High-density radiating fin device

Abstract

The utility model provides a high-density heat radiation fin device, which comprises a plurality of heat radiation fins, each heat radiation fin is provided with two end edges, at least one end edge of each heat radiation fin is provided with a protruding folding sheet, each folding sheet is provided with a connecting end connected with the heat radiation fin and an open end, and the other end of each folding sheet is separated from the heat radiation fin. The width of the connecting end is larger than that of the open end, the open end protrudes out towards one side of the heat dissipation fin, so that the folded piece is in a side deflection state relative to the heat dissipation fin, and the open end enables the heat dissipation fin to oppositely form a notch. The open end is obliquely inserted into the notch adjacent to the other radiating fin and is firmly combined with the notch; therefore, the radiating fin device can greatly improve the distribution density of the radiating fins under the same volume / space, so that the radiating fin device can be matched with water cooling and immersed cooling / radiating technologies, has excellent radiating efficiency, and is actively and widely applied to the AI industry.

Description

Technical Field

[0001] The utility model relates to a heat dissipation fin structure, in particular to a high-density heat dissipation fin device which can greatly improve the heat dissipation efficiency by utilizing water cooling and immersion liquid cooling technology. Background Art

[0002] The electronic components in today's electronic products are becoming increasingly powerful, which means that more heat will be generated when the electronic components are in operation. If this heat cannot be removed in time, it will lead to problems with the stability of the electronic product performance and shortened lifespan. In order to maintain the operating temperature of the electronic components within an appropriate range, effective heat dissipation technology is critical. Therefore, using heat dissipation devices to effectively dissipate heat from electronic components has become a common concern in the industry.

[0003] Existing heat dissipation technologies such as Figure 1 As shown, it mainly uses a heat sink fin group 90 to cool / dissipate heat. The heat sink fin group 90 includes a plurality of heat sink fins 91. One end (upper end) of the heat sink fin 91 is provided with at least one buckle plate 92. The side of the buckle plate 92 is provided with a protruding surrounding portion 93. A buckle groove 94 is formed between the buckle plate 92 and the protruding surrounding portion 93. The same end (upper end) of the heat sink fin 91 is provided with an upper abutment portion 95 protruding from the same side as the protruding surrounding portion 93, and the other end (lower end) of the heat sink fin 91 is provided with a lower abutment portion 96 protruding from the same side as the upper abutment portion 95. In such a structure, when the several heat sink fins 91 are combined, the buckle plate 92 of one heat sink fin 91 is inserted into the corresponding buckle groove 94 of another adjacent heat sink fin 91 to form a connection between the adjacent heat sink fins 91, and the upper abutment portion 95 and the lower abutment portion 96 of the heat sink fin 91 abut against the adjacent heat sink fin 91 on the other side to form a gap 97 between the two heat sink fins 91. In order to consider the stability of the airflow operation of the heat sink fin group 90, the width of the gap 97 is usually about 1 to 1.5 times the thickness of the heat sink fin 91.

[0004] Although the conventional heat sink fin assembly 90 can meet the requirements of heat dissipation operation, due to the gradual development of the artificial intelligence (AI) industry in recent years, the heat dissipation efficiency requirements of the AI ​​industry have been further improved, and water cooling and immersion cooling / heat dissipation (Immersion Liquid Cooling) technology is usually used. However, due to the insufficient density of the heat sink fin assembly 90 (i.e., the number of heat sink fins 91 of the same volume), it is not sufficient to operate with water cooling and immersion cooling technology for higher heat dissipation operation.

[0005] Furthermore, the existing heat sink fins used in water cooling and immersion cooling / heat dissipation (Immersion Liquid Cooling) technology are formed by planing and bending a metal block. However, this type of heat sink fins cannot form a better water channel configuration and routing, and also lacks flexibility in application. Therefore, how to provide a heat sink fin group with a higher density design to more effectively dissipate heat in conjunction with water cooling and immersion cooling technology is an urgent problem that the industry needs to solve.

[0006] Therefore, in view of the fact that the conventional heat sink fin assembly is not ideal in structure design and use, the inventor of the present invention has started to research and develop solutions, hoping to develop a high-density heat sink fin device with higher density, better heat dissipation efficiency and structural stability to promote the development of this industry. After a long period of thinking, the present invention was created. Utility Model Content

[0007] The purpose of the utility model is to provide a high-density heat sink fin device, which can greatly increase the density of heat sink fins in the same volume / space, so that the heat sink fin device can cooperate with water cooling and immersion cooling / heat dissipation technology to have excellent heat dissipation efficiency, and can be widely used in AI industry.

