Topological cold plate and vapor chamber integrated structure

Abstract

The invention belongs to the technical field of heat dissipation of high-power-density electronic devices, and relates to a topological cold plate and vapor chamber integrated structure which comprises a cover plate, a first heat exchange plate and a second heat exchange plate which are sequentially overlapped from top to bottom and are connected in a sealed mode to form the integrated structure, and a cooling cavity used for containing a liquid working medium is defined between the cover plate and the first heat exchange plate. A phase change cavity used for containing a two-phase heat transfer working medium is defined between the first heat exchange plate and the second heat exchange plate, the cooling cavity and the phase change cavity are independent of each other, and heat transfer is achieved through the solid metal wall face of the first heat exchange plate. During use, the second heat exchange plate is attached to an electronic device, heat generated when the electronic device works is transferred to the second heat exchange plate, so that the two-phase heat transfer working medium in the phase change cavity is evaporated to generate steam, and the steam is diffused in the phase change cavity, then is in contact with the upper wall surface, is condensed when encountering cold and releases latent heat; heat is conducted to the cooling cavity through the first heat exchange plate to be absorbed by the liquid working medium. The structure is compact, the temperature equalizing performance is enhanced, and the heat transfer efficiency is improved.

Description

Technical Field

[0001] This invention belongs to the field of heat dissipation technology for high power density electronic devices, and specifically relates to an integrated structure of a topological cold plate and a vapor chamber. Background Technology

[0002] Currently, the mainstream solutions for heat dissipation of high power density electronic devices can be broadly categorized into two types: The first type is the traditional forced air cooling radiator, which typically consists of copper heat pipes and an aluminum fin array combined with an axial fan. In this design, heat is transferred from the chip surface to the heat pipe evaporation section via a thermally conductive medium. The heat is then rapidly transported to the distant air-cooled fin area through the phase change cycle of the working fluid, and finally dissipated into the air by forced convection. The main technical problem with this design is that its heat dissipation capacity is heavily dependent on the specific heat capacity and velocity of the air. When the heat flux density continues to climb to the hundreds of W / cm² level, the limited heat transfer coefficient of the air becomes an insurmountable bottleneck. Furthermore, the ever-increasing fin area and fan speed required to improve heat dissipation directly lead to a bulky device, significantly increased noise, and a sharp decline in performance in applications with limited internal space or poor airflow.

[0003] The second type is a more advanced hybrid or separate solution combining a vapor chamber and liquid cooling. In this solution, the vapor chamber rapidly flattens and diffuses the concentrated high heat flux generated by the chip, while the circulating liquid cooling system acts as the final "heat sink" to remove the heat. Although this solution theoretically possesses extremely high heat dissipation potential, current technical architectures typically design the vapor chamber and liquid cooling plate as two independent physical components, mechanically and thermally connected via thermal grease or soldering. The most critical technical problem caused by this separate design is the additional thermal resistance at the interface. During the heat transfer from the vapor chamber's condensation surface to the liquid cooling plate, heat must traverse at least one solid-solid contact interface. Microscopic irregularities and uneven contact pressure at this interface introduce significant thermal resistance, thereby reducing the efficiency of the entire cooling system. Furthermore, the separate structure also leads to engineering problems such as system complexity, increased space occupation, and increased reliability risks.

[0004] Among them, vapor chamber air cooler is a highly mature heat dissipation device. Its typical solution to the heat dissipation problem of high heat flux density chips is to build a cascaded heat transfer system of "vapor chamber-heat pipe-fin array-fan".

[0005] Specifically, this solution typically uses a vapor chamber that is in direct contact with the chip as a primary heat diffuser. Inside the vapor chamber, the concentrated high heat flow on the chip surface is rapidly diffused laterally to a metal substrate with an area much larger than the chip itself through the evaporation and condensation cycle of a liquid working fluid. Then, several heat pipes connected to the vapor chamber substrate by welding or mechanical pressing are responsible for axially transferring heat from the vapor chamber area to the distant fin stack. Finally, a heat dissipation fin assembly with a huge surface area, composed of multiple thin aluminum fins, dissipates heat into the surrounding air under the forced convection provided by an axial fan.

