Electronic equipment

Abstract

The electronic equipment provided by the utility model comprises a first shell which is provided with a first accommodating cavity, and a host system and a control system are arranged in the first accommodating cavity; the first heat dissipation module is used for dissipating heat of the host system; the first temperature adjusting module is at least arranged between the host system and the first heat dissipation module, and the first temperature adjusting module comprises a first contact part and a second contact part which are oppositely arranged; the first temperature adjusting module is in contact with the first heat dissipation module through the first contact part and is in contact with a heating component of the host system through the second contact part; wherein the control system is in signal connection with the first temperature adjusting module, and can control the first temperature adjusting module to heat or cool the host system through the second contact part of the first temperature adjusting module.

Description

Technical Field

[0001] The present application relates to the field of equipment, and more specifically, to an electronic device. Background Art

[0002] Edge computing devices have increasingly higher requirements for a wide temperature range. When the ambient temperature is higher or lower than the operating temperature of the components, traditional heat dissipation methods can no longer meet the requirements. It is necessary to maintain the system temperature within its normal operating range through cooling or heating. Therefore, a series of components such as TEC (Thermo Electric Cooler) and electric heaters are needed.

[0003] Typically, to achieve a wide temperature range, an additional wide temperature box is designed to indirectly cool / heat the system.

[0004] This solution has an obvious bottleneck, which is the low heat transfer efficiency. Assume that when cooling, the wide temperature box must first cool the internal thermal conductivity value, such as air, and then the air cools the system. The thermal conductivity of air itself is low, which wastes a lot of energy. Utility Model Content

[0005] In view of this, the present application provides an electronic device as follows:

[0006] An electronic device, comprising:

[0007] A first housing is formed with a first accommodating cavity, wherein a host system and a control system are arranged in the first accommodating cavity;

[0008] A first heat dissipation module, used for dissipating heat from the host system;

[0009] a first temperature adjustment module, at least arranged between the host system and the first heat dissipation module, the first temperature adjustment module comprising a first contact portion and a second contact portion arranged opposite to each other, the first temperature adjustment module contacts the first heat dissipation module through the first contact portion, and contacts the heat generating component of the host system through the second contact portion;

[0010] The control system is connected to the first temperature adjustment module by signal, and can control the first temperature adjustment module to increase or decrease the temperature of the host system through its second contact portion.

[0011] Optionally, the above-mentioned electronic device also includes a detection device for detecting environmental parameters of the spatial environment in which the host system is located, and the detection device is connected to the control system signal to provide the detected environmental parameter data to the control system; the control system can control the working parameters of the first temperature control module and / or the first heat dissipation module according to the environmental parameter data.

[0012] Optionally, the electronic device further comprises a second heat dissipation module for dissipating heat from the control system, and a second temperature adjustment module arranged between the control system and the second heat dissipation module;

[0013] The control system can also control the working parameters of the second temperature adjustment module and / or the second heat dissipation module according to the environmental parameter data.

[0014] Optionally, in the above-mentioned electronic device, the first accommodating cavity is provided with a first opening corresponding to the first heat-generating component of the host system, and the first heat sink of the first heat dissipation module is sealed at the first opening;

[0015] The electronic device further includes a first heat insulating member, which is coated on the outside of the first shell. The first heat insulating member is provided with a second opening corresponding to the first heat sink, and the first opening is correspondingly connected to the second opening.

[0016] Optionally, in the above-mentioned electronic device, a first surface of the first heat dissipation module contacting the first temperature adjustment module is provided with a first accommodation groove, and the first temperature adjustment module is at least partially accommodated in the first accommodation groove through the first contact portion; and / or,

[0017] The electronic device further includes a second heat insulating member, the first temperature regulating module further includes a first periphery connected to the first contact portion and the second contact portion, and the second heat insulating member is at least disposed to cover the first periphery.

[0018] Optionally, in the above electronic device, a first heat-conducting member is provided between the second contact portion and the first heat-generating component, and / or a second heat-conducting member is provided between the first contact portion and the first surface of the first heat sink; and / or,

[0019] The second thermal insulation member is at least partially disposed in the first accommodating groove; and / or,

[0020] A first sealing member is disposed between the first heat sink and the first opening and / or the second opening.

[0021] Optionally, in the above-mentioned electronic device, the first accommodating cavity is provided with a third opening corresponding to the second heat-generating component of the control system, and the second heat sink of the second heat dissipation module is blocked at the third opening;

[0022] The first heat insulating member of the electronic device is provided with a fourth opening corresponding to the second radiator, and the fourth opening is correspondingly communicated with the third opening.

[0023] Optionally, in the above-mentioned electronic device, a second surface of the second heat dissipation module contacting the second temperature adjustment module is provided with a second receiving groove, and the second temperature adjustment module is at least partially received in the second receiving groove through the first contact portion of the second temperature adjustment module; and / or,

[0024] The electronic device further includes a third heat insulating member, the second temperature regulating module further includes a second periphery connected to the first contact portion and the second contact portion thereof, and the third heat insulating member is at least disposed to cover the second periphery.

[0025] Optionally, in the above-mentioned electronic device, the temperature adjustment module includes a refrigerator;

[0026] The first contact portion and the second contact portion are respectively a hot end and a cold end of the refrigerator, and the refrigerator can cool down the heat-generating component in the first accommodating cavity through the cold end; or,

[0027] The first contact portion and the second contact portion are respectively a cold end and a hot end of the refrigerator, and the refrigerator can heat up the heat-generating component in the first accommodating cavity through the hot end.

[0028] Optionally, in the above-mentioned electronic device, the control system and the host system are respectively arranged in two mutually isolated accommodation spaces of the first accommodation cavity;

[0029] and / or,

[0030] The control system includes a controller and a power supply module, the controller can control the power supply parameters of the power supply module to supply power to at least one of the host system, the first heat dissipation module or the first temperature adjustment module, and / or the controller can also respond to a control instruction of a target mobile terminal to control the operating state of the electronic device, and the target mobile terminal is a device isolated from the electronic device in physical space;

[0031] and / or,

[0032] The target mobile terminal has a control interface, and the control interface includes an environment parameter area and / or a control area. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without creative work.

