Heat conduction device and electronic equipment

Abstract

The utility model discloses a heat conduction device and electronic equipment. The heat conduction device comprises a first heat conduction piece and a second heat conduction piece, and the first heat conduction piece can be bent; the end part of the second heat conduction piece is connected with the end part of the first heat conduction piece, and the second heat conduction piece cannot be bent; the thickness of the heat conduction device is not larger than the thickness of the first heat conduction piece or the thickness of the second heat conduction piece.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation equipment, and in particular to a heat conduction device and an electronic device. Background Art

[0002] As the performance of electronic products such as mobile phones and tablets becomes more and more powerful, the power consumption naturally increases. The thickness of the battery also increases with the required capacity. At the same time, the overall device must meet the trend of becoming lighter and thinner, so heat dissipation becomes a top priority.

[0003] At present, a heat spreader is usually installed inside the device. However, the material of the heat spreader and the existing processing technology determine that it cannot be bent and is not easy to thin, and cannot meet the needs of lightweight or foldable products. Utility Model Content

[0004] In a first aspect, the present application provides a heat conduction device, comprising:

[0005] a first heat-conducting member, wherein the first heat-conducting member is bendable;

[0006] A second heat-conducting member, an end of which is connected to an end of the first heat-conducting member, and the second heat-conducting member is not bendable;

[0007] Wherein, the thickness of the heat conducting device is not greater than the thickness of the first heat conducting member or the thickness of the second heat conducting member.

[0008] In some modified implementations of the first aspect of the present application, the aforementioned heat conducting device further includes a third heat conducting member;

[0009] The end of the first heat conducting member is butted against the end of the second heat conducting member through the third heat conducting member.

[0010] In some modified implementations of the first aspect of the present application, in the aforementioned heat-conducting device, the third heat-conducting member is a metal member;

[0011] The third heat conducting member is disposed on the end of the first heat conducting member by magnetron sputtering.

[0012] A second aspect of the present application provides an electronic device, comprising

[0013] A first body, wherein a heating element is disposed in the first body;

[0014] A heat-conducting device, the heat-conducting device comprising a first heat-conducting member and a second heat-conducting member, the first heat-conducting member being bendable and extending to a region of the electronic device where the heating element is not located; an end of the second heat-conducting member being connected to an end of the first heat-conducting member, the second heat-conducting member being non-bendable, and the second heat-conducting member being in contact with the heating element;

[0015] Wherein, the thickness of the heat conducting device is not greater than the thickness of the first heat conducting member or the thickness of the second heat conducting member.

[0016] In some modified implementations of the second aspect of the present application, the aforementioned electronic device, wherein the first body comprises a support plate, the support plate is provided with a first opening, and the support plate is provided with the heating element and the power storage element at intervals along a first side of the axial direction of the first opening;

[0017] The heat conducting device is arranged on the second side of the support plate along the axial direction of the first opening, and the second heat conducting member is arranged in the first opening to fit the heating element; the first heat conducting member extends from the end of the second heat conducting member toward the direction of the power storage element.

[0018] In some modified implementations of the second aspect of the present application, in the aforementioned electronic device, a surface of the first heat conductor facing away from the power storage element and a surface of the second heat conductor facing away from the heating element meet a coplanar condition.

[0019] In some modified implementations of the second aspect of the present application, the aforementioned electronic device further includes a second body, which is rotatably connected to the first body via a rotating member;

[0020] The first heat conducting member at least partially extends to the rotating member.

[0021] In some modified implementations of the second aspect of the present application, the aforementioned electronic device further includes a fourth heat conductor, which is connected to an end of the first heat conductor facing away from the second heat conductor and extends into the second body.

[0022] In some modified implementations of the second aspect of the present application, in the aforementioned electronic device, the fourth heat conducting member is the same as the first heat conducting member; and / or the fourth heat conducting member is integrally formed with the first heat conducting member; or

[0023] The fourth heat conducting member is the same as the second heat conducting member.