[0006] Although this solution successfully transitioned from "point heat source" to "volume heat dissipation" and once became a benchmark for high-performance computing heat dissipation, its inherent shortcomings have become increasingly apparent as chip power has surged: 1. Performance bottlenecks are limited by the physical properties of air as a cooling medium, such as its low specific heat capacity, low thermal conductivity, and low density. This results in a theoretical upper limit to its heat dissipation capacity, determined by the air convection heat transfer coefficient, making it difficult to cope with future chip power consumption exceeding 500W or even kilowatts. To overcome this theoretical limit, engineers are often forced to adopt strategies such as increasing fin area and fan speed. This directly leads to a sharp increase in the size and weight of the heat sink, which runs counter to the trend of miniaturization and thinning of electronic devices.

[0007] 2. The heat transfer path is lengthy, from the chip to the heat spreader, then to the heat pipe, and finally to the fins. There are multiple solid-solid contact interfaces and material transition nodes. Each of these introduces additional contact thermal resistance and conduction thermal resistance, making it difficult to further reduce the total thermal resistance from the chip junction temperature to the ambient air. This results in low heat transfer efficiency, temperature uniformity, and heat dissipation capacity. Summary of the Invention

[0008] In view of this, the present invention provides an integrated structure of topological cold plate and heat spreader to solve the problems existing in the prior art.

[0009] The technical solution of this invention is: An integrated structure of a topological cold plate and a heat exchanger includes: The cover plate, the first heat exchange plate, and the second heat exchange plate are arranged sequentially from top to bottom, and the cover plate, the first heat exchange plate, and the second heat exchange plate are sealed together to form an integrated structure. The cover plate and the first heat exchange plate enclose a cooling cavity for containing liquid working fluid, and the first heat exchange plate and the second heat exchange plate enclose a phase change cavity for containing two-phase heat transfer working fluid. The cooling cavity and the phase change cavity are independent of each other and heat transfer is achieved through the solid metal wall of the first heat exchange plate. The first heat exchange plate includes a plate body, which has a liquid flow channel on the side facing the cooling chamber and a vapor diffusion zone on the side facing the phase change chamber. The cooling chamber is located between the liquid flow channel and the cover plate, and the phase change chamber is located between the vapor diffusion zone and the second heat exchange plate.

[0010] Furthermore, the liquid flow channel includes at least one main flow channel formed on the plate body and multiple branch flow channels formed by the main flow channel. One end of the branch flow channel is connected to the main flow channel, and the other end is connected to the adjacent branch flow channel and / or the main flow channel.

[0011] Furthermore, the main flow channel and multiple branch flow channels are provided with multiple flow-disrupting recessed structures, which are distributed at intervals.

[0012] Furthermore, the concave structure is cylindrical.

[0013] Furthermore, the vapor diffusion zone includes multiple independent groove structures formed on the plate body, and the groove structures are connected to the phase change cavity.

[0014] Furthermore, multiple support structures are provided around the groove structure, and the positions of the multiple support structures correspond one-to-one with the positions of the multiple turbulence-causing recessed structures.

[0015] Furthermore, the support structure is cylindrical, and the cross-sectional dimension of the turbulence-causing recessed structure is smaller than that of the corresponding support structure.

[0016] Furthermore, the cover plate includes a plate body two and a cooling liquid working medium inlet and a cooling liquid working medium outlet disposed on the plate body two. The cooling liquid working medium inlet and the cooling liquid working medium outlet are respectively used to connect with an external liquid cooling circulation system and to guide the liquid working medium to flow inside the cooling chamber. The cooling liquid working medium inlet is connected to the main channel inlet, and the cooling liquid working medium outlet is connected to the main channel outlet.

[0017] Furthermore, the second heat exchange plate includes a plate body three and a capillary porous structure layer disposed on one side of the plate body three. The capillary porous structure layer is disposed toward the vapor diffusion zone and is used to promote vapor generation and liquid diffusion during the liquid phase change process of the two-phase heat transfer working fluid.

