Adapter board, circuit board assembly and electronic equipment

Abstract

The utility model discloses an adapter plate, a circuit board assembly and electronic equipment, and the adapter plate is provided with a plurality of pins. At least one pin of the adapter plate is provided with a first clamping structure; and the first clamping structures of the pins can be connected with the circuit board in a clamping manner.

Description

Technical Field

[0001] The present application relates to the technical field of circuit boards, and in particular to an adapter board, a circuit board assembly and an electronic device. Background Art

[0002] In some electronic devices, a circuit board is sometimes mounted on another circuit board, and the electronic components and chips carried by the former circuit board can be electrically connected to the latter circuit board through the pins of the former circuit board.

[0003] In this connection mode, the connection between the two circuit boards is less secure and the front circuit board can easily fall off from the rear circuit board. Utility Model Content

[0004] To this end, this application discloses the following technical solutions:

[0005] A first aspect of the present application provides an adapter board, wherein the adapter board has a plurality of pins;

[0006] At least one of the pins of the adapter board has a first engaging structure;

[0007] The first engaging structure of the pin can be engaged and connected with the circuit board.

[0008] Optionally, the first engaging structure includes a protrusion structure or a groove structure.

[0009] Optionally, the adapter plate has a first limiting structure, and the first limiting structure is located in a first area of ​​the adapter plate, and the first area is configured as an area for mounting an integrated circuit chip.

[0010] Optionally, the first limiting structure includes a plurality of limiting protrusions located at the edge of the first area, and the plurality of limiting protrusions are used to limit the integrated circuit chip in different directions.

[0011] Optionally, the adapter plate has a second limiting structure, and the second limiting structure is located in a second area of ​​the adapter plate, and the second area is configured as an area for mounting electronic components.

[0012] Optionally, the second limiting structure is a second limiting groove, and the edge of the second limiting groove is the edge of the second area.

[0013] Wherein, the first limiting structure and the second limiting structure are located on the same surface or different surfaces of the adapter plate.

[0014] A second aspect of the present application provides a circuit board assembly, comprising: the adapter board provided in any one of the first aspects of the present application, and a circuit board, wherein the circuit board has a plurality of contacts;

[0015] At least one contact of the circuit board has a second engaging structure;

[0016] The first engaging structure of the pin is engaged and connected with the second engaging structure of the contact.

[0017] Optionally, the first engaging structure includes a protrusion structure, and the second engaging structure includes a groove structure;

[0018] Alternatively, the first engaging structure includes a groove structure, and the second engaging structure includes a protrusion structure.

[0019] Optionally, an integrated circuit chip is provided on the adapter board, the integrated circuit chip is electrically connected to the adapter board via chip pins, and the adapter board is electrically connected to the circuit board via the pins.

[0020] A third aspect of the present application provides an electronic device, including an integrated circuit chip, an electronic component and a circuit board assembly;

[0021] The circuit board assembly comprises a circuit board and an adapter board;

[0022] The circuit board has a plurality of contacts;

[0023] At least one contact of the circuit board has a second engaging structure;

[0024] The adapter board has a plurality of pins;

[0025] At least one of the pins of the adapter board has a first engaging structure;

[0026] The first engaging structure of the pin is engaged and connected with the second engaging structure of the contact;

[0027] The integrated circuit chip and the electronic components are mounted on the adapter board. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the related technical descriptions are briefly introduced below. Obviously, the drawings described below are merely embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0029] Figure 1 is a structural schematic diagram of an adapter board provided in an embodiment of the present application;

[0030] Figure 2 is a structural schematic diagram of another adapter board provided in an embodiment of the present application;

[0031] Figure 3 This is a schematic diagram of the pin arrangement on the back of an adapter board provided in an embodiment of the present application;

[0032] Figure 4 is a schematic diagram of a first first engaging structure provided in an embodiment of the present application;

[0033] Figure 5 is a schematic diagram of a second first engaging structure provided in an embodiment of the present application;

[0034] Figure 6 is a schematic diagram of a third first engaging structure provided in an embodiment of the present application;

[0035] Figure 7 is a schematic diagram of a fourth first engaging structure provided in an embodiment of the present application;

[0036] Figure 8 is a schematic diagram of a fifth first engaging structure provided in an embodiment of the present application;

