Display screen

Abstract

The utility model discloses a display screen which is characterized in that the display screen comprises a plurality of red light LED chips, a plurality of green light LED chips and a plurality of blue light LED chips, a green light filtering layer is arranged on at least part of the light-emitting surface of each green light LED chip, and the green light filtering layer is used for absorbing light with wave bands smaller than 505 nm and larger than 545 nm. According to the display screen, the limitation of green light on the color gamut of the display screen can be eliminated, and the display effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of display screens, in particular to a display screen. Background Art

[0002] LED direct display refers to the technology of directly displaying images through LED light. For LED direct display, the color gamut of its display depends on the LED chip, which is divided into red LED chip, blue LED chip and green LED chip. The color gamut effect of red LED chip and blue LED chip is better than that of green LED chip. Therefore, green LED chip actually limits the color gamut of LED direct display. Utility Model Content

[0003] In order to overcome the deficiencies of the prior art, the purpose of the utility model is to provide a display screen which can remove the limitation of the color gamut of the display screen by the green light LED chip and improve the display effect.

[0004] The purpose of the utility model is achieved by the following technical solutions:

[0005] A display screen, characterized in that it comprises: a plurality of red light LED chips, a plurality of green light LED chips and a plurality of blue light LED chips, wherein a green light filter layer is provided on at least part of the light emitting surface of each of the green light LED chips, and the green light filter layer is used to absorb light in the wavelength band less than 505nm and greater than 545nm.

[0006] Furthermore, the green light filter layer is arranged on the entire light emitting surface of each of the green light LED chips.

[0007] Furthermore, a red light filter layer is provided on at least part of the light emitting surface of each of the red light LED chips, and the red light filter layer is used to absorb light in the wavelength band below 610nm and above 645nm.

[0008] Furthermore, a red light filter layer is provided on the entire light emitting surface of each of the red light LED chips.

[0009] Furthermore, a blue light filter layer is provided on at least part of the light emitting surface of each of the blue light LED chips, and the blue light filter layer is used to absorb light in the wavelength band below 450nm and above 485nm.

[0010] Furthermore, the blue light filter layer is arranged on the entire light emitting surface of each of the blue light LED chips.

[0011] Furthermore, a black glue light shielding layer is arranged on the side surface of each green LED chip, and only the green light filter layer is arranged on the top surface of each green LED chip.

[0012] Furthermore, a black glue light shielding layer is arranged on the side surface of each red light LED chip, and the red light filter layer is arranged only on the top surface of each red light LED chip.

[0013] Furthermore, a black glue light shielding layer is arranged on the side surface of each blue light LED chip, and each blue light LED chip is only arranged on the top surface with the blue light filter layer.

[0014] Furthermore, a mixed filter layer is provided on at least part of the light emitting surface of each red light LED chip, green light LED chip and blue light LED chip, and the mixed filter layer is used to absorb light in the bands less than 450nm, 485nm-505nm, 545nm-610nm and greater than 645nm.

[0015] Compared with the prior art, the beneficial effect of the utility model is that by setting a green light filter layer on the green light LED chip, the spectrum of each green light LED chip is limited to the 505nm-545nm band, thereby changing the color purity of the green light LED chip and making its color coordinates closer to the spectral color of its main wavelength, thereby expanding the color gamut of the display screen. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of processing green, red and blue LED chips in the glue dispensing and curing process;

[0017] Figure 2 for Figure 1 Schematic diagram from another perspective;

[0018] Figure 3 This is a schematic diagram of processing only green LED chips in the dispensing and curing process;

[0019] Figure 4 for Figure 3 Schematic diagram from another perspective;

[0020] Figure 5 This is a schematic diagram of processing the green LED chip and applying black glue before the MiniLED module packaging process begins;

[0021] Figure 6 This is a schematic diagram of the processing of green, red and blue LED chips before the MiniLED module packaging process begins;

[0022] Figure 7 for Figure 6 Schematic diagram from another perspective;

[0023] In the figure: 1. Red light LED chip; 11. Red light filter layer; 2. Green light LED chip; 21. Green light filter layer; 3. Blue light LED chip; 31. Blue light filter layer; 41. Black plastic shading layer. DETAILED DESCRIPTION

[0024] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The drawings provide preferred embodiments of the present invention. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present invention more thorough and comprehensive.

