Electronic equipment

Abstract

The utility model discloses an electronic device, comprising: a case housing having an accommodating space; the heating assembly is arranged in the accommodating space and can generate heat; the heat dissipation assembly is arranged in the accommodating space; the heat dissipation assembly can drive airflow to dissipate heat of the heat dissipation assembly; the adjusting assembly is located between the heating assembly and the heat dissipation assembly; the adjusting assembly can adjust the airflow flowing to the heating assembly, and when the adjusted airflow passes through the heating assembly, the disturbance degree of the heating assembly is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] As server performance increases, cooling requirements also increase, and air-cooled servers have higher and higher fan speeds, which in turn leads to increased vibration / noise.

[0003] Taking the hard disk in the server as an example, as the technology develops and improves from generation to generation, the magnetic density of the disk is also increasing, and the maximum allowable position tolerance of the read and write heads is also decreasing. As the capacity of the hard disk increases, it is possible that the hard disk will become more sensitive to external disturbances, causing the performance of the hard disk to decline. Utility Model Content

[0004] In view of this, the present application provides an electronic device that ensures the performance of the heating component.

[0005] To achieve the above objectives, this application provides the following technical solutions:

[0006] An electronic device, comprising:

[0007] A chassis shell, wherein the chassis shell has a receiving space;

[0008] A heating component, which is disposed in the accommodation space and is capable of generating heat;

[0009] A heat dissipation component, which is disposed in the accommodation space and can drive airflow to dissipate heat from the heat generating component;

[0010] An adjusting component is located between the heating component and the heat dissipation component; the adjusting component can adjust the airflow flowing to the heating component, and the degree of disturbance of the heating component caused by the adjusted airflow passing through the heating component is reduced.

[0011] Optionally, in the above electronic device, the adjustment component includes an adjustment component and a support component;

[0012] The supporting component can position the adjusting component between the heat generating component and the heat dissipating component, and the airflow flowing toward the heat generating component can flow toward the heat generating component after being adjusted by the adjusting component.

[0013] Optionally, in the above electronic device, both ends of the support component have connecting parts, and the connecting parts can be detachably connected to the side walls of the chassis shell;

[0014] Both ends of the supporting component are arranged along a first direction, and the heat generating component and the heat dissipating component are arranged along a second direction, and the first direction is different from the second direction.

[0015] Optionally, in the above electronic device, the supporting component includes a supporting portion, and the adjusting component is arranged on a side of the supporting component facing the heat dissipation component;

[0016] The supporting part has a first avoidance hole, and the adjusting part has a second avoidance hole arranged corresponding to the first avoidance hole. The first avoidance hole and the second avoidance hole constitute a first avoidance structure arranged corresponding to the heat dissipation hole structure of the heat-generating component, and the airflow can flow toward the heat-generating component through the first avoidance structure.

[0017] Optionally, in the above electronic device, the supporting parts are multiple in number and arranged along the first direction, and the supporting component further includes a bending part connecting two adjacent supporting parts, and the bending part can be bent in a direction perpendicular to the first direction.

[0018] Optionally, in the above electronic device, the adjustment component has a hole-shaped structure;

[0019] The hole-shaped structure can reduce the noise transmitted to the heat-generating component through the airflow and / or can reduce the airflow disturbance of the airflow.

[0020] Optionally, in the above electronic device, the supporting component has a supporting structure and a connecting structure, the supporting structure has a first surface and a second surface opposite to each other, the first surface faces away from the heating component, the connecting structure is located on the second surface, and the adjusting component is connected to the connecting structure;

[0021] The supporting structure is connected to the heat generating component.

[0022] Optionally, in the above electronic device, the adjusting component is arranged on a side of the connecting structure facing the heat dissipation component;

[0023] The connection structure has a first area and a second area, the first area can be connected to the adjustment component, and the second area has a second avoidance structure arranged corresponding to the heat dissipation hole structure of the heat-generating component, and the airflow can flow to the heat-generating component through the second avoidance structure.

[0024] Optionally, in the above electronic device, the supporting component further comprises a plug-in structure detachably connected to the connecting structure; the plug-in structure has a third area that can be connected to the adjusting component;

[0025] The third area is larger than the fourth area, and the fourth area is an area where the first area is blocked by the plug-in structure and cannot be connected to the adjusting component.

