more flexible. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 It is a structural schematic diagram of a liquid-assisted heat dissipation device in the related art;

[0029] Figure 2 It is a schematic diagram of the structure of a cabinet-level or computer room-level phase change heat dissipation system in the related art;

[0030] Figure 3 is a schematic structural diagram of a first embodiment of a phase-change working medium auxiliary cooling device according to an exemplary embodiment;

[0031] Figure 4 It is a schematic structural diagram of a second embodiment of a phase change working medium auxiliary cooling device according to an illustrative embodiment.

[0032] In the accompanying drawings, the names of the components represented by the reference numerals are as follows:

[0033] 101. Water cooling head, 102. Radiator, 103. Water pipe, 104. Fan, 201. Server, 202. Liquid area, 203. Condenser, 204. Pump, 205. Drying tower, 206. Fan, 301. Working fluid storage device, 302. Working fluid steam delivery pipe, 303. Subcooled working fluid delivery pipe, 304. Working fluid condensation unit, 305. Working fluid liquid level height control unit, 306. Control unit, 307. Working fluid delivery pump, 308. Flow meter, 309. Liquid level sensor, 310. Heat source. DETAILED DESCRIPTION

[0034] In order to make the objectives, technical solutions and advantages of the present disclosure more clearly understood, the present disclosure is further described in detail below with reference to the accompanying drawings and examples.

[0035] Traditional cooling methods for computing devices are mainly air cooling, for example, a heat sink is mounted on the surface of the chip and a fan is installed, and the heat of the chip is removed by the fan blowing air on the surface of the heat sink. In this method, because the heat sink and the fan are both located inside the chassis of the computing device, although the temperature rise of the local area of ​​the chip can be suppressed to a certain extent, the overall temperature inside the chassis may still be high, and it may be necessary to further install a fan on the chassis to assist the air flow inside the chassis, but the heat dissipation efficiency of this method is still relatively low.

[0036] Therefore, some new heat dissipation methods are proposed in the related art. Figure 1 Schematic diagram of a liquid-assisted heat dissipation device in the related art. Figure 1 As shown, the liquid-assisted heat dissipation device mainly includes a water-cooling head 101, a radiator 102, a water pipe 103 and a fan 104. The water-cooling head 101 is directly mounted on the surface of the CPU and is connected to the radiator 102 through the water pipe 103. A water pump is arranged inside the water-cooling head 101. Under the action of the water pump, the coolant circulates between the water-cooling head 101 and the radiator 102 through the water pipe 103. The fan 104 blows air to the radiator 102 to take away the heat dissipated by the radiator 102. The heat generated by the CPU during operation is heat exchanged with the coolant in the water-cooling head 101, so that the temperature of the coolant rises. The coolant with the increased temperature is dissipated and cooled with the assistance of the fan 104 of the radiator 102. The cooled coolant returns to the water-cooling head 101 to continue heat exchange with the CPU, thereby achieving heat dissipation of the CPU. The radiator 102 and the fan 104 are usually installed in a chassis. The liquid-assisted heat dissipation device is arranged in a compact space in the chassis as a whole, and the chassis arrangement in the machine room is also very compact. Because the temperature difference in a compact space is relatively small, the heat dissipation capacity of the liquid-assisted cooling device may be limited. In addition, compared with the phase change cooling method, the liquid-assisted cooling device has a higher PUE (Power Usage Effectiveness).

[0037] Figure 2 This is a schematic diagram of a cabinet-level or room-level phase change cooling system structure in the related art. Figure 2 As shown, the phase change cooling system places multiple servers 201 in a liquid area 202. The heat generated by the operation of the servers 201 causes the working fluid in the liquid area 202 to boil and generate working fluid vapor. The working fluid vapor is cooled down and turned back into liquid through heat exchange at the condenser 203. The coolant in the condenser 203 circulates between the condenser 203 and the drying tower 205 under the drive of the pump 204, and is cooled down at the drying tower 205 by the fan 206. The overall structure of the phase change cooling system is complex, occupies a large space, and is not compatible with the existing infrastructure of the data center and computer room. It needs to be designed and manufactured separately, and the equipment investment cost and operation and maintenance cost are high.