[0034] Figure 1is a structural schematic diagram of an electronic device embodiment 1 provided by the present application;

[0035] Figure 2 is a structural schematic diagram of an electronic device embodiment 2 provided by the present application;

[0036] Figure 3 is a structural diagram of an electronic device embodiment 3 provided by the present application;

[0037] Figure 4 is a structural schematic diagram of an electronic device embodiment 4 provided by the present application;

[0038] Figure 5 is a structural schematic diagram of an electronic device embodiment 5 provided by the present application;

[0039] Figure 6 is another structural schematic diagram of an electronic device embodiment 5 provided by the present application;

[0040] Figure 7 is another structural schematic diagram of an electronic device embodiment 5 provided by the present application;

[0041] Figure 8 is a structural schematic diagram of an electronic device embodiment 6 provided by the present application;

[0042] Fig. 9 is a structural schematic diagram of an electronic device embodiment 7 provided by the present application;

[0043] Fig.10 is a structural schematic diagram of an electronic device embodiment 8 provided by the present application;

[0044] Fig.11 is another structural schematic diagram of an electronic device embodiment 8 provided by the present application;

[0045] Fig.12 is another structural schematic diagram of an electronic device embodiment 8 provided by the present application;

[0046] Fig.13 is a structural schematic diagram of an electronic device embodiment 9 provided by the present application;

[0047] Fig.14 It is a structural schematic diagram of a control system in an electronic device embodiment 9 provided by the present application;

[0048] Fig.15 This is a schematic diagram of a control interface of a mobile terminal in Embodiment 9 of an electronic device provided by the present application;

[0049] Fig.16 It is a schematic diagram of the structure of an electronic device in the application scenario provided by this application;

[0050] Fig.17 It is a schematic diagram of the sensor layout of an electronic device in the application scenario provided by this application. DETAILED DESCRIPTION

[0051] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0052] Figure 1 The figure is a schematic diagram of the structure of an electronic device embodiment 1 provided by the present application, the electronic device comprises the following structures: a first housing 101, a host system 102, a control system 103, a first heat dissipation module 104 and a first temperature adjustment module 105;

[0053] The first housing is formed with a first accommodating cavity 1011, in which a host system and a control system are arranged;

[0054] A first heat dissipation module 104, used for dissipating heat from the host system;

[0055] A first temperature adjustment module 105 is at least arranged between the host system and the first heat dissipation module. The first temperature adjustment module includes a first contact portion 1051 and a second contact portion 1052 arranged opposite to each other. The first temperature adjustment module contacts the first heat dissipation module through the first contact portion and contacts the heat generating component of the host system through the second contact portion.

[0056] The control system is connected to the first temperature adjustment module by signal, and can control the first temperature adjustment module to increase or decrease the temperature of the host system through its second contact portion.

[0057] in, Figure 1 Dashed lines are used to indicate signal connections.

[0058] Among them, the host system can be an edge computing device, which can perform massive data processing tasks. During the operation of the host system, the heat-generating component is a structural component that specifically performs data processing tasks, and its temperature needs to be maintained within a normal working range.

[0059] Specifically, if the temperature of the host system is too low, the first temperature adjustment module is required to increase the temperature of the host system. If the temperature of the host system is too high, the first temperature adjustment module is required to reduce the temperature of the host system.

[0060] The control system may be composed of a plurality of functional structures, and may be capable of controlling the first temperature adjustment module to increase or decrease the temperature of the host system.

[0061] The control system presets a control algorithm to control the first temperature adjustment module according to the control algorithm.

[0062] In some implementations, the first heat dissipation module may be a heat sink, or a combination of a heat sink and a fan.

[0063] The first temperature adjustment module may be a TEC (Thermo Electric Cooler).

[0064] Among them, the second contact part of the first temperature control module is in contact with the heat-generating component of the host system, and the first contact part of the first temperature control module is in contact with the first heat dissipation module. If it is necessary to heat up the heat-generating component of the host system, the control system controls the second contact part of the first temperature control module to release heat, and controls the first contact part of the first temperature control module to absorb heat; if it is necessary to cool down the heat-generating component of the host system, the control system controls the second contact part of the first temperature control module to absorb heat, and controls the first contact part of the first temperature control module to release heat.

[0065] Among them, the Figure 1 The shape of the first shell and the first accommodating cavity shown in the figure is a rectangular parallelepiped. In the specific implementation process, the shape of the first shell and the shape of the first accommodating cavity can be determined according to its internal accommodating structure or the installation position space of the electronic device. The present application does not limit the shape of the first shell and the shape of the first accommodating cavity.

[0066] Among them, the Figure 1 The first temperature control module and the first heat dissipation module shown in the figure are respectively single structures. In a specific implementation, the first temperature control module can be composed of multiple identical / different structures, such as multiple arranged TECs, and the first heat dissipation module can also be composed of multiple identical / different structures, such as multiple arranged radiators, multiple arranged fans, etc.

[0067] In this embodiment, a host system and a control system are arranged in the first accommodating cavity of the first shell, and a first temperature adjustment module is arranged between a first heat dissipation module for dissipating heat for the host system and the host system. A first contact portion in the first temperature adjustment module is in contact with the first heat dissipation module, and a second contact portion in the first temperature adjustment module is in contact with a heating component of the host system. The control system is connected to the first temperature adjustment module by signal, and can control the first temperature adjustment module to heat up or cool down the host system through the second contact portion, thereby realizing contact between the first heat dissipation module and the host system through the first temperature adjustment module, realizing direct control of heating up or cooling the host system, and having high energy utilization rate.

[0068] Figure 2 The figure is a schematic diagram of the structure of an electronic device embodiment 2 provided by the present application, the electronic device comprises the following structures: a first housing 201, a host system 202, a control system 203, a first heat dissipation module 204, a first temperature adjustment module 205 and a detection element 206;

[0069] Among them, the first housing 201, the host system 202, the control system 203, the first heat dissipation module 204, and the first temperature adjustment module 205 have the same structures and functions as those in Example 1, and are not described in detail here.

[0070] The detection element 206 is used to detect environmental parameters of the space environment where the host system is located.

[0071] The detection element is connected to the control system signal to provide the detected environmental parameter data to the control system; the control system can control the working parameters of the first temperature adjustment module and / or the first heat dissipation module according to the environmental parameter data.

[0072] The space environment where the host system is located includes the internal environment of the first accommodating cavity and the external environment of the accommodating cavity.

[0073] The environmental parameters include various parameters related to the space environment in which the host system is located, such as ambient temperature, host system temperature, humidity, altitude, wind speed, etc.

[0074] The detection element may include a temperature sensor for measuring temperature, a humidity sensor for measuring temperature, a barometer for measuring altitude, an anemometer for measuring wind speed, and the like.