[0026] Optionally, in the above electronic device, the adjustment component has a hole-shaped structure;

[0027] The hole-shaped structure can reduce the noise transmitted to the heat-generating component through the airflow and / or can reduce the airflow disturbance of the airflow. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0030] Figure 2 A schematic diagram of the installation of the first adjustment component provided in an embodiment of the present application;

[0031] Figure 3 A schematic diagram of the structure of a first adjustment component provided in an embodiment of the present application;

[0032] Figure 4 A schematic diagram of the exploded structure of the first adjustment component provided in an embodiment of the present application;

[0033] Figure 5 A schematic diagram of the structure of a second adjustment component provided in an embodiment of the present application;

[0034] Figure 6 A schematic diagram of the partial structure of the second adjustment component provided in an embodiment of the present application. DETAILED DESCRIPTION

[0035] The present application discloses an electronic device, which ensures the performance of a heating component.

[0036] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] like Figure 1As shown, an embodiment of the present application provides an electronic device, including a chassis housing 100, a heating component 200, a heat dissipation component 300 and an adjustment component.

[0038] The chassis shell 100 has a accommodating space; the heating component 200 is arranged in the accommodating space and can generate heat; the heat dissipation component 300 is arranged in the accommodating space and can drive the airflow to dissipate heat from the heating component 200; the adjustment component is located between the heating component 200 and the heat dissipation component 300; the adjustment component can adjust the airflow flowing to the heating component 200, and the degree of disturbance of the heating component 200 caused by the adjusted airflow passing through the heating component 200 is reduced.

[0039] In the process where the heat dissipation component 300 drives the airflow to dissipate heat from the heat generating component 200, the airflow is affected by factors such as the noise carried by the airflow and the airflow disturbance of the airflow itself, causing the heat generating component 200 to be disturbed when the airflow contacts the heat generating component 200.

[0040] The electronic device provided in the embodiment of the present application can effectively reduce the degree of disturbance caused by contact between the heating component 200 and the airflow, thereby ensuring the performance of the heating component 200, by correspondingly adjusting the airflow flowing to the heating component 200.

[0041] In the embodiment where the electronic device is a server, the heating component 200 may be a hard disk module. Specifically, hard disk modules are arranged at the front, middle and rear of the server. For example, a 2U server may have up to 40 2.5" HDDs (Hard Disk Drives) and 20 3.5" HDDs placed at the front, middle and rear. Among them, the middle hard disk module is the hard disk module most obviously affected by vibration and noise. Therefore, the heating component 200 may be a middle hard disk module.

[0042] Of course, the heating component 200 may also be other components whose performance is affected by disturbances, which are not specifically limited here and are all within the scope of protection.

[0043] The heat dissipation component 300 may be a fan module.

[0044] In order to facilitate the adjustment of the airflow, the adjustment component includes an adjustment component and a support component; the support component can position the adjustment component between the heating component 200 and the heat dissipation component 300, and the airflow flowing to the heating component 200 can flow to the heating component 200 through the adjustment of the adjustment component. Since the adjustment component can adjust the airflow, the strength of its own structure may not meet the positioning effect. By setting the adjustment component to a combined structure including the adjustment component and the support component, the adjustment component can meet the adjustment of the airflow, and the support component meets the support positioning requirements.

[0045] Of course, the adjustment component may also include only the adjustment component, which is connected to the existing structure in the electronic device (such as the chassis housing 100, the heating component 200 or the heat dissipation component 300, etc.) to achieve the function of positioning the adjustment component between the heating component 200 and the heat dissipation component 300.

[0046] like Figure 1 As shown, the adjustment component can be the first adjustment component 400 or the second adjustment component 600, and the structures of the first adjustment component 400 and the second adjustment component 600 are different. The same electronic device can have only the first adjustment component 400, only the second adjustment component 600, or both the first adjustment component 400 and the second adjustment component 600.

[0047] like Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, in the first embodiment, the adjusting component is a first adjusting component 400 .

