Semiconductor integrated circuit board manufacturing process waste gas treatment equipment

Abstract

The utility model discloses semiconductor integrated circuit board manufacturing process waste gas treatment equipment which comprises a rack and a blow-down valve installed on the outer wall of one side of the rack, a spraying tank is fixed in the rack, a waste gas inlet pipe used for allowing waste gas to enter is installed at the bottom end of the spraying tank, and a waste gas outlet pipe used for allowing waste gas to enter is installed at the bottom end of the spraying tank. A disc-type hollow water tank is rotatably mounted at the top of the spraying tank, and a liquid inlet pipe is mounted at the center of the top end of the disc-type hollow water tank in a communicating manner. According to the utility model, a high-density and multi-layer spraying area is formed in the spraying tank by utilizing the laminated spraying structure, and the laminated spraying structure swings in a fan shape under the driving of components such as the belt wheel transmission unit and the like, so that the whole waste gas flowing area can be uniformly covered by spraying liquid through the movement mode; according to the invention, harmful substances in waste gas can be uniformly and comprehensively adsorbed and converted in the treatment process, and the non-uniformity of the waste gas treatment effect is reduced, so that the emission amount of waste gas pollutants is effectively reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board waste gas treatment, in particular to a semiconductor integrated circuit board process waste gas treatment device. Background Art

[0002] Semiconductor integrated circuit boards are mainly used in the manufacture of electronic products. They are the main support for the installation and connection of electronic product components and are essential basic parts for all electronic products. Semiconductor integrated circuit boards will generate waste gas during the processes of cutting, trimming, drilling, pickling, micro-etching, etc. The role of waste gas treatment devices in the production of semiconductor integrated circuit boards is to convert harmful waste gases such as organic solvent evaporation, acid and alkali waste gas, and volatile organic compounds into harmless substances or reduce the emission of harmful components. Commonly used waste gas treatment devices include combustion devices, adsorption devices, and spray waste gas treatment devices. The spray waste gas treatment device sprays the waste gas in a special spray device, and uses the chemical substances in the spray liquid to react with the harmful substances in the waste gas to convert them into harmless substances. Its structure includes components such as a spray device, an acid and alkali liquid storage tank, and a waste liquid collector. Harmful substances are converted into harmless products through chemical reactions to achieve the purpose of exhaust gas purification. However, the current exhaust gas spray treatment equipment has a low number of spray layers and insufficient density, and the spray liquid is sprayed in a static state. When the spray density and number of layers are insufficient, the distribution of the spray liquid is uneven, and it is difficult to ensure that the spray liquid is fully in contact with the harmful substances in the exhaust gas during the adsorption and reaction process. This may lead to better purification effects in some areas of the exhaust gas, while poor exhaust gas treatment effects in other areas. At the same time, when the spray liquid is sprayed in a static state, the exhaust gas usually passes through a tower structure, and the spray liquid is sprayed from the top to the bottom. This method is also difficult to fully utilize gravity and wetting effects during the exhaust gas treatment process to reduce the concentration of harmful substances in the exhaust gas. Utility Model Content

[0003] The purpose of the utility model is to provide a semiconductor integrated circuit board process waste gas treatment equipment, so that the waste gas diffuses from bottom to top in the tower structure and increases the number of spray layers and density of the spray liquid to solve the problems raised in the above background technology.

[0004] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor integrated circuit board process waste gas treatment equipment, including a frame, a spray tank is fixed inside the frame, and an exhaust gas inlet pipe for exhaust gas to enter is installed at the bottom end of the spray tank, a drain valve is installed on the outer wall of one side of the spray tank, a disc-type hollow water tank is rotatably installed on the top of the spray tank, a liquid inlet pipe is installed at the center position of the top of the disc-type hollow water tank, the top of the liquid inlet pipe passes through the outside of the spray tank and is installed with an electromagnetic switch valve, a pulley transmission unit for driving the liquid inlet pipe to rotate is installed on one side of the top of the spray tank, four stacked spray structures are installed at equal intervals at the bottom end of the disc-type hollow water tank, and a motor controller electrically connected to the input end of the pulley transmission unit is installed on the outer wall of one side of the frame.

[0005] Preferably, a circular air intake pipe is installed at one end of the exhaust gas air intake pipe away from the spray tank.