[0075] Among them, the setting of the detection component is based on the environmental parameters required by the electronic device. In specific implementation, it can be set according to actual conditions and is not limited to the environmental parameters and detection component types listed in this application.

[0076] Among them, the Figure 2 The middle detection member is disposed in the first accommodating cavity, and its location is not limited thereto, and can be disposed according to actual conditions in specific implementation.

[0077] In a specific implementation, if the detection component is used to measure the environmental parameters of the environment inside the first accommodating cavity, the detection component is arranged inside the first accommodating cavity; if the detection component is used to measure the environmental parameters of the environment outside the first accommodating cavity, the detection component is arranged outside the first accommodating cavity, such as on the outside of the first shell, or in the environment outside the first shell, without contacting the first shell, and only transmits the detected environmental parameters to the control system by wired or wireless means.

[0078] The detection component transmits the detected environmental parameters to the control system in real time or according to a set period, and the control system analyzes the environmental parameters to determine whether to adjust the environment of the host system and how to adjust it.

[0079] Among them, adjusting the environment of the host system includes controlling the internal temperature and humidity of the first accommodation chamber within a normal working range to prevent condensation.

[0080] The working parameters include the running, stopping and operation parameters of the module.

[0081] For example, the first temperature control module is a TEC, and the working parameters of the TEC may include the voltage magnitude and the current magnitude and direction to achieve control of the heat absorption end and the heat release end of the TEC.

[0082] For example, the first heat dissipation module uses a radiator and a fan, and the operating parameters may at least include controlling the wind speed of the fan. If the radiator is a controllable type, the operating parameters also include parameters for controlling the heat dissipation capacity of the radiator.

[0083] For example, the environmental parameter indicates that the ambient temperature is lower than a low temperature threshold, and the operation of the host system is affected by the temperature when the temperature is too low, and the host system needs to be heated up.

[0084] In some usage scenarios, the first temperature control module is TEC, and the first heat dissipation module uses a radiator and a fan. If the ambient temperature is lower than the low temperature threshold, the side of the TEC in contact with the host system is controlled as the heat release end, and the side of the TEC in contact with the radiator is controlled as the heat absorption end to increase the temperature of the environment where the host system is located.

[0085] For example, the environmental parameter indicates that the ambient temperature is higher than a high temperature threshold, and the operation of the host system is affected by the temperature when the temperature is too high, and the host system needs to be cooled down.

[0086] In some usage scenarios, the first temperature control module is TEC, and the first heat dissipation module uses a radiator and a fan. If the ambient temperature is higher than the high temperature threshold and the humidity is greater than the humidity threshold, the side of the TEC in contact with the host system is controlled as the heat absorption end, the side of the TEC in contact with the radiator is controlled as the heat release end, and the fan is turned on to lower the temperature of the environment where the host system is located and lower the humidity of the environment where the host system is located.

[0087] In some implementations, the control system can send control signals to the first heat dissipation module and the first temperature control module respectively, and the control signal sent to the first heat dissipation module can drive the operating state of each structure in the first heat dissipation module, and the control signal sent to the first temperature control module can control the operating state of the first temperature control module.

[0088] The detection component may further include a temperature switch, and the first temperature adjustment module may further include a heating wire, which is connected to a power source via the temperature switch to achieve low-temperature startup.

[0089] Specifically, when the electronic device is powered on, due to the low ambient temperature, the host system and the control system cannot be started. The temperature switch is in a closed state, the heating wire is turned on and heated, and when the starting temperature of the control system is reached, the control system starts to work. Based on the detection of each sensor, the temperature in the accommodating cavity is lower than the starting temperature of the host system. The control system starts the TEC heating in the first temperature control module. When the temperature in the first accommodating cavity reaches the starting temperature of the host system, the control system controls the power switch state of the host system to switch to the starting state, and starts the host system.

[0090] Among them, the control system can also be connected to the host system. When the ambient temperature is too high / the temperature of the host system is too high, the control system can control the power consumption adjustment of the host system based on environmental parameters, and control the working parameters of the first heat dissipation module to reduce the temperature of the host system.

[0091] Specifically, the control signal may be in the form of a PWM (Pulse Width Modulation) signal.

[0092] Of course, the above are only examples of the control system controlling one or two environmental parameters. During the specific implementation process, the first heat dissipation module and the first temperature adjustment module will be controlled in combination with various environmental parameters, and are not limited to the above examples.

[0093] In this embodiment, a detection component is also provided in the electronic device, and the detection component is used to detect the environmental parameters of the spatial environment in which the host system is located. The detection component provides the detected environmental parameter data to the control system. The control system can control the working parameters of at least one of the first heat dissipation module and the first temperature adjustment module according to the environmental parameters. The control system controls the working parameters of the temperature adjustment module and the heat dissipation module according to the environmental parameters of the environment in which the host system is located, so as to adjust the temperature of the host system.

[0094] Figure 3 The figure is a schematic diagram of the structure of an electronic device embodiment 3 provided by the present application, and the electronic device includes the following structures: a first housing 301, a host system 302, a control system 303, a first heat dissipation module 304, a first temperature adjustment module 305, a detection element 306, a second heat dissipation module 307 and a second temperature adjustment module 308;

[0095] Among them, the first shell 301, the host system 302, the control system 303, the first heat dissipation module 304, the first temperature adjustment module 305, and the detection component 306 have the same structure and function as the corresponding structures in Example 2, and are not described in detail here.

[0096] Wherein, the second heat dissipation module 307 is used to dissipate heat for the control system;

[0097] Wherein, the second temperature adjustment module 308 is arranged between the control system and the second heat dissipation module;

[0098] The control system can also control the working parameters of the second temperature adjustment module and / or the second heat dissipation module according to the environmental parameter data.

[0099] Among them, the control system is composed of electronic components, and its temperature needs to be kept within a specific temperature range. There will also be temperature changes during its operation. Therefore, in order to ensure the normal operation of the control system, the control system also needs to be temperature controlled.

[0100] Wherein, a second temperature regulating module is arranged between the control system and the second heat dissipation module, and the temperature control of the control system is realized through the second heat dissipation module and the second temperature regulating module.

[0101] The control system also controls the working parameters of the second temperature adjustment module and / or the second heat dissipation module according to the environmental parameter data detected by the detection element.

[0102] The second temperature adjustment module and the first temperature adjustment module may adopt the same type of functional structure, and may be completely the same structure except for the different setting positions.

[0103] The second heat dissipation module and the first heat dissipation module may adopt the same type of functional structure, and except for the different setting positions, the two may be completely the same structure.