[0048] The two ends of the support component 410 have connecting parts 430, which can be detachably connected to the side wall 110 of the chassis shell 100; the two ends of the support component 410 are arranged along a first direction, and the heating component 200 and the heat dissipation component 300 are arranged along a second direction, and the first direction is different from the second direction.

[0049] Since the first direction is different from the second direction, when the first adjustment component 400 is located between the heating component 200 and the heat dissipation component 300 , the airflow flowing from the heat dissipation component 300 to the heating component 200 can be effectively adjusted.

[0050] Preferably, the first direction is relatively perpendicular to the second direction. Figure 1 As shown, the first direction is Figure 1 The up and down directions of the view structure shown, the second direction is Figure 1 The left-right direction of the view structure shown.

[0051] Through the above arrangement, both ends of the adjustment component (first adjustment component 400 ) are detachably connected to the side walls 110 of the chassis shell 100 , so that the adjustment component 420 can be positioned between the heating component 200 and the heat dissipation component 300 .

[0052] In a specific embodiment, Figure 2As shown, the side wall 110 has a bayonet, and the connecting portion 430 has a clamping portion that can cooperate with the bayonet. The operator can contact the clamping portion from the outside of the side wall 110 (the outside of the accommodating space of the chassis housing 100), so as to achieve relative connection and separation between the side wall 110 and the connecting portion 430 by moving the clamping portion relative to the bayonet.

[0053] Furthermore, the connecting portion 430 also has a pressing portion, and when the pressing portion is pressed by an external force, the clamping portion can be relatively separated from the bayonet; when the pressing portion is not pressed, the clamping portion can be clamped with the bayonet, so that the connecting portion 430 is relatively connected to the side wall 110. Through the above arrangement, the disassembly and assembly operation of the adjustment component can be achieved without tools.

[0054] In order to ensure smooth flow of airflow, the combined structure of the support component 410 and the adjustment component 420 has a first avoidance structure arranged corresponding to the heat dissipation hole structure of the heating component 200, and the airflow can flow toward the heating component 200 through the first avoidance structure.

[0055] Specifically, Figure 4 As shown, the support component 410 includes a support portion 411, and the adjustment component 420 is arranged on the side of the support component 410 facing the heat dissipation component 300; the support portion 411 has a first avoidance hole 4111, and the adjustment component 420 has a second avoidance hole 421 corresponding to the first avoidance hole 4111, and the first avoidance hole 4111 and the second avoidance hole constitute a first avoidance structure corresponding to the heat dissipation hole structure of the heating component 200, and the airflow can flow to the heating component 200 through the first avoidance structure.

[0056] In this embodiment, the first avoidance hole 4111 and the second avoidance hole 421 are both square holes, and their shapes correspond to the heat dissipation hole structure of the heating component 200 , so as to guide the airflow to flow toward the heat dissipation hole structure of the heating component 200 .

[0057] Furthermore, the adjusting component 420 can be connected to the supporting portion 411 by bonding or snap connection. Preferably, the lower edge of the supporting portion 411 has a bent edge to support the bottom surface of the adjusting component 420 and reduce the probability of separation of the adjusting component 420 from the supporting portion 411.

[0058] Since the adjusting component 420 is arranged on the side of the supporting component 410 facing the heat dissipation component 300, before the airflow flows into the first avoidance structure, the airflow first contacts the side of the adjusting component 420 facing the heat dissipation component 300. During this process, the adjusting component 420 can adjust the airflow.

[0059] Moreover, when the airflow flows along the first avoidance structure, since the adjusting component 420 has a second avoidance hole 421 corresponding to the first avoidance hole 4111, when the airflow enters the second avoidance hole 421, the airflow contacts the inner wall of the second avoidance hole 421. During this process, the adjusting component 420 can also adjust the airflow.

[0060] That is, the regulating component 420 has a first contact surface perpendicular to the airflow direction and a second contact surface along the airflow direction. The airflow direction may be parallel to the second direction, and the airflow flows from the heat dissipation component 300 to the heating component 200, that is, the airflow flows along the arrangement direction of the heat dissipation component 300 and the heating component 200.

[0061] Both of these two contact surfaces can be functional surfaces that can adjust the airflow, that is, during the process of the airflow contacting these two surfaces, the airflow can be adjusted, thereby reducing the degree of disturbance caused by the contact between the heating component 200 and the airflow.