[0025] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0027] Embodiment 1

[0028] Reference Figure 3-4 A display screen includes: multiple red light LED chips 1, multiple green light LED chips 2 and multiple blue light LED chips 3, and a green light filter layer 21 is arranged on the entire light emitting surface of each green light LED chip 2, and the green light filter layer 21 is used to absorb light in the band less than 505nm and greater than 545nm.

[0029] It should be noted that the current MiniLED module packaging process generally includes the following steps: SMT drive surface - lamp surface solid crystal RGB - reflow oven welding - molded sealant - process edge cutting. Commonly used color filter materials generally include color dyes and color resins. Color dyes (Color Dyes) are organic compounds that can absorb light of a specific wavelength so that only light of a specific color is retained when it passes through; color resins (Color Resins) are a special polymer material that can achieve different color filtering effects by adding specific pigments or dyes. Color resins usually have high light transmittance and color stability. In this embodiment, a filter material that can absorb light in the wavelength range less than 505nm and greater than 545nm, that is, a green filter material, should be selected.

[0030] After selecting the green filter material, a glue dispensing and curing process can be added between the reflow furnace soldering step and the molding and sealing step, that is, the green filter material is directly coated on each green LED chip 2 to form a green filter layer 21, or the green filter material is first mixed into the packaging glue / bottom filler, and then coated on each green LED chip 2 to form a green filter layer 21. The coating process is more convenient to use glue dispensing. In this way, the spectrum of each green LED chip 2 has only a 505nm-545nm band, so that the color purity of the green LED chip 2 can be changed, so that its color coordinates are closer to the spectrum color of its main wavelength, thereby expanding the color gamut of the display screen.

[0031] Embodiment 2

[0032] The difference between the second embodiment and the first embodiment is that only a part of the light emitting surface of each green LED chip 2 is provided with a green light filter layer 21. This arrangement can also improve the color purity of the green LED chip 2 to a certain extent, but the effect is slightly inferior to the arrangement of the green light filter layer 21 on the entire light emitting surface.

[0033] Embodiment 3

[0034] The difference between Example 3 and Example 1 is that after the green filter material is selected, the green LED chip 2 needs to be processed before the MiniLED module packaging process begins. Specifically, the green filter material needs to be directly coated on the green LED chip 2 to form a green filter layer 21, or the green filter material is first added to the packaging glue / bottom filler, and then coated on the green LED chip 2 to form a green filter layer 21. The coating process is more convenient using spraying, spin coating, and silk screen printing processes. After the green filter layer 21 is cured, it can be cut to make each green LED chip 2 independent, so that individual grabbing and solid crystal can be achieved. The green LED chip 2 coated with the green filter layer 21 can be directly used in the subsequent lamp surface solid crystal RGB step.

[0035] Embodiment 4

[0036] Reference Figure 5, the difference between the fourth embodiment and the first embodiment is that: after the green filter material is selected, the green LED chip 2 needs to be processed before the module packaging process of the MiniLED starts. Specifically, black glue can be applied between the green LED chips 2 on the blue film to make each green LED chip 2 independent, and the height of the black glue is consistent with or slightly lower than the height of the green LED chip 2 (that is, at this time, a black glue shading layer 41 is formed on the surrounding side of each green LED chip 2), and then the green filter material is directly applied to the green LED chip 2 to form a green filter layer 21 only on the top surface of the green LED chip 2; or the green filter material is first mixed into the packaging glue / bottom filling glue, and then applied to the green LED chip 2. At this time, the green LED chip 2 is on the blue film and is processed as a whole. The coating process is more convenient to use spraying, spin coating, and silk screen printing processes. After the green filter layer 21 and the black glue shading layer 41 are cured, they are cut to make each green LED chip 2 independent, and individual crystal grabbing can be achieved. In the subsequent RGB die-bonding step of the lamp surface, the green LED chip 2 coated with the green light filter layer 21 can be directly used.

