Heat dissipation device of high-power power supply

Abstract

The utility model provides a heat dissipation device of a high-power power supply, and relates to the technical field of cooling equipment. The heat dissipation device of the high-power power supply is used for heat dissipation of the high-power power supply, and the high-power power supply comprises at least one circuit board and electronic elements arranged on each circuit board. The heat dissipation device comprises a first heat dissipation assembly and a second heat dissipation assembly. The first heat dissipation assembly is arranged below the circuit board, the first heat dissipation assembly comprises a first cooling plate and a first flow channel which is arranged in the first cooling plate and used for circulating a cooling medium, and heat dissipation is carried out on the circuit board through the cooling medium. The first flow channel is arranged along the position of each circuit board. The second heat dissipation assembly is arranged above the circuit boards, and the position of the second heat dissipation assembly is matched with the position of each circuit board. The first heat dissipation assembly and the second heat dissipation assembly can cool the circuit board and electronic components on the circuit board in a targeted mode, and the heat dissipation efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of cooling equipment, in particular to a heat dissipation device for a high-power power supply. Background Art

[0002] RF generator is a power source used to generate RF power. Its output is generally a sine wave or pulse, with frequencies of 13.56MHz, 27.12MHz, etc., output power ranging from tens of watts to tens of kilowatts, and output impedance is generally 50 ohms. It can be used in a variety of fields such as plasma generation, induction heating, medical treatment, reactive ion etching, chemical vapor deposition, etc.

[0003] In recent years, the power of RF power supplies has become increasingly larger to meet the needs of production applications. Higher power will generate more heat. The increase in temperature will not only affect the efficiency of the entire machine, but also cause damage to power devices. In the prior art, the cooling device for cooling the power supply is in direct contact with the power supply, and does not centrally cool the main heating components of the power supply, resulting in poor cooling effect. Utility Model Content

[0004] An object of the first aspect of the present invention is to provide a heat dissipation device to solve the problem of poor cooling effect of cooling devices in the prior art.

[0005] In particular, the utility model provides a heat dissipation device for a high-power power supply, which is used to dissipate heat for the high-power power supply, wherein the high-power power supply comprises at least one circuit board and electronic components arranged on each of the circuit boards, and the heat dissipation device comprises:

[0006] a first heat dissipation assembly, arranged below the circuit board, comprising a first cooling plate and a first flow channel arranged in the first cooling plate for circulating a cooling medium, and dissipating heat for the circuit board through the cooling medium; the first flow channel is arranged along the position of each circuit board; and

[0007] The second heat dissipation component is arranged above the circuit board, and the position of the second heat dissipation component matches the position of each of the circuit boards.

[0008] Optionally, the second heat dissipation assembly includes at least one second cooling plate and a second flow channel arranged in each of the second cooling plates for circulating a cooling medium.

[0009] Optionally, the number of the second cooling plates is the same as the number of the circuit boards, and the second flow channel in each of the second cooling plates is arranged along the position of the electronic component of the corresponding circuit board.

[0010] Optionally, a first heat conducting member is further included, wherein the first heat conducting member is disposed between the first heat dissipating assembly and the circuit board and is in contact with the first heat dissipating assembly and the circuit board.

[0011] Optionally, a second heat conducting member is further included, and the second heat conducting member is disposed between the second heat dissipating assembly and the circuit board, and is in contact with the second heat dissipating assembly and the circuit board.

[0012] Optionally, the second heat dissipation assembly includes at least one vortex tube, and a cold end of each of the vortex tubes faces the electronic component of one of the circuit boards.

[0013] Optionally, the number of the vortex tubes is the same as the number of the circuit boards.

[0014] Optionally, a shell is further included, and a first opening for the cooling medium to enter and exit is provided on the shell, and a pipeline passes through the first opening to communicate with the flow channels of the first heat dissipation component and the second heat dissipation component.

[0015] Optionally, a second opening is further provided at the shell, and a fan is provided in the shell near the second opening to enable air circulation convection in the shell.

[0016] Optionally, a dustproof net is further provided at the second opening to prevent dust from entering the shell.

[0017] The heat dissipation device in this solution may include a first heat dissipation component and a second heat dissipation component, wherein the first heat dissipation component may include a first cooling plate and a first flow channel disposed in the first cooling plate for circulating a cooling medium, and the first flow channel is designed to match the circuit board, so that the circuit board and the electronic components thereon can be cooled in a targeted manner. The second heat dissipation component of this solution is also matched with the circuit board, and the circuit board is then cooled by the first heat dissipation component and the second heat dissipation component, thereby improving the heat dissipation efficiency.

