PCB with auxiliary heat dissipation structure

Abstract

The utility model discloses a PCB with an auxiliary heat dissipation structure, which comprises a thermoelectric separation circuit board, a copper substrate is arranged at the bottom of the thermoelectric separation circuit board, a plurality of bayonets are uniformly arranged on the bottom surface of the copper substrate, heat dissipation aluminum plates are connected to the inner sides of the bayonets, heat conduction silicone grease is coated between the connection positions of the heat dissipation aluminum plates and the copper substrate, and the heat conduction silicone grease is coated on the copper substrate. The heat conduction silicone grease is used for guiding heat on the copper substrate to the heat dissipation aluminum plate, a heat dissipation fan is installed below the heat dissipation aluminum plate, and the heat dissipation fan is matched with the heat dissipation aluminum plate to be used for rapidly discharging heat generated by the thermoelectric separation circuit board. The heat dissipation aluminum plate is installed on the bottom face of the thermoelectric separation circuit board through heat conduction silicone grease, the heat dissipation aluminum plate makes full contact with the copper substrate at the bottom of the thermoelectric separation circuit board through the heat conduction silicone grease, heat generated by the copper substrate can be smoothly transmitted to the heat dissipation aluminum plate, and heat generated by the heat dissipation aluminum plate can be rapidly taken away through the heat dissipation fan.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a PCB circuit board with an auxiliary heat dissipation structure. Background Art

[0002] There are many kinds of PCB circuit boards, and the structures of PCB circuit boards are different according to different usage requirements and functions. Some PCB circuit boards generate a lot of heat when working, so some auxiliary heat dissipation devices are installed on these PCB circuit boards. For example, a circuit board with an auxiliary heat dissipation mechanism disclosed in the patent with the Chinese patent authorization announcement number CN216626447U includes a circuit board, a connection mechanism is provided at both sides of the circuit board, and an auxiliary heat dissipation mechanism is provided between the two connection mechanisms; the auxiliary heat dissipation mechanism includes a bracket, a strip groove is provided on the bracket, and large holes are provided on both sides of the strip groove on the bracket; the circuit board with the auxiliary heat dissipation mechanism is provided through the provided connection mechanism and the auxiliary heat dissipation mechanism: on the one hand, the provided bracket and the fan blades installed on the bracket, etc., can drive the fan blades to rotate through the motor, so that the circuit board can be cooled under the action of the wind force generated by the rotation of the fan blades, and this design improves the heat dissipation effect of the circuit board; on the other hand, the provided fixing seat and the limit rod are convenient for disassembly and assembly of the heat dissipation mechanism, so as to facilitate the operation of the circuit board; this design facilitates the heat dissipation of the circuit board and protects the circuit board.

[0003] The heat dissipation structure of the circuit board provided by the above patent has limited heat dissipation effect on the circuit board. Among the commonly used circuit boards, there is a type called a thermoelectric separation circuit board, which is mostly used in LED lamps. Therefore, the heat dissipation surface of the thermoelectric separation circuit board used in large LED lamps will generate a large amount of heat, and the auxiliary heat dissipation structure provided by the above patent cannot effectively discharge the heat generated by the heat dissipation surface of the thermoelectric separation circuit board, resulting in the heat separation circuit board used in large LED lamps being easily damaged due to overheating. Utility Model Content

[0004] The purpose of the utility model is to provide a PCB circuit board with an auxiliary heat dissipation structure, aiming to improve the problem that the auxiliary heat dissipation structure of the existing PCB circuit board cannot effectively discharge the heat generated by the heat dissipation surface of the thermoelectric separation circuit board, resulting in the heat separation circuit board used in large LED lamps being easily damaged due to overheating.

[0005] The utility model is achieved in this way:

[0006] A PCB circuit board with an auxiliary heat dissipation structure comprises a thermoelectric separation circuit board, a copper base plate is arranged at the bottom of the thermoelectric separation circuit board, a plurality of bayonet holes are evenly arranged on the bottom surface of the copper base plate, a heat dissipation aluminum plate is connected to the inner side of the bayonet hole, thermal conductive silicone grease is applied between the connection position of the heat dissipation aluminum plate and the copper base plate, the thermal conductive silicone grease is used to guide the heat on the copper base plate to the heat dissipation aluminum plate, and a heat dissipation fan is installed under the heat dissipation aluminum plate, and the heat dissipation fan cooperates with the heat dissipation aluminum plate to quickly discharge the heat generated by the thermoelectric separation circuit board.

