Heat dissipation module and electronic equipment

Abstract

The utility model discloses a heat dissipation module and electronic equipment, which are used for solving the technical problem of poor heat dissipation effect of the existing heat dissipation module. The heat dissipation module is used for being fixed to a first heating source and a second heating source of a circuit board and comprises a heat dissipation substrate and a first locking elastic piece. The heat dissipation substrate comprises a first branch part and a second branch part, and the first branch part and the second branch part are connected with each other; the first end of the first locking elastic piece is connected to the first branch part, and the second end of the first locking elastic piece is suspended above the second branch part; when the first locking elastic piece is locked and fixed, the first branch part abuts against the first heating source through the first locking elastic piece, and the second end of the first locking elastic piece abuts against the second branch part and forces the second branch part to abut against the second heating source.

Description

Technical Field

[0001] The utility model relates to the technical field of heat dissipation module design, in particular to a heat dissipation module and electronic equipment. Background Art

[0002] Heat sources in electronic devices, such as central processing chips, high-power components, etc., will generate heat when working. In order to ensure that the electronic equipment can operate normally, a heat dissipation module is required to dissipate the heat from the above heat sources.

[0003] The existing heat dissipation module generally includes a heat dissipation substrate and a locking spring connected to the heat dissipation substrate. The heat dissipation substrate is fixed to the circuit board connected to the heat source by the locking spring. Through the elastic force of the locking spring, the heat dissipation substrate can effectively fit with the heat source, thereby completing the heat dissipation work. As the current electronic equipment tends to be thinner and miniaturized, the electronic components inside the electronic equipment are placed more and more closely. The number of locking screws matched by the locking spring of the heat dissipation module is limited. The current high-power components are placed in front of the position corresponding to one of the screws. Since the locking spring is far away from the high-power components, this results in that after the heat dissipation substrate is locked by the locking spring, the heat dissipation substrate can only be in close contact with one of the heat sources, such as the central processing unit chip, and the other parts of the heat dissipation substrate cannot be in close contact with the high-power components, which results in the high-power components being unable to dissipate heat in time, resulting in the high-power components operating temperature being too high, which in turn causes the heat dissipation module to have a poor heat dissipation effect.

[0004] Therefore, finding a technical solution that can solve the above technical problems has become an important topic studied by technical personnel in this field. Utility Model Content

[0005] The embodiment of the utility model discloses a heat dissipation module and an electronic device, which are used to solve the technical problem that the heat dissipation effect of the existing heat dissipation module is not good.

[0006] The embodiment of the utility model provides a heat dissipation module, which is used to be fixed to a first heat source and a second heat source of a circuit board, and the heat dissipation module includes a heat dissipation substrate and a first locking spring;

[0007] The heat dissipation substrate includes a first sub-portion covering the first heat source and a second sub-portion covering the second heat source, and the first sub-portion and the second sub-portion are connected to each other;

[0008] The first end of the first locking elastic sheet is connected to the first sub-portion, and the second end of the first locking elastic sheet is suspended above the second sub-portion;

[0009] When the first locking spring is locked and fixed, the first sub-portion is pressed against the first heat source through the first locking spring, and the second end of the first locking spring is pressed against the second sub-portion and forces the second sub-portion to press against the second heat source.

[0010] Optionally, the first locking elastic piece includes a first connecting portion, a pressing portion, and a first locking portion connected to the first connecting portion;

[0011] The first connecting portion is fixed to the first sub-portion, the first locking portion is provided with a first mounting through hole, the pressing portion is connected to a side of the first locking portion away from the first connecting portion, and the pressing portion is suspended above the second sub-portion;

[0012] When the first locking spring is locked and fixed, the first sub-portion is pressed against the first heat source through the first locking spring, and the pressing portion is pressed against the second sub-portion and forces the second sub-portion to press against the second heat source.

[0013] Optionally, a side of the first locking portion away from the first connecting portion is bent to form the pressing portion, and the pressing portion and the first locking portion form a step-shaped structure.

[0014] Optionally, it further comprises a second locking spring piece, wherein the second locking spring piece is connected to the first sub-portion;

[0015] When the second locking elastic sheet is locked and fixed with the first locking elastic sheet, the first sub-portion is pressed against the first heat source through the first locking elastic sheet and the second locking elastic sheet.

[0016] Optionally, the second locking elastic piece includes a second connecting portion and second locking portions connected to opposite ends of the second connecting portion;

[0017] The second connecting portion is fixed on the first sub-portion, and the second locking portion is provided with a second mounting through hole.

[0018] Optionally, the first locking spring piece and the second locking spring piece are both integrally formed structures.