[0038] In addition, when the liquid cooling or air cooling schemes in the related art are used to dissipate heat for multiple chips, the chip temperature may be low at first and high at the end. In the liquid cooling scheme, the temperature of the coolant will gradually rise due to the heating of the chips it flows through. As a result, on the cooling path of the coolant, the temperature of the chip that the coolant flows through first is relatively low, and the temperature of the chip that the coolant flows through last is relatively high, resulting in the situation that the chip temperature in the liquid cooling scheme is low at first and high at the end. In the air cooling scheme, the temperature of the air will also gradually rise due to the heating of the chips it flows through. As a result, on the side close to the upper air outlet, the temperature of the chip that the air flows through first is relatively low, and on the side close to the lower air outlet, the temperature of the chip that the air flows through last is relatively high, resulting in the situation that the chip temperature in the air cooling scheme is low at first and high at the end.

[0039] In view of this, the embodiments of the present disclosure provide a phase change medium auxiliary cooling device and a computing device, so as to help improve the heat dissipation capacity of the computing device in a compact space without high investment cost.

[0040] Figure 3 FIG. 1 is a schematic diagram of the structure of a first embodiment of a phase change medium auxiliary cooling device according to an exemplary embodiment. Figure 3As shown, the phase change working fluid auxiliary cooling device mainly includes at least two working fluid storage devices 301, a working fluid steam delivery pipe 302, a supercooled working fluid delivery pipe 303, a working fluid condensation unit 304 and a working fluid liquid level height control unit 305. Among them, at least two working fluid storage devices 301 are arranged on at least two heat sources 310 in a one-to-one correspondence, that is, each heat source 310 is respectively provided with a working fluid storage device 301, and each working fluid storage device 301 has a working fluid steam outlet and a supercooled working fluid inlet, and the position of the working fluid steam outlet is higher than the position of the supercooled working fluid inlet. One end of the working fluid steam delivery pipe 302 is connected to the working fluid steam outlet. One end of the supercooled working fluid delivery pipe 303 is connected to the supercooled working fluid inlet. The working medium condensing unit 304 has a working medium vapor inlet and a subcooled working medium outlet, wherein the working medium vapor inlet is connected to the other end of the working medium vapor delivery pipe 302, and the subcooled working medium outlet is connected to the other end of the subcooled working medium delivery pipe 303, wherein a circulation path of the phase-changing working medium is formed in the space inside the at least two working medium storages 301, the working medium vapor delivery pipe 302, the working medium condensing unit 304, and the subcooled working medium delivery pipe 303. The working medium liquid level control unit 305 is connected to the at least two working medium storages 301 to balance the liquid level of the liquid phase working medium in the at least two working medium storages 301.

[0041] In the phase-change working fluid auxiliary cooling device of the embodiment of the present disclosure, the working fluid circulates between at least two working fluid storage devices 301 and the working fluid condensation unit 304 through the working fluid vapor delivery pipe 302 and the supercooled working fluid delivery pipe 303, thereby achieving heat dissipation of at least two heat sources 310. The phase-change working fluid auxiliary cooling device has a simple structure and can be arranged in the chassis of a computing device. Compared with the cabinet-level or computer room-level phase-change heat dissipation system in the related art, there is no need to change the original facilities of the data center and computer room. Compared with the liquid-assisted heat dissipation device of the related art, the phase-change working fluid auxiliary cooling device has a lower PUE, and the device cost at least does not increase significantly. The phase-change working fluid auxiliary cooling device of the embodiment of the present disclosure achieves the purpose of helping to improve the heat dissipation capacity of computing equipment in a compact space without high investment costs.

[0042] In the exemplary embodiment, the heat source 310 is a chip. The number of chips may be two or more. Based on this, in the exemplary embodiment, the number of working medium storages 301 is set according to the number of chips.

[0043] Figure 4 FIG. 1 is a schematic diagram of the structure of a second embodiment of a phase change medium auxiliary cooling device according to an exemplary embodiment. Figure 4As shown, in order to further improve the flow efficiency of the working fluid and help further improve the heat dissipation capacity, the phase change working fluid auxiliary cooling device of the embodiment of the present disclosure may further include a control unit 306 and a working fluid delivery pump 307. The working fluid delivery pump 307 is installed on the supercooled working fluid delivery pipe 303, and is used to pump the supercooled working fluid to at least two working fluid storages 301 under the control of the control unit 306.