[0018] Compared with existing technologies, the integrated structure of the vapor chamber and the liquid cooling plate provided by this invention fundamentally eliminates the intermediate interface by fusing the condensation surface of the vapor chamber and the heat absorption surface of the liquid cooling plate into a single physical component. This allows the latent heat of phase change released by the condensation of vapor on the lower surface of the first heat exchange plate to be directly introduced into the liquid cooling channel on the upper surface and absorbed by the liquid working fluid with extremely low thermal resistance, thereby significantly reducing the total thermal resistance from the chip heat source to the final liquid working fluid. Furthermore, the structure provided by this invention utilizes an integrated structure to deeply couple the excellent lateral heat diffusion capability of the vapor chamber with the efficient single-phase convective heat transfer capability of the liquid cooling system at the physical level. The two-phase heat transfer working fluid in the second heat exchange plate rapidly smooths out the uneven heat flow on the chip surface through phase change circulation, while the carefully designed liquid cooling channel in the first heat exchange plate provides a powerful, directional longitudinal heat removal capability, thus achieving the dual optimization goals of temperature homogenization and heat removal in the chip temperature field under high heat loads. Furthermore, the structure provided by this invention is integrated into a compact three-layer board structure, which greatly simplifies the system architecture, reduces volume and weight, and helps to improve the reliability and robustness of the entire heat dissipation subsystem, better adapting to the application requirements of kilowatt-level high power density electronic devices. Attached Figure Description

[0019] Figure 1 A schematic diagram of the overall structure of the present invention.

[0020] Figure 2 A schematic diagram of the cover plate structure of the present invention.

[0021] Figure 3 A schematic diagram of the structure of one side of the first heat exchange plate of the present invention.

[0022] Figure 4 A schematic diagram of the structure of the other side of the first heat exchange plate of the present invention.

[0023] Figure 5 A schematic diagram of the structure of the second heat exchange plate of the present invention.

[0024] Figure label: 1. Cover plate; 1.1 Cooling liquid working fluid inlet; 1.2 Cooling liquid working fluid outlet; 2. First heat exchange plate; 2.1 Multi-stage branch flow channel structure; 2.2 Rib structure; 2.3 Groove structure; 2.4 Support structure; 2.5 Recessed structure; 3. Second heat exchange plate; 3.1 Plate body three; 3.2 Capillary porous structure layer. Detailed Implementation

[0025] This invention provides an integrated structure of a topological cold plate and a heat spreader to solve the aforementioned problems. To enable those skilled in the art to better understand and implement the technical solution of this invention, the technical solution will be clearly and thoroughly described below with reference to the accompanying drawings.

[0026] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0027] Furthermore, it should be further explained that in the description of the embodiments of the present invention, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of the present invention, "multiple" means two or more.

[0028] The terms "first," "second," "third," and "fourth" are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of indicated technical features. Thus, a feature defined as "first," "second," "third," or "fourth" may explicitly or implicitly include one or more of that feature. In the description of this invention, unless otherwise stated, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0029] In this invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0030] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature is in indirect contact with the second feature through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0031] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this invention are for illustrative purposes only and do not represent the only possible implementation.

[0032] Example 1 The following is a detailed description of the integrated structure of a topological cold plate and a heat exchanger provided by the present invention: The integrated structure of the topological cold plate vapor chamber integrates a phase change cavity and a cooling cavity within the integrated structure, enabling direct coupling of two different heat transfer mechanisms at the structural level. This creates a composite heat transfer path with low thermal resistance, high temperature uniformity, and strong heat dissipation capacity, fundamentally eliminating the intermediate interface. This allows the latent heat of phase change released by the condensation of steam on the lower surface of the first heat exchange plate 2 to be directly introduced into the liquid cooling channel on the upper surface with extremely low thermal resistance and absorbed by the liquid working fluid. This significantly reduces the total thermal resistance from the chip heat source to the final liquid working fluid, achieving the dual optimization goals of temperature uniformity and heat transfer in the chip temperature field under high heat load.

