Camera module

Abstract

A camera module is provided. The camera module includes: a substrate on which an image sensor is disposed; an inner case disposed on the first surface of the substrate; and a heat transfer member including a thermoelectric element and disposed on the second surface of the substrate, in which the lens module is disposed in the inner case, in which the substrate includes a heat transfer portion, in which the heat transfer portion includes a plurality of holes penetrating the substrate, and in which a heat transfer material is disposed in the plurality of holes.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the priority of Korean Patent Application No. 10-2023-0111352 filed in the Korean Intellectual Property Office on August 24, 2023, the disclosure of which is incorporated herein by reference in its entirety for all purposes. Technical Field

[0003] The following description relates to a camera module. Background Art

[0004] The camera module can be implemented to enable autonomous driving or safe operation of a transport vehicle. For example, at least one camera module can be mounted on the outside of the vehicle to provide the driver with information about objects located in front of and / or behind the vehicle.

[0005] Camera modules mounted on the exterior body of a vehicle have been increasingly applied with image sensors having higher resolutions. When image sensors having higher resolutions are applied, the heat generated by the image sensors increases, and image quality deteriorates due to the heat generated by the image sensors. In addition, cameras mounted on the exterior of a vehicle may be directly affected by temperature and humidity depending on the driving environment of the vehicle, and thus there is a problem that the performance of the camera may deteriorate depending on temperature and humidity. Therefore, a camera module that can appropriately maintain the temperature and humidity therein would be beneficial.

[0006] The above information is presented as background information only to assist with understanding the present disclosure. No determination has been made, and no assertion is made, as to whether any of the above may be applicable as prior art with respect to the present disclosure. Utility Model Content

[0007] The purpose of providing this summary of the utility model is to introduce a selection of utility model concepts in a brief form, and these utility model concepts will be further described in the following detailed description. This summary of the utility model is not intended to identify the key features or essential features of the subject matter claimed for protection, nor to help determine the scope of the subject matter claimed for protection.

[0008] In a general aspect, a camera module includes: a substrate on which an image sensor is disposed; an inner housing disposed on a first surface of the substrate; and a heat transfer member including a thermoelectric element and disposed on a second surface of the substrate, wherein a lens module is disposed in the inner housing, wherein the substrate includes a heat transfer portion, wherein the heat transfer portion includes a plurality of holes penetrating the substrate, and wherein a heat transfer material is disposed in the plurality of holes.

[0009] A heat transfer portion may be formed around the image sensor.

[0010] The heat transfer portion may be disposed along a lower surface of the inner shell.

[0011] The heat transfer material may be a metallic material.

[0012] The metal material can be gold, aluminum or copper.

[0013] The heat transfer portion may overlap with a lower surface of the inner case in a direction parallel to the optical axis.

[0014] The lower surface of the inner shell may be arranged to contact the heat transfer portion.

[0015] The camera module may further include a first lens disposed in front of the lens module, wherein an outer peripheral surface of the first lens may be disposed to contact an inner peripheral surface of the inner housing.

[0016] An outer surface of the lens module may be disposed to contact an inner surface of the inner housing.

[0017] An adhesive may be applied between the lower surface of the inner shell and the heat transfer portion.

[0018] The heat transfer member may further include a heat dissipation plate having a first surface on which the thermoelectric element is disposed, and wherein a second surface of the heat dissipation plate may be disposed to contact the substrate.

[0019] The heat transfer member may further include heat dissipation pins disposed on the first surface of the heat dissipation plate.

[0020] The heat sink may be formed of a metal material.

[0021] The heat sink may be formed from gold, aluminum, or copper.

[0022] The camera module may further include a housing in which the inner case is disposed, a temperature sensor disposed in the housing, and a humidity sensor disposed in the housing.

[0023] In one general aspect, a camera module includes: a substrate; an inner housing disposed on a first surface of the substrate; and a heat transfer member including a thermoelectric element and disposed on a second surface of the substrate, wherein the substrate includes a heat transfer portion, wherein the heat transfer portion includes a plurality of holes penetrating the substrate, and wherein a heat transfer material is disposed in the plurality of holes to thermally connect the inner housing to the heat transfer member.