[0007] Preferably, an insulating layer is provided between the thermoelectric separation circuit board and the copper substrate, the insulating layer is made of epoxy resin fiberglass board, and the insulating layer is connected to the thermoelectric separation circuit board and the copper substrate by adhesive resin, and the bayonet is in a T-shaped structure, which is used to stably connect the heat dissipation aluminum plate to the thermoelectric separation circuit board.

[0008] Preferably, a plurality of clamping rods are evenly arranged on the upper surface of the heat dissipation aluminum plate, the clamping rods are in a T-shaped structure, and a plurality of heat dissipation fins are evenly arranged on the bottom surface of the heat dissipation aluminum plate, a connecting platform is provided at the bottom of the heat dissipation aluminum plate aligned with the position of the heat dissipation fan, a threaded groove is provided in the middle of the connecting platform, and the connecting platform cooperates with the threaded groove to install the heat dissipation fan.

[0009] Preferably, an insert ring is provided at the edge of the air suction end of the cooling fan, and the insert ring is against the cooling fins. Perforations are provided at the corners of the cooling fan, and the perforations are used to cooperate with bolts to fix the position of the cooling fan. A wire is provided on the side of the cooling fan, and a plug connector is provided at the end of the wire.

[0010] Preferably, a drainage cover is attached to the bottom end of the heat dissipation fin, and the heat dissipation fan is pressed against the drainage cover, and the drainage cover is used to ensure that airflow enters from both ends of the heat dissipation fin.

[0011] Preferably, a pressure ring is provided on the bottom surface of the drainage cover aligned with the corner of the cooling fan, a sleeve hole is provided in the middle of the pressure ring, and an air diffusion hole is provided in the middle of the drainage cover, and the air diffusion hole is used to cooperate with the cooling fan to extract air and dissipate heat.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The utility model installs a heat dissipation aluminum plate on the bottom surface of the thermoelectric separation circuit board through thermal conductive silicone grease. The heat dissipation aluminum plate fully contacts the copper substrate at the bottom of the thermoelectric separation circuit board by thermal conductive silicone grease, so that the heat generated by the copper substrate can be smoothly transferred to the heat dissipation aluminum plate, and the heat generated by the heat dissipation aluminum plate will be quickly drawn away by the heat dissipation fan, thereby ensuring that the heat generated by the thermoelectric separation circuit board can be quickly discharged.

[0014] 2. The drainage cover of the utility model is covered on the surface of the heat sink fins, so that only two sides of the heat sink fins are connected to the outside world. In this way, when the heat sink fan drives the airflow, the external air can flow into the inside of the heat sink fins through the two sides of the heat sink fins, thereby efficiently dissipating the heat dissipated by the heat sink fins. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a structural schematic diagram of the thermoelectric separation circuit board of the utility model;

[0017] Figure 3 It is a structural schematic diagram of the heat dissipation aluminum plate of the utility model;

[0018] Figure 4 It is a structural schematic diagram of the heat dissipation fan of the utility model;

[0019] Figure 5 It is a structural schematic diagram of the drainage cover of the utility model.

[0020] In the figure: 1. Thermoelectric separation circuit board; 11. Insulation layer; 12. Copper base plate; 13. Bayonet; 2. Heat dissipation aluminum plate; 21. Clamping rod; 22. Heat dissipation fins; 23. Connecting platform; 24. Threaded groove; 3. Heat dissipation fan; 31. Insertion ring; 32. Perforation; 33. Wire; 34. Plug connector; 4. Drainage cover; 41. Pressing ring; 42. Sleeve hole; 43. Air diffusion hole. DETAILED DESCRIPTION

[0021] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] The following is a further description with reference to the accompanying drawings and specific embodiments:

[0023] Example 1

[0024] like Figure 1As shown, a PCB circuit board with an auxiliary heat dissipation structure includes a thermoelectric separation circuit board 1. A copper substrate 12 is provided at the bottom of the thermoelectric separation circuit board 1. The copper substrate 12 is used for the thermoelectric separation circuit board 1, so that the thermoelectric separation circuit board 1 can smoothly discharge heat. A plurality of bayonet holes 13 are evenly arranged on the bottom surface of the copper substrate 12. The bayonet holes 13 are convenient for installing the heat dissipation aluminum plate 2. At the same time, the bayonet holes 13 are also convenient for increasing the heat dissipation surface of the copper substrate 12, so that the copper substrate 12 can quickly dissipate heat. A heat dissipation aluminum plate 2 is connected to the inner side of the bayonet hole 13. Thermal conductive silicone grease is applied between the connection position of the heat dissipation aluminum plate 2 and the copper substrate 12. The thermal conductive silicone grease is used to guide the heat on the copper substrate 12 to the heat dissipation aluminum plate 2. A heat dissipation fan 3 is installed under the heat dissipation aluminum plate 2. The heat dissipation fan 3 cooperates with the heat dissipation aluminum plate 2 to quickly discharge the heat generated by the thermoelectric separation circuit board 1.

[0025] like Figure 2 As shown, an insulating layer 11 is provided between the thermoelectric separation circuit board 1 and the copper substrate 12, and the insulating layer 11 is used to separate the thermoelectric separation circuit board 1 and the copper substrate 12 to prevent the internal circuits thereof from being affected. The insulating layer 11 is made of epoxy resin glass fiber board, and the insulating layer 11 is connected to the thermoelectric separation circuit board 1 and the copper substrate 12 by adhesive resin. This structure can ensure that the thermoelectric separation circuit board 1 has good integrity. The bayonet 13 is a T-shaped structure, and is used to stably connect the heat dissipation aluminum plate 2 to the thermoelectric separation circuit board 1.

[0026] like Figure 3 As shown, the upper surface of the heat dissipation aluminum plate 2 is evenly provided with a plurality of clamping rods 21, which are in a T-shaped structure, and the clamping rods 21 facilitate the stable connection of the heat dissipation aluminum plate 2 with the thermoelectric separation circuit board 1. And the bottom surface of the heat dissipation aluminum plate 2 is evenly provided with a plurality of heat dissipation fins 22, and the heat dissipation fins 22 facilitate the heat dissipation of the heat dissipation aluminum plate 2 to quickly dissipate heat. The bottom of the heat dissipation aluminum plate 2 is aligned with the position of the heat dissipation fan 3 and is provided with a connecting platform 23, and a threaded groove 24 is provided in the middle of the connecting platform 23, and the connecting platform 23 cooperates with the threaded groove 24 to install the heat dissipation fan 3.

[0027] like Figure 4 As shown, a plug ring 31 is provided at the edge of the air suction end of the cooling fan 3, and the plug ring 31 is against the heat dissipation fins 22, so as to facilitate the cooling fan 3 to pump out heat. A through hole 32 is provided at the corner of the cooling fan 3, and the through hole 32 is used to cooperate with the bolt to fix the position of the cooling fan 3. A wire 33 is provided on the side of the cooling fan 3, and a plug connector 34 is provided at the end of the wire 33. The cooperation between the wire 33 and the plug connector 34 is convenient for connecting the cooling fan 3 with the control end of the device, so as to facilitate the control of the operation of the cooling fan 3.

[0028] Working principle: When in use, apply thermal grease to the inner side of the buckle of the thermoelectric separation circuit board 1 according to the use requirements, and then snap the heat dissipation aluminum plate 2 into the bayonet 13 at the bottom of the thermoelectric separation through the thermal grease, and then install the circuit board and the heat dissipation fan 3 in the middle of the device. When the device is working, the heat dissipation fan 3 will rotate, and the heat generated by the thermoelectric separation circuit board 1 will be transferred to the heat dissipation aluminum plate 2, and after passing through the heat dissipation aluminum plate 2, it will be pumped by the heat dissipation fan 3, so that the heat generated by the thermoelectric separation circuit board 1 can be quickly discharged. Compared with the prior art, the present application installs a heat dissipation aluminum plate 2 on the bottom surface of the thermoelectric separation circuit board 1 through thermal grease, and the heat dissipation aluminum plate 2 fully contacts the copper substrate 12 at the bottom of the thermoelectric separation circuit board 1 with the thermal grease, so that the heat generated by the copper substrate 12 can be smoothly transferred to the heat dissipation aluminum plate 2, and the heat generated by the heat dissipation aluminum plate 2 will be quickly pumped away by the heat dissipation fan 3, thereby ensuring that the heat generated by the thermoelectric separation circuit board 1 can be quickly discharged.