[0024] In some modified implementations of the second aspect of the present application, the aforementioned electronic device further includes a display device, the display device is rotatably connected to the first body, the display device has a display area, and the size of the display area is variable;

[0025] The first heat conducting member passes through a rotational connection between the first body and the display device and extends into the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] By reading the detailed description below with reference to the accompanying drawings, the above and other purposes, features and advantages of the exemplary embodiments of the present application will become easy to understand. In the accompanying drawings, several embodiments of the present application are shown in an exemplary and non-limiting manner, and the same or corresponding reference numerals represent the same or corresponding parts, wherein:

[0027] Figure 1 The schematic diagram of the structure of the heat conduction device provided in this embodiment is schematically shown;

[0028] Figure 2 A second structural diagram of the heating device provided in this embodiment is schematically shown;

[0029] Figure 3 The schematic diagram schematically shows a state where the heat conduction device provided by this embodiment is placed in a first electronic device;

[0030] Figure 4 Schematically shows Figure 3 A top view of the electronic device;

[0031] Figure 5 The schematic diagram schematically shows a state where the heat conduction device provided by this embodiment is placed in a second electronic device;

[0032] Figure 6 Schematically shows Figure 5 A top view of the electronic device;

[0033] Figure 7 A schematic diagram schematically shows another state in which the heat conduction device provided by this embodiment is placed in a second electronic device;

[0034] Description of the accompanying drawings: first heat-conducting member 1, second heat-conducting member 2, heating element 3, third heat-conducting member 4, first body 5, support plate 51, first opening 52, first area 53, second area 54, power storage element 6, second body 7, fourth heat-conducting member 8, rotating member 9. DETAILED DESCRIPTION

[0035] The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided in order to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

[0036] It should be noted that, unless otherwise specified, the technical terms or scientific terms used in this application should have the common meanings understood by technicians in the field to which this application belongs.

[0037] The technical solution of the embodiment of the present application is to solve the above technical problems, and the overall idea is as follows:

[0038] The power consumption of electronic products such as mobile phones and tablets has become increasingly greater with their performance, and heat dissipation has become a top priority. Currently, a heat spreader is often installed inside the device, but the material of the heat spreader and the existing processing technology determine that it cannot be bent and is not easy to be thinned. For a straight-screen body, when the heat spreader is set in conjunction with the middle frame, it is necessary to dig holes to fit with the CPU, GPU and other heat-generating components and conduct and dissipate heat to the cold zone. However, the battery requires the middle frame to maintain a sufficient bonding area, so the middle frame at the battery position cannot have holes. If the heat spreader maintains its original thickness and extends to the cold zone where the battery is located, the overall thickness of the device at the battery position will increase, and there will be a contradiction between the heat dissipation effect and the thickness of the entire machine. For folding machines, the heat spreader cannot be bent, and the heat from the system side cannot be transferred to the display side, and the heat dissipation requirements cannot be met.

[0039] Reference Figure 1 and attached Figure 2 The heat-conducting device provided in an embodiment of the present application includes a first heat-conducting member 1 and a second heat-conducting member 2; the first heat-conducting member 1 is bendable; the end of the second heat-conducting member 2 is connected to the end of the first heat-conducting member 1, and the second heat-conducting member 2 is not bendable; wherein the thickness of the heat-conducting device is not greater than the thickness of the first heat-conducting member 1 or the thickness of the second heat-conducting member 2.

[0040] Specifically, in order to solve the problem that the heat dissipation structure in existing electronic products cannot meet the needs of lightweight or foldable products, the heat-conducting device provided in this embodiment connects the bendable first heat-conducting part 1 and the non-bendable second heat-conducting part 2 together, so that the second heat-conducting part 2 can fit the heating element 3 to absorb heat and conduct the heat out, and the first heat-conducting part 1 can be bent or thinned by its bendable property to extend to the area where the non-heat-conducting element is located, which will not occupy the space of other components in the thickness direction of the device, and can conduct the heat out for heat dissipation, thereby improving the heat dissipation efficiency.