[0062] Of course, only one of the above-mentioned contact surfaces can be used as a functional surface that can adjust the airflow. For example, the first contact surface is a functional surface, so that when the airflow contacts the side of the regulating component 420 facing the heat dissipation component 300 (the first contact surface), the airflow can be adjusted; then, the airflow after adjustment passes through the first avoidance structure composed of the second avoidance hole 421 and the first avoidance hole 4111 to flow toward the heating component 200. Alternatively, the second contact surface is a functional surface, the airflow contacts the side of the regulating component 420 facing the heat dissipation component 300 and flows toward the first avoidance structure, and when passing through the second avoidance hole 421, the airflow contacts the inner wall of the second avoidance hole 421 (the second contact surface), thereby adjusting the airflow.

[0063] In this embodiment, there may be multiple adjusting components 420 , so as to respectively correspond to multiple heat dissipation hole structures of the heat generating components 200 , or to the heat dissipation hole structures of multiple heat generating components 200 .

[0064] Furthermore, the number of the supporting portions 411 is multiple and arranged along the first direction, and the supporting component 410 further includes a bending portion 412 connecting two adjacent supporting portions 411, and the bending portion 412 can be bent perpendicular to the first direction. Through the above arrangement, the distance between the two connecting portions 430 can be adjusted by bending the bending portion 412, thereby facilitating the connection and removal of the connecting portion 430 and the side wall 110.

[0065] Furthermore, by providing the bending portion 412 , the support component 410 can have a certain elastic deformation in the first direction, thereby avoiding the impact of the airflow on the support component 410 in the initial state of contact with the support component 410 , and improving the structural stability of the support component 410 .

[0066] The bending portion 412 can be set as an elastic bending portion, that is, when an external force is applied to the supporting component 410, the bending portion 412 can be bent to different degrees by the force, so that the supporting component 410 produces corresponding deformation; when the external force disappears or weakens, the bending portion 412 can restore to the initial bending degree by its own elastic restoring force.

[0067] In a specific embodiment, the adjustment component has a hole structure, wherein the hole structure can reduce the noise transmitted to the heating component 200 through the airflow. The hole structure can also reduce the airflow disturbance of the airflow.

[0068] When the airflow flows from the heat dissipation component 300 to the heating component 200, it can reduce noise and airflow disturbance after contacting the hole structure of the adjustment component, thereby adjusting the airflow. The adjusted airflow passes through the first avoidance structure and flows to the heating component 200.

[0069] In this embodiment, the adjusting component is preferably sound-absorbing cotton, and the porous structure is the pore structure of the sound-absorbing cotton.

[0070] Among them, the pore structure of the sound-absorbing cotton can serve as an auxiliary channel for air flow, that is, in the process of air flow flowing from the heat dissipation component 300 to the heating component 200, a small part of the gas can pass through the pore structure of the sound-absorbing cotton and flow to the first avoidance structure, while most of the gas passes through the first avoidance structure, so as to reduce the resistance of the air flow through the regulating component.

[0071] The hole-like structure may also be used only as an adjustment structure for regulating airflow, and the airflow does not pass through the hole-like structure.

[0072] Of course, in an embodiment where there is no second avoidance hole 421 and only the first avoidance hole 4111 , the adjusting component is sound-absorbing cotton, and the airflow needs to pass through the pore structure of the sound-absorbing cotton and flow through the first avoidance hole 4111 to the rear heating component 200 .

[0073] The porous structure of the sound-absorbing cotton can reduce the noise transmitted to the heating component 200 through the airflow. The specific principle is that the sound waves (noise) of the airflow enter the pore structure of the sound-absorbing cotton and are reflected multiple times therein, increasing the contact area between the sound waves and the sound-absorbing cotton material, thereby improving the absorption efficiency of the sound waves. In addition, the solid material (fiber material) inside the sound-absorbing cotton will damp the sound waves. In the process of the sound waves entering the pore structure of the sound-absorbing cotton and contacting the solid material, the sound wave energy is converted into tiny heat, thereby reducing the propagation of the sound waves.