[0037] Embodiment 5

[0038] Reference Figure 1-2 The difference between the fifth embodiment and the first embodiment is that in addition to selecting a filter material that can absorb light in the band below 505nm and above 545nm, that is, a green filter material, a filter material that can absorb light in the band below 610nm and above 645nm, that is, a red filter material, and a filter material that can absorb light in the band below 450nm and above 485nm, that is, a blue filter material, are also selected.

[0039] After selecting the green filter material, the red filter material and the blue filter material, a dispensing curing process can be added between the reflow furnace soldering step and the molding and sealing step, that is, the green filter material is coated on the green LED chip 2 to form a green filter layer 21, the red filter material is coated on the red LED chip 1 to form a red filter layer 11, and the blue filter material is coated on the blue LED chip 3 to form a blue filter layer 31; or the green, red and blue filter materials are firstly respectively mixed into the packaging glue / bottom filler, and then respectively coated on the green, red and blue LED chips 3 to form the green filter layer 21, the red filter layer 11 and the blue filter layer 31. In this way, the color purity of the green, red and blue LED chips 3 can be improved, and the light emitting spectrum bands of the display screen are 610nm-645nm, 505nm-545nm and 450nm-485nm.

[0040] Embodiment 6

[0041] The difference between Example 6 and Example 1 is that in addition to selecting a filter material that can absorb light in the band below 505nm and above 545nm, i.e., a green filter material, it is also necessary to select a filter material that can absorb light in the band below 610nm and above 645nm, i.e., a red filter material, and it is also necessary to select a filter material that can absorb light in the band below 450nm and above 485nm, i.e., a blue filter material.

[0042] After selecting the green filter material, the red filter material and the blue filter material, a glue curing process can be added between the reflow furnace soldering step and the molding and sealing step, that is, firstly, black glue is applied between each green light LED chip 2 on the blue film to make each green light LED chip 2 independent, and the height of the black glue is consistent with or slightly lower than the height of the green light LED chip 2 (that is, at this time, a black glue shading layer 41 is formed on the surrounding side of each green light LED chip 2), black glue is applied between each red light LED chip 1 on the blue film to make each red light LED chip 1 independent, and the height of the black glue is consistent with or slightly lower than the height of the red light LED chip 1 (that is, at this time, a black glue shading layer 41 is formed on the surrounding side of each red light LED chip 1), and black glue is applied between each blue light LED chip 3 on the blue film to make each blue light LED chip 3 independent, and the height of the black glue is consistent with or slightly lower than the height of the blue light LED chip 3 (that is, at this time, a black glue shading layer 41 is formed on the surrounding side of each blue light LED chip 3); then The green filter material is coated on the green LED chip 2 to form a green filter layer 21 only on the top surface of the green LED chip 2, the red filter material is directly coated on the red LED chip 1 to form a red filter layer 11 only on the top surface of the red LED chip 1, and the blue filter material is directly coated on the blue LED chip 3 to form a blue filter layer 31 only on the top surface of the blue LED chip 3; or the green, red and blue filter materials are first mixed into the packaging glue / bottom filling glue, and then respectively coated on the green LED chip 2, the red LED chip 1 and the blue LED chip 3 to form the green filter layer 21, the red filter layer 11 and the blue filter layer 31. The coating process is more convenient to use spraying, spin coating and silk screen printing processes. After the green filter layer 21, the red filter layer 11, the blue filter layer 31 and the black glue shading layer 41 are cured, they are cut to make each green, red and blue LED chip 3 independent, so that individual crystal grabbing can be realized. In the subsequent RGB die-bonding step of the lamp surface, the green LED chip 2 coated with the green filter layer 21, the red LED chip 1 coated with the red filter layer 11, and the blue LED chip 3 coated with the blue filter layer 31 can be directly used. In this way, the color purity of the green, red, and blue LED chips 3 can be improved, and the light emitting spectrum bands of the display screen are 610nm-645nm, 505nm-545nm, and 450nm-485nm.