[0037] Fig. 9 is a schematic diagram of a sixth first engaging structure provided in an embodiment of the present application;

[0038] Fig.10 is a schematic diagram of a seventh first engaging structure provided in an embodiment of the present application;

[0039] Fig.11 is a schematic diagram of an eighth first engaging structure provided in an embodiment of the present application;

[0040] Fig.12 is a schematic diagram of a ninth first engaging structure provided in an embodiment of the present application;

[0041] Fig.13 is a schematic diagram of a top view of a first limiting structure provided in an embodiment of the present application;

[0042] Fig.14 is a schematic diagram of a front view of a first limiting structure provided in an embodiment of the present application;

[0043] Fig.15 is a schematic diagram of a top view of another first limiting structure provided in an embodiment of the present application;

[0044] Fig.16 is a schematic diagram of a cross-sectional view of another first limiting structure provided in an embodiment of the present application;

[0045] Fig.17 is a schematic diagram of a top view of a second limiting structure provided in an embodiment of the present application;

[0046] Fig.18is a schematic diagram of a front view of a second limiting structure provided in an embodiment of the present application;

[0047] Fig.19 is a schematic diagram of a top view of another second limiting structure provided in an embodiment of the present application;

[0048] Fig. 20 is a schematic diagram of a cross-sectional view of another second limiting structure provided in an embodiment of the present application;

[0049] Fig.21 This is a schematic diagram of the positional relationship between a first limiting structure and a second limiting structure provided in an embodiment of the present application;

[0050] Fig. 22 is a schematic diagram of the positional relationship between the second first limiting structure and the second limiting structure provided in an embodiment of the present application;

[0051] Fig.23 is a schematic diagram of the positional relationship between the third first limiting structure and the second limiting structure provided in an embodiment of the present application;

[0052] Fig.24 is a schematic diagram of a front plan view of another structure of an adapter plate provided in an embodiment of the present application;

[0053] Fig.25 is a schematic structural cross-sectional diagram of another adapter plate provided in an embodiment of the present application;

[0054] Fig.26 This is a schematic diagram of the back side top view of another adapter plate provided in an embodiment of the present application.

[0055] Fig. 27 It is a structural schematic diagram of a circuit board assembly provided in an embodiment of the present application;

[0056] Fig.28 is a structural schematic diagram of a first second engaging structure provided in an embodiment of the present application;

[0057] Fig.29 is a structural schematic diagram of a second second engaging structure provided in an embodiment of the present application;

[0058] Fig.30 is a structural schematic diagram of a third second engaging structure provided in an embodiment of the present application;

[0059] Fig.31 is a structural schematic diagram of a fourth second engaging structure provided in an embodiment of the present application;

[0060] Fig.32 is a structural schematic diagram of a fifth second engaging structure provided in an embodiment of the present application;

[0061] Fig.33 is a structural schematic diagram of a sixth second engaging structure provided in an embodiment of the present application;

[0062] Fig.34 is a structural schematic diagram of a seventh second engaging structure provided in an embodiment of the present application;

[0063] Fig.35 is a structural schematic diagram of an eighth second engaging structure provided in an embodiment of the present application;

[0064] Fig.36 is a structural schematic diagram of a ninth second engaging structure provided in an embodiment of the present application;

[0065] Fig.37 is a structural schematic diagram of a tenth second engaging structure provided in an embodiment of the present application;

[0066] Fig.38 is a schematic top view of the structure of an electronic device provided in an embodiment of the present application;

[0067] Fig.39 It is a schematic front view of the structure of an electronic device provided in an embodiment of the present application. DETAILED DESCRIPTION

[0068] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0069] Electronic devices generally have a circuit board, which is usually the largest printed circuit board (PCB) in an electronic device. The circuit board is used to carry and connect various components of the electronic device, integrated circuit chips, and other electronic components (such as resistors, capacitors, transistors, inductors, etc.).

[0070] In order to facilitate the upgrading of integrated circuit chips, the integrated circuit chips in some electronic devices are installed on the circuit board in the following way: the integrated circuit chip is installed on a smaller adapter board, and the adapter board is installed on another larger circuit board of the electronic device. Based on this installation method, when the pins of the integrated circuit chip change with the upgrade, only the smaller adapter board needs to be replaced to install the new integrated circuit chip on the circuit board of the electronic device.