[0074] The porous structure of the sound-absorbing cotton can reduce the airflow disturbance. The specific principle is that the airflow enters the sound-absorbing cotton through the pore structure of the sound-absorbing cotton. When the airflow passes through these pores, it will undergo multiple reflections, refractions and diffusions, reducing the kinetic energy of the airflow, thereby reducing the flow rate and turbulence of the airflow.

[0075] Therefore, sound-absorbing cotton can not only absorb sound waves, but also reduce the disturbance of airflow.

[0076] Of course, the adjustment component can also be set to other components, such as a sound-absorbing panel (soundproof panel) or a soundproof screen, and the sound absorption and noise reduction effect can be achieved through the structure of the sound-absorbing panel or the soundproof screen.

[0077] The regulating component may also be provided as a component capable of reducing air flow disturbance.

[0078] like Figure 1 and Figure 5 As shown, in the second embodiment, the adjusting component is a second adjusting component 600 .

[0079] The supporting component has a supporting structure 610 and a connecting structure 620. The supporting structure 610 has a first surface and a second surface opposite to each other. The first surface faces away from the heating component 200. The connecting structure 620 is located on the second surface. The adjusting component is connected to the connecting structure 620. The supporting structure 610 is connected to the heating component 200.

[0080] In this embodiment, the support structure 610 of the adjustment component is connected to the heating component 200 to achieve positioning of the support component, and the adjustment component is connected to the connection structure 620 to achieve the operation of positioning the adjustment component between the heating component 200 and the heat dissipation component 300.

[0081] Specifically, the chassis housing 100 of the electronic device includes a housing having a accommodating cavity and an upper cover arranged on the housing, and the upper cover seals the accommodating cavity to form an accommodating space for accommodating the heating component 200, the heat dissipation component 300 and the adjustment component.

[0082] When the adjustment component is installed in the accommodating cavity, the connection structure 620 is inserted between the heating component 200 and the heat dissipation component 300, and the second surface of the support structure 610 contacts the surface (top surface) of the heating component 200 facing the opening of the accommodating cavity. Through the connection between the upper cover and the shell, the inner wall of the upper cover contacts the first surface of the support structure 610, so that the support structure 610 is clamped between the upper cover and the heating component 200, thereby playing a positioning role. Through the above arrangement, the disassembly and assembly operation of the adjustment component in a limited space without tools is realized.

[0083] In this embodiment, other components, such as heat sink fins 500, are also included between the heating component 200 and the heat sink component 300. The second surface of the support structure 610 contacts the top surface of the heating component 200 and the heat sink fins 500, and the connecting structure 620 is located between the heating component 200 and the heat sink fins 500.

[0084] In this embodiment, the adjustment component is disposed on the side of the connection structure 620 facing the heat dissipation component 300; the connection structure 620 has a first area and a second area, the first area can be connected to the adjustment component, and the second area has a second avoidance structure corresponding to the heat dissipation hole structure of the heat dissipation component 200, and the airflow can flow toward the heat dissipation component 200 through the second avoidance structure. That is, after the airflow contacts and adjusts the adjustment component, it flows through the second avoidance structure in the second area and flows toward the heat dissipation component 200.

[0085] Specifically, the connection structure 620 is a grid structure, the solid part of which is the first area, and the hollow part is the second area.

[0086] To facilitate adjustment, the supporting component also includes a plug-in structure 630 that is detachably connected to the connecting structure 620; the plug-in structure 630 has a third area that can be connected to the adjusting component; the third area is larger than the fourth area, and the fourth area is an area where the first area is blocked by the plug-in structure 630 and cannot be connected to the adjusting component.

[0087] That is, in a state where the plug-in structure 630 is connected to the connection structure 620 , the total area that can be connected to the adjustment member increases.

[0088] Through the above arrangement, it is possible to choose whether to install the plug-in structure 630 according to specific needs, thereby controlling the total area of ​​the adjustment components and adjusting the airflow adjustment effect.

[0089] In this embodiment, the connection structure 620 is a grille structure, and the plug-in structure 630 can be installed on the solid part of the grille structure. The solid part where the plug-in structure 630 is installed is blocked by the plug-in structure 630 and cannot be connected to the adjustment component. The surface of the adjustment component forms a third area to which the adjustment component can be connected.