[0006] Preferably, an annular flange is fixed at one end inside the spray tank, an annular lip is fixed at one end of the surface of the disc-type hollow water tank, the annular lip and the annular flange are rotatably connected, and a plurality of exhaust holes are arranged at the edge position of the top end of the annular flange.

[0007] Preferably, the pulley transmission unit includes a motor base installed on the top of the frame, and a servo motor installed on the top of the motor base, and the output end of the servo motor is installed with a belt transmission structure for driving the liquid inlet pipe to rotate.

[0008] Preferably, the cascade spray structure includes a riser installed at the bottom end of the disc-type hollow water tank, and an F-shaped support frame installed on the back of the riser, the riser is provided with a plurality of equally spaced diversion pipes in the vertical direction, and high-pressure nozzles are installed at the top and bottom ends of the diversion pipes.

[0009] Preferably, the high-pressure nozzle gradually approaches the F-shaped support frame from one end close to the shunt pipe to the other end, and the angle between the length extension direction reference line of the high-pressure nozzle and the horizontal extension direction reference line of the F-shaped support frame is an acute angle.

[0010] Compared with the prior art, the beneficial effects of the utility model are as follows: the semiconductor integrated circuit board process waste gas treatment equipment is provided with structures that cooperate with each other, such as an electromagnetic switch valve and a cascade spray structure, and the waste gas surges from the bottom of the frame from the bottom to the top through the waste gas intake pipe. The electromagnetic switch valve is connected to the spray liquid pumping end, and the motor controller can control the servo motor in the pulley transmission unit to work according to the set direction, speed, angle, and response time. The cascade spray structure is used to form a high-density, multi-layer spray area in the spray tank, and the cascade spray structure is driven by the pulley transmission unit and other components to swing in a fan shape. This movement mode can make the spray liquid evenly cover the entire waste gas flow area, which can ensure that the harmful substances in the waste gas are evenly and comprehensively adsorbed and converted during the treatment process, reduce the unevenness of the waste gas treatment effect, and thus effectively reduce the emission of waste gas pollutants. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] Figure 1 This is a schematic diagram of the main structure of the utility model;

[0012] Figure 2 This is a schematic diagram of the main cross-sectional structure of the utility model;

[0013] Figure 3 It is a three-dimensional structural schematic diagram of the cascading spray structure of the utility model;

[0014] Figure 4 This is a schematic diagram of the three-dimensional structure of the spray tank of the utility model;

[0015] In the figure: 1. frame; 2. spray tank; 3. exhaust gas inlet pipe; 4. round-shaped inlet pipe; 5. motor controller; 6. disc-type hollow water tank; 601. annular lip; 7. annular flange; 701. exhaust hole; 8. cascade spray structure; 801. vertical pipe; 802. F-type support frame; 803. diverter pipe; 804. high-pressure nozzle; 9. motor base; 10. pulley transmission unit; 11. liquid inlet pipe; 12. electromagnetic switch valve; 13. drain valve. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0017] See also Figure 1-4, the utility model provides an embodiment: a semiconductor integrated circuit board process waste gas treatment equipment, including a frame 1, a spray tank 2 is fixed inside the frame 1, and a waste gas inlet pipe 3 for waste gas to enter is installed at the bottom of the spray tank 2, and a round-shaped inlet pipe 4 is installed at one end of the waste gas inlet pipe 3 away from the spray tank 2, and the industrial waste gas in the semiconductor integrated circuit board processing workshop is pumped out by an air pump and sent into the round-shaped inlet pipe 4 and the waste gas inlet pipe 3, so that the waste gas surges from the bottom of the frame 1 from bottom to top. When the waste gas diffuses from bottom to top, it will be diluted and mixed with the surrounding air and the spray liquid. This diffusion process can effectively dilute the pollutants in the waste gas to a lower concentration, reduce the impact on the surrounding air quality, and the waste gas is mixed with more fresh air during the rising process, so that it is better dispersed and diluted;