[0071] However, when these adapter boards are mounted on another circuit board, the pins of the adapter board and the other circuit board are only connected together by solder (such as solder), and the firmness is poor.

[0072] In view of the above technical problems, the present application embodiment provides a transfer board, see Figure 1 , is a schematic diagram of the structure of the adapter board 100, the adapter board has a plurality of pins 101, the pins 101 are located on one side of the adapter board 100, and the other side of the adapter board 100 can be used to install the integrated circuit chip 200, and can also be used to install other electronic components electrically connected to the integrated circuit chip, including but not limited to resistors, capacitors, inductors, transistors, etc.

[0073] For easy distinction, the side where the pins 101 are located may be referred to as the back side of the adapter board 100 , and the side for mounting the integrated circuit chip 200 and other electronic components may be referred to as the front side of the adapter board 100 .

[0074] See also Figure 2 In the present embodiment, a first snap-fit ​​structure 102 is constructed on at least one pin 101 of the adapter board 100. The first snap-fit ​​structure 102 can be located at the end of the pin 101. When the adapter board 100 is installed on another circuit board 300, the first snap-fit ​​structure 102 of the pin 101 can be snap-fitted and connected with the circuit board 300.

[0075] The end of the pin 101 may be an end of the pin 101 that contacts another circuit board 300 .

[0076] The first snap-fitting structure 102 can be snap-fitted and connected to the circuit board 300 in such a way that the circuit board 300 has a plurality of contacts 301 that can be electrically connected to the pins 101, wherein at least one of the contacts 301 has a second snap-fitting structure 302, and when the adapter board 100 is installed on the circuit board 300, the first snap-fitting structure 102 can be snap-fitted and connected to the second snap-fitting structure 302.

[0077] When the adapter board provided in the present embodiment is installed on another circuit board, the pins of the adapter board and the other circuit board can be connected by snapping together through the first snapping structure of the pins and by soldering together. Compared with the conventional adapter board which is connected to the other circuit board only through a single welding connection, the adapter board of the present embodiment can be connected to the other circuit board through two connection methods, namely, a composite connection method of snapping connection and welding connection. Therefore, when the adapter board provided in the present embodiment is connected to the other circuit board, the connection is more firmly connected and is less likely to fall off than the conventional adapter board.

[0078] In some embodiments, only a portion of the pins 101 of the transfer board 100 may have the first locking structure 102 , while another portion of the pins 101 may not have the first locking structure 102 .

[0079] For example, the adapter plate 100 may have Figure 3 The 4 rows of pins shown, Figure 3 is a schematic diagram of the back side of the adapter board 100, wherein the arrangement direction of each row of pins may be parallel to one side of the adapter board 100. Figure 3 As shown, the pins at both ends of each row of pins, that is, the pins 101 closest to each vertex of the adapter board 100 , may have the first engaging structure 102 , while the other pins 101 do not have the first engaging structure 102 .

[0080] The advantages of the above structure are that, on the one hand, the first engaging structure of some pins can enhance the firmness of the connection between the adapter board and another circuit board, and on the other hand, constructing the first engaging structure only on some pins can reduce the structural complexity of the adapter board.

[0081] Alternatively, the adapter board 100 may also be constructed such that each pin 101 has a first engaging structure 102. Compared with the embodiment in which the first engaging structure is constructed only on a part of the pins, this embodiment can further enhance the firmness of the connection between the adapter board and another circuit board.

[0082] The specific form of the first engaging structure 102 is not limited. In some embodiments, the first engaging structure 102 may include a protrusion structure or a groove structure.

[0083] When the first engaging structure 102 includes a groove structure, the first engaging structure 102 may include: Figure 2 The arc-shaped groove structure shown may include Figure 4 The square groove structure shown may also include Figure 5 The multiple square groove structures shown.

[0084] When the first engaging structure 102 includes a protruding structure, the first engaging structure may include: Figure 6 The arc-shaped protrusion structure shown may include Figure 7 The square convex structure shown may also include Figure 8 Multiple square raised structures are shown.

[0085] In some other embodiments, when the first engaging structure 102 includes a groove structure, the first engaging structure 102 may also include an irregularly shaped groove structure, for example, Fig. 9 or Fig.10The curved groove structure shown; when the first engaging structure 102 includes a convex structure, the first engaging structure 102 may also include an irregular convex structure, for example, may include Fig.11 or Fig.12 The curved convex structure shown.