[0033] Specifically, the integrated structure of the topological cold plate heat exchanger of the present invention is a stacked plate structure, which includes a cover plate 1, a first heat exchange plate 2 and a second heat exchange plate 3 from top to bottom. The cover plate 1, the first heat exchange plate 2 and the second heat exchange plate 3 are arranged sequentially along the thickness direction and are formed into an integrated structure by welding, diffusion connection or other reliable sealing connection methods.

[0034] The cover plate 1 and the first heat exchange plate 2 enclose a cooling cavity for containing liquid working fluid, and the first heat exchange plate 2 and the second heat exchange plate 3 enclose a phase change cavity for containing two-phase heat transfer working fluid.

[0035] The cooling chamber and the phase change chamber are structurally independent and not connected to each other, but they transfer heat through the solid metal wall of the first heat exchange plate 2. This arrangement allows the cooling chamber and the phase change chamber to maintain a good thermal coupling relationship while being isolated from each other.

[0036] As a further explanation of the above embodiment, the cover plate 1 is disposed on the uppermost layer of the overall structure, and together with the first heat exchange plate 2, it defines a cooling chamber. The cover plate 1 includes a plate body and a cooling liquid working fluid inlet 1.1 and a cooling liquid working fluid outlet 1.2 disposed on the plate body. The cooling liquid working fluid inlet 1.1 and the cooling liquid working fluid outlet 1.2 are respectively used to communicate with an external liquid cooling circulation system to guide the liquid working fluid to flow inside the cooling chamber. The cooling liquid working fluid inlet 1.1 is connected to the main channel inlet, and the cooling liquid working fluid outlet 1.2 is connected to the main channel outlet.

[0037] As a further explanation of the above embodiments, the first heat exchange plate 2 is the core functional component of the present invention, which simultaneously undertakes the dual functions of two-phase heat transfer and condensation heat exchange and liquid cooling heat exchange.

[0038] Specifically, the first heat exchange plate 2 has a first heat exchange side and a second heat exchange side arranged opposite to each other along the thickness direction, wherein the first heat exchange side faces the cooling cavity and the second heat exchange side faces the phase change cavity.

[0039] Specifically, as a further explanation of the above embodiment, the first heat exchange plate 2 includes a plate body. The plate body has a liquid flow channel on the side facing the cooling chamber and a vapor diffusion zone on the side facing the phase change chamber. The cooling chamber is located between the liquid flow channel and the cover plate, and the phase change chamber is located between the vapor diffusion zone and the second heat exchange plate.

[0040] The liquid flow channel includes a multi-level branch flow channel structure 2.1 opened on one side of the plate. The multi-level branch flow channel structure 2.1 is the main functional structure of the first heat exchange side. The multi-level branch flow channel structure 2.1 includes at least one main flow channel and multiple branch flow channels formed by the main flow channel.

[0041] Specifically, the main flow channel and multiple branch flow channels adopt a biomimetic topology optimization design, whose shape simulates the distribution of efficient branch veins in nature. The aim is to achieve uniform coverage of the entire heating area by the liquid working fluid with minimal flow resistance, avoiding flow dead zones and weak heat transfer zones.

[0042] Specifically, as one implementation method, there is one main channel, and multiple branch channels are evenly distributed on both sides of the main channel and arranged symmetrically. One end of the branch channel is connected to the main channel, and the other end is connected to the adjacent branch channel and / or the main channel.

[0043] The inlet of the main channel is connected to the inlet 1.1 of the cooling liquid working medium, and the outlet of the main channel is connected to the outlet 1.2 of the cooling liquid working medium, so that the liquid working medium can be distributed and covered more evenly on the surface of the first heat exchange plate 2.

[0044] A rib structure 2.2 is formed between adjacent branch channels. The rib structure 2.2 not only defines the shape of the channel, but also serves as the load-bearing and heat-conducting structure of the first heat exchange plate 2, so that the cooling cavity can obtain a large effective heat exchange area while ensuring mechanical strength.

[0045] It should be noted that multiple flow-disrupting recessed structures 2.5 are provided in the main flow channel and multiple branch flow channels. The multiple flow-disrupting recessed structures 2.5 are distributed at intervals along the flow direction of the liquid working medium to disturb the flow state during the flow of the liquid working medium, thereby enhancing the degree of fluid mixing.