[0043] Embodiment 7

[0044] Reference Figure 6-7The difference between the seventh embodiment and the first embodiment is that in addition to selecting a filter material that can absorb light in the band below 505nm and above 545nm, that is, a green filter material, a filter material that can absorb light in the band below 610nm and above 645nm, that is, a red filter material, and a filter material that can absorb light in the band below 450nm and above 485nm, that is, a blue filter material, are also selected.

[0045] After selecting the green, red and blue filter materials, the green, red and blue LED chips 3 need to be processed before the MiniLED module packaging process begins. Specifically, the green filter material can be directly coated on the green LED chip 2 to form a green filter layer 21, the red filter material can be directly coated on the red LED chip 1 to form a red filter layer 11, and the blue filter material can be directly coated on the blue LED chip 3 to form a blue filter layer 31, or the green, red and blue filter materials can be first mixed into the packaging glue / bottom filler, and then coated on the green, red and blue LED chips 3 to form a green filter layer 21, a red filter layer 11 and a blue filter layer 31. At this time, the green, red and blue LED chips 3 are on the blue film and are processed as a whole. The coating process can be conveniently sprayed, spin-coated, or screen-printed. After the green filter layer 21, the red filter layer 11, and the blue filter layer 31 are cured, they are cut to make each green, red, and blue LED chip 3 independent, so that individual crystals can be captured and solidified. In the subsequent RGB crystal solidification step of the lamp surface, the green LED chip 2 coated with the green filter layer 21, the red LED chip 1 coated with the red filter layer 11, and the blue LED chip 3 coated with the blue filter layer 31 can be directly used. In this way, the color purity of the green, red, and blue LED chips 3 can be improved, and the luminous spectrum bands of the display screen are 610nm-645nm, 505nm-545nm, and 450nm-485nm.

[0046] Embodiment 8

[0047] The difference between the eighth embodiment and the first embodiment is that: instead of selecting green green light material, a filter material that absorbs light in the wavelength bands less than 450nm, 485nm-505nm, 545nm-610nm, and greater than 645nm is directly prepared and mixed into the molded packaging glue. In the subsequent molded packaging glue step, the treated molded glue is used to form a mixed filter layer on the green light, red light, and blue light LED chips 3. The glue can be epoxy, silicon, polyurethane, etc. The mixed filter layer on the green light, red light, and blue light LED chips 3 can cover the entire light emitting surface or part of the light emitting surface, preferably the entire light emitting surface. The scheme of this embodiment can make the light emitting spectrum band of the display screen 610nm-645nm, 505nm-545nm, and 450nm-485nm.

[0048] Embodiment 9

[0049] The difference between the ninth embodiment and the first embodiment is that in addition to selecting a filter material that can absorb light in the wavelength range below 505nm and above 545nm, i.e., a green filter material, a filter material that can absorb light in the wavelength range below 610nm and above 645nm, i.e., a red filter material, is also selected.