[0024] The camera module may further include a lens barrel disposed in the inner housing and an image sensor disposed on the substrate.

[0025] The lens barrel may be coupled to the inner housing.

[0026] Other features and aspects will be apparent from the following detailed description, the accompanying drawings, and the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A perspective view of an exemplary camera module is shown in accordance with one or more embodiments.

[0028] Figure 2 An exemplary camera module according to one or more embodiments is shown along Figure 1 A cross-sectional view taken along line II'.

[0029] Figure 3 An exploded perspective view of a portion of an exemplary camera module is shown in accordance with one or more embodiments.

[0030] Figure 4 An enlarged cross-sectional view of a portion of an exemplary camera module is shown in accordance with one or more embodiments.

[0031] Figure 5 A substrate of an exemplary camera module according to one or more embodiments is shown when viewed from an object side.

[0032] Figure 6 A structure is shown in which a heat transfer material is disposed on a substrate according to one or more embodiments.

[0033] Figure 7 An exemplary camera module according to one or more embodiments is shown along Figure 1 A cross-sectional view taken along line II'.

[0034] Figure 8 An enlarged cross-sectional view of a portion of an exemplary camera module is shown in accordance with one or more embodiments.

[0035] Fig. 9 An exemplary camera module according to one or more embodiments is shown along Figure 1 A cross-sectional view taken along line II'.

[0036] Fig.10 An enlarged cross-sectional view of a portion of an exemplary camera module is shown in accordance with one or more embodiments.

[0037] Throughout the drawings and detailed description, unless otherwise described, the same reference numerals refer to the same elements. For purposes of clarity, illustration, and convenience, the drawings may not be drawn to scale, and the relative sizes, proportions, and depictions of elements in the drawings may be exaggerated. DETAILED DESCRIPTION

[0038] Provide the following specific embodiments to help the reader fully understand the method, device and / or system described in the application. However, after understanding the disclosure of the application, various changes, modifications and equivalences of the method, device and / or system described in the application will be apparent. For example, the order in the operation described in the application and / or the order of operation are only examples, and except for the order in the operation that must occur in a specific order and / or the order of operation, it is not limited to the order set forth in the application, but can be changed as apparent after understanding the disclosure of the application. As another example, except for at least a portion of the order of the operation that must occur in a sequence (e.g., a specific order) and / or at least a portion of the order in the operation, the order of operation and / or the order in the operation can be performed in parallel. In addition, the description of known features after understanding the disclosure of the application may be omitted to improve clarity and conciseness.

[0039] Although various components, parts, regions, layers or sections may be described in the present application using terms such as "first", "second" and "third" or A, B, (a), (b), etc., these components, parts, regions, layers or sections are not limited by these terms. Each of these terms is not used to define, for example, the essence, order or sequence of the corresponding components, parts, regions, layers or sections, but is only used to distinguish the corresponding components, parts, regions, layers or sections from other components, parts, regions, layers or sections. Therefore, without departing from the teachings of the examples described in the present application, the first component, first component, first region, first layer or first section mentioned in these examples may also be referred to as the second component, second component, second region, second layer or second section.

[0040] Throughout the specification, when a component, element or layer is described as being "on another component, element or layer", "connected to another component, element or layer", "coupled to another component, element or layer" or "engaged to another component, element or layer", it may be directly "on another component, element or layer", directly "connected to another component, element or layer", directly "coupled to another component, element or layer" or directly "engaged to another component, element or layer" (e.g., in contact with the other component, element or layer), or one or more other components, elements or layers may reasonably exist between them. When a component, element or layer is described as being "directly on another component, element or layer", "directly connected to another component, element or layer", "directly coupled to another component, element or layer" or "directly engaged to another component, element or layer", no other components, elements or layers may exist between them. Similarly, expressions such as "between" and "immediately between" and "adjacent to" and "closely adjacent to" may also be interpreted as described above.

