Mobile phone rear cover plate capable of improving shock absorption and heat dissipation performance

Abstract

The utility model discloses a mobile phone rear cover plate capable of improving shock absorption and heat dissipation performance, which comprises a mobile phone rear cover plate, an ink layer and thermal grease, and is characterized in that the outer edge of the upper surface of the mobile phone rear cover plate is provided with an annular groove, and the annular groove surrounds a display area of a mobile phone display module; the ink layer is arranged on the upper surface of the mobile phone rear cover plate in a silk-screen mode and located in an area defined by the annular groove. The thermal grease is arranged on the upper surface of the ink layer in a silk-screen mode and located in the surrounding area. When the rear cover plate of the mobile phone is attached or pressed to other parts, redundant thermal grease can overflow into the annular groove, so that the thermal grease is prevented from overflowing to other areas. And the ink layer and the thermal grease are both subjected to silk-screen printing, so that the product cost can be effectively reduced. The thermal grease is helpful for shielding external signal interference, has good elastic performance and compression performance, and can play a role in shock resistance and shock absorption for opponents. The heat transfer efficiency can be effectively improved, and the temperature of the mobile phone is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of liquid crystal display, and more specifically to a mobile phone rear cover with improved shock absorption and heat dissipation performance. Background Art

[0002] With the rapid development of technology, smartphones have become an indispensable electronic device in our daily lives. Whether it is social entertainment, communication or work, smartphones can provide us with convenience.

[0003] As the performance of smartphones continues to improve, the heat generated inside will also increase. Therefore, the demand for heat dissipation in smartphones will be more urgent in the future. How to achieve better and more effective heat dissipation has always been the direction of our research. Utility Model Content

[0004] The technical problem to be solved by the utility model is how to improve the shock absorption performance and heat dissipation performance of the rear cover of a mobile phone.

[0005] The technical problem to be solved by the utility model is achieved through the following technical solutions:

[0006] In order to solve the above technical problems, the utility model provides a mobile phone back cover with improved shock absorption and heat dissipation performance, which includes a mobile phone back cover, an ink layer and a heat dissipation paste. The outer edge of the upper surface of the mobile phone back cover is provided with a ring groove, and the ring groove surrounds the display area of ​​the mobile phone display module; the ink layer is silk-screened on the upper surface of the mobile phone back cover and is located in the area enclosed by the ring groove; the heat dissipation paste is silk-screened on the upper surface of the ink layer and is located in the area enclosed by the ring groove.

[0007] As a preferred implementation of the mobile phone rear cover with improved shock absorption and heat dissipation performance provided by the utility model, the heat dissipation paste is an insulating heat dissipation paste.

[0008] As a preferred implementation of the mobile phone rear cover with improved shock absorption and heat dissipation performance provided by the utility model, the edge of the annular groove is provided with a chamfer.

[0009] As a preferred implementation of the mobile phone rear cover with improved shock absorption and heat dissipation performance provided by the utility model, the chamfer is a rounded corner.

[0010] As a preferred implementation of the mobile phone rear cover with improved shock absorption and heat dissipation performance provided by the utility model, the chamfer is a right angle.

[0011] As a preferred implementation of the mobile phone rear cover with improved shock absorption and heat dissipation performance provided by the utility model, the cross-sectional shape of the annular groove is a trapezoid.

[0012] As a preferred implementation of the mobile phone rear cover with improved shock absorption and heat dissipation performance provided by the utility model, the cross-sectional shape of the annular groove is an isosceles trapezoid.

[0013] As a preferred implementation of the mobile phone rear cover with improved shock absorption and heat dissipation performance provided by the utility model, the annular groove is an open groove that is wide outside and narrow inside.

[0014] As a preferred implementation of the mobile phone rear cover with improved shock absorption and heat dissipation performance provided by the utility model, the depth of the annular groove is 0.1 mm.

[0015] As a preferred implementation of the mobile phone rear cover with improved shock absorption and heat dissipation performance provided by the utility model, the inner surface of the annular groove is provided with a surface treatment layer for improving surface roughness.