[0050] After selecting the green filter material, the red filter material and the blue filter material, a dispensing curing process can be added between the reflow furnace soldering step and the molding and sealing step, that is, the green filter material is coated on the green LED chip 2 to form a green filter layer 21, and the red filter material is coated on the red LED chip 1 to form a red filter layer 11; or the green and red filter materials are first respectively mixed into the packaging glue / bottom filler, and then respectively coated on the green and red LED chips 1 to form the green filter layer 21 and the red filter layer 11. The green filter layer 21 and the red filter layer 11 formed on the green and red LED chips 1 can cover the entire light emitting surface or part of the light emitting surface, preferably the entire light emitting surface. In this way, the color purity of the green and red LED chips 1 can be improved, and the light emitting spectrum band of the display screen is 610nm-645nm and 505nm-545nm.

[0051] Embodiment 10

[0052] The difference between the tenth embodiment and the first embodiment is that in addition to selecting a filter material that can absorb light in the band below 505nm and above 545nm, i.e., a green filter material, a filter material that can absorb light in the band below 450nm and above 485nm, i.e., a blue filter material, is also selected.

[0053] After selecting the green filter material and the blue filter material, a dispensing curing process can be added between the reflow furnace soldering step and the molding and sealing step, that is, the green filter material is coated on the green LED chip 2 to form a green filter layer 21, and the blue filter material is coated on the blue LED chip 3 to form a blue filter layer 31; or the green and blue filter materials are first respectively mixed into the packaging glue / bottom filling glue, and then respectively coated on the green and blue LED chips 3 to form the green filter layer 21 and the blue filter layer 31. The green filter layer 21 and the blue filter layer 31 formed on the green and blue LED chips 3 can cover the entire light emitting surface or part of the light emitting surface, preferably the entire light emitting surface. In this way, the color purity of the green and blue LED chips 3 can be improved, and the light emitting spectrum band of the display screen is 505nm-545nm and 450nm-485nm.

[0054] The solutions of the above-mentioned embodiments 1 to 10 can increase the color gamut of the display screen to more than 90% of the BT.2020 color gamut, making it infinitely close to the BT.2020 color gamut, expanding the color display of the display screen, and improving the visual effect of the viewer.

[0055] The above are only embodiments of the present invention, and are not intended to limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. A display screen, characterized in that: include: A plurality of red LED chips, a plurality of green LED chips and a plurality of blue LED chips, at least part of the light emitting surface of each green LED chip is provided with a green light filter layer, the green light filter layer is used to absorb light in the wavelength range of less than 505nm and greater than 545nm.

2. The display screen according to claim 1, wherein: The green light filter layer is arranged on the entire light emitting surface of each green light LED chip.

3. The display screen according to claim 1, wherein: A red light filter layer is provided on at least part of the light emitting surface of each of the red light LED chips, and the red light filter layer is used to absorb light in the wavelength range of less than 610nm and greater than 645nm.

4. The display screen according to claim 3, characterized in that: A red light filter layer is arranged on the entire light emitting surface of each red light LED chip.

5. The display screen according to claim 1, wherein: A blue light filter layer is provided on at least part of the light emitting surface of each of the blue light LED chips, and the blue light filter layer is used to absorb light in the wavelength band below 450nm and above 485nm.

6. The display screen according to claim 5, characterized in that: The blue light filter layer is arranged on the entire light emitting surface of each blue light LED chip.

7. The display screen according to claim 1, wherein: A black glue light shielding layer is arranged on the side surface of each green light LED chip, and only the green light filter layer is arranged on the top surface of each green light LED chip.

8. The display screen according to claim 3, characterized in that: A black glue light shielding layer is arranged on the side surface of each red light LED chip, and only the red light filter layer is arranged on the top surface of each red light LED chip.

9. The display screen according to claim 5, characterized in that: A black glue light shielding layer is arranged on the side surface of each blue light LED chip, and only the blue light filter layer is arranged on the top surface of each blue light LED chip.

10. The display screen according to claim 1, wherein: A mixed filter layer is provided on at least part of the light emitting surface of each red light LED chip, green light LED chip and blue light LED chip, and the mixed filter layer is used to absorb light in the wavelength bands less than 450nm, 485nm-505nm, 545nm-610nm and greater than 645nm.

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