[0086] Figure 1 , Figure 2 ,and Figures 4 to 12 The various first engaging structures shown are only examples. In practical applications, the first engaging structure may also include other structures different from the above structures, and is not limited to the structures listed in the above examples.

[0087] Since the adapter board has a larger contact area and thickness than the electronic components, cold solder joints are likely to occur when the adapter board is soldered to the circuit board.

[0088] In the adapter board 100 provided in this embodiment, the first snap-fit ​​structure 102 is constructed as a protrusion structure or a groove structure, so the first snap-fit ​​structure 102 can increase the contact area between the pin 101 and the circuit board 300, and increase the contact area between the pin 101 and the solder when the pin 101 is soldered to the circuit board 300. The larger contact area is beneficial to preventing cold solder joints from occurring during the welding process, thereby improving the welding yield when the adapter board 100 is soldered to the circuit board 300.

[0089] Furthermore, when the adapter board 100 is welded to the circuit board 300, the first engaging structure 102 is engaged with the circuit board 300, which can prevent the corresponding pin 101 from moving relative to the circuit board 300, thereby preventing cold solder joints and improving the soldering yield.

[0090] In some embodiments, the front side of the transfer board 100 may have a first limiting structure 103 , and the first limiting structure is located in a first area of ​​the transfer board 100 , and the first area is configured as an area for mounting the integrated circuit chip 200 .

[0091] For a conventional adapter board without the first limiting structure 103, when the adapter board is welded to another circuit board, the integrated circuit chip may be displaced due to uneven heating of the adapter board. In this case, the integrated circuit chip needs to be re-welded to the adapter board or replaced with a new one.

[0092] In this embodiment, the first limiting structure 103 arranged in the first area can prevent the integrated circuit chip 200 from moving when the adapter board 100 is unevenly heated, avoiding the need to re-solder the integrated circuit chip or replace a new adapter board, thereby improving the success rate of soldering the adapter board 100 to another circuit board 300.

[0093] The structure of the first limiting structure 103 is not limited.

[0094] In some embodiments, the first limiting structure may include a plurality of limiting protrusions located at the edge of the first region, and the plurality of limiting protrusions are used to limit the integrated circuit chip in different directions.

[0095] As an example, the first limiting structure 103 may include: Fig.13 The two limiting protrusions shown, wherein Fig.13 is a top view of the first limiting structure 103 and the adapter plate 100, Fig.14 It is a front view of the first limiting structure 103 and the adapter plate 100 .

[0096] In this example, the first limiting structure 103 may include a limiting protrusion 1031 located at the upper left corner of the first area and a limiting protrusion 1032 located at the lower right corner of the first area. The limiting protrusions may be in a right angle shape. The horizontal edges of the two limiting protrusions may limit the integrated circuit chip 200 in the vertical direction to prevent the integrated circuit chip 200 from being displaced in the vertical direction. The vertical edges of the two limiting protrusions may limit the integrated circuit chip 200 in the horizontal direction to prevent the integrated circuit chip 200 from being displaced in the horizontal direction.

[0097] In some other embodiments, the first limiting structure 103 may be as follows: Fig.15 and Fig.16 The first limiting groove 1033 shown, Fig.15 is a top view of the first limiting groove 1033 and the adapter plate 100, Fig.16 It is a cross-sectional view of the first limiting groove 1033 and the adapter plate 100 along the AA plane.

[0098] In this embodiment, when the integrated circuit chip 200 is installed on the adapter board 100, a portion of the integrated circuit chip 200 can be accommodated in the first limiting groove 1033, and the other portion can be higher or lower than or horizontal to the surface of the adapter board 100. In this way, the edge of the first limiting groove 1033 can limit the integrated circuit chip 200 in the horizontal direction and the vertical direction respectively.

[0099] Some adapter boards also have electronic components that are electrically connected to the integrated circuit chips, such as resistors and capacitors. When the adapter board is soldered to another circuit board, these electronic components may also shift due to uneven heating of the adapter board, resulting in the need to re-solder these electronic components to the adapter board or replace the adapter board with a new one.

[0100] To solve this problem, in some embodiments, the front side of the adapter board 100 may further have a second limiting structure 104 , and the second limiting structure 104 is located in a second area of ​​the adapter board 100 , and the second area is configured as an area for mounting the electronic component 400 .