[0041] The terms used in this application are only used to describe various examples and are not used to limit the present disclosure. The terms "one", "an" and "said" are intended to also include plural forms, unless the context clearly indicates otherwise. As a non-limiting example, the terms "include" or "include", "include" or "includes" and "have" or "have" specify the existence of stated features, quantities, operations, components, elements and / or its combination, but do not exclude the existence or addition of one or more other features, quantities, operations, components, elements and / or its combination, or the alternative existence of the stated features, quantities, operations, components, elements and / or its combination. In addition, although an embodiment can state such terms "include" or "include", "include" or "includes" and "have" or "have" specify the existence of stated features, quantities, operations, components, elements and / or its combination, there can be other embodiments in which there is no one or more of the stated features, quantities, operations, components, elements and / or its combination.

[0042] As used in this application, the term "and / or" includes any one of the associated listed items and any combination of any two or more. The phrases "at least one of A, B, and C," etc. are intended to have separate meanings, and these phrases "at least one of A, B, and C," etc. also include examples in which one or more of A, B, and C may be present (e.g., any combination of one or more of A, B, and C), unless the corresponding description and embodiments require that such a list (e.g., "at least one of A, B, and C") be interpreted as having a combined meaning.

[0043] The features described in this application can be embodied in different forms and should not be interpreted as being limited to the examples described in this application. On the contrary, the examples described in this application are provided only to illustrate some of the many possible ways of implementing the method, device and / or system described in this application, which will be apparent after understanding the disclosure of this application. The use of the wording "may" in this application with respect to an example or embodiment (for example, the content that can be included or implemented with respect to an example or embodiment) means that there is at least one example or embodiment in which such a feature is included or implemented, and all examples are not limited thereto. The wording "example" or "embodiment" used in this application has the same meaning (for example, the phrase "in one example" has the same meaning as "in one embodiment", and "in one or more examples" has the same meaning as "in one or more embodiments").

[0044] As a non-limiting example, the camera module described in the present application can be configured to be installed on a vehicle, such as a transport vehicle. For example, according to one or more embodiments, the camera module can be installed in the form of a front surveillance camera and / or a rear surveillance camera or an autonomous driving camera in a car, a truck, a freight vehicle, a fire truck, a forklift, etc. However, the scope and examples of implementing the camera module described in one or more examples are not limited to the above-mentioned devices. For example, the camera module can be installed in the form of a camera for imaging (such as, a surveillance drone, a transport drone, etc.), but is not limited thereto.

[0045] One or more examples provide a camera module in which temperature and humidity can be appropriately maintained.

[0046] Figure 1 shows a perspective view of an exemplary camera module according to one or more embodiments, Figure 2 An exemplary camera module according to one or more embodiments is shown along Figure 1 A cross-sectional view taken along line II' of Figure 3 is an exploded perspective view illustrating a portion of an exemplary camera module according to one or more embodiments.

[0047] In an example, a camera module according to one or more embodiments may include a housing 10 , an inner case 20 , a lens module 30 , and a substrate 40 .

[0048] The housing 10 may form the exterior of the camera module. The housing 10 may be disposed in the outermost portion of the camera module. The temperature sensor 225 , the humidity sensor 235 , the inner case 20 , the lens module 30 , and the substrate 40 may be disposed in the housing 10 .

[0049] The temperature sensor 225 and the humidity sensor 235 may be disposed in the housing 10, and their positions are not limited to specific positions. The temperature sensor 225 and the humidity sensor 235 may detect the temperature and humidity in the housing 10, respectively, and the operation of the thermoelectric element 620 may be determined based on the temperature and humidity detected by the temperature sensor 225 and the humidity sensor 235, respectively.

