Bonding device capable of realizing self-calibration

Abstract

The utility model provides a bonding device capable of realizing self-calibration, which comprises a bonding head and a base station, a pressure sensor is arranged above the base station, the bonding head is driven by an external driving mechanism to move longitudinally, the bonding head comprises a mounting seat and a suction head, the suction head comprises a pressing rod and a suction nozzle, and the pressing rod is inserted and mounted in the mounting seat in a lifting and sliding manner; an elastic component is further arranged in the mounting base and comprises multiple stages of elastic pieces which are arranged in the lifting direction of the pressing rod step by step, when the pressing rod is pressed downwards and is propped to move upwards relative to the mounting base, the pressing rod makes contact with the elastic pieces step by step, and downward reset elastic force provided by the multiple stages of elastic pieces is gradually increased; a displacement sensor is further arranged on the installation base and used for detecting the displacement amount of the pressing rod in the lifting direction, and the displacement amount corresponds to the positions of the multiple stages of elastic pieces. According to the bonding device capable of achieving self-calibration, the bonding process is simple and rapid, and pressure control and monitoring are simpler and more visual.

Description

Technical Field

[0001] The utility model relates to the technical field of crystal bonding, in particular to a bonding device capable of realizing self-calibration. Background Art

[0002] The die bonder is one of the essential key equipment in the semiconductor chip packaging process. It is used to bond the semiconductor chip to the designated area of ​​the PCB or substrate through colloid to form a thermal path or an electrical path, providing conditions for subsequent wire bonding. The bonding device is an important component of the die bonder. It is used to grab and carry semiconductor chips, move the semiconductor chips to the designated area, and apply pressure to the chips. Considering the accuracy of the chip handling process and the accuracy of the pressure applied to the chip, the bonding device needs to be calibrated before work, so that the preset pressure value of the bonding device is consistent with the actual pressure value. The bonding device in the prior art often needs to be calibrated with the assistance of external equipment, and the calibration process is cumbersome. Utility Model Content

[0003] The embodiment of the utility model provides a bonding device that can realize self-calibration, so as to solve the problem that the bonding device in the prior art often needs to be calibrated with the assistance of external equipment and the calibration process is complicated.

[0004] To achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A bonding device for realizing self-calibration, comprising a bonding head and a base, a pressure sensor is arranged on the base, the bonding head is driven to move longitudinally by an external driving mechanism, the bonding head comprises a mounting seat and a suction head mounted at the bottom of the mounting seat for contacting and adsorbing a chip, the suction head comprises a pressure rod and a suction nozzle mounted at the end of the pressure rod, and the pressure rod can be lifted and slidably inserted into the mounting seat;

[0006] An elastic component is also provided in the mounting seat, and the elastic component is used to provide elastic force to the pressure rod. The elastic component includes a multi-stage spring sheet, which is arranged step by step in the lifting direction of the pressure rod, wherein the first-stage spring sheet maintains the pressure rod in the initial position in the lifting direction, and the spring sheets of other stages can be selectively or adjustable in spacing above the first-stage spring sheet, so that when the pressure rod is pressed down and resisted and moves upward relative to the mounting seat, the pressure rod will contact the spring sheets step by step, and the downward reset elastic force provided by the multi-stage spring sheets gradually increases;

[0007] A displacement sensor is also provided on the mounting seat, and the displacement sensor is used to detect the displacement of the pressure rod in the lifting direction, and the displacement forms a corresponding relationship with the position of the multi-stage spring piece.

[0008] Furthermore, the elastic component includes a first elastic sheet, which is directly and fixedly connected to the pressure rod and the mounting seat, and provides elastic force for the pressure rod to maintain an initial position in the lifting direction.

[0009] Furthermore, the elastic component also includes a second spring sheet, an annular flange is formed at the end of the pressure rod away from the base, a stopping position is formed in the mounting seat, the flange presses against the stopping position of the mounting seat, so that the stopping position prevents the pressure rod from moving downward, the second spring sheet is fixedly connected to the mounting seat, and the second spring sheet presses against the flange.