[0104] Wherein, the temperature adjustment module includes a refrigerator;

[0105] The first contact portion and the second contact portion are respectively the hot end and the cold end of the refrigerator, and the refrigerator can cool down the heat-generating component in the first accommodating cavity through the cold end; or, the first contact portion and the second contact portion are respectively the cold end and the hot end of the refrigerator, and the refrigerator can heat up the heat-generating component in the first accommodating cavity through the hot end.

[0106] The cold end and the hot end of the refrigerator can be switched, and the switching is specifically controlled by a control system.

[0107] Among them, the Figure 2The second temperature control module and the second heat dissipation module shown in the figure are respectively single structures. In a specific implementation, the second temperature control module can be composed of multiple identical / different structures, such as multiple arranged TECs, and the second heat dissipation module can also be composed of multiple identical / different structures, such as multiple arranged radiators, multiple arranged fans, etc.

[0108] In this embodiment, the electronic device is also provided with a second heat dissipation module and a second temperature control module. The second heat dissipation module is used to dissipate heat for the control system, and the second temperature control module is arranged between the control system and the second heat dissipation module; moreover, the control system can also control the working parameters of the second temperature control module and / or the second heat dissipation module according to the environmental parameter data detected by the detection component, thereby realizing temperature control of the control system arranged in the first accommodating cavity. On the premise of ensuring that the temperature of the control system is controllable, it can also assist in the temperature control of the host system in the first accommodating cavity.

[0109] Figure 4 FIG. 4 is a schematic diagram of the structure of an electronic device embodiment 4 provided by the present application, wherein the electronic device comprises the following structures: a first housing 401, a host system 402, a control system 403, a first heat dissipation module 404, a first temperature adjustment module 405 and a first heat insulation member 406;

[0110] Among them, the host system 402, the control system 403, and the first heat dissipation module 404 have the same structures and functions as the corresponding structures in Example 1, and are not described in detail here.

[0111] The first accommodating cavity 4011 is provided with a first opening 40111 corresponding to the first heat generating component 4021 of the host system 402, and the first heat sink 4041 of the first heat dissipation module 404 is blocked at the first opening;

[0112] The first heat insulating member 406 is covered on the outside of the first shell 401 , and the first heat insulating member is provided with a second opening 4061 corresponding to the first heat sink, and the first opening is connected to the second opening correspondingly.

[0113] The first heat generating component in the host system may be a component with the greatest temperature sensitivity or temperature variation in the host system.

[0114] A first opening is arranged in the first accommodating cavity, and the first opening corresponds to a first heating component of the host system, and a first heat sink of the first heat dissipation module is sealed at the first opening so that heat of the first heating component can be dissipated through the first opening.

[0115] The outer side of the first shell is covered with a first thermal insulation component, and the first thermal insulation component can be arranged on the outer side of the first shell by coating or wrapping.

[0116] In some implementations, the thermal insulation material used for the first thermal insulation member may be polyurethane rigid foam, ultra-fine glass fiber, etc., but is not limited thereto.

[0117] Among them, the first thermal insulation component is provided with a second opening corresponding to the position of the first radiator, the second opening is connected to the first opening, the first radiator blocked in the first opening is connected to the outside of the first shell through the second opening, and the first radiator can dissipate heat to the external environment through the second opening.

[0118] Among them, the Figure 4 In the structural diagram of , the first radiator is a component of the first heat dissipation module. In a specific implementation, the first heat dissipation module may include only the first radiator, or may include the first radiator and other structures.

[0119] Wherein, a first sealing member is arranged between the first heat sink and the first opening and / or the second opening.

[0120] When the first radiator is only sealed at the first opening, a sealing member is arranged between the first radiator and the first opening to prevent foreign matter from entering the first accommodating cavity through the gap between the first radiator and the first opening.

[0121] The first heat sink is sealed at the first opening and the second opening, and a seal may be provided between the first heat sink and the first opening and the second opening to prevent foreign matter from entering the first accommodation cavity through the gap between the first heat sink and the first opening and the second opening.

[0122] Among them, the first radiator is sealed at the first opening and the second opening, and the first opening and the second opening are tightly connected, so a seal can be set only between it and the second opening to prevent external impurities from entering the first accommodating cavity through the gap between the first radiator and the second opening.

[0123] In this embodiment, a first opening is provided in the first accommodating cavity, and the first opening is located at a position corresponding to the first heat generating component of the host system. The first heat sink of the first heat dissipation module is blocked at the first opening, so as to realize that the heat of the first heat generating component is dissipated to the external environment through the first heat sink. In addition, the electronic device also includes a first heat insulating member covering the outside of the first shell, and the first heat insulating member is provided with a second opening at a position corresponding to the first heat sink. The second opening is connected to the first opening, so that the heat dissipated by the first heat sink is dissipated to the external environment through the second opening. In addition to other positions at the second opening, a path for the first heat sink to dissipate heat is reserved on the premise of isolating the external environment temperature from the internal temperature of the first accommodating cavity, so as to ensure that the heat dissipated by the host system can be dissipated to the external environment through the first heat sink.

[0124] Figure 5 FIG. 5 is a schematic diagram of a structure of an electronic device embodiment 5 provided by the present application, wherein the electronic device comprises the following structures: a first housing 501, a host system 502, a control system 503, a first heat dissipation module 504, a first temperature adjustment module 505 and a first heat insulation member 506;

[0125] Among them, the first shell 501, the host system 502, the control system 503 and the first thermal insulation component 506 have the same structural functions as the corresponding structures in Example 4, and are not described in detail here.

[0126] A first surface of the first heat dissipation module 504 contacting the first temperature adjustment module is provided with a first accommodation groove 5041 , and the first temperature adjustment module 505 is at least partially accommodated in the first accommodation groove through the first contact portion.

[0127] The first heat dissipation module is provided with a first accommodating groove 5041, and the first accommodating groove is used to accommodate at least a part of the first contact portion of the first temperature adjustment module.

[0128] The size of the first receiving groove can be set according to the size of the first contact portion, and the thickness is not greater than the thickness of the first contact portion. The specific value of the depth of the first receiving groove is not limited in the present application.

[0129] Among them, the contact area between the first heat dissipation module and the first temperature adjustment module can be increased through the first accommodating groove. Compared with only planar contact, the first accommodating groove can achieve planar and side contact with the first temperature adjustment module, thereby increasing the contact area between the two and achieving a better heat conduction effect.