[0008] Another object of the present invention is to provide a high-density heat sink fin device, which can make the connection of the heat sink fin device quite stable, thereby improving the overall structural stability.

[0009] In order to achieve the above-mentioned purpose, the technical means adopted by the utility model are as follows:

[0010] A high-density heat dissipation fin device, characterized in that it includes a plurality of heat dissipation fins, the heat dissipation fins having two end edges, the heat dissipation fins being provided with a protruding folding piece at least adjacent to one of the end edges, one end of the folding piece being a connecting end connected to the heat dissipation fin, and the other end being an open end separated from the heat dissipation fin, the width of the connecting end being greater than the width of the open end, the open end protruding toward one side of the heat dissipation fin so that the folding piece is laterally tilted relative to the heat dissipation fin, the open end forming a notch relative to the heat dissipation fin, and the open end being able to be obliquely inserted into the notch of another adjacent heat dissipation fin so as to be firmly combined with each other.

[0011] The high-density heat dissipation fin device, wherein: there is a gap between two adjacent heat dissipation fins, and the width of the gap is 1 times or less than 1 times the thickness of the heat dissipation fin.

[0012] The high-density heat dissipation fin device, wherein: the heat dissipation fin is provided with a pressing end portion opposite to the end edge adjacent to the notch, and a groove is respectively provided on both sides of the pressing end portion.

[0013] The high-density heat dissipation fin device, wherein: the groove is an arc-shaped groove.

[0014] The high-density heat dissipation fin device, wherein: the pressing end portion can be pressed by a fixture to deform and displace downward, and the notch can also deform and displace downward to resist the open end of the folded piece.

[0015] The high-density heat dissipation fin device, wherein: the two end edges of the heat dissipation fin are both provided with the folding piece, and the folding piece is formed by punching the heat dissipation fin.

[0016] The high-density heat dissipation fin device is immersed in a cooling liquid to perform heat dissipation operation.

[0017] The high-density heat dissipation fin device is arranged on a heat dissipation seat.

[0018] The high-density heat dissipation fin device, wherein: the open end is in a flat end configuration, an arc-shaped configuration or a triangular arc-end configuration.

[0019] The high-density heat dissipation fin device, wherein: the pressing end portion forms a deformed bent end portion toward one side, and the deformed bent end portion can increase the welding contact area.

[0020] The high-density heat sink fin device of the utility model can greatly increase the density of the heat sink fin arrangement in the same volume / space through the above-mentioned structural design, so that the heat sink fin device can cooperate with water cooling and immersion cooling / heat dissipation technology to have excellent heat dissipation efficiency, and can be widely used in the AI ​​industry; at the same time, the utility model can make the connection of the heat sink fin device quite stable, thereby improving its overall structural stability.

[0021] In order to enable a further understanding and recognition of the technical, method features and effects achieved by the present utility model, preferred embodiment diagrams and detailed descriptions are provided as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 FIG. 4 is a three-dimensional schematic diagram of a conventional heat dissipation fin assembly.

[0023] Figure 2 It is a three-dimensional schematic diagram of the first embodiment of the utility model.

[0024] Figure 3 It is a partial schematic diagram of the first embodiment of the utility model.

[0025] Figure 4 It is a combined cross-sectional schematic diagram of the first embodiment of the utility model.

[0026] Figure 5 This is a schematic diagram of the application decomposition of the first embodiment of the utility model.

[0027] Figure 6 It is a three-dimensional schematic diagram of the application of the first embodiment of the utility model.

[0028] Figure 7a It is a schematic diagram of an embodiment of the folding piece of the utility model.

[0029] Figure 7b It is a schematic diagram of a second embodiment of the folding piece of the utility model.

[0030] Figure 8 It is a three-dimensional schematic diagram of the second embodiment of the utility model.

[0031] Fig. 9 This is a schematic diagram of the application of the second embodiment of the utility model.

[0032] Fig.10 It is a schematic structural diagram of the third embodiment of the utility model.

[0033] Explanation of the reference numerals in the accompanying drawings: heat sink fin device 1; heat sink fin 10; end edge 11; folded piece 12; end edge 13; notch 14; notch 14A; connecting end 16; open end 18; pressing end 20; pressing end 20A; deformed bent end 20B; groove 22; groove 22A; gap 24; folded piece 26; open end 27; notch 28; folded piece 30; open end 31; notch 32; heat sink 100. DETAILED DESCRIPTION

[0034] See also Figure 2 , Figure 3 and Figure 4 , is the first embodiment of the high-density heat dissipation fin device of the utility model. These drawings are schematic diagrams for convenient explanation. They only illustrate the basic structure of the utility model in a schematic way, and the structure shown is not limited to the same shape and size ratio in actual implementation. The shape and size ratio in actual implementation is a selective design.