[0016] The utility model has the following beneficial effects:

[0017] Since the outer edge of the upper surface of the back cover of the mobile phone is provided with a ring groove, and the thermal paste is screen-printed on the upper surface of the ink layer and is located in the area enclosed by the ring groove, when the back cover of the mobile phone is fitted or pressed with other components, the excess thermal paste can overflow into the ring groove to prevent the thermal paste from overflowing into other areas. Both the ink layer and the thermal paste are screen-printed, which can effectively reduce the product cost. The thermal paste helps to shield external signal interference, and also has good elasticity and compression performance, which can play a role in shock resistance and shock absorption for the mobile phone. The thermal paste can conduct the heat inside the mobile phone to the back cover of the mobile phone, so that the entire heat dissipation area of ​​the back cover of the mobile phone can dissipate heat, thereby enhancing the heat dissipation effect. It can effectively improve the heat transfer efficiency and reduce the temperature of the mobile phone; and it can meet the design requirements of miniaturization and ultra-thinness of the equipment, is highly processable and practical, and has a wide range of thickness applications, and is an excellent thermal conductive design. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the scheme in the present application, a brief introduction is given below to the drawings required for use in the description of the embodiments. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0019] Figure 1 The utility model provides a structural schematic diagram of a mobile phone rear cover with improved shock absorption and heat dissipation performance.

[0020] Figure 2 for Figure 1 Bottom view of the back cover of the mobile phone.

[0021] Figure 3 for Figure 1 Schematic diagram of the improved structure.

[0022] Figure 4 for Figure 1 Another improved structural schematic diagram of .

[0023] Description of Figure Numbers:

[0024] Mobile phone back cover 1; ink layer 2; heat dissipation paste 3; ring groove 4. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the solution of the utility model, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the utility model.

[0026] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0027] In addition, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", and "third" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0028] The utility model provides a mobile phone rear cover plate with improved shock absorption and heat dissipation performance, comprising a mobile phone rear cover plate, an ink layer and heat dissipation paste, wherein an annular groove is provided on the outer edge of the upper surface of the mobile phone rear cover plate, and the annular groove surrounds the display area of ​​the mobile phone display module; the ink layer is screen-printed on the upper surface of the mobile phone rear cover plate and is located in the area enclosed by the annular groove; the heat dissipation paste is screen-printed on the upper surface of the ink layer and is located in the area enclosed by the annular groove.

[0029] Since the outer edge of the upper surface of the back cover of the mobile phone is provided with a ring groove, and the thermal paste is screen-printed on the upper surface of the ink layer and is located in the area enclosed by the ring groove, when the back cover of the mobile phone is fitted or pressed with other components, the excess thermal paste can overflow into the ring groove to prevent the thermal paste from overflowing into other areas. Both the ink layer and the thermal paste are screen-printed, which can effectively reduce the product cost. The thermal paste helps to shield external signal interference, and also has good elasticity and compression performance, which can play a role in shock resistance and shock absorption for the mobile phone. The thermal paste can conduct the heat inside the mobile phone to the back cover of the mobile phone, so that the entire heat dissipation area of ​​the back cover of the mobile phone can dissipate heat, thereby enhancing the heat dissipation effect. It can effectively improve the heat transfer efficiency and reduce the temperature of the mobile phone; and it can meet the design requirements of miniaturization and ultra-thinness of the equipment, is highly processable and practical, and has a wide range of thickness applications, and is an excellent thermal conductive design.

[0030] In order to enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the accompanying drawings. The present invention is described in detail below in conjunction with the accompanying drawings and embodiments, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements with the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limitations on the present invention.

[0031] Example 1

[0032] See also Figure 1 and Figure 2, a mobile phone back cover plate with improved shock absorption and heat dissipation performance provided by the utility model, comprising a mobile phone back cover plate 1, an ink layer 2 and a heat dissipation paste 3, a ring groove 4 is provided on the outer edge of the upper surface of the mobile phone back cover plate 1, and the ring groove 4 surrounds the display area of ​​the mobile phone display module; the ink layer 2 is screen-printed on the upper surface of the mobile phone back cover plate 1 and is located in the area enclosed by the ring groove 4; the heat dissipation paste 3 is screen-printed on the upper surface of the ink layer 2 and is located in the area enclosed by the ring groove 4. Since the outer edge of the upper surface of the mobile phone back cover plate 1 is provided with a ring groove 4, and the heat dissipation paste 3 is screen-printed on the upper surface of the ink layer 2 and is located in the area enclosed by the ring groove 4, when the mobile phone back cover plate 1 is fitted or pressed with other components, the excess heat dissipation paste 3 can overflow into the ring groove 4, and the heat dissipation paste 3 is prevented from overflowing to other areas. The ink layer 2 and the heat dissipation paste 3 are both screen-printed, which can effectively reduce the product cost. The heat dissipation paste 3 helps to shield external signal interference, and also has good elasticity and compression performance, which can play a role in shock resistance and shock absorption for the mobile phone. The thermal paste 3 can conduct the heat inside the mobile phone to the rear cover plate 1 of the mobile phone, so that the entire heat dissipation area of ​​the rear cover plate 1 of the mobile phone can dissipate heat, thereby enhancing the heat dissipation effect. It can effectively improve the heat transfer efficiency and reduce the temperature of the mobile phone; and it can meet the design requirements of miniaturization and ultra-thinness of the equipment. It is highly manufacturable and practical, and has a wide range of applicable thicknesses. It is an excellent thermal conductive design.