[0018] A disc-type hollow water tank 6 is rotatably installed on the top of the spray tank 2, and a liquid inlet pipe 11 is connected and installed at the center position of the top of the disc-type hollow water tank 6. The top of the liquid inlet pipe 11 penetrates the outside of the spray tank 2 and is installed with an electromagnetic switch valve 12, and the electromagnetic switch valve 12 is connected to the spray liquid pumping end. A pulley transmission unit 10 for driving the liquid inlet pipe 11 to rotate is installed on one side of the top of the spray tank 2. Four stacked spray structures 8 are installed at equal intervals at the bottom end of the disc-type hollow water tank 6. The stacked spray structures 8 are used to form a high-density, multi-layer spray area in the spray tank 2. A motor controller 5 electrically connected to the input end of the pulley transmission unit 10 is installed on the outer wall of one side of the frame 1;

[0019] The pulley transmission unit 10 includes a motor base 9 mounted on the top of the frame 1, and a servo motor mounted on the top of the motor base 9. The motor controller 5 can control the servo motor in the pulley transmission unit 10 to work according to the set direction, speed, angle, and response time. The output end of the servo motor is installed with a belt transmission structure for driving the liquid inlet pipe 11 to rotate;

[0020] The motor controller 5 can realize the forward and reverse rotation of the servo motor by changing the direction and magnitude of the motor current, so that the liquid inlet pipe 11, the electromagnetic switch valve 12, the disc-type hollow water tank 6 and other components can reciprocate forward and reverse;

[0021] The cascade spray structure 8 is driven by the pulley transmission unit 10 and other components to swing in a fan shape. This movement mode can make the spray liquid evenly cover the entire exhaust gas flow area, which can ensure that the harmful substances in the exhaust gas are evenly and comprehensively adsorbed and converted during the treatment process.

[0022] An annular flange 7 is fixed to one end of the spray tank 2, an annular lip 601 is fixed to one end of the surface of the disc-type hollow water tank 6, the annular lip 601 is rotatably connected to the annular flange 7, and a plurality of exhaust holes 701 are arranged at the edge of the top of the annular flange 7;

[0023] A drain valve 13 is installed on the outer wall of one side of the spray tank 2, and the drain valve 13 is connected to the waste liquid recovery end. The dropped spray liquid can be collected at the bottom of the spray tank 2 and discharged through the drain valve 13. The pulley transmission unit 10 drives the liquid inlet pipe 11, the motor seat 9, and the stacked spray structure 8 to rotate. In this process, the cooperation of the annular flange 7 and the annular lip 601 makes the disc-type hollow water tank 6 rotate more stably and steadily. The waste gas after spraying can be discharged from the outside of the spray tank 2 through the exhaust hole 701 and treated by the next waste gas treatment equipment;

[0024] The stacked spray structure 8 includes a vertical pipe 801 installed at the bottom end of the disk-type hollow water tank 6, and an F-shaped support frame 802 installed on the back of the vertical pipe 801. The vertical pipe 801 is provided with a plurality of equally spaced diversion pipes 803. The top and bottom ends of the diversion pipes 803 are both provided with high-pressure nozzles 804. The high-pressure nozzles 804 gradually approach the F-shaped support frame 802 from one end close to the diversion pipe 803 to the other end. The included angle between the length extension direction reference line of the high-pressure nozzle 804 and the horizontal extension direction reference line of the F-shaped support frame 802 is an acute angle.

[0025] The spray liquid in the liquid inlet pipe 11 enters the disc-type hollow water tank 6 and is separated and enters the four vertical pipes 801. The spray liquid in the vertical pipe 801 enters the diversion pipe 803 and is sprayed out from the high-pressure nozzle 804. A layer of atomized spray liquid can be formed on the upper and lower sides of the diversion pipe 803, thereby increasing the contact area and time between the harmful substances and the spray liquid, thereby improving the coverage effect of the spray liquid on the exhaust gas and reducing the residue and deposition of harmful substances.