[0019] Optionally, the first section and the second section are an integrally formed structure.

[0020] Optionally, a heat pipe is also included;

[0021] The heat pipe is fixed on a surface of the heat dissipation substrate away from the circuit board.

[0022] The embodiment of the utility model provides an electronic device, comprising a circuit board, a first heat source and a second heat source electrically connected to the circuit board, and the above-mentioned heat dissipation module;

[0023] When the heat dissipation substrate of the heat dissipation module is locked and fixed on the circuit board through the first locking spring piece of the heat dissipation module, the first section of the heat dissipation module is pressed against the first heat source through the first locking spring piece, and the second end of the first locking spring piece is pressed against the second section of the heat dissipation module and forces the second section to be pressed against the second heat source.

[0024] Optionally, the first heat source is a central processing unit chip; the second heat source is a high-power consumption component.

[0025] It can be seen from the above technical solutions that the embodiments of the utility model have the following advantages:

[0026] In this embodiment, the heat dissipation module includes a heat dissipation substrate and a second locking spring; the heat dissipation substrate includes a first section covering the first heat source and a second section covering the second heat source, and the first section and the second section are connected to each other; the first end of the first locking spring is connected to the first section, and the second end of the second locking spring is suspended above the second section. In the above design, when the first locking spring is locked and fixed, the first section is pressed against the first heat source through the first locking spring, and the second end of the first locking spring is pressed against the second section and forces the second section to press against the second heat source. Through the above design, when the heat dissipation substrate is locked and fixed through the first locking spring, the heat dissipation substrate can be fully pressed against the first heat source and the second heat source, ensuring that the first heat source and the second heat source are effectively cooled, thereby ensuring the heat dissipation effect of the heat dissipation module. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0028] Figure 1 A schematic diagram of the structure of a heat dissipation module provided by an embodiment of the utility model;

[0029] Figure 2 A schematic diagram of the structure of a first locking spring in a heat dissipation module provided by an embodiment of the utility model;

[0030] Figure 3 A schematic diagram of the structure of a second locking spring in a heat dissipation module provided by an embodiment of the utility model;

[0031] Figure 4A diagram showing the position relationship between the pressing portion and the second sub-portion in a heat dissipation module provided by an embodiment of the utility model;

[0032] Figure 5 A schematic diagram of the structure of a heat dissipation substrate in a heat dissipation module provided by an embodiment of the utility model after a heat pipe is installed;

[0033] Illustration: heat dissipation substrate 1; first subsection 101; second subsection 102; first locking spring piece 2; first connecting portion 201; first locking portion 202; pressing portion 203; first mounting through hole 204; second locking spring piece 3; second connecting portion 301; second locking portion 302; second mounting through hole 303; heat pipe 4. DETAILED DESCRIPTION

[0034] The embodiment of the utility model discloses a heat dissipation module and an electronic device, which are used to solve the technical problem that the heat dissipation effect of the existing heat dissipation module is not good.

[0035] In order to enable those skilled in the art to better understand the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present invention.

[0036] See also Figures 1 to 5 , a heat dissipation module provided by an embodiment of the utility model is used to be fixed to a first heat source and a second heat source of a circuit board, and the heat dissipation module includes a heat dissipation substrate 1 and a first locking spring 2;

[0037] The heat dissipation substrate 1 includes a first sub-portion 101 covering the first heat source and a second sub-portion 102 covering the second heat source, and the first sub-portion 101 and the second sub-portion 102 are connected to each other;

[0038] The first end of the first locking elastic piece 2 is connected to the first sub-portion 101, and the second end of the first locking elastic piece 2 is suspended above the second sub-portion 102;

[0039] When the first locking spring 2 is locked and fixed, the first section 101 is pressed against the first heat source through the first locking spring 2, and the second end of the first locking spring 2 is pressed against the second section 102 and forces the second section 102 to press against the second heat source.

[0040] Through the above design, when the heat dissipation substrate 1 is locked and fixed by the first locking spring 2, the heat dissipation substrate 1 can fully press against the first heat source and the second heat source, ensuring that the first heat source and the second heat source are effectively dissipated and ensuring the heat dissipation effect of the heat dissipation module.

[0041] Furthermore, the first locking elastic piece 2 in this embodiment includes a first connecting portion 201, a pressing portion 203 and a first locking portion 202 connected to the first connecting portion 201;

[0042] The first connecting portion 201 is fixed to the first sub-portion 101, the first locking portion 202 is provided with a first mounting through hole 204, the pressing portion 203 is connected to a side of the first locking portion 202 away from the first connecting portion 201, and the pressing portion 203 is suspended above the second sub-portion 102;

[0043] When the first locking spring 2 is locked and fixed, the first sub-portion 101 is pressed against the first heat source through the first locking spring 2 , and the pressing portion 203 is pressed against the second sub-portion 102 and forces the second sub-portion 102 to press against the second heat source.