[0041] Among them, the second heat conducting member 2 is thermally conductive and cannot be bent or adjusted in thickness. In this embodiment, the traditional VC heat spreader structure or heat pipe structure can be used, which has a high thermal conductivity efficiency and can improve the heat dissipation efficiency when it is bonded to the corresponding heating element 3 to absorb heat and conduct heat.

[0042] Among them, the first heat-conducting member 1 has heat-conducting properties and can be bent or the thickness can be adjusted. In this embodiment, graphite or bendable heat-conducting metal can be selected, such as graphite, artificial graphite, and soft metals such as copper and aluminum foil can also be selected. Although the thermal conductivity of graphite is lower than that of soft metals such as copper, for electronic devices with display screens, graphite of the same thickness can ensure that the degree of lifting of the screen during the bending process is small, thereby extending the service life of the screen; the first heat-conducting member 1 can be selected in a form according to the actual space setting, such as a plate body, a cavity, a cylinder, etc.; in this embodiment, the thickness of the first heat-conducting member 1 can be designed and adjusted according to the actual space needs, for example, the thickness of the first heat-conducting member 1 can be less than the thickness of the second heat-conducting member 2, the thickness of the first heat-conducting member 1 can be equal to the thickness of the second heat-conducting member 2, and the thickness of the first heat-conducting member 1 can be greater than the thickness of the second heat-conducting member 2. In this embodiment, the end of the first heat conductor 1 and the end of the second heat conductor 2 are butted together to form a complete heat conduction device, so that when the heat conduction device is used in an electronic device, the heat of the heating element 3 can be quickly conducted to the cold zone for heat dissipation. The butt connection can be, but is not limited to, welding connection, that is, the ends are horizontally butted with no overlapping parts. The butt connection of the ends of the two heat conductors makes the overall thickness of the heat conduction device equal to the thicker one, which can also contribute to the design of the overall device to be thinner when assembled in an electronic device.

[0043] The heat conducting device can be used in, but is not limited to, mobile phones, tablet computers, laptop computers and other devices.

[0044] According to the above, the heat-conducting device provided by the present application connects the bendable first heat-conducting member 1 at the end of the second heat-conducting member 2, thereby transferring the heat absorbed by the second heat-conducting member 2 to the first heat-conducting member 1 and extending it to the cold area of ​​the electronic device for heat dissipation. Under the premise of improving the heat dissipation efficiency, the bendable feature of the first heat-conducting member 1 can also be used to change the position and reduce the thickness, which is beneficial to the overall lightweight design of the equipment and can also be adapted to the heat dissipation of foldable products. It has a positive impact on the problem that the heat dissipation structure in existing electronic products cannot meet the needs of lightweight or foldable products.

[0045] The term "and / or" in this article is merely a description of the association relationship of associated objects, indicating that three relationships may exist, for example, A and / or B, which is specifically understood as: A and B may be included at the same time, A may exist alone, or B may exist alone, and any of the above three situations may exist.

[0046] Further, see Attachment Figure 1 and attached Figure 2 The heat-conducting device provided in this embodiment may further include a third heat-conducting member 4 in a specific implementation; the end of the first heat-conducting member 1 may be connected to the end of the second heat-conducting member 2 through the third heat-conducting member 4 .

[0047] In this embodiment, a third heat-conducting member 4 can be provided to achieve the docking of the ends of the first heat-conducting member 1 and the second heat-conducting member 2. The third heat-conducting member 4 has heat-conducting properties, and it may be bendable or not. In this embodiment, the third heat-conducting member 4 may be, but is not limited to, tin or a composite material containing titanium. When the first heat-conducting member 1 is a soft metal, the third heat-conducting member 4 may be made of tin for direct welding of the first heat-conducting member 1 and the second heat-conducting member 2. When the first heat-conducting member 1 is a material that cannot be directly welded, such as graphite, the third heat-conducting member 4 may be made of a metal member, such as a composite material containing titanium. The third heat-conducting member 4 is first plated on the end of the first heat-conducting member 1 by magnetron sputtering or physical vapor deposition, so that the end of the first heat-conducting member 1 is weldable, and then welded to the second heat-conducting member 2 by welding. Magnetron sputtering is a process in which, under a vacuum environment, the target material is bombarded by ionized inert gas ions through the combined action of voltage and magnetic field, so that the target material is ejected in the form of ions, atoms or molecules and deposited on the substrate to form a thin film. Physical vapor deposition refers to the process of transferring atoms or molecules from a source to the surface of a substrate by using physical processes to achieve material transfer.