[0090] Of course, in a specific configuration, when the plug-in structure 630 is connected to the connection structure 620, the adjustment component may be provided only on the plug-in structure 630, that is, the adjustment component may be provided only in the third region, and no adjustment component may be provided on the connection structure 620. Alternatively, the adjustment component may be provided on both the connection structure 620 and the plug-in structure 630.

[0091] It is also possible to set an adjustment component on the connection structure 620 when the connection structure 620 is not connected to the plug-in structure 630 .

[0092] The connection structure 620 has a third surface facing the heat dissipation assembly 300, and the adjustment component can be connected to the third surface of the connection structure 620 by pasting, snapping or other positioning members. In addition, the plug-in structure 630 is also connected to the third surface of the connection structure 620. Among them, except for one side of the plug-in structure 630 facing the third surface of the connection structure 620, the other outer surfaces of the plug-in structure 630 can be connected to the adjustment component, and the adjustment component can be connected to the plug-in structure 630 by pasting, snapping or other positioning members.

[0093] That is, when the connection structure 620 is connected to the plug-in structure 630, the total area where the adjustment components can be set is increased. That is, the plug-in structure 630, as a component that increases the area where the adjustment components can be connected, can be used to set the adjustment components on the plug-in structure 630 so as to cooperate with the connection structure 620 to achieve the function of increasing the total area of ​​the adjustment components, and the degree of freedom of adjusting the total amount of connected adjustment components can be increased, so as to adjust the total amount of adjustment components set on the adjustment component (the second adjustment component 600) and the setting position of the adjustment components according to actual needs. Specifically, when the heating component 200 has a higher anti-disturbance requirement (such as when the heating component 200 is a hard disk module with a large capacity), the total amount of the adjustment components can be increased, such as setting the adjustment components on both the connection structure 620 and the plug-in structure 630 as described above.

[0094] When the heating component 200 has a higher heat dissipation requirement (for example, the heating component 200 is a hard disk module and the heat dissipation is large), it is necessary to reduce the obstruction to the airflow. An adjustment component can be set only on the connecting structure 620 to reduce the obstruction of the airflow by the adjustment component, so as to facilitate the airflow to flow to the heating component 200 through the second avoidance structure in the second area.

[0095] like Figure 6 As shown, the connection structure 620 has a snap-fit ​​structure 621 , and the plug-in structure 630 has a snap-fit ​​portion 631 , and the snap-fit ​​portion 631 is snapped into the snap-fit ​​structure 621 .

[0096] In order to facilitate the insertion of the snap-on portion 631 into the snap-on structure 621, the snap-on portion 631 is generally a columnar structure such as a cylinder, and the snap-on structure 621 is a C-shaped ring structure with an opening. Through the elastic deformation of the snap-on structure 621, the snap-on portion 631 enters the interior of the C-shaped ring structure from the opening of the C-shaped ring structure. Since the inner wall of the C-shaped ring structure hugs the outer wall of the snap-on portion 631, under the action of the gravity of the plug-in structure 630 or the pressure exerted by contact with the airflow, the snap-on portion 631 is easily rotated in the snap-on structure 621, thereby affecting the positioning effect of the plug-in structure 630. For example, in an embodiment where the plug-in structure 630 has a clamping portion 631 at one end close to the connection structure 620, the other end of the plug-in structure 630 extends in a direction away from the connection structure 620, so that the extension direction from one end of the plug-in structure 630 to the other end thereof is perpendicular to the third surface of the connection structure 620, and the center of gravity of the plug-in structure 630 is located between one end of the plug-in structure 630 and the other end thereof. Under the action of gravity, the other end of the plug-in structure 630 is easily moved downward, thereby driving the clamping portion 631 to rotate in the buckle structure 621, and after the plug-in structure 630 rotates and tilts at a certain angle, it is easy for the plug-in structure 630 to cover the second avoidance structure of the second area of ​​the connection structure 620. Therefore, in order to improve the positioning effect, the clamping portion 631 is fixed to the buckle structure 621 by a positioning connector 640. Among them, the positioning connector 640 can be a component such as a screw, so as to realize the positioning of the connection structure 620 and the plug-in structure 630, and avoid the plug-in structure 630 from moving relative to the connection structure 620 and covering the second avoidance structure.