[0029] Example 2

[0030] like Figure 1 As shown, a PCB circuit board with an auxiliary heat dissipation structure includes a thermoelectric separation circuit board 1. A copper substrate 12 is provided at the bottom of the thermoelectric separation circuit board 1. The copper substrate 12 is used for the thermoelectric separation circuit board 1, so that the thermoelectric separation circuit board 1 can smoothly discharge heat. A plurality of bayonet holes 13 are evenly arranged on the bottom surface of the copper substrate 12. The bayonet holes 13 are convenient for installing the heat dissipation aluminum plate 2. At the same time, the bayonet holes 13 are also convenient for increasing the heat dissipation surface of the copper substrate 12, so that the copper substrate 12 can quickly dissipate heat. A heat dissipation aluminum plate 2 is connected to the inner side of the bayonet hole 13. Thermal conductive silicone grease is applied between the connection position of the heat dissipation aluminum plate 2 and the copper substrate 12. The thermal conductive silicone grease is used to guide the heat on the copper substrate 12 to the heat dissipation aluminum plate 2. A heat dissipation fan 3 is installed under the heat dissipation aluminum plate 2. The heat dissipation fan 3 cooperates with the heat dissipation aluminum plate 2 to quickly discharge the heat generated by the thermoelectric separation circuit board 1.

[0031] like Figure 2 As shown, an insulating layer 11 is provided between the thermoelectric separation circuit board 1 and the copper substrate 12, and the insulating layer 11 is used to separate the thermoelectric separation circuit board 1 and the copper substrate 12 to prevent the internal circuits thereof from being affected. The insulating layer 11 is made of epoxy resin glass fiber board, and the insulating layer 11 is connected to the thermoelectric separation circuit board 1 and the copper substrate 12 by adhesive resin. This structure can ensure that the thermoelectric separation circuit board 1 has good integrity. The bayonet 13 is a T-shaped structure, and is used to stably connect the heat dissipation aluminum plate 2 to the thermoelectric separation circuit board 1.

[0032] like Figure 3As shown, the upper surface of the heat dissipation aluminum plate 2 is evenly provided with a plurality of clamping rods 21, which are in a T-shaped structure, and the clamping rods 21 facilitate the stable connection of the heat dissipation aluminum plate 2 with the thermoelectric separation circuit board 1. And the bottom surface of the heat dissipation aluminum plate 2 is evenly provided with a plurality of heat dissipation fins 22, and the heat dissipation fins 22 facilitate the heat dissipation of the heat dissipation aluminum plate 2 to quickly dissipate heat. The bottom of the heat dissipation aluminum plate 2 is aligned with the position of the heat dissipation fan 3 and is provided with a connecting platform 23, and a threaded groove 24 is provided in the middle of the connecting platform 23, and the connecting platform 23 cooperates with the threaded groove 24 to install the heat dissipation fan 3.

[0033] like Figure 4 As shown, a plug ring 31 is provided at the edge of the air suction end of the cooling fan 3, and the plug ring 31 is against the heat dissipation fins 22, so as to facilitate the cooling fan 3 to pump out heat. A through hole 32 is provided at the corner of the cooling fan 3, and the through hole 32 is used to cooperate with the bolt to fix the position of the cooling fan 3. A wire 33 is provided on the side of the cooling fan 3, and a plug connector 34 is provided at the end of the wire 33. The cooperation between the wire 33 and the plug connector 34 is convenient for connecting the cooling fan 3 with the control end of the device, so as to facilitate the control of the operation of the cooling fan 3.