[0010] Furthermore, the elastic component also includes a third spring sheet, which is fixedly connected to the mounting seat, the third spring sheet is located above the second spring sheet, and there is a gap between the third spring sheet and the top end of the pressure rod.

[0011] The beneficial effects of the utility model are:

[0012] The utility model provides a bonding device that realizes self-calibration, uses a displacement sensor to measure the longitudinal displacement of the pressure rod, and uses a pressure sensor to measure the elastic force of the elastic component, so that the pressure applied by the pressure rod is associated with the displacement of the pressure rod itself, that is, the bonding device can be calibrated, the bonding process is simple and fast, and in the subsequent normal chip handling and pressure application process, the bonding device of the utility model only needs to know the pressure value applied by the pressure rod on the chip according to the indication of the displacement sensor, and the control and monitoring of the pressure are simpler and more intuitive. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A three-dimensional diagram of a bonding device for self-calibration;

[0014] Figure 2 Front view of the bonding device for self-calibration;

[0015] Figure 3 is the side view of the cantilever;

[0016] Figure 4 for Figure 3 Sectional view of the AA section;

[0017] Figure 5 for Figure 4 A partial enlarged view of part G in the middle.

[0018] Description of reference numerals:

[0019] 1. Bond head; 11. Mounting seat; 111. Stopping position; 12. Suction head; 121. Pressure rod; 122. Suction nozzle; 1211. Flange; 13. Displacement sensor; 14. First spring piece; 15. Second spring piece; 16. Third spring piece; 2. Base; 21. Pressure sensor. DETAILED DESCRIPTION

[0020] The specific implementation of the present application is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present application, and is not used to limit the present application.

[0021] like Figure 1-2 As shown, the embodiment of the utility model provides a bonding device for realizing self-calibration, including a bonding head 1 and a base 2. The bonding head 1 is driven to move longitudinally by an external driving mechanism. The bonding head 1 includes a mounting seat 11 and a suction head 12 mounted at the bottom of the mounting seat 11 for contacting and adsorbing the chip. The suction head 12 includes a pressure rod 121 and a suction nozzle 122 mounted at the end of the pressure rod 121. The pressure rod 121 is installed in the mounting seat 11 in a lifting and sliding manner. An elastic component is also arranged in the mounting seat 11. The elastic component is used to provide elastic force to the pressure rod 121 to maintain the pressure rod 121 in the lifting direction. Initial position, when the pressure rod 121 deviates from the longitudinal initial position, the elastic component provides elastic force for the pressure rod 121 to reset; a displacement sensor 13 is also arranged on the mounting seat 11, and the displacement sensor 13 is used to detect the displacement of the pressure rod 121 in the lifting direction; a pressure sensor 21 is arranged above the base 2, and the elastic component includes a multi-stage spring sheet, which is arranged step by step in the lifting direction of the pressure rod 121. The spring sheet arranged at the bottom end can be regarded as a first-stage spring sheet, which is used to provide pressure for the initial position of the pressure rod 121, that is, the first-stage spring sheet presses downward against the pressure rod 121 to maintain the pressure rod 121 in the initial position.

[0022] It can be understood that when the pressure rod 121 is in the initial position, the mounting seat 11 is provided with a stopper 111, which is used to abut the pressure rod 121 and prevent the pressure rod 121 from moving downward. The stopper 111 abuts against the protrusion on the peripheral side of the pressure rod 121, so that the pressure rod 121 cannot move further downward relative to the mounting seat 11, and the reverse movement of the pressure rod 121 is not restricted by the stopper 111. The elastic components of other levels can be selectively or adjustable in spacing above the first-level spring sheet, so that when the pressure rod 121 is pressed down and abutted and moves upward relative to the mounting seat 11, the pressure rod 121 will contact the spring sheet step by step, and the elastic force of the multiple-level spring sheets provided by the pressure rod 121 to reset downward gradually increases.