[0101] In this embodiment, the second limiting structure 104 arranged in the second area can prevent the electronic component 400 from moving when the adapter board 100 is unevenly heated, avoiding the need to re-solder the electronic component 400 or replace a new adapter board, thereby improving the success rate of soldering the adapter board 100 to another circuit board 300.

[0102] The adapter plate 100 may have one second area or multiple second areas. When the adapter plate has multiple second areas, the adapter plate 100 may have multiple second limiting structures 104 .

[0103] When there are multiple second areas and multiple second limiting structures 104, the relationship between the second areas and the second limiting structures 104 can be that each second area of ​​the adapter plate 100 is provided with a second limiting structure 104; or a part of the second areas are provided with the second limiting structure 104, and another part of the second areas are not provided with the second limiting structure 104.

[0104] The structure of the second limiting structure 104 is not limited.

[0105] In some embodiments, the second limiting structure may include a plurality of limiting protrusions located at the edge of the second area, and the plurality of limiting protrusions are used to limit the electronic component in different directions.

[0106] As an example, the second limiting structure 104 may include: Fig.17 The two limiting protrusions shown, wherein Fig.17 is a top view of the second limiting structure 104 and the adapter plate 100, Fig.18 It is a front view of the second limiting structure 104 and the adapter plate 100 .

[0107] In this example, the second limiting structure 104 may include a limiting protrusion 1041 located at the upper left corner of the second area and a limiting protrusion 1042 located at the lower right corner of the second area. The limiting protrusions may be in a right angle shape. The horizontal edges of the two limiting protrusions may limit the electronic component 400 in the vertical direction to prevent the electronic component 400 from being displaced in the vertical direction. The vertical edges of the two limiting protrusions may limit the electronic component 400 in the horizontal direction to prevent the electronic component 400 from being displaced in the horizontal direction.

[0108] In some other embodiments, the second limiting structure 104 may be as follows: Fig.19 and Fig. 20 The second limiting groove 1043 shown, Fig.19 is a top view of the second limiting groove 1043 and the adapter plate 100, Fig. 20It is a cross-sectional view of the second limiting groove 1043 and the adapter plate 100 along the AA plane.

[0109] In this embodiment, when the electronic component 400 is installed on the adapter plate 100, a portion of the electronic component 400 can be accommodated in the second limiting groove 1043, and the other portion can be higher or lower than or horizontal to the surface of the adapter plate 100. In this way, the edge of the second limiting groove 1043 can limit the electronic component 400 in the horizontal direction and the vertical direction respectively.

[0110] Since both the adapter board and the electronic components have a certain thickness, installing the electronic components on the adapter board will increase the space occupied by the adapter board.

[0111] To address this problem, in the adapter plate 100 of this embodiment, the second limiting structure 104 may be constructed as a second limiting groove 1043 , and the second limiting groove may be located on the same surface or a different surface of the adapter plate 100 as the first limiting structure.

[0112] by Fig.21 For example, when the first limiting structure 103 includes a limiting protrusion 1031 and a limiting protrusion 1032, the second limiting groove 1043 and the first limiting structure 103 can be located on a different surface of the adapter plate 100, that is, the two limiting protrusions constituting the first limiting structure 103 can be located on the upper surface of the adapter plate 100, and the bottom surface of the second limiting groove 1043 can be located on a horizontal plane that is a certain distance h below the upper surface.

[0113] by Fig. 22 For example, when the first limiting structure 103 is the first limiting groove 1033, the second limiting groove 1043 can be located on the same surface of the adapter plate 100 as the first limiting structure 103, that is, the bottom surface of the first limiting groove 1033 and the bottom surface of the second limiting groove 1043 can both be on a horizontal plane that is a certain distance h below the upper surface.

[0114] by Fig.23 For example, when the first limiting structure 103 is the first limiting groove 1033, the second limiting groove 1043 and the first limiting structure 103 can be located on a different surface in the adapter plate 100, that is, the bottom surface of the first limiting groove 1033 can be on a horizontal plane lower than the upper surface h1, and the bottom surface of the second limiting groove 1043 can be on a horizontal plane lower than the upper surface h2, wherein h2 can be greater than h1, that is, with the upper surface as a reference, the depth of the second limiting groove is greater than the depth of the first limiting groove.