[0044] It should be noted that when the first locking spring 2 is locked, the screw of the locking screw passes through the first mounting hole on the first locking portion 202 and is threadedly connected to the threaded hole on the circuit board, and the nut of the locking screw is pressed against the first locking portion 202, thereby causing the first locking portion 202 and the pressing portion 203 to move toward the circuit board, thereby causing the pressing portion 203 to press against the second section 102 and forcing the second section 102 to press against the second heat source, thereby ensuring that the second heat source is effectively cooled.

[0045] Furthermore, the first connecting portion 201, the first locking portion 202 and the pressing portion 203 in this embodiment are an integrally formed structure. Specifically, the side of the first locking portion 202 away from the first connecting portion 201 is bent to form the pressing portion 203, and the pressing portion 203 and the first locking portion 202 form a step-like structure.

[0046] It should be noted that the first locking spring piece 2 in this embodiment is made of elastic metal. Through the above design, the structural integrity of the first locking spring piece 2 can be effectively improved, and the service life of the first locking spring piece 2 can be effectively extended.

[0047] Furthermore, it also includes a second locking spring piece 3, wherein the second locking spring piece 3 is connected to the first sub-portion 101;

[0048] When the second locking elastic piece 3 and the first locking elastic piece 2 are locked and fixed, the first sub-portion 101 is pressed against the first heat source through the first locking elastic piece 2 and the second locking elastic piece 3 .

[0049] Specifically, the second locking elastic piece 3 in this embodiment includes a second connecting portion 301 and second locking portions 302 connected to opposite ends of the second connecting portion 301;

[0050] The second connecting portion 301 is fixed on the first sub-portion 101 , and a second mounting through hole 303 is defined in the second locking portion 302 .

[0051] It should be noted that when the second locking spring piece 3 is locked, the screw of the locking screw passes through the second mounting hole on the second locking portion 302 and is threadedly connected to the threaded hole on the circuit board, and the nut of the locking screw is pressed into the second locking portion 302, thereby causing the second locking portion 302 to move toward the circuit board, thereby enabling the second locking spring piece 3 to press the first section 101 against the first heat source, ensuring that the first heat source is effectively dissipated.

[0052] Specifically, the second connecting portion 301 and the second locking portion 302 in this embodiment are an integrally formed structure.

[0053] It should be noted that the second locking spring piece 3 in this embodiment is made of elastic metal. Through the above design, the structural integrity of the second locking spring piece 3 can be effectively improved, and the service life of the second locking spring piece 3 can be effectively extended.

[0054] Furthermore, the heat dissipation substrate 1 in this embodiment is a heat dissipation substrate made of thermally conductive metal.

[0055] Specifically, the first section 101 and the second section 102 are an integrally formed structure.

[0056] It should be noted that the heat dissipation substrate 1 in this embodiment is preferably made of metal copper. In addition, this embodiment does not limit this. Designers can choose a suitable thermally conductive metal material to make the heat dissipation substrate 1 according to actual heat dissipation requirements.

[0057] In addition, the heat dissipation substrate 1 is an integrally formed structure, which can ensure the structural integrity of the heat dissipation substrate 1 .

[0058] Further, it also includes a heat pipe 4;

[0059] The heat pipe 4 is fixed on the surface of the heat dissipation substrate 1 away from the circuit board.

[0060] It should be noted that the heat pipe 4 in this embodiment is also made of heat-conductive metal. Through the above design, the heat dissipation performance of the heat dissipation module can be further improved.

[0061] Please refer to Figures 1 to 5 , an electronic device provided by an embodiment of the utility model comprises a circuit board, a first heat source and a second heat source electrically connected to the circuit board, and the above-mentioned heat dissipation module;

[0062] When the heat dissipation substrate 1 of the heat dissipation module is locked and fixed on the circuit board through the first locking spring piece 2 of the heat dissipation module, the first section 101 of the heat dissipation module is pressed against the first heat source through the first locking spring piece 2, and the second end of the first locking spring piece 2 is pressed against the second section 102 of the heat dissipation module and forces the second section 102 to be pressed against the second heat source.

[0063] It should be noted that a first screw hole corresponding to the first mounting through hole 204 of the first locking spring piece 2 is preset on the circuit board in this embodiment. The screw of the first locking screw is passed through the first mounting through hole 204 and threadedly connected to the first screw hole to lock the first locking spring piece 2 on the circuit board.