[0033] Furthermore, the heat dissipation paste 3 is an insulating heat dissipation paste 3 to improve the insulation effect.

[0034] Example 2

[0035] See also Figure 3 As a further optimization scheme of Example 1, in this embodiment, the edge of the annular groove 4 is provided with a chamfer, and the chamfer is a rounded corner or a right angle. The chamfer can not only remove burrs, but also make the heat dissipation paste 3 flow into the annular groove 4 better to avoid the generation of bubbles.

[0036] See also Figure 4 Furthermore, the cross-sectional shape of the annular groove 4 is a trapezoid, and more preferably, the cross-sectional shape of the annular groove 4 is an isosceles trapezoid. The annular groove 4 is an open groove that is wide outside and narrow inside, so that the heat dissipation paste 3 can stay in the annular groove 4 after entering the annular groove 4, so as to prevent the heat dissipation paste 3 from overflowing to other areas.

[0037] Furthermore, the depth of the annular groove 4 is 0.1 mm, so as to provide sufficient overflow space for the heat dissipation paste 3 to prevent the heat dissipation paste 3 from overflowing to other areas.

[0038] Furthermore, the inner surface of the annular groove 4 is provided with a surface treatment layer for improving the surface roughness, so that the heat dissipation paste 3 can be better adhered to the annular groove 4 and prevent the heat dissipation paste 3 from overflowing to other areas.

[0039] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral one; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0040] Obviously, the embodiments described above are only some embodiments of the present application, rather than all embodiments. The preferred embodiments of the present application are given in the accompanying drawings, but they do not limit the patent scope of the present application. The present application can be implemented in many different forms. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive. Although the present application is described in detail with reference to the aforementioned embodiments, for those skilled in the art, it is still possible to modify the technical solutions recorded in the aforementioned specific implementation methods, or to perform equivalent replacement of some of the technical features therein. Any equivalent structure made using the contents of the specification and drawings of this application, directly or indirectly used in other related technical fields, is similarly within the scope of patent protection of this application.

Claims

1. A mobile phone rear cover with improved shock absorption and heat dissipation performance, characterized in that: It includes: A mobile phone rear cover plate, the outer edge of the upper surface of which is provided with an annular groove, the annular groove surrounds the display area of ​​the mobile phone display module; An ink layer, which is screen-printed on the upper surface of the rear cover of the mobile phone and is located in the area enclosed by the annular groove; The heat dissipation paste is screen-printed on the upper surface of the ink layer and is located in the area enclosed by the annular groove.

2. The mobile phone rear cover with improved shock absorption and heat dissipation performance according to claim 1, characterized in that: The heat dissipation paste is an insulating heat dissipation paste.

3. The mobile phone rear cover with improved shock absorption and heat dissipation performance according to claim 1, characterized in that: The edge of the annular groove is provided with a chamfer.

4. The mobile phone rear cover with improved shock absorption and heat dissipation performance according to claim 3, characterized in that: The chamfer is a rounded corner.

5. The mobile phone rear cover with improved shock absorption and heat dissipation performance according to claim 3, characterized in that: The chamfer is a right angle.

6. The mobile phone rear cover with improved shock absorption and heat dissipation performance according to claim 1, characterized in that: The cross-sectional shape of the annular groove is a trapezoid.

7. The mobile phone rear cover with improved shock absorption and heat dissipation performance according to claim 6, characterized in that: The cross-sectional shape of the annular groove is an isosceles trapezoid.

8. The mobile phone rear cover with improved shock absorption and heat dissipation performance according to claim 1, characterized in that: The annular groove is an open groove which is wide outside and narrow inside.

9. The mobile phone rear cover with improved shock absorption and heat dissipation performance according to claim 1, characterized in that: The depth of the annular groove is 0.1 mm.

10. The mobile phone rear cover with improved shock absorption and heat dissipation performance according to claim 1, characterized in that: The inner surface of the annular groove is provided with a surface treatment layer for improving the surface roughness.

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