[0026] When the embodiment of the present application is in use, the staff first extracts the industrial waste gas in the semiconductor integrated circuit board processing workshop through an air pump and sends it into the circular air inlet pipe 4 and the waste gas inlet pipe 3, so that the waste gas surges from the bottom of the frame 1 from the bottom to the top. Then the staff connects the electromagnetic switch valve 12 to the spray liquid pumping end and connects the drain valve 13 to the waste liquid recovery end. The staff turns on the electromagnetic switch valve 12 and the pulley transmission unit 10 to work. The electromagnetic switch valve 12 is in a normally open state, and the motor controller 5 can control the servo motor in the pulley transmission unit 10 to work according to the set direction, speed, angle, and response time. At this time, the motor controller 5 can realize the forward and reverse rotation of the servo motor by changing the current direction and size of the motor. Then the liquid inlet pipe 11, the electromagnetic switch valve 12, the disc-type hollow water tank 6 and other components rotate back and forth, and the spray liquid in the electromagnetic switch valve 12 Entering into the liquid inlet pipe 11, the disc-type hollow water tank 6 and the stacked spray structure 8, the stacked spray structure 8 is used to form a high-density, multi-layer spray area in the spray tank 2. By increasing the number of spray layers and the spray density, the spray liquid can more fully contact and cover the exhaust gas, which can increase the contact area and time between the harmful substances and the spray liquid, improve the adsorption and conversion efficiency of the harmful substances in the exhaust gas, and thus improve the exhaust gas treatment effect. The stacked spray structure 8 is driven by the pulley transmission unit 10 and other components to swing in a fan shape. This movement mode can make the spray liquid evenly cover the entire exhaust gas flow area, which can ensure that the harmful substances in the exhaust gas are evenly and comprehensively adsorbed and converted during the treatment process, reduce the unevenness of the exhaust gas treatment effect, and thus effectively reduce the emission of exhaust gas pollutants, and meet the growing exhaust gas treatment needs in the production process of semiconductor integrated circuit boards.

Claims

1. A semiconductor integrated circuit board process waste gas treatment equipment, characterized by: The invention comprises a frame (1), a spray tank (2) is fixed inside the frame (1), and an exhaust gas intake pipe (3) for exhaust gas is installed at the bottom end of the spray tank (2), a drain valve (13) is installed on the outer wall of one side of the spray tank (2), a disc-type hollow water tank (6) is rotatably installed on the top of the spray tank (2), a liquid inlet pipe (11) is connected and installed at the center position of the top of the disc-type hollow water tank (6), the top of the liquid inlet pipe (11) passes through the outside of the spray tank (2) and is installed with an electromagnetic switch valve (12), a pulley transmission unit (10) for driving the liquid inlet pipe (11) to rotate is installed on one side of the top of the spray tank (2), four stacked spray structures (8) are installed at equal intervals at the bottom end of the disc-type hollow water tank (6), and a motor controller (5) electrically connected to the input end of the pulley transmission unit (10) is installed on the outer wall of one side of the frame (1).

2. The semiconductor integrated circuit board process waste gas treatment equipment according to claim 1, characterized in that: A circular air intake pipe (4) is installed at one end of the exhaust gas intake pipe (3) away from the spray tank (2).

3. The semiconductor integrated circuit board process waste gas treatment equipment according to claim 1, characterized in that: An annular flange (7) is fixed at one end of the interior of the spray tank (2), an annular lip (601) is fixed at one end of the surface of the disc-type hollow water tank (6), the annular lip (601) and the annular flange (7) are rotatably connected, and a plurality of exhaust holes (701) are provided at the edge of the top end of the annular flange (7).

4. The semiconductor integrated circuit board process waste gas treatment equipment according to claim 1, characterized in that: The pulley transmission unit (10) comprises a motor base (9) mounted on the top of the frame (1), and a servo motor mounted on the top of the motor base (9); a belt transmission structure for driving the liquid inlet pipe (11) to rotate is mounted on the output end of the servo motor.

5. The semiconductor integrated circuit board process waste gas treatment equipment according to claim 1, characterized in that: The stacked spray structure (8) comprises a vertical pipe (801) installed at the bottom end of a disk-type hollow water tank (6), and an F-shaped support frame (802) installed at the back of the vertical pipe (801), wherein the vertical pipe (801) is provided with a plurality of equally spaced branch pipes (803) in the vertical direction, and high-pressure spray heads (804) are installed at the top and bottom ends of the branch pipes (803).

6. The semiconductor integrated circuit board process waste gas treatment equipment according to claim 5, characterized in that: The high-pressure nozzle (804) gradually approaches the F-shaped support frame (802) from one end close to the shunt pipe (803) to the other end, and the angle between the length extension direction reference line of the high-pressure nozzle (804) and the horizontal extension direction reference line of the F-shaped support frame (802) is an acute angle.

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