[0048] Reference Figure 3 and attached Figure 4 The electronic device provided in this embodiment, in a specific implementation, includes a first body 5 and a heat-conducting device, wherein the first body 5 is provided with a heating element 3; the heat-conducting device includes a first heat-conducting member 1 and a second heat-conducting member 2, wherein the first heat-conducting member 1 extends to an area of ​​the electronic device where the heating element 3 is not located; an end of the second heat-conducting member 2 is connected to an end of the first heat-conducting member 1, the second heat-conducting member 2 cannot be bent, and the second heat-conducting member 2 is in contact with the heating element 3; wherein the thickness of the heat-conducting device is not greater than the thickness of the first heat-conducting member 1 or the thickness of the second heat-conducting member 2.

[0049] Specifically, the electronic device provided in this embodiment can be, but is not limited to, mobile phones, tablet computers, laptop computers and other devices. The heat conduction device in the electronic device provided in this embodiment is the heat conduction device in Example 1, which connects the bendable first heat conduction member 1 at the end of the second heat conduction member 2, and then transfers the heat absorbed by the second heat conduction member 2 to the first heat conduction member 1 and extends to the cold area of ​​the electronic device for heat dissipation. Under the premise of improving the heat dissipation efficiency, the bendable characteristics of the first heat conduction member 1 can also be used to change the position and reduce the thickness, which is conducive to the overall lightweight design of the electronic device, and can also adapt to the heat dissipation of foldable products.

[0050] Among them, the first body 5 is the system end of the electronic device. For straight-type devices such as mobile phones and tablets, the first body 5 can be the device itself. For folding devices such as laptops, the first body 5 can be the system end of the device for chip installation and data processing rather than the display end.

[0051] The heating element 3 may be, but is not limited to, a relatively core element such as a CPU or a GPU. For an electronic device, it may be provided with a power storage element 6, such as a battery. The power storage element 6 generates less heat than the heating element 3, so that the area where the heating element 3 is located is a hot area, and the area where the power storage element 6 is located is a cold area. In this embodiment, when the heat conduction device is set in the electronic device, the second heat conduction member 2 can be attached to the heating element 3 to absorb heat, and then the heat is conducted out through the first heat conduction member 1 extending to the cold area.

[0052] Furthermore, according to different types of electronic devices, this embodiment provides the following ways to arrange the heat conduction device in the electronic device:

[0053] In one possible case, refer to the attached Figure 3 and attached Figure 4 The first body 5 includes a support plate 51, a first opening 52 is provided on the support plate 51, and a heating element 3 and an electricity storage element 6 are spaced apart on the first side of the first support plate 51 along the axial direction of the first opening 52; the heat-conducting device is arranged on the second side of the support plate 51 along the axial direction of the first opening 52, and the second heat-conducting member 2 is arranged in the first opening 52 to fit the heating element 3; the first heat-conducting member 1 extends from the end of the second heat-conducting member 2 toward the direction of the electricity storage element 6.