[0046] The vapor diffusion zone includes multiple independent groove structures 2.3 formed on the plate, and the groove structures 2.3 are all connected to the phase change cavity.

[0047] The groove structure 2.3 is the main functional structure on the second heat exchange side, providing more space for the vapor diffusion and condensation of the two-phase heat transfer medium. Simultaneously, multiple spaced support structures 2.4 are located on the other side of the plate. These support structures 2.4 are situated around the groove structure 2.3, supporting the first heat exchange plate 2 and the second heat exchange plate 3 while connecting multiple independent groove structures. This enhances the overall stability of the integrated topological cold plate and heat exchanger structure, preventing the phase change cavity from collapsing during vacuuming or changes in operating pressure, and ensuring a stable cavity height.

[0048] In practical applications, the flow-disrupting recessed structure 2.5 can be positioned in the thickness direction corresponding to the support structure 2.4 on the second heat exchange side. This allows the first heat exchange plate 2 to simultaneously possess both a flow-disrupting structure and a support structure in the corresponding area, achieving the dual functions of enhancing mechanical strength and strengthening heat exchange. The support structure 2.4 maintains structural stability between the first heat exchange plate 2 and the second heat exchange plate 3 during vacuuming or changes in operating pressure. The flow-disrupting recessed structure 2.5 promotes heat exchange between the cooling liquid working fluid and the first heat exchange side by altering the local flow state within the flow channel.

[0049] As a further optimization of this embodiment, the turbulence-causing recessed structure 2.5 and the support structure 2.4 are arranged correspondingly to each other in the thickness direction and are located on both sides of the plate body.

[0050] In one specific embodiment, the cross-sections of the turbulence-disrupting recessed structure 2.5 and the supporting structure 2.4 can be respectively set as circular, and the cross-sectional dimension of the turbulence-disrupting recessed structure 2.5 is smaller than that of the corresponding supporting structure 2.4, so as to optimize the overall structural form of the first heat exchange plate 2 while meeting the structural layout requirements. Through the above structural setting, it is helpful to improve the flow state of the coolant and the heat exchange conditions while meeting the structural stability requirements.

[0051] The second heat exchange plate 3 is located at the bottom of the overall structure, and includes a plate body 3.1 and a capillary porous structure layer 3.2 disposed on one side of the plate body 3.1. The capillary porous structure layer 3.2 is oriented towards the phase change cavity, and its own porous structure can be used to promote steam generation and liquid diffusion during the liquid phase change process.

[0052] The first heat exchange plate 2 and the second heat exchange plate 3 are connected by a sealed connection to form a closed phase change cavity, which is filled with an appropriate amount of two-phase heat transfer medium. During operation, heat from the electronic device is transferred through the plate body 3.1 to the capillary porous structure layer 3.2, causing the liquid working medium to absorb heat and evaporate to generate steam. The steam enters the steam diffusion cavity and diffuses to the second heat exchange side of the first heat exchange plate 2, where it condenses and releases latent heat. The released heat is conducted through the first heat exchange plate 2 to its first heat exchange side and is finally carried away by the liquid working medium flowing in the cooling cavity, thereby achieving efficient heat dissipation of the electronic device.

[0053] The present invention provides an integrated structure of a topological cold plate and a vapor chamber, the working process of which is a synergistic cycle coupling phase change heat transfer and single-phase forced convection, which can be divided into three interconnected stages: The first stage is the heat absorption and evaporation process. The heat generated when the electronic device is working is transferred to the second heat exchange plate 3 through the thermally conductive interface material. The heat on the second heat exchange plate 3 is transferred to the capillary porous structure layer 3.2 through the plate body 3.1. The liquid two-phase heat transfer medium impregnated in the capillary core in the capillary porous structure layer 3.2 quickly absorbs the heat and undergoes a phase change, turning into steam. This converts the heat generated by the electronic device from solid-state heat transfer to phase change heat transfer and stores it in latent heat. This process absorbs a large amount of latent heat of phase change, which can efficiently reduce the temperature of the chip contact area and convert thermal energy into the internal energy of steam.