[0115] In the above examples, the depths h, h1 and h2 of the limiting grooves can be set according to the thickness of the electronic components and integrated circuit chips accommodated therein, without limitation.

[0116] A second limiting groove is set on the adapter plate, and the bottom surface of the second limiting groove is set at a position lower than the upper surface of the adapter plate. A part of the space occupied by the thickness of the adapter plate itself can be reused to accommodate electronic components installed in the second area, thereby saving the space occupied by the adapter plate on which the electronic components are installed.

[0117] In other embodiments, the second area may be located on the back side of the adapter board 100, the second limiting groove 1043 may be constructed on the back side of the adapter board 100, the first area may be located on the front side of the adapter board 100, and the first limiting structure 1033 may be constructed on the front side of the adapter board 100. In this case, the adapter board 100 may have a plurality of through holes for connecting the front and back sides, and these through holes can realize electrical connection between the integrated circuit chip 200 installed on the front side and the electronic component 400 installed on the back side.

[0118] As an example, see Fig.24 , Fig.25 and Fig.26 , is a schematic diagram of an exemplary structure of the adapter plate 100 provided in the above embodiment, wherein Fig.24 is a top view of the front side of the adapter plate 100, Fig.25 is a top view of the back side of the adapter plate 100, Fig.26 It is a cross-sectional view of the adapter board 100 along the AA plane, wherein the through hole 105 is used to connect the front and back sides of the adapter board 100 to achieve electrical connection between the integrated circuit chip 200 mounted on the front side and the electronic component 400 mounted on the back side.

[0119] In this example, the first limiting structure 103 may be a first limiting groove 1033 .

[0120] For a type of adapter board that only uses the front side to accommodate integrated circuit chips and electronic components, in order to provide sufficient space to accommodate the integrated circuit chips and electronic components, this type of adapter board generally has a top-view projection area. For example, the top-view projection area of ​​this type of adapter board is generally larger than the sum of the top-view projection area of ​​the integrated circuit chip to be accommodated and the top-view projection area of ​​all electronic components.

[0121] The front and back sides of the adapter board 100 provided in this embodiment can accommodate integrated circuit chips and electronic components respectively, so the adapter board 100 can reuse the top projection area of ​​the integrated circuit chip to accommodate electronic components.

[0122] Since the sum of the top-view projection areas of the various electronic components is generally smaller than the top-view projection area of ​​the integrated circuit chip, the top-view projection area of ​​the adapter board 100 of this embodiment can be determined according to the top-view projection area of ​​the integrated circuit chip. For example, the top-view projection area of ​​the adapter board 100 only needs to be slightly larger than the top-view projection area of ​​the integrated circuit chip, and does not need to be larger than the sum of the top-view projection areas of the integrated circuit chip and the various electronic components.

[0123] Therefore, the adapter board 100 of this embodiment can further reduce the occupied area of ​​the adapter board 100 .

[0124] The present application also provides a circuit board assembly, such as Fig. 27 As shown, the circuit board assembly may include the adapter board 100 provided in the aforementioned embodiment, and a circuit board 300 for mounting the adapter board.

[0125] The circuit board 300 has a plurality of contacts, at least one of which has a second engaging structure 301 , and the first engaging structure of the pins of the adapter board 100 is engaged and connected with the second engaging structure 301 of the contact.

[0126] Optionally, an integrated circuit chip may be provided on the adapter board 100, and the integrated circuit chip may be electrically connected to the adapter board through chip pins. The pins of the adapter board 100 may correspond to the contacts of the circuit board 300. When the adapter board 100 is mounted on the circuit board 300, the pins of the adapter board 100 may be electrically connected to the corresponding contacts on the circuit board 300, so that the adapter board is electrically connected to the circuit board through the pins. Thus, the integrated circuit chip provided on the adapter board 100 may be electrically connected to the circuit board 300 through the chip pins and the pins of the adapter board, and further may be electrically connected to other integrated circuit chips and electronic components provided on the circuit board 300 through the circuit printed on the circuit board 300.

[0127] For the contact of the circuit board 300, if the pin of the adapter board 100 corresponding to the contact has a first snap-fit ​​structure, then the contact may have a second snap-fit ​​structure; if the pin of the adapter board 100 corresponding to the contact does not have the first snap-fit ​​structure, then the contact may not have the second snap-fit ​​structure.