[0034] like Figure 1 As shown, a drainage cover 4 is attached to the bottom of the heat dissipating fin 22, and the heat dissipating fan 3 is pressed against the drainage cover 4. The drainage cover 4 is used to ensure that the airflow enters from both ends of the heat dissipating fin 22, so as to facilitate the airflow to smoothly take away the heat dissipated by the heat dissipating fin 22.

[0035] like Figure 5 As shown, a pressing ring 41 is provided at the bottom of the drainage cover 4 aligned with the corner of the cooling fan 3. The pressing ring 41 is used to press the cooling fan 3 on the drainage cover 4 to ensure the stability of the drainage cover 4. A sleeve hole 42 is provided in the middle of the pressing ring 41. The sleeve hole 42 is used to be sleeved on the connecting platform 23. A diffuser hole 43 is provided in the middle of the drainage cover 4. The diffuser hole 43 is used to cooperate with the cooling fan 3 to extract air and dissipate heat.

[0036] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may be modified and varied in various ways. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A PCB circuit board with an auxiliary heat dissipation structure, comprising a thermoelectric separation circuit board (1), characterized in that: The bottom of the thermoelectric separation circuit board (1) is provided with a copper base plate (12), the bottom surface of the copper base plate (12) is evenly provided with a plurality of bayonet holes (13), the inner side of the bayonet hole (13) is connected to a heat dissipation aluminum plate (2), a thermal conductive silicone grease is applied between the connection position of the heat dissipation aluminum plate (2) and the copper base plate (12), the thermal conductive silicone grease is used to guide the heat on the copper base plate (12) to the heat dissipation aluminum plate (2), and a heat dissipation fan (3) is installed below the heat dissipation aluminum plate (2), and the heat dissipation fan (3) cooperates with the heat dissipation aluminum plate (2) to quickly discharge the heat generated by the thermoelectric separation circuit board (1).

2. A PCB circuit board with an auxiliary heat dissipation structure according to claim 1, characterized in that: An insulating layer (11) is provided between the thermoelectric separation circuit board (1) and the copper substrate (12); the insulating layer (11) is made of an epoxy resin glass fiber board, and the insulating layer (11) is connected to the thermoelectric separation circuit board (1) and the copper substrate (12) via an adhesive resin; the bayonet (13) is in a T-shaped structure and is used to stably connect the heat dissipation aluminum plate (2) to the thermoelectric separation circuit board (1).

3. The PCB circuit board with auxiliary heat dissipation structure according to claim 1, characterized in that: The upper surface of the heat dissipation aluminum plate (2) is evenly provided with a plurality of clamping rods (21), the clamping rods (21) are in a T-shaped structure, and the bottom surface of the heat dissipation aluminum plate (2) is evenly provided with a plurality of heat dissipation fins (22), the bottom of the heat dissipation aluminum plate (2) is aligned with the position of the heat dissipation fan (3) and a connecting platform (23) is provided at the middle of the connecting platform (23), and the connecting platform (23) cooperates with the threaded groove (24) for installing the heat dissipation fan (3).

4. The PCB circuit board with auxiliary heat dissipation structure according to claim 3, characterized in that: The cooling fan (3) is provided with an insert ring (31) at the edge of the air suction end, the insert ring (31) is against the cooling fin (22), the cooling fan (3) is provided with a through hole (32) at the corner, the through hole (32) is used to cooperate with the bolt to fix the position of the cooling fan (3), the cooling fan (3) is provided with a wire (33) on the side, and the end of the wire (33) is provided with a plug connector (34).

5. The PCB circuit board with auxiliary heat dissipation structure according to claim 4, characterized in that: The bottom end of the heat dissipation fin (22) is fitted with a drainage cover (4), and the heat dissipation fan (3) is pressed against the drainage cover (4). The drainage cover (4) is used to ensure that airflow enters from both ends of the heat dissipation fin (22).

6. The PCB circuit board with auxiliary heat dissipation structure according to claim 5, characterized in that: A pressing ring (41) is provided on the bottom surface of the drainage cover (4) so ​​as to align with the corner of the heat dissipation fan (3), a sleeve hole (42) is provided in the middle of the pressing ring (41), and an air diffusion hole (43) is provided in the middle of the drainage cover (4), and the air diffusion hole (43) is used to cooperate with the heat dissipation fan (3) to extract air and dissipate heat.

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