[0054] The second stage is the steam transport and condensation homogenization process. Under the pressure difference within the phase change cavity, the generated steam rapidly diffuses throughout the entire phase change cavity space and condenses on the second heat exchange side surface of the first heat exchange plate 2, releasing latent heat. Due to the high diffusion capacity of steam within the phase change cavity, the temperature distribution on the second heat exchange side of the first heat exchange plate 2 tends to be uniform, thereby achieving temperature homogenization of the corresponding heat source area of ​​the second heat exchange plate 3. Simultaneously, the latent heat of condensation released by the steam is directly transferred vertically through the thermal conductivity of the solid metal of the first heat exchange plate 2, ultimately conducting the heat to the first heat exchange side of the first heat exchange plate 2.

[0055] The third stage is the liquid cooling-enhanced heat transfer and final heat dissipation process. The heat transferred from the first heat exchange plate 2 to its first heat exchange side is carried away by the liquid working fluid flowing in the main channel and multiple branch channels. The main channel and multiple branch channels adopt a biomimetic topology optimization design, and their shape simulates the distribution of efficient branching veins in nature. The aim is to achieve uniform coverage of the entire heating area by the liquid working fluid with minimal flow resistance, avoiding flow dead zones and weak heat transfer zones. The multiple turbulence-inducing recessed structures 2.5 set in the main channel and multiple branch channels periodically disturb the boundary layer. When the liquid working fluid flows through the turbulence-inducing recessed structures 2.5, flow separation and reattachment occur, thereby significantly enhancing the mixing and turbulence intensity of the fluid. The enhanced turbulence greatly disrupts the development of the thermal boundary layer, strengthens the convective heat transfer coefficient between the liquid working fluid and the channel wall, and allows the heat introduced from the metal wall of the first heat exchange plate 2 to be absorbed by the liquid working fluid more efficiently and rapidly and carried to the outside of the system. Finally, the liquid working fluid, after absorbing heat, is circulated to the external air-cooled or water-cooled condenser by the external pump of the external liquid cooling circulation system, completing the final heat dissipation. The cooled liquid working fluid is then pumped back into the flow channel to start the next cycle.

[0056] This embodiment provides an integrated structure of a topological cold plate and a vapor chamber, suitable for heat dissipation of 800W high power density chips. The parameters of each component are as follows: In one specific embodiment, the cover plate 1, the first heat exchange plate 2, and the second heat exchange plate 3 can all be made of copper-based thermally conductive materials, such as oxygen-free copper. The overall dimensions of the structure can be designed according to the installation space of the electronic devices, for example, approximately 150mm × 150mm × 12mm.

[0057] The thickness of the cover plate 1 can be 1mm–3mm, for example 2mm. The cover plate 1 is provided with a cooling liquid working fluid inlet 1.1 and a cooling liquid working fluid outlet 1.2. The diameter of the outlet can be selected according to the cooling liquid flow rate and heat exchange requirements, and it is connected to the external liquid cooling circulation system by means of threads.

[0058] The external liquid cooling circulation system can use deionized water as the cooling medium, with a flow rate controllable between 2m / s and 3m / s and an inlet / outlet temperature difference controllable between 5℃ and 8℃.

[0059] The thickness of the first heat exchange plate 2 can be 3mm–5mm, for example 4mm, and its first heat exchange side is provided with a multi-stage branch flow channel structure 2.1. The multi-stage branch flow channel structure 2.1 can adopt a single-stage or multi-stage branch design, and the width, depth and distribution of its main flow channel and branch flow channels are designed and determined according to the coolant flow rate and heat exchange requirements.

[0060] In one embodiment, the width of the main flow channel can be 6mm–10mm, and the width of the branch flow channels can be 2mm–4mm. Rib structures 2.2 are provided between adjacent flow channels. The width and height of the rib structures 2.2 are designed according to the strength requirements of the first heat exchange plate 2; for example, the width of the rib structure 2.2 is smaller than the width of the adjacent flow channels. Multiple turbulence-inducing recessed structures 2.5 can be provided within the main flow channel and branch flow channels. The shape, size, and spacing of the turbulence-inducing recessed structures 2.5 are set according to the flow channel dimensions. In one embodiment, its cross-section is circular, with a cross-sectional dimension smaller than the corresponding support structure 2.4, and it is correspondingly arranged to the support structure 2.4 in the thickness direction. A groove structure 2.3 with a depth of 1mm–2mm is provided on the second heat exchange side of the first heat exchange plate 2 to define a sealed phase change cavity.