[0128] In the circuit board assembly provided in this embodiment, the adapter board 100 and the circuit board 300 are connected by welding between pins and contacts, and also by snapping together by a first snapping structure of the pins and a second snapping structure of the contacts. Therefore, compared with the circuit board assembly in the related technical field that is only connected by welding, the connection between the adapter board and the circuit board in the circuit board assembly of this embodiment is more secure.

[0129] The specific form of the second engaging structure 301 is not limited, as long as it can be engaged and connected with the first engaging structure.

[0130] In some embodiments, when the first engaging structure 102 is a protruding structure, the second engaging structure 301 may be a corresponding groove structure; when the first engaging structure 102 is a groove structure, the second 301 may be a protruding structure.

[0131] by Figures 28 to 30 For example, when the first engaging structure 102 is an arc-shaped protruding structure, the second engaging structure 301 may be Fig.28 When the first engaging structure 102 is a square protrusion structure, the second engaging structure 301 may be Fig.29 When the first engaging structure includes a plurality of square protrusion structures, the second engaging structure 301 may include the following: Fig.30 The multiple square groove structures shown.

[0132] The first engaging structure and the second engaging structure are constructed as a groove structure and a protrusion structure that cooperate with each other, which can increase the contact area between the pin and the contact point, prevent cold soldering, and increase the soldering yield.

[0133] In the related field, the process of soldering the adapter board to the circuit board can be to first brush a layer of solder paste on the contact surface of the circuit board, and then place the adapter board in the area on the circuit board for installing the adapter board, so that each pin on the adapter board contacts the corresponding contact on the circuit board during placement, and then heat the solder paste previously brushed on the contact surface to form a welding connection between the pin and the corresponding contact.

[0134] In the above soldering process, if the second engaging structure of the contact is a groove structure, the solder paste in the groove structure may overflow from the groove structure after being heated, and the overflowed solder paste may form an electrical connection between adjacent contacts, which is called solder bridging. Solder bridging will affect the normal operation of integrated circuit chips and electronic components installed on the circuit board and the adapter board.

[0135] Therefore, in some embodiments, the first engaging structure 102 may be constructed as a groove structure, and the second engaging structure 301 may be constructed as a protruding structure, so as to prevent excess solder paste in the groove structure from overflowing and causing solder joints.

[0136] by Figure 31 to Figure 33 For example, when the first engaging structure 102 is an arc-shaped groove structure, the second engaging structure 301 may be Fig.31 When the first engaging structure 102 is a square groove structure, the second engaging structure 301 may be Fig.32 When the first engaging structure includes a plurality of square groove structures, the second engaging structure 301 may include a square protrusion structure as shown in FIG. Fig.33 Multiple square raised structures are shown.

[0137] In some other embodiments, when the first engaging structure 102 includes an irregular groove structure, the second engaging structure 301 may include an irregular protrusion structure corresponding to the first engaging structure 102. For example, the second engaging structure may include Fig.34 or Fig.35 The curved convex structure shown; when the first engaging structure 102 includes an irregular shaped convex structure, the second engaging structure 301 may include an irregular shaped groove structure corresponding to the first engaging structure 102, for example, including Fig.36 or Fig.37 The curved groove structure shown.

[0138] Fig.11 The various second engaging structures shown are only examples. In practical applications, the second engaging structure may also include other structures different from the above structures, and is not limited to the structures listed in the above examples.

[0139] The present application also provides an electronic device. Fig.38 and Fig.39 .

[0140] Fig.38 is a schematic diagram of the structure of the electronic device when viewed from above, Fig.39 Schematic diagram of the structure of the electronic device when viewed from the front.

[0141] The electronic device comprises a circuit board assembly, an integrated circuit chip 200 and an electronic component 400 . The circuit board assembly comprises a circuit board 300 and an adapter board 100 .

[0142] The circuit board 300 has a plurality of contacts;

[0143] At least one contact of the circuit board 300 has a second engaging structure 301;

[0144] The adapter board 100 has a plurality of pins;

[0145] At least one pin of the adapter board 100 has a first engaging structure 102;

[0146] The first engaging structure 102 of the pin is engaged and connected with the second engaging structure 301 of the contact;

[0147] The integrated circuit chip 200 and the electronic component 400 are mounted on the interposer.