[0035] As shown in the figure, the heat sink fin device 1 provided by the present invention includes a plurality of heat sink fins 10, and the heat sink fins 10 have upper and lower corresponding end edges 11 and 13 (see Figure 8), the heat sink 10 is provided with a protruding folding piece 12 adjacent to the end edge 11, for example: the heat sink 10 is formed by punching the folding piece 12, the folding piece 12 has a connecting end 16 and an open end 18 opposite to the other end, the connecting end 16 is connected to the heat sink 10, the open end 18 is separated / detached from the heat sink 10 and protrudes to one side, so that the folding piece 12 is in a state of being laterally tilted relative to the heat sink 10, and the open end 18 forms a notch 14 relative to the heat sink 10, that is, the notch 14 is formed when the open end 18 of the folding piece 12 is separated / detached from the heat sink 10. For example Figure 3 As shown, the open end 18 of the flap 12 has a width W1, and the connecting end 16 has a width W2, and W2 is greater than W1.

[0036] Furthermore, the heat dissipation fin 10 is provided with a pressing end portion 20 at the end edge 11 opposite to the notch 14 , and two sides of the pressing end portion 20 are respectively provided with a groove 22 , and the groove 22 can be an arc groove.

[0037] When the heat dissipation fin device 1 of the first embodiment of the present invention is assembled, the folded piece 12 (open end 18) of one heat dissipation fin 10 is obliquely inserted into the corresponding notch 14 of another heat dissipation fin 10, and the folded piece 12 (open end 18) protrudes from the notch 14, and then a jig (such as Figure 2 , Figure 4 The pressing end portion 20 is pressed by the arrow shown in the figure to deform and displace downward to form the pressing end portion 20A. Meanwhile, the groove 22 is also partially deformed and displaced downward to form the groove 22A, and the notch 14 is also deformed and displaced downward to form the notch 14A. The notch 14A after deformation and displacement just resists connecting the folding piece 12, so that the two adjacent heat sink fins 10 are firmly combined. In this way, the adjacent heat sink fins 10 are pressed and resisted one by one to form the overall combination of the heat sink fin device 1.

[0038] During the assembly operation of the heat sink fin device 1 , after the second heat sink fin 10 is punched out, they are connected one by one by applying pressure with a jig. Alternatively, several heat sink fins 10 may be punched out and then connected as a whole by applying pressure with a jig. There is no limitation to this.

[0039] After the heat sink fin device 1 is assembled, there is a gap 24 between two adjacent heat sink fins 10. Since the heat sink fin device 1 is combined with water cooling and immersion cooling / heat dissipation (Immersion Liquid Cooling) technology, that is, the heat sink fin device 1 is immersed in a coolant to perform heat dissipation operation, the width X of the gap 24 can be 1 times or less than 1 times the thickness Y of the heat sink fin 10 (see Figure 4 ), so that the number or arrangement density of the heat dissipation fins 10 can be increased, thereby greatly improving the heat dissipation efficiency.

[0040] Please also read Figure 5 , Figure 6 When the first embodiment of the high-density heat sink fin device of the utility model is used, the assembled heat sink fin 10 (heat sink fin device 1) is turned over and positioned (for example, welded) on a heat sink 100, and the heat sink 100 is used to contact the heat source / heat generating component (not shown) of the electronic device for water cooling and immersion heat dissipation operations.

[0041] Please also read Figure 7a , is the first embodiment of the folding piece structure of the high-density heat dissipation fin device of the utility model, which is based on the structural design of the folding piece 12 mentioned above and is appropriately changed so that the open end 27 of the folding piece 26 is in an arc shape, and the opening end 27 relative to the notch 28 is also in an arc shape.

[0042] Like Figure 7b , is a second embodiment of the high-density heat dissipation fin device of the present invention, which is based on the structural design of the folding piece 12 described above and is appropriately changed, so that the open end 31 of the folding piece 30 is in a triangular arc end configuration, and the corresponding notch 32 is also in a triangular arc end configuration. That is, the open end of the present invention can be in a flat end configuration (such as Figure 2 , Figure 3 As shown), arc-shaped configuration (as Figure 7a as shown) or triangular arc end configuration (as shown Figure 7b In other words, the flap 30 may have different geometric configurations, but is not limited thereto.

