Backlight module with rubber frame provided with shockproof salient points
By setting shock-proof bumps on the inner side of the rubber frame of the backlight module, the loose abnormal noise caused by temperature changes of the rubber frame and the lower iron frame is solved, and a good buffering effect is achieved and the product defect rate is reduced.
Patent Information
- Application Number
- CN202420537691.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-19
- Publication Date
- 2025-04-22
- Estimated Expiration
- 2034-03-19
AI Technical Summary
The glue frame and the lower iron frame in traditional backlight modules are prone to loosening due to temperature changes, causing abnormal noise, which increases the product defect rate.
A backlight module with anti-shock bumps is designed with a rubber frame with anti-shock bumps. The inner side of the rubber frame is provided with anti-shock bumps. When the rubber frame expands and deforms, the anti-shock bumps collide with the side wall to absorb collision energy and avoid direct collision between the rubber frame and the lower iron frame.
Through the buffering effect of anti-shock bumps, abnormal noise caused by loose collisions is effectively prevented, the product defect rate is reduced, and the product competitiveness is improved.
Smart Images
Figure CN222784731U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of liquid crystal display, and more specifically to a backlight module with a rubber frame and shockproof convex points. Background Art
[0002] Since the rubber frame is a plastic part, it is easy to deform. Therefore, a certain gap needs to be retained between the rubber frame and the lower iron frame in the traditional backlight module so that the rubber frame can retain sufficient deformation when the temperature changes. However, the rubber frame will expand when heated, causing the gap between the rubber frame and the lower iron frame to increase, thereby causing the rubber frame and the lower iron frame to loosen and produce abnormal noise, which in turn leads to an increase in product defective rate and reduces product competitiveness. Utility Model Content
[0003] The technical problem to be solved by the utility model is how to prevent the looseness between the rubber frame and the lower iron frame from causing abnormal noise.
[0004] The technical problem to be solved by the utility model is achieved through the following technical solutions:
[0005] In order to solve the above technical problems, the utility model provides a backlight module with a rubber frame and shockproof bumps, which includes a lower iron frame and a rubber frame, the lower iron frame includes a bottom plate and a side wall extending upward from the edge of the bottom plate, the side wall is provided with a buckle, a buckle position is opened on the side of the rubber frame, the lower iron frame is fixed to the buckle position of the rubber frame by buckling the buckle, the rubber frame is sleeved on the outer side of the lower iron frame, the inner surface of the side wall is provided with an FPC, an LED lamp is fixed on the FPC, a gap is reserved between the side of the rubber frame and the side wall, and shockproof bumps are provided on the inner side of the rubber frame, and the shockproof bumps are abutted against the side wall.
[0006] As a preferred implementation of the backlight module with the rubber frame and shockproof bumps provided by the utility model, the shape of the shockproof bumps is hemispherical.
[0007] As a preferred implementation of the backlight module with the rubber frame having shockproof bumps provided by the utility model, the height of the shockproof bumps is 0.05 mm.
[0008] As a preferred implementation of the backlight module with the rubber frame having shockproof convex points provided by the utility model, the shockproof convex points are integrally formed with the rubber frame.
[0009] As a preferred implementation of the backlight module with the rubber frame having shockproof convex points provided by the utility model, the rubber frame is in a frame shape, and at least one shockproof convex point is disposed on the inner side of each of the four side walls of the rubber frame.
[0010] As a preferred implementation of the backlight module with the rubber frame and shockproof bumps provided by the utility model, four shockproof bumps are arranged on each of the side walls.
[0011] As a preferred embodiment of the backlight module with shockproof bumps provided by the utility model, the FPC includes a substrate layer, a circuit layer arranged on the upper surface of the substrate layer, and a metal heat dissipation layer arranged on the lower surface of the substrate layer.
[0012] As a preferred embodiment of the backlight module with shock-proof bumps in the rubber frame provided by the utility model, the FPC also includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and the inner wall of the through-hole is provided with a thermal conductive layer in contact with the circuit layer and the metal heat dissipation layer.
[0013] As a preferred implementation of the backlight module with shockproof bumps in the rubber frame provided by the utility model, a heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.
[0014] As a preferred implementation of the backlight module with shockproof bumps in the rubber frame provided by the utility model, the structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wavy structure or a honeycomb structure.
[0015] The utility model has the following beneficial effects:
[0016] Since shock-proof bumps are arranged on the inner side of the rubber frame, when the rubber frame expands and deforms due to heat and collides with the lower iron frame, the inner side of the rubber frame will not directly collide with the side wall of the lower iron frame, but will collide with the side wall through the shock-proof bumps. The shock-proof bumps can absorb most of the collision energy and thus play a good buffering role to prevent abnormal noise after collision, thereby reducing the product defective rate and improving the product competitiveness. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.