[0061] The thickness of the second heat exchange plate 3 can be 1.5mm–3mm, and a capillary porous structure layer 3.2 is provided on it. The capillary porous structure layer is a metal porous structure, such as a copper powder sintered structure. Its thickness, porosity, and pore size range are designed according to the working fluid reflux capacity, for example, the porosity is 70%–90%. The phase change cavity is filled with a two-phase heat transfer working fluid, such as pure water, and its filling volume can be 20%–50% of the cavity volume. It is evacuated to a vacuum state during the encapsulation process.

[0062] The cover plate 1, the first heat exchange plate 2, and the second heat exchange plate 3 can be sealed together by means of vacuum brazing or other methods to form a closed phase change cavity.

[0063] The heat dissipation performance test of this embodiment shows that when the chip heat flux density is 800W / cm², the chip junction temperature is controlled below 85℃, the surface temperature uniformity of the intermediate heat exchange plate is ±1.5℃, the flow pressure drop is less than 10kPa, the heat dissipation efficiency is 25% higher than the traditional split heat exchange plate + liquid cooling plate solution, and the volume is reduced by 35%, which meets the stable operation requirements of high power chips.

[0064] This invention provides an integrated structure of a topological cold plate and a vapor chamber, primarily addressing the issue of solid-solid interface thermal resistance between separate vapor chambers and liquid cooling plates. In traditional vapor chamber + liquid cooling plate combinations, the mechanical connection between the two introduces significant and non-negligible additional thermal resistance, becoming a bottleneck limiting further improvement in overall heat dissipation performance. By integrating the condensation surface of the vapor chamber and the heat absorption surface of the liquid cooling plate into a single physical component, this intermediate interface is fundamentally eliminated. This allows the latent heat of phase change released by the condensation of vapor on the lower surface of the first heat exchange plate to be directly introduced into the liquid cooling channel on the upper surface with extremely low thermal resistance and carried away by the circulating liquid working fluid. This significantly reduces the total thermal resistance from the chip heat source to the final liquid working fluid, improving heat dissipation efficiency by more than 20% compared to separate solutions.

[0065] Secondly, the structure provided by this invention aims to solve the problem of balancing temperature uniformity and heat dissipation intensity in a heat dissipation system under high heat flux density conditions. Traditional pure liquid cooling plates, when in direct contact with the chip, can provide high-intensity heat dissipation, but their temperature uniformity may be insufficient, easily leading to localized hot spots. While independent vapor chambers offer excellent temperature uniformity, their ultimate heat dissipation capacity is limited by secondary heat dissipation methods. The integrated structure deeply couples the vapor chamber's superior lateral heat diffusion capability with the efficient single-phase convective heat transfer capability of liquid cooling at the physical level. The phase change cycle within the second heat exchange plate 3 rapidly diffuses the high temperature on the chip surface, while the carefully designed liquid cooling channels within the first heat exchange plate 2 provide a powerful, directional, longitudinal heat removal capability, thereby achieving the dual optimization goals of temperature uniformity and heat removal in the chip temperature field under high heat loads.

[0066] Furthermore, the structure provided by this invention offers a solution to the problems of redundant structures, large space occupation, and dispersed reliability risks in complex heat dissipation systems. By integrating two core functional modules that originally required independent design, fabrication, and assembly into a compact three-layer board structure, the system architecture is greatly simplified, valuable installation space is saved, and the volume is reduced by more than 30% compared to traditional solutions. This is of great significance for applications that are extremely sensitive to size and weight. At the same time, the reduction in the number of components also means a reduction in potential leakage points, mechanical connection failure points, and other failure modes, contributing to improved reliability and robustness of the entire heat dissipation subsystem.