[0018] The second heat dissipation component of the present scheme may include at least one second cooling plate and a second flow channel for circulating a cooling medium arranged in each second cooling plate, and the second flow channel in the second cooling plate is arranged along the position of the electronic component, so that the electronic component with higher heat generation can be cooled and the cooling efficiency can be improved to avoid damage to the electronic component due to excessive heat generation.

[0019] In this solution, a thermally conductive silicone layer is provided between the first heat dissipation component and the circuit board, and between the second heat dissipation component and the circuit board, so as to fill the air gap between the circuit board and the heat dissipation component, thereby improving the cooling efficiency.

[0020] Based on the detailed description of the specific embodiments of the present invention in combination with the accompanying drawings below, those skilled in the art will become more aware of the above and other purposes, advantages and features of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Hereinafter, some specific embodiments of the present invention will be described in detail in an exemplary and non-limiting manner with reference to the accompanying drawings. The same reference numerals in the accompanying drawings indicate the same or similar components or parts. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale. In the accompanying drawings:

[0022] Figure 1 is a schematic structural diagram of a heat dissipation device according to a specific embodiment of the utility model;

[0023] Figure 2 It is a schematic structural diagram of the connection between a first heat dissipation component, a second heat dissipation component and a circuit board according to a specific embodiment of the utility model;

[0024] Figure 3 It is a partial schematic structural diagram of the connection between the first heat dissipation component, the second heat dissipation component and the circuit board according to a specific embodiment of the utility model;

[0025] Figure 4 is a partial schematic structural diagram of a first heat dissipation component according to a specific embodiment of the utility model;

[0026] Figure 5 is a partial schematic exploded view of a first heat dissipation component, a first heat conducting member, a second heat dissipation component, a second heat conducting member and a circuit board according to another specific embodiment of the utility model;

[0027] Figure 6 is a schematic structural diagram of a first heat conducting member or a second heat conducting member according to another specific embodiment of the utility model;

[0028] Figure 7 It is a schematic structural diagram of one side of a shell according to another specific embodiment of the utility model.

[0029] Description of reference numerals:

[0030] Heat dissipation device-100; first heat dissipation component-110; first cooling plate-111; first flow channel-112; second heat dissipation component-120; second cooling plate-121; second flow channel-122; first heat-conducting member-130; first thermally conductive silicone layer-131; first steel mesh-132; second heat-conducting member-140; second thermally conductive silicone layer-141; second steel mesh-142; housing-150; first opening-151; second opening-152; fan-153; dustproof net-154; handle-155; circuit board-210; electronic component-220. DETAILED DESCRIPTION

[0031] In the description of this embodiment, it should be understood that the terms "length", "width", "height", "up", "down", "left", "right", "vertical", "horizontal", "bottom", "inside" and "outside" etc. indicating orientation or positional relationships are based on the orientation or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0032] As a specific embodiment of the present invention, Figure 1-Figure 4 As shown, this embodiment provides a heat dissipation device 100 for a high-power power supply, which is used to dissipate heat for the high-power power supply. The high-power power supply includes at least one circuit board 210 and an electronic component 220 arranged on each circuit board 210. Specifically, the heat dissipation device 100 of this embodiment may include a first heat dissipation component 110 and a second heat dissipation component 120. The first heat dissipation component 110 is arranged below the circuit board 210, and the first heat dissipation component 110 may include a first cooling plate 111 and a first flow channel 112 arranged in the first cooling plate 111 for circulating a cooling medium, and dissipating heat for the circuit board 210 through the cooling medium. The first flow channel 112 is arranged along the position of each circuit board 210. The second heat dissipation component 120 is arranged above the circuit board 210, and the position of the second heat dissipation component 120 matches the position of each circuit board 210.

[0033] The heat dissipation device 100 in this embodiment may include a first heat dissipation component 110 and a second heat dissipation component 120, wherein the first heat dissipation component 110 includes a first cooling plate 111 and a first flow channel 112 disposed in the first cooling plate 111 for circulating a cooling medium, and the first flow channel 112 is designed to match the circuit board 210, so that the circuit board 210 and the electronic components 220 thereon can be cooled in a targeted manner. The second heat dissipation component 120 in this embodiment is also matched with the circuit board 210, and the circuit board 210 is cooled through the first heat dissipation component 110 and the second heat dissipation component 120, thereby improving the heat dissipation efficiency.

[0034] Specifically, the number of circuit boards 210 in this embodiment can be two, and the two circuit boards 210 are arranged side by side. Multiple electronic components 220 are arranged on each circuit board 210, and the first flow channel 112 in the first cooling plate 111 is mainly concentrated at the two circuit boards 210, so as to dissipate heat specifically for the electronic components 220 at this position.

[0035] Specifically, the first cooling plate 111 in this embodiment can be composed of two upper and lower plates with grooves respectively buckled together to form the first flow channel 112. The first cooling plate 111 in this embodiment can be connected to the circuit board 210 by metal screws.