[0097] In this embodiment, the adjusting component has a hole structure; the hole structure can reduce the noise transmitted to the heating component 200 through the airflow, and can also enable the hole structure to reduce the airflow disturbance of the airflow.

[0098] As above, the regulating component can be sound-absorbing cotton, or a sound-absorbing board (soundproof board) or a soundproof screen, etc. The pore structure of the sound-absorbing cotton can be used as an auxiliary channel for airflow to pass through, that is, in the process of airflow flowing from the heat dissipation component 300 to the heating component 200, a small part of the gas can pass through the pore structure of the sound-absorbing cotton to flow to the second avoidance structure, while most of the gas passes through the second avoidance structure, so as to reduce the resistance of the airflow passing through the regulating component.

[0099] The hole-like structure may also be used only as an adjustment structure for regulating airflow, and the airflow does not pass through the hole-like structure.

[0100] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0101] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. An electronic device, characterized in that: include: A chassis shell, wherein the chassis shell has a receiving space; A heating component, which is disposed in the accommodation space and is capable of generating heat; A heat dissipation component, which is disposed in the accommodation space and can drive airflow to dissipate heat from the heat generating component; An adjusting component is located between the heating component and the heat dissipation component; the adjusting component can adjust the airflow flowing to the heating component, and the degree of disturbance of the heating component caused by the adjusted airflow passing through the heating component is reduced.

2. The electronic device according to claim 1, wherein: The adjustment assembly includes an adjustment component and a support component; The supporting component can position the adjusting component between the heat generating component and the heat dissipating component, and the airflow flowing toward the heat generating component can flow toward the heat generating component after being adjusted by the adjusting component.

3. The electronic device according to claim 2, characterized in that: The two ends of the support component have connecting parts, and the connecting parts can be detachably connected to the side walls of the chassis shell; Both ends of the supporting component are arranged along a first direction, and the heat generating component and the heat dissipating component are arranged along a second direction, and the first direction is different from the second direction.

4. The electronic device according to claim 3, characterized in that: The supporting component comprises a supporting portion, and the adjusting component is arranged on a side of the supporting component facing the heat dissipation assembly; The supporting part has a first avoidance hole, and the adjusting part has a second avoidance hole arranged corresponding to the first avoidance hole. The first avoidance hole and the second avoidance hole constitute a first avoidance structure arranged corresponding to the heat dissipation hole structure of the heat-generating component, and the airflow can flow toward the heat-generating component through the first avoidance structure.

5. The electronic device according to claim 4, characterized in that: The supporting parts are multiple in number and arranged along the first direction. The supporting component further includes a bending part connecting two adjacent supporting parts. The bending part can be bent in a direction perpendicular to the first direction.

6. The electronic device according to claim 4 or 5, characterized in that: The adjusting component has a hole-shaped structure; The hole-shaped structure can reduce the noise transmitted to the heat-generating component through the airflow and / or can reduce the airflow disturbance of the airflow.

7. The electronic device according to claim 2, characterized in that: The supporting component has a supporting structure and a connecting structure, the supporting structure has a first surface and a second surface opposite to each other, the first surface faces away from the heating component, the connecting structure is located on the second surface, and the adjusting component is connected to the connecting structure; The supporting structure is connected to the heat generating component.

8. The electronic device according to claim 7, characterized in that: The adjusting component is arranged on a side of the connecting structure facing the heat dissipation assembly; The connection structure has a first area and a second area, the first area can be connected to the adjustment component, and the second area has a second avoidance structure arranged corresponding to the heat dissipation hole structure of the heat-generating component, and the airflow can flow to the heat-generating component through the second avoidance structure.

9. The electronic device according to claim 8, characterized in that: The supporting component further comprises a plug-in structure detachably connected to the connecting structure; the plug-in structure has a third area that can be connected to the adjusting component; The third area is larger than the fourth area, and the fourth area is an area where the first area is blocked by the plug-in structure and cannot be connected to the adjusting component.

10. The electronic device according to claim 8 or 9, characterized in that: The adjusting component has a hole-shaped structure; The hole-shaped structure can reduce the noise transmitted to the heat-generating component through the airflow and / or can reduce the airflow disturbance of the airflow.

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