[0044] In an illustrative embodiment, the control unit 306 may be a BMC (Baseboard Management Controller). BMC is an embedded microcontroller that can be integrated on a server motherboard and is used to monitor and manage the hardware status of the server. BMC has its own processor, memory, and operating system and does not rely on the server's main CPU, memory, or operating system. BMC can monitor the hardware status of the server in real time, including temperature, voltage, fan speed, power status, etc., and record logs. The main function of BMC is to improve the manageability, reliability, and availability of the server, especially in data centers and enterprise environments.

[0045] Since the working fluid flow rate in the phase change working fluid auxiliary cooling device of the embodiment of the present disclosure is relatively small, in the exemplary embodiment, the working fluid delivery pump 307 can use a low-speed pump or a gear pump. In the exemplary embodiment, the working fluid delivery pump 307 has the ability to accurately control the flow rate, is resistant to cavitation, can receive the control signal of the control unit 306, and can adjust the flow rate according to the working fluid liquid level in the working fluid storage 301 and the power consumption of the heat source 310 to ensure that the working fluid level is relatively stable.

[0046] In the exemplary embodiment, when applied to multi-chip heat dissipation, an independent fluid delivery pump 307 can be set for each chip to help achieve precise control of the heat dissipation of each chip. In order to optimize the control logic and save costs, in the exemplary embodiment, a fluid delivery pump 307 is set to deliver the fluid, and all chips share one fluid delivery pump 307.

[0047] Continue to see Figure 4As shown, in the exemplary embodiment, the phase change working fluid auxiliary cooling device may further include a flow meter 308. The flow meter 308 is installed on the supercooled working fluid delivery pipe 303 and is coupled to the control unit 306. Based on this, on the basis of the structure of the phase change working fluid auxiliary cooling device of the embodiment of the present disclosure, the control unit 306 can control the operation of the working fluid delivery pump 307 according to the flow measurement result of the supercooled working fluid in the supercooled working fluid delivery pipe 303 by the flow meter 308, so as to realize the flow control of the supercooled working fluid. For example, when the flow measurement result of the flow meter 308 shows that the flow of the supercooled working fluid is less than the preset flow value range, the control unit 306 controls the working fluid delivery pump 307 to increase the power to increase the flow of the supercooled working fluid; when the flow measurement result of the flow meter 308 shows that the flow of the supercooled working fluid is greater than the preset flow value range, the control unit 306 controls the working fluid delivery pump 307 to reduce the power to reduce the flow of the supercooled working fluid.

[0048] Continue to see Figure 4 As shown, in the exemplary embodiment, the phase-change working medium auxiliary cooling device may further include at least two liquid level sensors 309. At least two liquid level sensors 309 are installed in at least two working medium storage devices 301 in a one-to-one correspondence and coupled to the control unit 306. Based on this, on the basis of the structure of the phase-change working medium auxiliary cooling device in the embodiment of the present disclosure, the control unit 306 may control the operation of the working medium delivery pump 307 according to the liquid level sensor 309 sensing the liquid level height of the liquid working medium in the working medium storage device 301, thereby controlling the liquid working medium in the working medium storage device 301 to be within the required capacity range. For example, when the liquid level sensor 309 senses that the liquid level of the liquid working fluid in the working fluid storage 301 is lower than a preset height range, the control unit 306 controls the working fluid delivery pump 307 to increase power to increase the liquid level of the liquid working fluid in the working fluid storage 301; when the liquid level sensor 309 senses that the liquid level of the liquid working fluid in the working fluid storage 301 is higher than the preset height range, the control unit 306 controls the working fluid delivery pump 307 to reduce power or temporarily shut down, and then under the heating of the heat source 310, the liquid level of the liquid working fluid in the working fluid storage 301 gradually decreases.

[0049] In the exemplary embodiment, after the phase change working medium auxiliary cooling device of the embodiment of the present disclosure works stably, the flow rate of the supercooled working medium controlled by the working medium delivery pump 307 is:

[0050] q=P / (C·ΔT+L)

[0051] Among them, q is the pumping flow rate of the working fluid delivery pump 307, P is the total power consumption of the heat source 310, C is the specific heat capacity of the working fluid, ΔT is the working fluid subcooling at the outlet of the working fluid delivery pump 307, and L is the latent heat of vaporization of the working fluid.