[0036] As a specific embodiment of the present invention, the second heat dissipation assembly 120 of this embodiment may include at least one second cooling plate 121 and a second flow channel 122 disposed in each second cooling plate 121 for circulating a cooling medium.

[0037] The second heat dissipation assembly 120 of the present embodiment may include a second cooling plate 121 , and the circuit board 210 is cooled by flowing a cooling medium through the second cooling plate 121 .

[0038] As a specific embodiment of the present invention, the number of the second cooling plates 121 in this embodiment is the same as the number of the circuit boards 210 , and the second flow channels 122 in each second cooling plate 121 are arranged along the position of the electronic components 220 of the corresponding circuit board 210 .

[0039] Specifically, the number of second cooling plates 121 in this embodiment is the same as the number of circuit boards 210. The second cooling plates 121 are arranged at the corresponding circuit boards 210, and the second flow channels 122 in the second cooling plates 121 are arranged along the positions of the electronic components 220, so that the electronic components 220 with higher heat generation can be cooled and the cooling efficiency can be improved to prevent the electronic components 220 from being damaged due to excessive heat generation.

[0040] More specifically, the number of the second cooling plates 121 is the same as the number of the circuit boards 210, both of which are two. A second cooling plate 121 is correspondingly disposed above each circuit board 210. And the second flow channel 122 in each second cooling plate 121 matches the position of the electronic component 220 on the circuit board 210.

[0041] Specifically, in this embodiment, both the first cooling plate 111 and the second cooling plate 121 need to be made of a metal material with high thermal conductivity, such as copper or aluminum, to increase the heat dissipation capacity.

[0042] Specifically, the cooling medium flowing in the first flow channel 112 and the second flow channel 122 of this embodiment can be water, cold air, etc. Taking water as the cooling medium, it is necessary to connect a water chiller to the first cooling plate and the second cooling plate for circulating refrigeration.

[0043] As another specific embodiment of the present invention, the second heat dissipation assembly 120 of this embodiment may include at least one vortex tube (not shown in the figure), and the cold end of each vortex tube faces the electronic component 220 of one of the circuit boards 210 .

[0044] Specifically, the number of vortex tubes can be the same as the number of circuit boards 210. Each vortex tube matches one of the circuit boards 210. The cold end of the vortex tube faces the electronic component 220 on the corresponding circuit board 210, and the hot end is directly discharged through the pipeline to a place far away from the circuit board 210. In this embodiment, the electronic component 220 on the circuit board 210 is cooled by the vortex tube. The vortex tube needs to be connected to an external compressed air pipe to provide stable compressed air for generating a cold air flow.

[0045] The following is a specific description using the second heat dissipation component 120 as the second cooling plate 121 as an example.

[0046] As a specific embodiment of the present invention, Figure 5 and Figure 6 As shown, the heat dissipation device 100 of this embodiment may include a first heat conductive member 130 , which is disposed between the first heat dissipation component 110 and the circuit board 210 and contacts the first heat dissipation component 110 and the circuit board 210 .

[0047] The first heat-conducting member 130 of this embodiment includes a first heat-conducting silicone rubber layer 131. The first steel mesh 132 is mainly used to assist in applying the first heat-conducting silicone rubber 131.

[0048] In this embodiment, the first thermally conductive silicone layer 131 is provided between the first heat dissipation assembly 110 and the circuit board 210 to fill the air gap between the first cooling plate 111 and the circuit board 210, thereby improving the cooling efficiency. The thermally conductive silicone in the first thermally conductive silicone layer 131 is selected from silicone with higher thermal conductivity.

[0049] As a specific embodiment of the present invention, Figure 5 and Figure 6 As shown, the heat dissipation device 100 of this embodiment may further include a second heat conducting member 140 , which is disposed between the second heat dissipation component 120 and the circuit board 210 , and is in contact with the second heat dissipation component 120 and the circuit board 210 .

[0050] Specifically, when the second heat dissipation component 120 is a second cooling plate 121 and water cooling is performed using the cooling plate, it is necessary to set the second heat conducting member 140 between the second heat dissipation component 120 and the circuit board 210. Specifically, the second heat conducting member 140 includes a second heat conductive silicone layer 141. The second steel mesh 142 is mainly used to assist in applying the second heat conductive silicone 141.

[0051] Similarly, the second thermally conductive silicone layer 141 can fill the air gap between the second cooling plate 121 and the circuit board 210, thereby improving the cooling efficiency. The thermally conductive silicone in the second thermally conductive silicone layer 141 is selected from silicone of a type with high thermal conductivity.