[0130] Moreover, since the first contact portion of the first temperature regulating module is at least partially accommodated in the first accommodation groove, the connection between the first temperature regulating module and the first heat dissipation module can be made more stable.

[0131] Figure 6 FIG. 1 is another structural schematic diagram of an electronic device embodiment 5 provided by the present application, wherein the electronic device includes the following structures: a first housing 601, a host system 602, a control system 603, a first heat dissipation module 604, a first temperature adjustment module 605, a first heat insulation member 606 and a second heat insulation member 607;

[0132] The first housing 601, the host system 602, the control system 603, the first heat dissipation module 604, the first temperature adjustment module 605, the first heat insulation member 606 and the Figure 5 The corresponding structures and functions are consistent and will not be described here.

[0133] The electronic device further includes a second thermal insulation member 607, the first temperature regulating module further includes a first peripheral edge connected to the first contact portion and the second contact portion, and the second thermal insulation member is at least disposed to cover the first peripheral edge.

[0134] Wherein, a second heat insulating member is coated outside a first periphery where the first contact portion and the second contact portion of the first temperature regulating module 605 are connected.

[0135] The second thermal insulation component may be disposed outside the first peripheral edge by coating or wrapping.

[0136] The second thermal insulation component may be made of the same material as the aforementioned first thermal insulation component, or may be made of a different material, which is not limited in the present application.

[0137] Among them, the second thermal insulation component is wrapped around the first periphery, so that the side where the first contact part of the first temperature control module is located is isolated from the side where the second contact part is located, preventing heat influence through the gap between different contact parts of the first temperature control module, and temperature control is achieved only through the first temperature control module.

[0138] Among them, when there is space between the host system and the first heat dissipation module in addition to the first temperature adjustment module, a second thermal insulation component can also be set in the space; when there is space in the first temperature adjustment module in addition to the first periphery, a second thermal insulation component can also be set in the space to achieve isolation between the side where the first contact part is located and the side where the second contact part is located.

[0139] Among them, the second thermal insulation member is at least partially arranged in the first receiving groove of the first heat dissipation module, and the second thermal insulation member wraps the first temperature control module, so that the part of the first temperature control module accommodated in the first receiving groove of the first heat dissipation module is completely wrapped by the second thermal insulation member, so that except for the contact area between the first temperature control module and the first heat dissipation module, the two are completely isolated by the second thermal insulation member.

[0140] Figure 7 FIG. 1 is another structural schematic diagram of an electronic device embodiment 5 provided by the present application, wherein the electronic device includes the following structures: a first housing 701, a host system 702, a control system 703, a first heat dissipation module 704, a first temperature adjustment module, a first heat insulation member 706, and a second heat insulation member 707;

[0141] The first temperature control module is composed of two TEC7051-7052, the two TECs are arranged between the host system and the first temperature control module, and the second thermal insulation component is wrapped around the outside of the two TECs.

[0142] In this embodiment, a first surface of the first heat dissipation module in contact with the first temperature adjustment module is provided with a first receiving groove, and the first temperature adjustment module is at least partially received in the first receiving groove through the first contact portion, thereby increasing the contact area between the first temperature adjustment module and the first heat dissipation module, increasing the heat conduction effect, and improving the connection stability between the two. The electronic device also includes a second thermal insulation member, and the first temperature adjustment module also includes a first peripheral edge connected to the first contact portion and the second contact portion, and the second thermal insulation member is at least coated on the first peripheral edge, so that the side of the first contact portion of the first temperature adjustment module is isolated from the side of the second contact portion, and the temperature is adjusted by the first temperature adjustment module, thereby improving the accuracy of the temperature adjustment.

[0143] Figure 8 What is shown is a schematic diagram of the structure of an electronic device embodiment 6 provided in the present application, which includes a first shell 801, a host system 802, a control system 803, a first heat dissipation module 804, a first temperature adjustment module 805, a first thermal insulation member 806, a first heat conductor 807 and a second heat conductor 808.

[0144] Among them, the structural functions of the first shell 801, the host system 802, the control system 803, the first heat dissipation module 804, the first temperature adjustment module 805, and the first thermal insulation component 806 are consistent with those in the aforementioned embodiment 5, and are not repeated in this embodiment.

[0145] The first heat-conducting member is disposed between the second contact portion of the first temperature regulating module and the first heat-generating component 8021 of the host system.

[0146] The second heat-conducting member is arranged between the first contact portion of the first temperature regulating module and the first surface of the first heat sink of the first heat dissipating module.

[0147] The first heat-conducting member can realize rapid heat conduction between the second contact portion and the first heat-generating component; and the second heat-conducting member can realize rapid heat conduction between the first contact portion and the first heat sink.

[0148] The material of the heat conducting element is not limited in this application, and it only needs to be able to be disposed between the two contact surfaces.

[0149] In some implementations, a heat conducting member is also provided between the contact surfaces of the second temperature regulating module and the control system to achieve rapid heat conduction between the two.

[0150] In some implementations, a heat conducting member is also provided between the contact surfaces of the second temperature regulating module and the second heat sink to achieve rapid heat conduction between the two.

[0151] In this embodiment, a first heat conductor is arranged between the second contact portion of the first temperature adjustment module and the first heat-generating component of the host system, and a second heat conductor is arranged between the first contact portion of the first temperature adjustment module and the first surface of the first heat sink of the first heat dissipation module, so as to realize rapid heat conduction between the contact structures at both ends of the heat conductor.

[0152] Fig. 9 The present application provides a structural schematic diagram of an electronic device embodiment 7, the electronic device includes a first housing 901, a host system 902, a control system 903, a first heat dissipation module 904, a first temperature adjustment module 905, a detection element 906, a second heat dissipation module 907, a second temperature adjustment module 908 and a first thermal insulation element 909;

[0153] Among them, the host system 902, control system 903, first heat dissipation module 904, first temperature adjustment module 905, detection component 906, second heat dissipation module 907 and second temperature adjustment module 308 have the same structural functions as those in Example 3, and are not described in detail here.

[0154] The first heat insulating member 909 is coated on the outside of the first shell 901 .

[0155] The first accommodating cavity 9011 is provided with a third opening 90111 corresponding to the second heat generating component 9031 of the control system, and the second heat sink 9071 of the second heat dissipation module is blocked at the third opening;

[0156] The first heat insulating component of the electronic device is provided with a fourth opening corresponding to the second radiator, and the fourth opening is correspondingly connected to the third opening.