[0148] The number of the electronic component 400 can be one or more. Fig.38 The two electronic components 400 shown are merely examples.

[0149] The electronic component 400 may include any one or more of resistors, capacitors, inductors, transistors, etc. In some embodiments, a switch circuit for driving the integrated circuit chip 200 may be mounted on the circuit board 300, and the switch circuit may include a driver, a transistor, and an inductor.

[0150] By mounting the switch circuit on the circuit board 300 , the area and occupied space of the adapter board 100 can be reduced.

[0151] The driver, transistor and inductor constituting the above-mentioned switching circuit can be recorded on the bill of materials (BOM) of the electronic device, so as to distinguish whether the integrated circuit chip in the electronic device is directly installed on the circuit board or installed on the circuit board through the adapter board of the aforementioned embodiment according to the BOM.

[0152] In some embodiments, the integrated circuit chip 200 may be a power control chip for powering a central processing unit (CPU), which may be mounted on the circuit board 300 and may be electrically connected to the integrated circuit chip 200 via a circuit printed on the circuit board 300 .

[0153] It should be noted that the various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0154] For the convenience of description, the above system or device is described by dividing it into various modules or units according to its functions. Of course, when implementing the present application, the functions of each unit can be implemented in the same or multiple software and / or hardware.

[0155] It can be known from the description of the above implementation methods that those skilled in the art can clearly understand that the present application can be implemented by means of software plus a necessary general hardware platform. Based on such an understanding, the technical solution of the present application can be essentially or partly contributed to the relevant technology in the form of a software product, which can be stored in a storage medium such as ROM / RAM, a disk, an optical disk, etc., including several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in the various embodiments of the present application or certain parts of the embodiments.

[0156] Finally, it should be noted that, in this article, relational terms such as first, second, third and fourth are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "comprise a ..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0157] The above is only a preferred implementation of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A transfer plate, characterized in that: The adapter board has a plurality of pins; At least one of the pins of the adapter board has a first engaging structure; The first engaging structure of the pin can be engaged and connected with the circuit board.

2. The adapter plate according to claim 1, characterized in that: The first engaging structure includes a protrusion structure or a groove structure.

3. The adapter plate according to claim 1, characterized in that: The transfer board has a first limiting structure, and the first limiting structure is located in a first area of ​​the transfer board, and the first area is configured as an area for mounting an integrated circuit chip.

4. The adapter plate according to claim 3, characterized in that: The first limiting structure includes a plurality of limiting protrusions located at the edge of the first area, and the plurality of limiting protrusions are used to limit the integrated circuit chip in different directions.

5. The adapter plate according to claim 3, characterized in that: The adapter plate has a second limiting structure, and the second limiting structure is located in a second area of ​​the adapter plate, and the second area is configured as an area for mounting electronic components.

6. The adapter plate according to claim 5, characterized in that: The second limiting structure is a second limiting groove, and the edge of the second limiting groove is the edge of the second area. Wherein, the first limiting structure and the second limiting structure are located on the same surface or different surfaces of the adapter plate.

7. A circuit board assembly, characterized in that: The circuit board assembly comprises: the adapter board according to any one of claims 1 to 6, and a circuit board, wherein the circuit board has a plurality of contacts; At least one contact of the circuit board has a second engaging structure; The first engaging structure of the pin is engaged and connected with the second engaging structure of the contact.

8. The circuit board assembly according to claim 7, characterized in that: The first engaging structure comprises a protrusion structure, and the second engaging structure comprises a groove structure; Alternatively, the first engaging structure includes a groove structure, and the second engaging structure includes a protrusion structure.

9. The circuit board assembly according to claim 7, characterized in that: An integrated circuit chip is arranged on the adapter board. The integrated circuit chip is electrically connected to the adapter board via chip pins, and the adapter board is electrically connected to the circuit board via the pins.

10. An electronic device, characterized in that: The electronic device includes an integrated circuit chip, electronic components and a circuit board assembly; The circuit board assembly comprises a circuit board and an adapter board; The circuit board has a plurality of contacts; At least one contact of the circuit board has a second engaging structure; The adapter board has a plurality of pins; At least one of the pins of the adapter board has a first engaging structure; The first engaging structure of the pin is engaged and connected with the second engaging structure of the contact; The integrated circuit chip and the electronic components are mounted on the adapter board.

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