[0050] The inner shell 20 may be disposed inside the housing 10. The lens module 30 to be described later may be inserted into the inner shell 20. The inner shell 20 may support the lens module 30 in the housing 10. The inner shell 20 may be disposed on or over a substrate 40 to be described later. The inner shell 20 may be disposed in direct contact with the substrate 40.

[0051] Figure 4 An enlarged cross-sectional view of a portion of an exemplary camera module is shown in accordance with one or more embodiments.

[0052] The inner housing 20 may include a first body 210, a second body 220, and a support portion 230. The first body 210, the second body 220, and the support portion 230 may be formed as one body. The first body 210, the support portion 230, and the second body 220 may be arranged in sequence in the optical axis direction. The first body 210 may be disposed on a first side of the support portion 230, and the second body 220 may be disposed on a second side of the support portion 230. The first side and the second side of the support portion 230 may be disposed in opposite directions.

[0053] The first body 210 may have a cylindrical shape including a first hole 211. The lens module 30 may be inserted into the first hole 211 of the first body 210. In an example, an outer radius of the first body 210 may be smaller than an outer radius of the second body 220. The radius of the first hole 211 of the first body 210 may be smaller than a radius of a second hole 221 of the second body 220 to be described later.

[0054] In an example, the support portion 230 may be a flat plate including a third hole. The third hole formed in the support portion 230 may be a hole having a circular cross-section. In a non-limiting example, the radius of the third hole may be the same as the radius of the first hole 211. In a non-limiting example, the support portion 230 may contact the housing 10. The inner shell 20 may be supported in the housing 10 by the support portion 230.

[0055] The second body 220 may have a cylindrical shape including the second hole 221. The outer radius of the second body 220 may be greater than the outer radius of the first body 210. The radius of the second hole 221 may be greater than the radius of the first hole 211. The lower surface of the second body 220 may be disposed on a substrate 40 to be described later. The lower surface of the second body 220 may be disposed to contact a heat transfer portion 400 of the substrate 40 to be described later.

[0056] The lens module 30 may include a plurality of lenses and a lens barrel. The lens module 30 may include a lens assembly including a plurality of lenses. The lens module 30 may be inserted into the inner shell 20. The outer surface of the lens module 30 may be arranged to contact the inner surface of the inner shell 20. The lens module 30 may be optically aligned with the image sensor 50 to be described later. The lens included in the lens module 30 may be a lens formed of a plastic material.

[0057] The heat transfer portion 400 of the substrate 40 may be disposed along the lower surface of the inner shell 20, may overlap with the lower surface of the inner shell 20 in a direction parallel to the optical axis, may be disposed to contact the lower surface of the inner shell 20, and the outer surface of the lens module 30 may contact the inner surface of the inner shell 20. Therefore, when the heat transfer portion 400 is heated or cooled, the inner shell 20 may be heated or cooled by the heat transfer portion 400, and the lens module 30 may be heated or cooled by the inner shell 20. Therefore, by heating or cooling the heat transfer portion 400, the lens disposed on the lens module 30 may also be maintained at an appropriate temperature.

[0058] Figure 5 shows a substrate of an exemplary camera module according to one or more embodiments when viewed from an object side, and Figure 6 A structure is shown in which a heat transfer material is disposed on a substrate according to one or more embodiments.

[0059] In an example, the substrate 40 may be a printed circuit board. The substrate 40 may be disposed in the housing 10. In an example, the substrate 40 may be disposed behind the inner housing 20. In an example, the substrate 40 may be disposed on an image side based on the lens module 30. The image sensor 50 may be disposed on the substrate 40. A first surface of the substrate 40 on which the image sensor 50 is disposed may be disposed on an object side based on the substrate 40. The heat transfer member 60 may be disposed on a second surface of the substrate 40. The heat transfer member 60 may be disposed to contact the second surface of the substrate 40.

[0060] The heat transfer member 60 may include a heat sink 610, a thermoelectric element 620, and a heat sink pin 630. The thermoelectric element 620 may be disposed between the heat sink 610 and the heat sink pin 630. The heat sink 610 may have a flat plate shape. In a non-limiting example, the heat sink 610 may be formed of a metal material. The heat sink 610 may be formed of a metal material having high thermal conductivity. As a non-limiting example, the heat sink 610 may be formed of gold, aluminum, or copper.