[0052] In order to be compatible with different heat dissipation methods, in the exemplary embodiment, the working fluid condensation unit 304 can be an air-cooled condensation unit or a liquid-cooled condensation unit. Among them, the air-cooled condensation unit is a condensation device that uses air as a cooling medium. In the exemplary embodiment, the air-cooled condensation unit may include a radiator and a cooling fan. The radiator structure is provided with cooling fins. Because the cooling fins increase the surface area of ​​the radiator, the heat dissipation efficiency of the radiator can be increased. At the same time, increasing the air flow on the surface of the radiator through the cooling fan can further increase the heat dissipation efficiency of the radiator. In the air-cooled condensation unit, the working fluid vapor exchanges heat with the radiator, and under the action of the cooling fan, the heat is quickly taken away by the air, so that the working fluid vapor temperature drops below the boiling point of the working fluid, and the working fluid condenses from gas to liquid to form a supercooled working fluid. The structure of the air-cooled condensation unit is relatively simple, and the installation position can be flexibly set. The liquid-cooled condensation unit is a refrigeration device that uses liquid as a cooling medium. The liquid-cooled condensing unit may include a heat exchange unit, in which a working fluid vapor channel and a cooling liquid channel are provided, the working fluid vapor channel and the cooling liquid channel are not interconnected, and heat exchange is performed between the working fluid vapor and the cooling liquid in the heat exchange unit, so that the heat of the working fluid vapor is transferred to the cooling liquid, the temperature of the working fluid vapor drops below the boiling point of the working fluid, the working fluid condenses from gas to liquid, forming a supercooled working fluid, and the cooling liquid with increased temperature is discharged from the heat exchange unit for cooling, and the cooling liquid enters the heat exchange unit again, and the cycle continues. Because the circulation of the cooling liquid requires a corresponding liquid pump device, and a device for cooling the cooling liquid is also required, compared with the air-cooled condensing unit, the space occupied and investment cost of the liquid-cooled condensing unit are relatively large, and the layout is not flexible, but a better heat dissipation effect can be obtained by designing a well-designed cooling liquid circulation path and a cooling liquid cooling device.

[0053] Although in scenarios where a large number of computing devices are arranged, such as scenarios where a large number of computing devices are densely arranged in a cabinet or a computer room, there is a high demand for the heat dissipation capacity of the computing devices, but as an independent computing device, there are usually requirements for the equipment to be flexibly placed, moved, and rearranged. For example, when a single computing device is repaired, it is necessary to be able to be easily taken out, disassembled and installed. Therefore, the phase-change working fluid auxiliary cooling device of the embodiment of the present disclosure gives priority to the design method that can be integrated with the computing device. Therefore, preferably, in the exemplary embodiment, the working fluid condensation unit 304 adopts an air-cooled condensation unit, and the working fluid condensation unit 304 is installed on the chassis of the computing device. In this way, there is no need to additionally consider the interference of the phase-change working fluid auxiliary cooling device of the embodiment of the present disclosure on the mobile and transport computing device. It is convenient for the maintenance of the computing device. At the same time, there is no need to carry out targeted transformation of the existing infrastructure or cabinets of the computer room, which saves the transformation cost of the computer room and the cabinet. The phase-change working fluid auxiliary cooling device of the embodiment of the present disclosure has stronger compatibility and will not change the original shape and volume of the computing device. It only needs to set the installation position for the working fluid condensation unit 304 on the chassis of the computing device.