[0067] In summary, the integrated topological cold plate and vapor chamber structure provided by this invention achieves a more compact structure and reduces the overall thickness through the integrated design of the vapor chamber and cold plate. The cold plate topological flow channel structure reduces flow pressure drop and thermal resistance, enhancing temperature uniformity. The concave structure for turbulence increases fluid turbulence, improving heat transfer efficiency. Furthermore, the integrated design helps improve the reliability and robustness of the entire heat dissipation subsystem. It can control the chip surface temperature uniformity within ±1.5℃ in scenarios with heat flux densities exceeding 500W / cm², while simultaneously meeting the heat dissipation requirements for kilowatt-level power consumption. It is highly practical and worthy of widespread adoption.

[0068] The above-disclosed embodiments are merely preferred embodiments of the present invention. However, the embodiments of the present invention are not limited thereto, and any variations that can be conceived by those skilled in the art should fall within the protection scope of the present invention.

Claims

1. An integrated structure of a topological cold plate and a heat dissipation plate, characterized in that, include: The cover plate, the first heat exchange plate, and the second heat exchange plate are arranged sequentially from top to bottom, and the cover plate, the first heat exchange plate, and the second heat exchange plate are sealed together to form an integrated structure. The cover plate and the first heat exchange plate enclose a cooling cavity for containing liquid working fluid, and the first heat exchange plate and the second heat exchange plate enclose a phase change cavity for containing two-phase heat transfer working fluid. The cooling cavity and the phase change cavity are independent of each other and heat transfer is achieved through the solid metal wall of the first heat exchange plate. The first heat exchange plate includes a plate body, which has a liquid flow channel on the side facing the cooling chamber and a vapor diffusion zone on the side facing the phase change chamber. The cooling chamber is located between the liquid flow channel and the cover plate, and the phase change chamber is located between the vapor diffusion zone and the second heat exchange plate.

2. The integrated structure of topological cold plate and heat spreader according to claim 1, characterized in that, The liquid flow channel includes at least one main flow channel formed on the plate and multiple branch flow channels formed by the main flow channel. One end of the branch flow channel is connected to the main flow channel, and the other end is connected to the adjacent branch flow channel and / or the main flow channel.

3. The integrated structure of topological cold plate and heat spreader according to claim 2, characterized in that, The main channel and multiple branch channels are equipped with multiple flow-disrupting recessed structures, which are distributed at intervals.

4. The integrated structure of the topological cold plate and the heat dissipation plate according to claim 3, characterized in that, The concave structure is cylindrical.

5. The integrated structure of topological cold plate and heat spreader according to claim 4, characterized in that, The vapor diffusion zone includes multiple independent groove structures formed on the plate, and the groove structures are connected to the phase change cavity.

6. The integrated structure of the topological cold plate and the heat spreader according to claim 5, characterized in that, The groove structure is surrounded by multiple support structures, and the positions of the multiple support structures correspond one-to-one with the positions of the multiple turbulence-causing recessed structures.

7. The integrated structure of topological cold plate and heat spreader according to claim 6, characterized in that, The support structure is cylindrical, and the cross-sectional dimension of the turbulence-causing recessed structure is smaller than that of the corresponding support structure.

8. The integrated structure of topological cold plate and heat spreader according to claim 2, characterized in that, The cover plate includes a plate body two and a cooling liquid working medium inlet and a cooling liquid working medium outlet disposed on the plate body two. The cooling liquid working medium inlet and the cooling liquid working medium outlet are respectively used to connect with an external liquid cooling circulation system and to guide the liquid working medium to flow inside the cooling chamber. The cooling liquid working medium inlet is connected to the main channel inlet, and the cooling liquid working medium outlet is connected to the main channel outlet.

9. The integrated structure of the topological cold plate and the heat dissipation plate according to claim 1, characterized in that, The second heat exchange plate includes a plate body three and a capillary porous structure layer disposed on one side of the plate body three. The capillary porous structure layer is disposed towards the vapor diffusion zone and is used to promote vapor generation and liquid diffusion during the liquid phase change process of the two-phase heat transfer working fluid.

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