[0157] The second heat generating component of the control system may be a component with the greatest temperature sensitivity or temperature variation in the control system.

[0158] Among them, a third opening is set in the first accommodating cavity, and the third opening is set corresponding to the second heating component of the control system, and the second radiator of the second heat dissipation module is sealed in the third opening, so that the heat of the second heating component can be dissipated through the third opening.

[0159] The first heat insulating member may be disposed on the outside of the first shell by coating or wrapping.

[0160] Among them, the first thermal insulation component is provided with a fourth opening corresponding to the position of the second radiator, the fourth opening is connected to the third opening, the second radiator blocked in the third opening is connected to the outside of the first shell through the fourth opening, and the second radiator can dissipate heat to the external environment through the fourth opening.

[0161] Among them, the Fig. 9In the structural diagram of , the second radiator is a component of the second heat dissipation module. In specific implementation, the second heat dissipation module may include only the second radiator, or may include the second radiator and other structures.

[0162] Wherein, a sealing member is arranged between the second heat sink and the third opening and / or the fourth opening.

[0163] In this embodiment, the first accommodating cavity is provided with a third opening corresponding to the second heat generating component of the control system, and the second heat sink of the second heat dissipation module is blocked at the third opening, so as to realize the heat dissipation of the second heat generating component to the external environment through the second heat sink. The first heat insulating member of the electronic device is provided with a fourth opening corresponding to the second heat sink, and the fourth opening is connected to the third opening, so that the heat dissipated by the second heat sink is dissipated to the external environment through the fourth opening. In addition to other positions at the fourth opening, a path for the second heat sink to dissipate heat is reserved under the premise of isolating the external environment temperature from the internal temperature of the first accommodating cavity, so as to ensure that the heat dissipated by the control system can be dissipated to the external environment through the second heat sink.

[0164] Fig.10 FIG. 1 is a schematic diagram of a structure of an electronic device embodiment 8 provided by the present application, wherein the electronic device includes a first housing 1001, a host system 1002, a control system 1003, a first heat dissipation module 1004, a first temperature adjustment module 1005, a detection element 1006, a second heat dissipation module 1007, a second temperature adjustment module 1008 and a first heat insulation element 1009;

[0165] Among them, the first shell 1001, the host system 1002, the control system 1003, the first heat dissipation module 1004, the first temperature adjustment module 1005, the detection component 1006, the second temperature adjustment module 1008 and the first thermal insulation component 1009 are consistent with the corresponding structural functions in Example 7 and are not repeated here.

[0166] A second accommodating groove 10081 is provided on the second surface of the second heat dissipation module contacting the second temperature regulating module, and the second temperature regulating module is at least partially accommodated in the first accommodating groove through the first contact portion of the second temperature regulating module.

[0167] Among them, the size of the second accommodating groove can be set according to the size of the first contact part of the second temperature adjustment module, and the thickness is not greater than the thickness of the first contact part of the second temperature adjustment module. The specific value of the depth of the second accommodating groove is not limited in this application.

[0168] Among them, the contact area between the second heat dissipation module and the second temperature control module can be increased through the second accommodating groove. Compared with only planar contact, the second accommodating groove can achieve planar and side contact with the second temperature control module, thereby increasing the contact area between the two and achieving a better heat conduction effect.

[0169] Moreover, since the first contact portion of the second temperature regulating module is at least partially accommodated in the second accommodation groove, the connection between the second temperature regulating module and the second heat dissipation module can be made more stable.

[0170] Fig.11 FIG. 1 is another structural schematic diagram of an electronic device embodiment 8 provided by the present application, wherein the electronic device includes a first housing 1101, a host system 1102, a control system 1103, a first heat dissipation module 1104, a first temperature adjustment module 1105, a detection element 1106, a second heat dissipation module 1107, a second temperature adjustment module 1108, a first heat insulation element 1109, and a third heat insulation element 1110;

[0171] The electronic device further comprises a third heat insulating member 607, the second temperature regulating module further comprises a second periphery connected to the first contact portion and the second contact portion thereof, and the third heat insulating member is at least arranged to cover the second periphery.

[0172] The third thermal insulation component may be disposed on the outer side of the second periphery by coating or wrapping.

[0173] The third thermal insulation component may be made of the same material as the aforementioned first thermal insulation component, or may be made of a different material, which is not limited in the present application.

[0174] Among them, the third thermal insulation component is wrapped around the second periphery, so that the side where the first contact part of the second temperature control module is located is isolated from the side where the second contact part is located, preventing heat influence through the gap between different contact parts of the second temperature control module, and temperature control is only achieved through the second temperature control module.

[0175] Among them, when there is space between the control system and the second heat dissipation module in addition to the second temperature adjustment module, a third thermal insulation component can also be set in the space; when there is space in the second temperature adjustment module in addition to the second periphery, a third thermal insulation component can also be set in the space to achieve isolation between the side where the first contact part of the second temperature adjustment module is located and the side where the second contact part is located.

[0176] Among them, the third thermal insulation member is at least partially arranged in the second receiving groove of the second heat dissipation module, and the third thermal insulation member wraps the second temperature control module, so that the part of the second temperature control module accommodated in the second receiving groove of the second heat dissipation module is completely wrapped by the third thermal insulation member, so that except for the contact area between the second temperature control module and the second heat dissipation module, the two are completely isolated by the third thermal insulation member.

[0177] Fig.12 1 is another structural schematic diagram of an electronic device embodiment 8 provided by the present application, the electronic device includes a first housing 1201, a host system 1202, a control system 1203, a first heat dissipation module 1204, a first temperature adjustment module 1205, a detection element 1206, a second heat dissipation module 1207, a second temperature adjustment module, a first heat insulation element 1209 and a third heat insulation element 1210;

[0178] The second temperature control module is composed of two TECs 12081 - 12082 , which are arranged between the control system and the second temperature control module 705 , and a third heat insulating member is wrapped around the outer side of the two TECs.

[0179] In this embodiment, a second surface of the second heat dissipation module in contact with the second temperature adjustment module is provided with a second receiving groove, and the second temperature adjustment module is at least partially received in the second receiving groove through the first contact portion of the second temperature adjustment module, thereby increasing the contact area between the second temperature adjustment module and the second heat dissipation module, increasing the heat conduction effect, and improving the connection stability between the two. The electronic device also includes a third thermal insulation member, and the second temperature adjustment module also includes a second periphery connected to the first contact portion and the second contact portion thereof, and the third thermal insulation member is at least coated on the second periphery, so that the side of the second temperature adjustment module where the first contact portion is located is isolated from the side where the second contact portion is located, and the temperature is adjusted by the second temperature adjustment module, thereby improving the accuracy of the temperature adjustment.