[0061] One surface of the heat dissipation plate 610 may be in contact with the second surface of the substrate 40. Heat from the thermoelectric element 620 may be transferred to the substrate 40 through the heat dissipation plate 610. Heat from the thermoelectric element 620 may be transferred to a large area through the heat dissipation plate 610.

[0062] The thermoelectric element 620 may be an element that is heated or cooled using electric energy. The heat dissipation plate 610 may be disposed on a first side of the thermoelectric element 620 , and the heat dissipation pin 630 may be disposed on a second side of the thermoelectric element 620 .

[0063] When the first side of the thermoelectric element 620 is heated, the second side of the thermoelectric element 620 may be cooled. Conversely, when the first side of the thermoelectric element 620 is cooled, the second side of the thermoelectric element 620 may be heated. When the temperature of the camera module 30 is lower than an appropriate temperature, the first side of the thermoelectric element 620 may be heated to heat the camera module 30. When the temperature of the camera module 30 is higher than an appropriate temperature, the first side of the thermoelectric element 620 may be cooled to cool the camera module 30.

[0064] The heat dissipation pin 630 may include a plurality of pins 631. The heat dissipation pin 630 may be formed of a metal material. As a non-limiting example, the material of the heat dissipation pin 630 may be formed of gold, aluminum, or copper. The heat dissipation pin 630 may transfer heat generated from the thermoelectric element 620 to the outside.

[0065] When the camera module needs to be cooled by the thermoelectric element 620, the first side of the thermoelectric element 620 may be cooled, and the second side of the thermoelectric element 620 may be heated. In this example, the heat generated from the second side of the thermoelectric element 620 may be dissipated outward through the heat dissipation pin 630. Therefore, the temperature difference between the first side and the second side of the thermoelectric element 620 may be appropriately maintained.

[0066] When the camera module needs to be heated by the thermoelectric element 620, the first side of the thermoelectric element 620 may be heated and the second side of the thermoelectric element 620 may be cooled. In this example, the heat in the air may be transferred to the second side of the thermoelectric element 620 through the heat dissipation pin 630. Therefore, the temperature difference between the first side of the thermoelectric element 620 and the second side of the thermoelectric element 620 may be appropriately maintained.

[0067] In an example, the substrate 40 may be a printed circuit board. The image sensor 50 may be disposed on a first side of the substrate 40. As described above, the heat transfer member 60 may be disposed on a second side of the substrate 40.

[0068] In an example, the heat transfer portion 400 may be disposed in the substrate 40. In an example, the heat transfer portion 400 may have an annular shape. However, this is merely an example, and the heat transfer portion 400 may be implemented in various other shapes. When viewed from an upper portion above the substrate 40, the heat transfer portion 400 may be disposed around the image sensor 50. The heat transfer portion 400 may include a plurality of holes 410 penetrating the substrate 40. In an example, the plurality of holes 410 may be arranged in an annular shape. In a plan view, the plurality of holes 410 may be arranged in an annular shape around the image sensor 50. The plurality of holes 410 may be arranged to be spaced apart from each other.

[0069] refer to Figure 6, the plurality of holes 410 may be filled with a heat transfer material 420. In an example, the heat transfer material 420 may be a metal material. In an example, as a non-limiting example, the metal material filled in the plurality of holes 410 may be gold, aluminum, or copper.

[0070] The heat transfer portion 400 may be in contact with the inner shell 20 on a first side of the substrate 40. At least a portion of the lower surface of the inner shell 20 may be in contact with at least a portion of the heat transfer portion 400. An adhesive may be applied between the heat transfer portion 400 and the lower surface of the inner shell 20. The inner shell 20 and the substrate 40 may be firmly coupled to each other using an adhesive. When the inner shell 20 is formed of a metal material, the heat transfer portion 400 and the lower surface of the inner shell 20 may be joined by solder.