[0064] Through the above design, when the heat dissipation substrate 1 in the electronic device of this embodiment is locked and fixed by the first locking spring piece 2, the heat dissipation substrate 1 can be fully pressed against the first heat source and the second heat source, ensuring that the first heat source and the second heat source are effectively dissipated, thereby ensuring the heat dissipation effect of the heat dissipation module.

[0065] Furthermore, in this embodiment, the first heat source is a central processing unit chip; the second heat source is a high power consumption component.

[0066] It should be noted that the first heat source mentioned above may be other types of components besides the CPU chip, and the second heat source mentioned above may be other types of components besides the high power consumption components, and this embodiment does not impose any limitation on this.

[0067] Furthermore, the electronic device in this embodiment may be a notebook computer or the like.

[0068] The above is a detailed introduction to a heat dissipation module and an electronic device provided by the present invention. For a person skilled in the art, according to the idea of ​​the embodiments of the present invention, there may be changes in the specific implementation method and the scope of application. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A heat dissipation module, used to be fixed to a first heat source and a second heat source of a circuit board, characterized in that: The heat dissipation module comprises a heat dissipation substrate (1) and a first locking spring (2); The heat dissipation substrate (1) comprises a first sub-portion (101) covering the first heat source and a second sub-portion (102) covering the second heat source, wherein the first sub-portion (101) and the second sub-portion (102) are connected to each other; The first end of the first locking spring (2) is connected to the first sub-portion (101), and the second end of the first locking spring (2) is suspended above the second sub-portion (102); When the first locking spring (2) is locked and fixed, the first sub-section (101) is pressed against the first heat source through the first locking spring (2), and the second end of the first locking spring (2) is pressed against the second sub-section (102) and forces the second sub-section (102) to be pressed against the second heat source.

2. The heat dissipation module according to claim 1, characterized in that: The first locking spring (2) comprises a first connecting portion (201), a pressing portion (203), and a first locking portion (202) connected to the first connecting portion (201); The first connecting portion (201) is fixed to the first sub-portion (101); a first mounting through hole (204) is provided on the first locking portion (202); the pressing portion (203) is connected to a side of the first locking portion (202) away from the first connecting portion (201); and the pressing portion (203) is suspended above the second sub-portion (102); When the first locking spring (2) is locked and fixed, the first sub-section (101) is pressed against the first heat source through the first locking spring (2), and the pressing portion (203) is pressed against the second sub-section (102) and forces the second sub-section (102) to press against the second heat source.

3. The heat dissipation module according to claim 2, characterized in that: A side of the first locking portion (202) away from the first connecting portion (201) is bent to form the pressing portion (203), and the pressing portion (203) and the first locking portion (202) form a step-shaped structure.

4. The heat dissipation module according to claim 1, characterized in that: It also includes a second locking spring (3), wherein the second locking spring (3) is connected to the first sub-portion (101); When the second locking spring sheet (3) and the first locking spring sheet (2) are locked and fixed, the first sub-section (101) is pressed against the first heat source through the first locking spring sheet (2) and the second locking spring sheet (3).

5. The heat dissipation module according to claim 4, characterized in that: The second locking spring (3) comprises a second connecting portion (301) and second locking portions (302) connected to two opposite ends of the second connecting portion (301); The second connecting portion (301) is fixed to the first sub-portion (101), and the second locking portion (302) is provided with a second mounting through hole (303).

6. The heat dissipation module according to claim 4, characterized in that: The first locking spring piece (2) and the second locking spring piece (3) are both integrally formed structures.

7. The heat dissipation module according to claim 1, characterized in that: The first sub-portion (101) and the second sub-portion (102) are an integrally formed structure.

8. The heat dissipation module according to claim 1, characterized in that: It also comprises a heat pipe (4); the heat pipe (4) is fixed on a surface of the heat dissipation substrate (1) away from the circuit board.

9. An electronic device, characterized in that: It comprises a circuit board, a first heat source and a second heat source electrically connected to the circuit board, and a heat dissipation module according to any one of claims 1 to 8; When the heat dissipation substrate (1) of the heat dissipation module is locked and fixed on the circuit board through the first locking spring piece (2) of the heat dissipation module, the first section (101) of the heat dissipation module is pressed against the first heat source through the first locking spring piece (2), and the second end of the first locking spring piece (2) is pressed against the second section (102) of the heat dissipation module and forces the second section (102) to be pressed against the second heat source.

10. The electronic device according to claim 9, characterized in that: The first heat source is a central processing unit chip; the second heat source is a high power consumption component.

Images