[0180] like Fig.13 The figure shows a schematic diagram of the structure of an electronic device embodiment 9 provided by the present application, the electronic device includes the following structures: a first housing 1301, a host system 1302, a control system 1303, a first heat dissipation module 1304 and a first temperature adjustment module 1305;

[0181] Among them, the first housing 1301, the host system 1302, the first heat dissipation module 1304 and the first temperature adjustment module 1305 have the same structure and function as the corresponding ones in Example 1, and are not described in detail here.

[0182] The control system and the host system are respectively arranged in two mutually isolated accommodation spaces of the first accommodation cavity.

[0183] The first accommodating cavity of the first shell includes two accommodating spaces, the control system and the host system are respectively arranged in the two accommodating spaces, and the two accommodating spaces are isolated by a heat conducting plate, and the two are isolated but not heat-insulated.

[0184] In which, when wired signal transmission is adopted between the control system and the first heat dissipation module and the second heat dissipation module, or when wired signal transmission is adopted between the control system and the detection room set in the accommodating space accommodating the host system, a wire threading hole may be provided on the heat conducting plate so that the signal transmission line can be connected to the devices at both ends through the wire threading hole.

[0185] like Fig.14 The structure diagram of the control system in this embodiment is shown, including a controller 1401 and a power supply module 1402;

[0186] The power supply module is used to supply power to at least one of the host system, the first heat dissipation module and the first temperature adjustment module;

[0187] The controller can control the power supply parameters of the power supply module to supply power to at least one of the host system, the first heat dissipation module or the first temperature adjustment module.

[0188] Among them, the power supply parameters in the host system can be set according to the operation requirements of the host system, and the relevant information of the operation control can be preset in the controller.

[0189] The controller may analyze and determine the power supply parameters of the first heat dissipation module and the first temperature adjustment module according to the environmental parameters of the host system.

[0190] The controller can also respond to a control instruction from a target mobile terminal to control the operating state of the electronic device, and the target mobile terminal is a device that is physically isolated from the electronic device.

[0191] The controller is also provided with structures such as a network chip and an antenna to receive control instructions from a mobile terminal, making it convenient for an operator to remotely control structures in an electronic device through a mobile terminal.

[0192] The target mobile terminal has a control interface, which includes an environmental parameter area and / or a control area.

[0193] The mobile terminal can receive the environmental parameters of the host system, which can be directly uploaded by the detection element to the mobile terminal, or the control system can forward the environmental parameters received from the detection element to the mobile terminal.

[0194] The control interface of the mobile terminal includes an environmental parameter area, at least one item in the control area, and the like.

[0195] Among them, the control area is an area for controlling the working parameters of each item in the first heat dissipation module and the first temperature adjustment module. Specifically, the operator can adjust the working parameters of each item in the first heat dissipation module and the first temperature adjustment module by inputting control operations in the control area.

[0196] Among them, the control area can also set selection modes, such as cooling mode, heating mode, performance mode and energy-saving mode. Among them, the cooling mode is to cool the host system by controlling the working parameters of the first heat dissipation module and the first temperature adjustment module; the heating mode is to heat the host system by controlling the working parameters of the first heat dissipation module and the first temperature adjustment module; the performance mode is to control the temperature and humidity of the host system under the premise of ensuring the performance of the host system; the energy-saving mode can be to control the temperature and humidity of the host system under the premise of energy saving (reducing the performance of the host system).

[0197] like Fig.15 The control interface diagram of the mobile terminal in this embodiment is shown, and the control interface includes: a parameter display area 1501 and a control area 1502. The parameter display area includes a temperature and humidity information output area and a main monitoring module. The main monitoring module is used to output environmental parameters (which may include the temperature and humidity inside the first accommodating cavity and outside the first shell and the host system). The control area 1502 includes a mode control area, an anti-condensation module, an energy management module, a CPU (central processing unit) control module, a fan control module and a TEC control module. The mode control area has selectable modes, such as cooling mode, heating mode, performance mode and energy-saving mode; the anti-condensation module is used to prompt condensation information and start the anti-condensation function button; the energy management module is used to control the energy consumption in the electronic device; the CPU control module is used to output CPU-related information and control buttons; the fan control module is used to control the speed of the fan; the TEC control module is used to control the status of each TEC.

[0198] In this embodiment, the control system and the host system are respectively arranged in two mutually isolated accommodating spaces of the first accommodating cavity to isolate the control system from the host system. The control system includes a controller and a power supply module. The controller can control the power supply parameters of the power supply module to supply power to at least one of the host system, the first heat dissipation module or the first temperature adjustment module. The power supply module can provide electrical energy to each power-consuming structure in the electronic device, and the controller can control the power supply parameters of the power supply module to achieve controllable power supply parameters of each power-consuming structure in the electronic device. The controller can also respond to the control instructions of the target mobile terminal to control the operating state of the electronic device. The target mobile terminal is a device that is physically isolated from the electronic device, thereby realizing remote control of the structure in the electronic device.

[0199] The present application provides an application scenario of the electronic device, in which the heat dissipation module uses a heat sink and a fan, the temperature control module uses TEC, the host system includes a mainboard and a heating component, and the control system includes a power module, a control board and a heating component.

[0200] like Fig.16 What is shown is a schematic diagram of the structure of an electronic device in an application scenario, including: a shell, a first accommodating cavity in the shell divided into two accommodating spaces, a host system, a control system, a thermal insulation member wrapping the shell, a heat sink arranged corresponding to the heat-generating components of the host system, two TECs and fans, a heat sink arranged corresponding to the heat-generating components of the control system, three TECs and fans, and a thermal insulation member wrapped around the TEC.

[0201] like Fig.17 The figure shows the sensor arrangement diagram of the electronic device in this application scenario. Fig.16 Consistent in.

[0202] A temperature and humidity sensor 1701 is provided in the accommodation space where the host system is located to detect the temperature and humidity of the host area; temperature sensors 1702-1703 are provided at both ends (cold end and hot end) of the TEC corresponding to the host system to detect the temperature of the cold end and hot end of the TEC. A temperature and humidity sensor 1704 is provided in the accommodation space where the control system is located to detect the temperature and humidity of the control area; temperature sensors 1705-1706 are provided at both ends (cold end and hot end) of the TEC corresponding to the control system to detect the temperature of the cold end and hot end of the TEC; a temperature and humidity sensor 1707 is provided on the outside of the shell to detect the external temperature and humidity.