[0071] On the second side of the substrate 40 , the heat transfer portion 400 may be in contact with the heat dissipation plate 610 of the heat transfer member 60 .

[0072] The heat transfer portion 400 may be heated or cooled by the thermoelectric element 620 of the heat transfer member 60. The inner space of the inner shell 20 may be heated or cooled by the heat transfer portion 400 through convection and radiation. In addition, since the lower surface of the inner shell 20 and the heat transfer portion 400 may be disposed in contact with each other, the inner shell 20 may be heated or cooled through conduction.

[0073] When the inner housing 20 is heated or cooled, the lens module 30 disposed in the inner housing 20 may also be heated or cooled.

[0074] In the following, reference will be made to Figures 7 to 10 Another embodiment of a camera module according to the present disclosure is described. Description of the same contents as those of the previously described embodiment will be omitted, and differences therein will be mainly described.

[0075] Figure 7 is an exemplary camera module according to one or more embodiments. Figure 1 A cross-sectional view taken along line II'. Figure 8 is an enlarged cross-sectional view of a portion of an exemplary camera module according to one or more embodiments. Fig. 9 is an exemplary camera module according to one or more embodiments. Figure 1 A cross-sectional view taken along line II'. Fig.10 is an enlarged cross-sectional view of a portion of an exemplary camera module according to one or more embodiments.

[0076] refer to Figures 7 to 10According to one or more embodiments, a lens module 30 including a lens barrel may be disposed inside the inner housing 20. In addition, a first lens 31 may be disposed in front of the lens module 30. The lens barrel of the lens module 30 and the first lens 31 may be coupled to the inner housing 20. Alternatively, the lens barrel of the lens module 30 and the first lens 31 may be inserted and disposed in a hole formed in the inner housing 20.

[0077] In an example, the first lens 31 may be a cover lens. The first lens 31 may refer to a lens disposed in the frontmost portion of the camera module that is closer to the object. Therefore, the surface of the first lens 31 facing the object side may be exposed to the atmosphere. As an example only, the material of the first lens 31 may be glass or plastic. Figure 2 Unlike the embodiment shown in which the side surface of the first lens 31 is spaced apart from the inner surface of the inner shell 20 and the first lens 31 is coupled to the inner shell 20 by a coupling member 35, the side surface of the first lens 31 may be disposed to be in direct contact with the inner surface of the inner shell 20. In order to couple the first lens 31 and the inner shell 20, an adhesive may be applied between the side surface of the first lens 31 and the inner surface of the inner shell 20. In an alternative manner, the first lens 31 and the inner shell 20 may be coupled by screws, or the first lens 31 and the inner shell 20 may be forcibly coupled by insertion. The coupling structure of the first lens 31 and the inner shell 20 may include various examples different from the above-described examples, but it is desirable that at least a portion of the first lens 31 and at least a portion of the inner shell 20 are coupled in direct contact with each other.

[0078] The substrate 40 may be disposed on the lower side of the inner case 20. The lower surface of the inner case 20 may be disposed to contact the upper surface of the substrate 40. Specifically, the lower surface of the inner case 20 may be disposed to contact the heat transfer portion 400 of the substrate 40. Therefore, when the heat transfer portion 400 is heated or cooled by the thermoelectric element 620, the inner case 20 may be heated or cooled.

[0079] When the inner housing 20 is heated or cooled by the heat transfer portion 400, the first lens 31 may be heated or cooled by the inner housing 20. Since the surface of the first lens 31 facing the object side is exposed to the outside, condensation may occur on the surface of the first lens 31 facing the image side according to a change in the external temperature. When condensation occurs on the surface of the first lens 31 facing the image side, the first lens 31 may be heated or cooled by heating or cooling the inner housing 20 to remove the condensation.

[0080] The exemplary camera module according to one or more embodiments may have an advantage of maintaining the temperature and humidity in the camera module at appropriate levels based on the operation of the heat transfer member 60 .