[0023] The automatic calibration force control operation process is as follows:

[0024] 1) The initial pressure of the first-stage spring is adjusted through the mechanical structure to prevent the suction nozzle 122 from moving up and down during high-speed operation;

[0025] 2) The bonding head 1 moves to be directly above the pressure sensor 21;

[0026] 3) The clamp head 1 moves downward. When the suction nozzle 122 contacts the pressure sensor 21, the clamp head 1 continues to move downward, so that the pressure rod 121 will retract upward to push the secondary spring sheet to perform elastic deformation. If a greater pressure is required, a greater retraction stroke is required to push the tertiary spring sheet to perform elastic deformation. In this way, the multi-stage spring sheets are pushed to deform, and the restoring elastic force provided is getting larger and larger. It can be understood that different overpressure amounts can be selected according to the required pressure;

[0027] 4) The displacement sensor 13 monitors the stroke of overpressure and corresponds to the pressure fed back by the pressure sensor 21, so that the curve relationship between pressure and stroke can be calibrated.

[0028] In this application, by setting up multi-stage springs, it has the advantages of automatic calibration force control structure:

[0029] 1) Primary shrapnel, secondary shrapnel, tertiary shrapnel...Multi-stage shrapnel can be made according to pressure requirements and can be compatible with a wider pressure range;

[0030] 2) Automatically calibrate the pressure to ensure a more stable elastic coefficient;

[0031] 3) The use of multi-stage self-made shrapnel can make the structure compact and light.

[0032] When the self-calibrated bonding device of the utility model is calibrated, the external driving mechanism drives the bonding head 1 downward, the pressure rod 121 contacts the pressure sensor 21 on the base 2 and continues to move downward, at this time the elastic component undergoes elastic deformation relative to the original state, and the elastic force generated by the deformation of the elastic component is equivalent to the pressure applied by the pressure rod 121 to the pressure sensor 21, the pressure sensor 21 measures the elastic force of the elastic component, and the displacement sensor 13 measures the lifting and lowering displacement of the pressure rod 121. By continuously adjusting the lifting and lowering position of the bonding head 1, the relationship between the pressure applied by the pressure rod 121 to the pressure sensor 21 and the displacement of the pressure rod 121 can be calibrated, and correspondingly, the elastic force corresponding to the position of each spring piece can be calibrated.

[0033] More specifically, if Figure 3-5As shown, the elastic component includes a first spring piece 14, a second spring piece 15 and a third spring piece 16. An annular flange 1211 is formed at one end of the pressure rod 121 away from the base 2, which is pressed against the stop position 111 of the mounting seat 11. The first spring piece 14 is fixedly connected to the pressure rod 121 and the mounting seat 11. The first spring piece 14 is used to provide the pressure rod 121 with an elastic force to maintain the initial position in the lifting direction. After the pressure rod 121 is displaced in the lifting direction, the first spring piece 14 can also provide the pressure rod 121 with a resetting elastic force; the second spring piece 15 is fixedly connected to the mounting seat 11, and The second spring piece 15 is downwardly supported on the flange 1211. After the pressure rod 121 contacts the pressure sensor 21 on the base 2 and moves upward, the second spring piece 15 undergoes elastic deformation to provide an elastic force for the pressure rod 121 to reset downward. The third spring piece 16 is fixedly connected to the mounting seat 11. The third spring piece 16 is located above the second spring piece 15, and there is a gap between the third spring piece 16 and the top end of the pressure rod 121. When the longitudinal displacement of the pressure rod 121 is large, the pressure rod 121 contacts the third spring piece 16 and the third spring piece provides additional elastic force for reset.