[0018] Figure 1 The utility model provides a structural schematic diagram of a backlight module with a rubber frame and shockproof bumps.
[0019] Figure 2 The utility model provides a cross-sectional view of a backlight module with a rubber frame and shockproof bumps.
[0020] Figure 3 This is a schematic diagram of the structure of Example 2.
[0021] Description of Figure Numbers:
[0022] Lower iron frame 1; plastic frame 2; bottom plate 11; side wall 12; buckle 13; buckle position 21; FPC 3; LED light 4; shockproof bump 22;
[0023] Base material layer 31 ; circuit layer 32 ; metal heat dissipation layer 33 ; through hole 34 . DETAILED DESCRIPTION
[0024] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.
[0025] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.
[0026] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0027] The utility model provides a backlight module with a rubber frame and shockproof convex points, which comprises a lower iron frame and a rubber frame, wherein the lower iron frame comprises a bottom plate and a side wall extending upward from an edge of the bottom plate, wherein buckles are arranged on the side wall, buckle positions are opened on the side edges of the rubber frame, and the lower iron frame is fixed to the buckle positions of the rubber frame by buckling the buckles, the rubber frame is sleeved on the outer side of the lower iron frame, an FPC is arranged on the inner surface of the side wall, an LED lamp is fixed on the FPC, a gap is reserved between the side edge of the rubber frame and the side wall, shockproof convex points are arranged on the inner side edges of the rubber frame, and the shockproof convex points abut against the side wall.
[0028] Since shock-proof bumps are arranged on the inner side of the rubber frame, when the rubber frame expands and deforms due to heat and collides with the lower iron frame, the inner side of the rubber frame will not directly collide with the side wall of the lower iron frame, but will collide with the side wall through the shock-proof bumps. The shock-proof bumps can absorb most of the collision energy and thus play a good buffering role to prevent abnormal noise after collision, thereby reducing the product defective rate and improving the product competitiveness.
[0029] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.
[0030] Example 1
[0031] See also Figure 1 and Figure 2The utility model provides a backlight module with a rubber frame and shockproof bumps, which includes a lower iron frame 1 and a rubber frame 2. The lower iron frame 1 includes a bottom plate 11 and a side wall 12 extending upward from the edge of the bottom plate 11. A buckle 13 is provided on the side wall 12. A buckle position 21 is provided on the side of the rubber frame 2. The lower iron frame 1 is fixed to the buckle position 21 of the rubber frame 2 by buckling the buckle 13. The rubber frame 2 is sleeved on the outer side of the lower iron frame 1. An FPC 3 is provided on the inner surface of the side wall 12. An LED lamp 4 is fixed on the FPC 3. A gap is reserved between the side of the rubber frame 2 and the side wall 12. Shockproof bumps 22 are provided on the inner side of the rubber frame 2, and the shockproof bumps 22 abut against the side wall 12. Since the inner side edge of the rubber frame 2 is provided with the shockproof convex points 22, when the rubber frame 2 is expanded and deformed by heat and collides with the lower iron frame 1, the inner side edge of the rubber frame 2 will not directly collide with the side wall 12 of the lower iron frame 1, but will collide with the side wall 12 through the shockproof convex points 22. The shockproof convex points 22 can absorb most of the collision energy, and then can play a good buffering role to prevent abnormal noise after the collision, thereby reducing the product defective rate and improving the competitiveness of the product.
[0032] Furthermore, the anti-vibration protrusions 22 are in a square or hemispherical shape.
[0033] Furthermore, the height or radius of the shock-proof protrusion 22 is 0.05 mm.
[0034] Furthermore, the shockproof protrusions 22 are integrally formed with the rubber frame 2 .
[0035] Furthermore, the shape of the plastic frame 2 is a frame shape, and at least one shock-proof protrusion 22 is disposed on the inner side of each of the four side walls 12 of the plastic frame 2 .
[0036] Furthermore, four shock-proof protrusions 22 are provided on each side wall 12 .