[0081] According to one or more examples, a camera module may be provided that may appropriately maintain temperature and humidity in the camera module to ensure image quality.

[0082] Although the present disclosure includes specific examples, it will be apparent after understanding the disclosure of the present application that various changes in form and detail may be made in these examples without departing from the spirit and scope of the claims and their equivalents. The examples described in this application are considered to be descriptive only, not for limiting purposes. The description of the features or aspects in each example is considered to be applicable to similar features or aspects in other examples. If the described techniques are performed in a different order, and / or if the components in the described system, architecture, device, or circuit are combined in different ways and / or replaced or supplemented by other components or their equivalents, suitable results may be obtained.

[0083] Therefore, in addition to the above contents and all the accompanying drawings disclosed, the scope of the present disclosure also includes the claims and their equivalents, that is, all changes within the scope of the claims and their equivalents should be construed as being included in the present disclosure.

Claims

1. A camera module, characterized in that: The camera module comprises: a substrate on which the image sensor is disposed; an inner shell, disposed on the first surface of the substrate; and a heat transfer member including a thermoelectric element and disposed on the second surface of the substrate, Wherein, the lens module is arranged in the inner shell, wherein the substrate comprises a heat transfer portion, wherein the heat transfer portion comprises a plurality of holes penetrating the substrate, and Wherein, the heat transfer material is arranged in the plurality of holes.

2. The camera module according to claim 1, characterized in that: The heat transfer portion is formed around the image sensor.

3. The camera module according to claim 2, characterized in that: The heat transfer portion is disposed along a lower surface of the inner shell.

4. The camera module according to claim 1, characterized in that: The heat transfer material is a metal material.

5. The camera module according to claim 4, characterized in that: The metal material is gold, aluminum or copper.

6. The camera module according to claim 1, characterized in that: The heat transfer portion overlaps with a lower surface of the inner housing in a direction parallel to the optical axis.

7. The camera module according to claim 1, characterized in that: A lower surface of the inner case is disposed to contact the heat transfer portion.

8. The camera module according to claim 7, characterized in that: The camera module further includes a first lens disposed in front of the lens module. Wherein, the outer peripheral surface of the first lens is arranged to contact the inner peripheral surface of the inner shell.

9. The camera module according to claim 7, characterized in that: An outer surface of the lens module is disposed to contact an inner surface of the inner housing.

10. The camera module according to claim 7, characterized in that: An adhesive is applied between the lower surface of the inner case and the heat transfer portion.

11. The camera module according to claim 1, wherein: The heat transfer member further includes a heat dissipation plate having a first surface on which the thermoelectric element is disposed, and Wherein, the second surface of the heat dissipation plate is configured to contact the substrate.

12. The camera module according to claim 11, characterized in that: The heat transfer member further includes heat dissipation pins disposed on the first surface of the heat dissipation plate.

13. The camera module according to claim 11, characterized in that: The heat sink is formed of a metal material.

14. The camera module according to claim 11, characterized in that: The heat sink is formed of gold, aluminum or copper.

15. The camera module according to claim 1, wherein: The camera module further includes: a housing, wherein the inner housing is disposed in the housing; a temperature sensor disposed in the housing; and The humidity sensor is arranged in the housing.

16. A camera module, characterized in that The camera module comprises: substrate; an inner shell, disposed on the first surface of the substrate; and a heat transfer member including a thermoelectric element and disposed on the second surface of the substrate, wherein the substrate comprises a heat transfer portion, wherein the heat transfer portion comprises a plurality of holes penetrating the substrate, and Wherein a heat transfer material is disposed in the plurality of holes to thermally connect the inner shell to the heat transfer member.

17. The camera module according to claim 16, characterized in that: The camera module further includes: a lens barrel disposed in the inner housing; and The image sensor is arranged on the substrate.

18. The camera module according to claim 17, wherein: The lens barrel is coupled to the inner housing.

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