[0054] Since each working fluid storage device 301 is independent of each other, different chips may generate different amounts of heat, resulting in different working fluid gasification efficiencies in different working fluid storage devices 301, which will lead to different working fluid liquid level heights between different working fluid storage devices 301. The working fluid liquid level in the working fluid storage device 301 corresponding to the chip with higher temperature may be lower, while the working fluid liquid level in the working fluid storage device 301 corresponding to the chip with lower temperature may be higher. In this case, when a working fluid delivery pump 307 is used to deliver the working fluid: on the one hand, to increase the height of the working fluid liquid level in the working fluid storage device 301 of the chip with higher temperature, the working fluid delivery pump 307 needs to maintain a larger delivery flow rate of the supercooled working fluid, and thus the higher working fluid liquid level in the working fluid storage device 301 corresponding to the chip with lower temperature will continue to rise, which may cause the working fluid liquid level in the working fluid storage device 301 corresponding to the chip with lower temperature to be too high, and even cause the liquid supercooled working fluid therein to overflow or pass through the working fluid storage device 301. The outlet of the medium vapor enters the medium vapor delivery pipe 302, causing the medium vapor delivery pipe 302 to be blocked. When the temperature of the lower temperature chip rises, the medium vapor generated in the medium storage device 301 may be difficult to be discharged from the medium vapor delivery pipe 302, causing the gas pressure in the medium storage device 301 to be too high and difficult to release the accumulated heat, which may affect the heat dissipation of the lower temperature chip and may also cause damage to the phase change medium auxiliary cooling device; on the other hand, to maintain the height of the medium liquid level in the medium storage device 301 of the lower temperature chip, the medium delivery pump 307 needs to maintain a smaller delivery flow rate of the supercooled medium, and then the replenishment amount of the supercooled medium in the medium storage device 301 corresponding to the higher temperature chip may be insufficient to make up for the deficit caused by the additional amount, causing the medium liquid level in the medium storage device 301 corresponding to the higher temperature chip to continue to drop, resulting in the possibility of being unable to continue to maintain the heat dissipation of the higher temperature chip, causing the chip temperature to overheat.

[0055] Therefore, in the embodiment of the present disclosure, the working fluid liquid level height control unit 305 is used to balance the liquid level height of the liquid phase working fluid in at least two working fluid storages 301. In order to achieve a low-cost and good liquid level height balancing effect, in the exemplary embodiment, the working fluid liquid level height control unit 305 is a connecting pipe, wherein the position of the pipe openings of at least two working fluid storages 301 connected to the connecting pipe is lower than the liquid level height of the liquid phase working fluid in at least two working fluid storages 301, and the position of the connecting pipe is lower than the liquid level height of the liquid phase working fluid in at least two working fluid storages 301. In this way, the liquid phase working fluid in at least two working fluid storages 301 will reach the same liquid level between each other through the connecting pipe under the action of gravity. When this method is adopted, preferably, each chip that performs heat dissipation in at least two working fluid storages 301 is located in the same horizontal plane. For example, each chip can be a chip on the same PCB (Printed Circuit Board), and the PCB is placed horizontally in the computing device. For another example, each chip can be a chip on the same PCB or different PCBs, the PCBs are placed vertically in the computing device, and the position heights of each chip are consistent. In the exemplary embodiment, the specific shape of the working fluid storage 301 can be designed accordingly according to the arrangement structure in the chassis. In the embodiment of the present disclosure, the shape of the working fluid storage 301 is not specifically limited.

[0056] In addition to using a connecting pipe as the working fluid liquid level height control unit 305, liquid level height balance can also be achieved through active control means. For example, in an illustrative embodiment, the working fluid liquid level height control unit 305 includes a liquid level height sensing sensor and a liquid level height balancing pump. Among them, the liquid level height sensing sensor is arranged in at least two working fluid storages 301. The liquid level height balancing pump is coupled to the liquid level height sensing sensor and connected between at least two working fluid storages 301 through a connecting pipe. The liquid level height balancing pump works according to the different liquid level heights in each working fluid storage 301 collected by the liquid level height sensing sensor to achieve consistency in the liquid level heights between each working fluid storage 301. This method can be applicable to situations where chips are at different heights.

[0057] In the exemplary embodiment, the method of using a connecting pipe as the working fluid liquid level height control unit 305 and the method of using a liquid level height balancing pump as the working fluid liquid level height control unit 305 can be used in combination. In an example of an application scenario, a computing device may include multiple PCB boards, each of which contains multiple chips, and each PCB board is stacked. In this structure, a connecting pipe can be used as the working fluid liquid level height control unit 305 between the working fluid storage devices 301 corresponding to multiple chips in the same PCB board, and a liquid level balancing pump can be used as the working fluid liquid level height control unit 305 between the working fluid storage devices 301 corresponding to the chips between different PCB boards.

[0058] The embodiment of the present disclosure further provides a computing device, which includes the phase-change medium auxiliary cooling device as described in any of the above exemplary embodiments. In addition, the computing device may also include all hardware structures possessed by the computing device in the related art.