[0034] When the bonding device that realizes self-calibration provided by the utility model is used, the chip is grabbed by the suction nozzle to perform the bonding operation. The traditional bonding device cannot sense the specific pressure value applied by the suction nozzle to the chip during the bonding operation. As the main improvement of the utility model, the utility model connects the suction nozzle to a pressure rod that is slidably inserted into the mounting seat, and an elastic component is provided, so that when the suction nozzle contacts the chip during the bonding operation, the bonding head further moves downward and the pressure rod moves upward, causing the elastic deformation of the elastic component, so that the pressure value applied by the suction nozzle to the chip can be intuitively reflected by the movement of the pressure rod. In the no-load state, the bonding device can be calibrated, that is, the pressure sensor on the base is used to measure the elastic force of the elastic component, so as to calculate the relationship between the longitudinal movement of the pressure rod and the pressure applied by the suction nozzle to the pressure sensor. After multiple consecutive measurements, the longitudinal movement of the pressure rod (displacement sensor indication) and the numerical correspondence between the pressure applied by the suction nozzle to the chip during the bonding process can be obtained, and the calibration is completed. After calibration is completed, in the subsequent normal chip bonding process, when the nozzle contacts the chip and presses down to apply pressure to the chip, the pressure value applied by the pressure rod on the chip can be obtained only based on the indication of the displacement sensor, and the control and monitoring of the pressure are simpler and more intuitive.

[0035] That is, the utility model also substantially discloses a corresponding bonding method, comprising the following steps:

[0036] In the no-load state, the cantilever is brought close to the base, and the nozzle contacts the pressure sensor;

[0037] Continuously change the longitudinal position of the cantilever and record the readings of the displacement sensor and the pressure sensor;

[0038] The corresponding relationship between the longitudinal movement of the pressure rod and the indication of the pressure sensor is fitted into a formula.

[0039] The above-mentioned embodiments only express the implementation methods of the utility model, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A bonding device for realizing self-calibration, characterized in that: The device comprises a bonding head (1) and a base (2), wherein a pressure sensor (21) is arranged above the base (2), and the bonding head (1) is driven to move longitudinally by an external driving mechanism. The bonding head (1) comprises a mounting seat (11) and a suction head (12) mounted at the bottom of the mounting seat (11) for contacting and adsorbing a chip, and the suction head (12) comprises a pressure rod (121) and a suction nozzle (122) mounted at the end of the pressure rod (121), and the pressure rod (121) can be inserted into the mounting seat (11) in a manner that it can be lifted and slidably installed; An elastic component is also provided in the mounting seat (11), and is used to provide elastic force to the pressure rod (121). The elastic component includes a plurality of spring sheets, which are arranged step by step in the lifting direction of the pressure rod (121), wherein the first-stage spring sheet maintains the pressure rod (121) at an initial position in the lifting direction, and the spring sheets of the other stages can be selectively or adjustable in spacing above the first-stage spring sheet, so that when the pressure rod (121) is pressed downward and resisted and moves upward relative to the mounting seat (11), the pressure rod (121) will contact the spring sheets step by step, and the elastic force for returning downward provided by the plurality of spring sheets gradually increases; A displacement sensor (13) is also provided on the mounting seat (11). The displacement sensor (13) is used to detect the displacement of the pressure rod (121) in the lifting direction. The displacement forms a corresponding relationship with the position of the multi-stage spring sheet.

2. The bonding device according to claim 1, characterized in that: The elastic component comprises a first elastic sheet (14), which is directly and fixedly connected to the pressure rod (121) and the mounting seat (11) to provide an elastic force for the pressure rod (121) to maintain an initial position in a lifting direction.

3. The bonding device according to claim 2, characterized in that: The elastic component also includes a second elastic sheet (15); an annular flange (1211) is formed at one end of the pressure rod (121) away from the base (2); a retaining position (111) is formed in the mounting seat (11); the flange (1211) is pressed against the retaining position (111) of the mounting seat (11), so that the retaining position (111) prevents the pressure rod (121) from descending; the second elastic sheet (15) is fixedly connected to the mounting seat (11), and the second elastic sheet (15) is pressed against the flange (1211).

4. The bonding device according to claim 3, characterized in that: The elastic component further comprises a third elastic sheet (16), the third elastic sheet (16) is fixedly connected to the mounting seat (11), the third elastic sheet (16) is located above the second elastic sheet (15), and there is a gap between the third elastic sheet (16) and the top end of the pressure rod (121).

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