Water-cooling heat dissipation cooling mechanism for computer

Abstract

The utility model discloses a water-cooling heat dissipation cooling mechanism for a computer, which comprises a metal substrate which is horizontally and fixedly contacted with a plurality of heat pipes, a heating source is welded on a pc mainboard below the metal substrate, a return pipe is welded on the metal substrate, one end of the return pipe is integrally connected with a water inlet pipe in a penetrating manner, and the other end of the return pipe is integrally connected with a water outlet pipe in a penetrating manner. The water inlet pipe and the water outlet pipe are respectively communicated with the water pump, the water pump is fixed on the pc mainboard, one side of the water pump facing the edge of the pc mainboard is connected with a first connector and a second connector, the first connector and the second connector are respectively communicated with the water inlet pipe and the water outlet pipe, and the first connector is communicated with an external cold water source after being sleeved with a connector. Under the action of the water pump, cold water enters and hot water is discharged, so that the temperature of the heating source area is reduced. The technical problems mentioned in the background technology are effectively solved.

Description

Technical Field

[0001] The utility model belongs to the technical field of computer heat dissipation, and particularly relates to a water-cooling heat dissipation and temperature reduction mechanism for a computer. Background Art

[0002] Laptops, tablets, and mini desktop computers have the following heat dissipation defects due to internal space limitations:

[0003] ①Small space and limited heat dissipation capacity;

[0004] ② When the graphics card has high power, it needs a strong heat dissipation capability. Generally, most of the heat dissipation on the market is through heat pipes plus fans or VC plus fans, which can hardly meet the heat released by high-performance graphics cards.

[0005] When the mini desktop thin computer host is placed vertically, the heat dissipation effect is equivalent to 60% of that when placed horizontally. The internal high temperature is not conducive to the smooth operation of the computer, and the cooling and heat dissipation must be increased by improving the heat dissipation device; although the patent scheme with authorization announcement number CN221261589U discloses a good cooling and heat dissipation solution, it cannot achieve fast and efficient results and cannot be effectively applied when the computer host is placed vertically. Utility Model Content

[0006] In view of the technical problems mentioned in the above background technology, in order to solve this problem, innovative heat dissipation improvements were made on the basis of the patent solution of CN221261589U. The improved heat dissipation solution can not only solve the problem of reduced heat dissipation effect when the computer is placed vertically, but also facilitate customers to DIY water-cooled radiators.

[0007] The utility model is implemented as follows: a water-cooled heat dissipation and temperature reduction mechanism for a computer comprises a metal base plate which is placed horizontally and fixedly in contact with a plurality of heat pipes, a heat source is welded on a PC mainboard below the metal base plate, a return pipe is welded on the metal base plate, one end of the return pipe is integrally connected with a water inlet pipe, and the other end is integrally connected with a water outlet pipe, the water inlet pipe and the water outlet pipe are respectively connected with a water pump, the water pump is fixed on the PC mainboard, a first connector and a second connector are connected to the side of the water pump facing the edge of the PC mainboard, the first connector and the second connector are respectively connected with the water inlet pipe and the water outlet pipe, the first connector is connected with an external cold water source after being covered with a connector, the second connector is connected with an external drain pipe after being covered with a connector, and under the action of the water pump, cold water enters and hot water is discharged to reduce the temperature of the heat source area.

[0008] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0009] The utility model improves the existing heat dissipation technology of heat pipe plus fan: water cooling is added to dissipate heat, and cold water enters and hot water is discharged under the action of a water pump to reduce the temperature of the heat source area. After the water pump is started, cold water enters the water inlet pipe from the first connector and flows to both ends of the return pipe, and is discharged through the water outlet pipe and the second connector. At the same time, under the action of the fans and radiators at both ends of the return pipe, the temperature of the heat source area is extremely quickly reduced and dissipated, effectively solving the problem of greatly reduced cooling and heat dissipation effect when the computer host is placed vertically. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] Figure 1 It is a structural diagram of the utility model;

[0011] Figure 2 It is a structural diagram of the use state of the utility model;

[0012] In the figure: 1 metal base plate, 2 water pump, 3 water outlet pipe, 4 water inlet pipe, 5 return pipe, 6 first connecting head, 7 second connecting head, 8 connector. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the implementation of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0014] Please refer to Figure 1 , Figure 2A water-cooling heat dissipation and temperature reduction mechanism for a computer comprises a metal substrate which is placed horizontally and fixedly in contact with a plurality of heat pipes. The metal plate 1 is a sheet-shaped plate made of copper or aluminum and is used for heat conduction. A heat source is welded on a PC motherboard below the metal substrate 1. The heat source is a main heat source such as a central processing unit and a graphics processing unit on the PC motherboard. The heat is conducted to the metal substrate through a plurality of heat pipes. A return pipe 5 is welded on the metal substrate 1. One end of the return pipe 5 is integrally connected with a water inlet pipe 4 and the other end is integrally connected with a water outlet pipe 3. The water inlet pipe 4 and the water outlet pipe 3 are respectively connected with a water pump 2. The water pump 2 is fixed on the PC motherboard. The side of the water pump facing the edge of the PC motherboard is connected with a first connector 6 and a second connector 7. A connector 6 and a second connector 7 are connected to the water inlet pipe 4 and the water outlet pipe 3 respectively. After the first connector 6 is covered with the connector 8, it is connected to the external cold water source. After the second connector 7 is covered with the connector 8, it is connected to the external drain pipe. Under the action of the water pump 4, cold water enters the water inlet pipe 4 and hot water is discharged to reduce the temperature of the heat source area. When the CPU and the graphics pull the load power at the same time higher than 280W, the water pump starts, and the cold water enters the water inlet pipe 4 from the first connector 6 and flows to the two ends 5 of the return pipe, and is discharged through the water outlet pipe 3 and the second connector 7. At the same time, under the action of the fans and radiators at both ends of the return pipe 5, the hot air is blown to the external space of the computer, and the temperature of the heat source area is extremely quickly reduced and dissipated. Considering the thermal conductivity, the water inlet pipe 4, the water outlet pipe 3 and the return pipe are flat pipes or round pipes made of copper. For the convenience of use, the discharged hot water can be connected in a circular manner with the incoming cold water, and the discharged hot water is circulated into the water inlet pipe again after cooling.

[0015] Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art may still modify the technical solutions described in the aforementioned embodiments, or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention shall be included in the protection scope of the present invention.

Claims

1. A computer water cooling heat dissipation and temperature reduction mechanism, comprising a metal substrate (1) placed horizontally and fixedly in contact with a plurality of heat pipes, a heat source is welded on a PC mainboard below the metal substrate (1), a return pipe (5) is welded on the metal substrate (1), one end of the return pipe (5) is integrally connected to a water inlet pipe (4), and the other end is integrally connected to a water outlet pipe (3), the water inlet pipe (4) and the water outlet pipe (3) are respectively connected to a water pump (2), and the water pump (2) is fixed on the PC mainboard. The water pump is connected to a first connector (6) and a second connector (7) on one side facing the edge of the PC mainboard. The first connector (6) and the second connector (7) are respectively connected to the water inlet pipe (4) and the water outlet pipe (3). The first connector (6) is connected to an external cold water source after being covered with a connector (8). The second connector (7) is connected to an external drain pipe after being covered with a connector (8). Under the action of the water pump (2), cold water enters and hot water is discharged to reduce the temperature of the heat source area.

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