[0052] As a specific embodiment of the utility model, the heat dissipation component of this embodiment may also include a shell 150, which covers the first heat dissipation component 110, the first heat conductor 130, the second heat dissipation component 120 and the second heat conductor 140. The shell 150 is provided with a first opening 151 for the entry and exit of the cooling medium, and is connected to the flow channels of the first heat dissipation component 110 and the second heat dissipation component 120 through a pipeline passing through the first opening 151.

[0053] Specifically, mounting holes or slots may be designed in the housing 150 to facilitate fixing the first heat dissipation component 110 , the first heat conductor 130 , the second heat dissipation component 120 and the second heat conductor 140 , so that these components can be stably placed in the housing 150 .

[0054] Specifically, when a vortex tube is positioned on the circuit board 210 , the number of the first openings 151 may be two, and a liquid inlet pipe and a liquid outlet pipe are respectively provided to allow the cooling medium to flow through the first cooling plate 111 .

[0055] When the second cooling plate 121 is positioned above the circuit board 210 , the number of the first openings 151 may be four, for respectively arranging the liquid inlet and outlet pipes of the first cooling plate 111 and the liquid inlet and outlet pipes of the second cooling plate 121 .

[0056] The housing 150 of this embodiment can be made of metal. The shape of the housing 150 can be designed according to actual needs. The housing 150 of this embodiment is a rectangular parallelepiped structure.

[0057] Specifically, the hot end of the vortex tube of the present embodiment passes through the housing 150 and leads to the outside of the housing 150 .

[0058] Specifically, Figure 7 As shown, the housing 150 of this embodiment is further provided with a second opening 152, and a fan 153 is provided near the second opening 152 in the housing 150 to enable air circulation convection in the housing 150. The fan 153 and the second opening 152 can further increase the heat dissipation inside the housing 150.

[0059] As a specific embodiment of the present invention, a dustproof net 154 may be further provided at the second opening 152 of the present embodiment to prevent dust from entering the housing 150 .

[0060] Specifically, a handle 155 , a power interface, and a communication interface are further provided outside the housing 150 of this embodiment.

[0061] At this point, those skilled in the art should recognize that, although multiple exemplary embodiments of the present invention have been shown and described in detail herein, many other variations or modifications that conform to the principles of the present invention can still be directly determined or derived from the contents disclosed in the present invention without departing from the spirit and scope of the present invention. Therefore, the scope of the present invention should be understood and recognized as covering all such other variations or modifications.

Claims

1. A heat dissipation device for a high-power power supply, used for dissipating heat for the high-power power supply, the high-power power supply comprising at least one circuit board and electronic components arranged on each of the circuit boards, characterized in that: The heat dissipation device comprises: a first heat dissipation assembly, arranged below the circuit board, comprising a first cooling plate and a first flow channel arranged in the first cooling plate for circulating a cooling medium, and dissipating heat for the circuit board through the cooling medium; the first flow channel is arranged along the position of each circuit board; and The second heat dissipation component is arranged above the circuit board, and the position of the second heat dissipation component matches the position of each of the circuit boards.

2. The heat dissipation device for a high-power power supply according to claim 1, characterized in that: The second heat dissipation assembly includes at least one second cooling plate and a second flow channel disposed in each of the second cooling plates for circulating a cooling medium.

3. The heat dissipation device for a high-power power supply according to claim 2, characterized in that: The number of the second cooling plates is the same as the number of the circuit boards, and the second flow channel in each of the second cooling plates is arranged along the position of the electronic component of the corresponding circuit board.

4. The heat dissipation device for a high-power power supply according to claim 1, characterized in that: The device further comprises a first heat conducting member, which is disposed between the first heat dissipating component and the circuit board and contacts the first heat dissipating component and the circuit board.

5. The heat dissipation device for a high-power power supply according to claim 2, characterized in that: It also includes a second heat conducting member, which is disposed between the second heat dissipation component and the circuit board and is in contact with the second heat dissipation component and the circuit board.

6. The heat dissipation device for a high-power power supply according to claim 1, characterized in that: The second heat dissipation component includes at least one vortex tube, and the cold end of each of the vortex tubes faces the electronic component of one of the circuit boards.

7. The heat dissipation device for a high-power power supply according to claim 6, characterized in that: The number of the vortex tubes is the same as the number of the circuit boards.

8. The heat dissipation device for a high-power power supply according to claim 1, characterized in that: It also includes a shell, which is provided with a first opening for the cooling medium to enter and exit, and is connected to the flow channels of the first heat dissipation component and the second heat dissipation component through a pipeline passing through the first opening.

9. The heat dissipation device for a high-power power supply according to claim 8, characterized in that: The shell is also provided with a second opening, and a fan is provided in the shell near the second opening to enable air circulation convection in the shell.

10. The heat dissipation device for a high-power power supply according to claim 9, characterized in that: A dustproof net is also provided at the second opening to prevent dust from entering the housing.

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