[0059] In the phase-change working fluid auxiliary cooling device and computing device of the disclosed embodiment, the pump-driven phase-change cooling system is concentrated to the single-machine level, which helps to improve the upper limit of air-cooled heat dissipation at the whole machine level of the computing device, while effectively reducing the PUE of the whole machine, and is particularly suitable for heat dissipation of high-power chipsets. The phase-change working fluid auxiliary cooling device of the disclosed embodiment has a simple structure, is not easy to leak, is reliable and durable, helps to control the temperature of related chips in the computing device to be consistent, and helps to avoid the situation where the chip temperature is low at first and high at the end caused by liquid cooling or air cooling solutions in related technologies. In the disclosed embodiment, only a small amount of phase-change working fluid is needed to achieve good heat dissipation of a single computing device, and it is compatible with conventional chassis structures and infrastructure, and has low cost of use.

[0060] The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present disclosure shall be included in the scope of protection of the present disclosure.

Claims

1. A phase change medium auxiliary cooling device, characterized in that: include: At least two working fluid storages, the at least two working fluid storages are arranged on at least two heat sources in a one-to-one correspondence, each of the working fluid storages has a working fluid vapor outlet and a supercooled working fluid inlet, and the position of the working fluid vapor outlet is higher than the position of the supercooled working fluid inlet; A working fluid steam delivery pipe, one end of which is connected to the working fluid steam outlet; A supercooled working medium delivery pipe, one end of which is connected to the supercooled working medium inlet; A working fluid condensing unit having a working fluid vapor inlet and a subcooled working fluid outlet, wherein the working fluid vapor inlet is connected to the other end of the working fluid vapor delivery pipe, and the subcooled working fluid outlet is connected to the other end of the subcooled working fluid delivery pipe, wherein a circulation path of a phase-change working fluid is formed in the spaces inside the at least two working fluid storage devices, the working fluid vapor delivery pipe, the working fluid condensing unit, and the subcooled working fluid delivery pipe; and A working fluid liquid level control unit is connected to the at least two working fluid storage units to balance the liquid levels of the liquid phase working fluids in the at least two working fluid storage units.

2. The phase change medium auxiliary cooling device according to claim 1, characterized in that: Also includes: Control unit; as well as A working fluid delivery pump is installed on the supercooled working fluid delivery pipe and is used to pump the supercooled working fluid to the at least two working fluid storages under the control of the control unit.

3. The phase change medium auxiliary cooling device according to claim 2, characterized in that: The phase-change working medium auxiliary cooling device also includes: A flow meter is installed on the supercooling medium delivery pipe and coupled to the control unit.

4. The phase change medium auxiliary cooling device according to claim 2, characterized in that: The phase-change working medium auxiliary cooling device also includes: At least two liquid level sensors are installed in the at least two working fluid storage devices in a one-to-one correspondence and coupled to the control unit.

5. The phase-change medium auxiliary cooling device according to claim 1, characterized in that: The working medium condensing unit is an air-cooled condensing unit or a liquid-cooled condensing unit.

6. The phase-change working medium auxiliary cooling device according to claim 1, characterized in that: The at least two working fluid storage devices are installed inside the computing device, and the working fluid condensing unit is installed on a chassis of the computing device.

7. The phase-change working medium auxiliary cooling device according to claim 1, characterized in that: The working fluid liquid level height control unit is a connecting tube, wherein the position of the pipe openings connecting the at least two working fluid storage devices and the connecting tube are lower than the liquid level height of the liquid-phase working fluid in the at least two working fluid storage devices, and the position of the connecting tube is lower than the liquid level height of the liquid-phase working fluid in the at least two working fluid storage devices.

8. The phase-change medium auxiliary cooling device according to claim 1, characterized in that: The working fluid level height control unit comprises: A liquid level sensing sensor, wherein the liquid level sensing sensor is disposed in the at least two working fluid storage devices; A liquid level balancing pump is coupled to the liquid level sensing sensor and connected between the at least two working fluid storages through a connecting pipe.

9. The phase-change working medium auxiliary cooling device according to claim 1, characterized in that: The heat source is a chip.

10. A computing device, characterized in that It comprises the phase change working fluid auxiliary cooling device as described in any one of claims 1 to 9.

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