[0203] By monitoring temperature and humidity through sensors, the control strategies of TEC, CPU power and fans are adjusted in real time to ensure the normal operation of each component, the temperature and humidity inside the system are within the normal working range, and condensation is effectively prevented.

[0204] Specifically: By monitoring the temperature of the hot and cold surfaces of TEC, combined with the CPU temperature, ambient temperature and internal temperature of the system, the TEC voltage / current, fan speed, and CPU power limit are adjusted in time; by monitoring the internal and external environmental temperature and humidity, the TEC voltage / current, fan speed, and CPU power are adjusted in time to ensure the normal operation of the system and prevent condensation.

[0205] By integrating the host system with the temperature control module and the heat dissipation module, the volume is compact and the TEC direct cooling / heating efficiency is high.

[0206] At low temperatures, the detection component can detect the time required for four nodes, including power-on, control system starting heating mode, host system reaching stable operation, and startup, as well as the temperature of each temperature / temperature and humidity sensor detection point.

[0207] At low temperatures (such as minus 40 degrees Celsius ambient temperature), compared with the startup time of the host in the compression refrigeration cabinet in the prior art, the time required for the host to start up normally using the electronic device in this application is shorter, and this solution can heat the host to the operating temperature in a very short time.

[0208] Among them, at high temperatures, the detection component can detect CPU-related information and the temperature of each temperature / temperature and humidity sensor detection point, wherein the CPU-related information includes CPU temperature, the total power consumption of the CPU, and the power level (such as level 1 (PL1)) can also be provided to the control system.

[0209] Under high temperature conditions, the electronic device in the present application can cool down the host system, and the TEC cold surface can reach below 60°C.

[0210] In this specification, each embodiment is described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the embodiments can be referred to each other. For the device provided in the embodiment, since it corresponds to the method provided in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0211] The above description of the embodiments provided enables professionals and technicians in the field to implement or use the present application. Various modifications to these embodiments will be apparent to professionals and technicians in the field, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features provided herein.

Claims

1. An electronic device, characterized in that: include: A first housing is formed with a first accommodating cavity, wherein a host system and a control system are arranged in the first accommodating cavity; A first heat dissipation module, used for dissipating heat from the host system; a first temperature adjustment module, at least arranged between the host system and the first heat dissipation module, the first temperature adjustment module comprising a first contact portion and a second contact portion arranged opposite to each other, the first temperature adjustment module contacts the first heat dissipation module through the first contact portion, and contacts the heat generating component of the host system through the second contact portion; The control system is connected to the first temperature adjustment module by signal, and can control the first temperature adjustment module to increase or decrease the temperature of the host system through its second contact portion.

2. The electronic device according to claim 1, characterized in that: The electronic device also includes a detection device for detecting environmental parameters of the spatial environment in which the host system is located. The detection device is connected to the control system signal to provide the detected environmental parameter data to the control system; the control system can control the working parameters of the first temperature control module and / or the first heat dissipation module according to the environmental parameter data.

3. The electronic device according to claim 2, characterized in that: The electronic device further comprises a second heat dissipation module for dissipating heat from the control system, and a second temperature adjustment module arranged between the control system and the second heat dissipation module; The control system can also control the working parameters of the second temperature adjustment module and / or the second heat dissipation module according to the environmental parameter data.

4. The electronic device according to claim 1, characterized in that: The first accommodating cavity is provided with a first opening corresponding to the first heat-generating component of the host system, and the first heat sink of the first heat dissipation module is blocked at the first opening; The electronic device further includes a first heat insulating member, which is coated on the outside of the first shell. The first heat insulating member is provided with a second opening corresponding to the first heat sink, and the first opening is correspondingly connected to the second opening.

5. The electronic device according to claim 4, characterized in that: A first accommodating groove is provided on a first surface of the first heat dissipation module contacting the first temperature regulating module, and the first temperature regulating module is at least partially accommodated in the first accommodating groove through the first contact portion; and / or, The electronic device further includes a second heat insulating member, the first temperature regulating module further includes a first periphery connected to the first contact portion and the second contact portion, and the second heat insulating member is at least disposed to cover the first periphery.

6. The electronic device according to claim 5, characterized in that: A first heat-conducting member is disposed between the second contact portion and the first heat-generating component, and / or a second heat-conducting member is disposed between the first contact portion and the first surface of the first heat sink; and / or, The second thermal insulation member is at least partially disposed in the first accommodating groove; and / or, A first sealing member is disposed between the first heat sink and the first opening and / or the second opening.

7. The electronic device according to claim 3, characterized in that: The first accommodating cavity is provided with a third opening corresponding to the second heat-generating component of the control system, and the second heat sink of the second heat dissipation module is blocked at the third opening; The first heat insulating member of the electronic device is provided with a fourth opening corresponding to the second radiator, and the fourth opening is correspondingly connected to the third opening.

8. The electronic device according to claim 7, characterized in that: A second surface of the second heat dissipation module contacting the second temperature adjustment module is provided with a second accommodation groove, and the second temperature adjustment module is at least partially accommodated in the second accommodation groove through the first contact portion of the second temperature adjustment module; and / or, The electronic device further includes a third heat insulating member, the second temperature regulating module further includes a second periphery connected to the first contact portion and the second contact portion thereof, and the third heat insulating member is at least disposed to cover the second periphery.

9. The electronic device according to claim 3, characterized in that: The temperature adjustment module includes a refrigerator; The first contact portion and the second contact portion are respectively a hot end and a cold end of the refrigerator, and the refrigerator can cool down the heat-generating component in the first accommodating cavity through the cold end; or, The first contact portion and the second contact portion are respectively a cold end and a hot end of the refrigerator, and the refrigerator can heat up the heat-generating component in the first accommodating cavity through the hot end.

10. The electronic device according to claim 1, characterized in that: The control system and the host system are respectively arranged in two mutually isolated accommodation spaces of the first accommodation cavity; and / or, The control system includes a controller and a power supply module, the controller can control the power supply parameters of the power supply module to supply power to at least one of the host system, the first heat dissipation module or the first temperature adjustment module, and / or the controller can also respond to a control instruction of a target mobile terminal to control the operating state of the electronic device, and the target mobile terminal is a device isolated from the electronic device in physical space; and / or, The target mobile terminal has a control interface, and the control interface includes an environment parameter area and / or a control area.

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