[0037] Example 2
[0038] See also Figure 3 As a further optimization scheme of Example 1, in this embodiment, the FPC3 includes a substrate layer 31, a circuit layer 32 arranged on the upper surface of the substrate layer 31, and a metal heat dissipation layer 33 arranged on the lower surface of the substrate layer 31. The arrangement method can be that the circuit layer 32 and the metal heat dissipation layer 33 are respectively attached to the substrate layer 31 by double-sided adhesive. Since the thickness of the substrate layer 31 is relatively thin, the heat on the FPC3 can be diffused to the metal heat dissipation layer 33 through the substrate layer 31. The metal heat dissipation layer 33 can effectively increase the heat dissipation area of the FPC3 and play a role in uniform heat dissipation, thereby improving the heat dissipation efficiency of the FPC3. The substrate layer 31 can be any one of polyimide, polyester, polysulfone or polytetrafluoroethylene, the double-sided adhesive is any one of an acrylic adhesive layer or an epoxy resin adhesive layer, and the metal heat dissipation layer 33 can be a copper foil layer.
[0039] Furthermore, the FPC 3 further includes at least one through-hole 34 penetrating the substrate layer 31, the circuit layer 32 and the metal heat dissipation layer 33, and the inner wall of the through-hole 34 is provided with a heat-conducting layer in contact with the circuit layer 32 and the metal heat dissipation layer 33. By utilizing the good thermal conductivity of the through-hole 34, the circuit layer 32 and the metal heat dissipation layer 33 on both sides of the substrate layer 31 can be electrically connected, and a good thermal conductivity function can be exerted, and the thermal conductive layer can provide a thermal conductive function to achieve a good heat dissipation effect. Among them, the thermal conductive layer can be a copper glue conductive ink layer.
[0040] Furthermore, a heat conductor connected to an external heat-conducting structure is disposed in the through hole 34. The heat conductor is connected to the external heat-conducting structure from one side of the circuit layer 32 and is also in contact with the heat-conducting layer in the through hole 34, so that the circuit layer 32 and the metal heat dissipation layer 33 can be connected to the external heat-conducting structure through the through hole 34, so that the heat in the FPC 3 is diffused to the external heat-conducting structure through the heat conductor in the through hole 34, so as to further improve the heat dissipation efficiency of the FPC 3. Preferably, in order to enable the through hole 34 to be connected to the external heat-conducting structure, the through hole 34 is disposed at the edge of the FPC 3.
[0041] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0042] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.
Claims
1. A backlight module with a rubber frame and shockproof bumps, characterized in that: It includes a lower iron frame and a rubber frame, the lower iron frame includes a bottom plate and a side wall extending upward from the edge of the bottom plate, the side wall is provided with a buckle, the side of the rubber frame is provided with a buckle position, the lower iron frame is fixed to the buckle position of the rubber frame by buckling the buckle, the rubber frame is sleeved on the outer side of the lower iron frame, the inner surface of the side wall is provided with an FPC, an LED lamp is fixed on the FPC, a gap is reserved between the side of the rubber frame and the side wall, and the inner side of the rubber frame is provided with a shockproof convex point, and the shockproof convex point abuts against the side wall.
2. The backlight module with a rubber frame and shockproof bumps according to claim 1, characterized in that: The shape of the shockproof convex point is hemispherical.
3. The backlight module with a rubber frame and shockproof bumps according to claim 1, characterized in that: The height of the shockproof protrusion is 0.05 mm.
4. The backlight module with a rubber frame and shockproof bumps according to claim 1, characterized in that: The shockproof protrusions are integrally formed with the rubber frame.
5. The backlight module with a rubber frame and shockproof bumps according to claim 1, characterized in that: The shape of the rubber frame is a frame shape, and the inner sides of the four side walls of the rubber frame are each provided with at least one shockproof convex point.
6. The backlight module with a rubber frame and shockproof bumps according to claim 5, characterized in that: Four shock-proof convex points are arranged on each of the side walls.
7. The backlight module with a rubber frame and shockproof bumps according to claim 1, characterized in that: The FPC includes a substrate layer, a circuit layer disposed on an upper surface of the substrate layer, and a metal heat dissipation layer disposed on a lower surface of the substrate layer.
8. The backlight module with a rubber frame and anti-vibration bumps according to claim 7, characterized in that: The FPC further includes at least one through-hole penetrating the substrate layer, the circuit layer and the metal heat dissipation layer, and an inner wall of the through-hole is provided with a heat-conducting layer in contact with the circuit layer and the metal heat dissipation layer.
9. The backlight module with a rubber frame and shockproof bumps according to claim 8, characterized in that: A heat conductor connected to an external heat-conducting structure is arranged in the through hole, and the heat conductor is in contact with the heat-conducting layer.
10. The backlight module with a rubber frame and shockproof bumps according to claim 7, characterized in that: The structure of the metal heat dissipation layer is a mesh structure, a strip structure, a wave structure or a honeycomb structure.