[0043] Please also read Figure 8 , Fig. 9 , is the second embodiment of the high-density heat dissipation fin device of the utility model, which is designed based on the structure of the first embodiment. The difference lies in that: the heat dissipation fin 10 is simultaneously provided with the protruding folding pieces 12 and the notch 14, the pressing end portion 20 and the grooves 22 on both sides near the end edges 11 and 13, and the folding piece 12 also has the structure of the connecting end 16 and the open end 18.

[0044] In other words, the high-density heat sink fin device of the present invention can be provided with the protruding folding pieces 12 and the notch 14, the pressing end portion 20 and the groove 22 near at least one end edge 11 or 13; or the protruding folding pieces 12 and the notch 14, the pressing end portion 20 and the groove 22 can be provided near the end edges 11 and 13 at the same time, without limitation.

[0045] Please also read Fig.10, is the third embodiment of the high-density heat dissipation fin device of the utility model, which is designed based on the structure of the first embodiment. The difference is that: an appropriate jig and a pressure force (such as pressing, stamping, etc.) are used to act on the pressing end portion 20, so that it is partially deformed and displaced downward to form the pressing end portion 20A. While the pressing end portion 20A is partially deformed downward, it is also allowed to form a deformed curved end portion 20B to one side. The formation of the deformed curved end portion 20B can ensure that the folding piece 12 is resisted and positioned, and increase the welding contact area, so that the upper part of the deformed curved end portion 20B (according to Fig.10 The area of ​​the heat sink 100 is larger than that of the end edge 11, so that when the end edge 11 is disposed on the heat sink 100, the heat sink fin device 1 as a whole can be more firmly welded and fixed on the heat sink 100. In the same principle, when the end edge 13 of the heat sink fin device 1 (heat sink fin 10) is used to be disposed on the heat sink 100, it can also have the same structure and achieve the same effect as the third embodiment.

[0046] The high-density heat sink fin device of the utility model can greatly increase the density of the heat sink fin arrangement in the same volume / space through the above-mentioned structural design, so that the heat sink fin device can cooperate with water cooling and immersion cooling / heat dissipation technology to have excellent heat dissipation efficiency, and can be widely used in the AI ​​industry; at the same time, the utility model can make the connection of the heat sink fin device quite stable, thereby improving its overall structural stability.

[0047] In summary, the utility model is indeed a very excellent utility model creation, which meets the requirements of utility model patent application; and the content of the above description is only a preferred embodiment of the utility model. For example, all changes extended from the technical means and methods of the utility model should fall within the patent scope of the utility model application.

Claims

1. A high-density heat sink fin device, characterized in that: The invention comprises a plurality of heat dissipation fins, each of which has two end edges. The heat dissipation fin is provided with a protruding folding piece at least adjacent to one of the end edges. One end of the folding piece is a connecting end connected to the heat dissipation fin, and the other end is an open end separated from the heat dissipation fin. The width of the connecting end is greater than the width of the open end. The open end protrudes toward one side of the heat dissipation fin so that the folding piece is laterally inclined relative to the heat dissipation fin. The open end forms a notch relatively to the heat dissipation fin, and the open end can be obliquely inserted into the notch of another adjacent heat dissipation fin to be firmly combined with each other.

2. The high-density heat sink fin device according to claim 1, wherein: There is a gap between two adjacent heat dissipation fins, and the width of the gap is 1 times or less than 1 times the thickness of the heat dissipation fins.

3. The high-density heat sink fin device according to claim 1, wherein: The heat dissipation fin is provided with a pressing end portion opposite to the end edge adjacent to the notch, and two sides of the pressing end portion are respectively provided with a groove.

4. The high-density heat sink fin device according to claim 3, characterized in that: The groove is an arc-shaped groove.

5. The high-density heat sink fin device according to claim 4, characterized in that: The pressing end portion can be pressed by a jig to deform and displace downward, and the notch can be deformed and displaced downward to resist the open end of the folding piece.

6. The high-density heat sink fin device according to claim 5, characterized in that: The two end edges of the heat dissipation fin are both provided with the folding piece, and the folding piece is formed by punching the heat dissipation fin.

7. The high-density heat sink fin device according to claim 1, wherein: The high-density heat dissipation fin device is immersed in a cooling liquid to perform heat dissipation operation.

8. The high-density heat sink fin device according to claim 1, wherein: The high-density heat dissipation fin device is arranged on a heat dissipation seat.

9. The high-density heat sink fin device according to claim 1, wherein: The open end is in a flat end configuration, an arc-shaped configuration or a triangular arc-shaped end configuration.

10. The high-density heat sink fin device according to claim 5, characterized in that: The pressing end portion forms a deformed bent end portion toward one side, and the deformed bent end portion can increase the welding contact area.

Images