[0054] Specifically, when a heat conducting device is provided corresponding to the structure of a straight-type electronic device, a support plate 51 may be provided in the first body 5 to form at least a portion of the middle frame structure. The support plate 51 is a rigid plate body, and its material and size may be designed and adjusted according to actual conditions. Figure 3 According to the conventional equipment space design, the heating element 3 and the power storage element 6 are respectively arranged at the upper and lower ends of the first body 5 to form a hot zone above the first body 5 and a cold zone below the first body 5. In order to ensure that the second heat-conducting member 2 can fit the heating element 3, a first opening 52 is arranged on the support plate 51. The first opening 52 runs through the thickness direction of the support plate 51, and the second heat-conducting member 2 can fit the heating element 3 through the first opening 52. It can be understood that in order to achieve the stable arrangement of the heating element 3 and the power storage element 6, in this embodiment, the heating element 3 and the power storage element 6 can be respectively pasted on the upper and lower frame areas remaining after the support plate 51 is opened, that is, Figure 3The first area 53 and the second area 54 in the device are separated, and the surface of the board on which the storage element 6 can be attached is relatively large. This setting can be easily understood by those skilled in the art, and will not be described in detail here. Under this setting, the second heat-conducting member 2 can be directly accommodated in the first opening 52 to reduce the overall thickness of the device. It can only correspond to the position of the heating element 3, or it can extend to the edge of the first opening 52 facing the cold zone to increase the area of ​​the second heat-conducting member 2 with higher heat dissipation efficiency. At the same time, the first heat-conducting member 1 extends toward the second area 54, and the first heat-conducting member 1 can be attached to the second area 54, which can be in the form of full coverage or partial coverage.

[0055] Further, see Attachment Figure 4 , a surface of the first heat conducting member 1 facing away from the electricity storage element 6 and a surface of the second heat conducting member 2 facing away from the heating element 3 meet a coplanar condition.

[0056] Specifically, in order to reduce the overall thickness of the electronic device, in this embodiment, the surface of the side of the first heat conductor 1 facing away from the energy storage element 6 and the surface of the side of the second heat conductor 2 facing away from the heating element 3 meet the coplanar condition. The coplanar condition can be that they are flush with each other to form the same surface, or they can be approximately flush, for example, by thinning the first heat conductor 2 so that it meets the coplanar condition with the side of the first heat conductor 1 facing away from the support plate 51.

[0057] In one possible case, refer to the attached Figure 5 and attached Figure 6 The electronic device provided in this embodiment further includes a second body 7 , which is rotatably connected to the first body 5 via a rotating member 9 ; and the first heat-conducting member 1 at least partially extends to the rotating member 9 .

[0058] Specifically, when a heat-conducting device is provided corresponding to the structure of a foldable electronic device such as a laptop computer or a foldable mobile phone, the second body 7 can be a display end of the electronic device with a display screen, and the rotating member 9 can be but not limited to a rotating shaft structure. The second body 7 is connected to the first body 5 through a rotating shaft, and the two can be relatively flipped 0-360 degrees or 0-180 degrees; accordingly, in this embodiment, the bendability of the first heat-conducting member 1 is utilized to extend it to the rotating member 9, and the first heat-conducting member 1 can be arranged in a bent shape at the rotating member 9, which does not affect the rotation of the rotating member 9 or its own heat transfer and heat dissipation; the first heat-conducting member 1 can extend to the rotating member 9 as a whole, or it can partially extend to the rotating member 9 and the other part extends to the cold area of ​​the first body 5 or to the second body 7, thereby improving the heat dissipation area and heat dissipation efficiency of the first heat-conducting member 1.

[0059] Further, see Attachment Figure 7The electronic device provided in this embodiment may further include a fourth heat conducting member 8 , which is connected to an end of the first heat conducting member 1 away from the second heat conducting member 2 and extends into the second body 7 .

[0060] Specifically, in order to improve the heat dissipation efficiency of the heat-conducting device and the electronic device, in this embodiment, a fourth heat-conducting member 8 can be arranged at the end of the first heat-conducting member 1 away from the second heat-conducting member 2. The fourth heat-conducting member 8 has thermal conductivity and may be bendable or not. The fourth heat-conducting member 8 extends into the second body 7 to increase the overall heat-conducting and heat-dissipating area of ​​the heat-conducting device to improve the heat dissipation efficiency. In this arrangement, the fourth heat-conducting member 8 can be attached to the display screen. The fourth heat-conducting member 8 can be the same as the first heat-conducting member 1, for example, both are graphite or both are soft metal. Under this setting mode, the fourth heat-conducting member 8 can be integrally formed with the first heat-conducting member 1, which is simple to prepare and has high efficiency; the fourth heat-conducting member 8 can also be made of a different material from the first heat-conducting member 1 but can also be integrally formed, for example, the first heat-conducting member 1 is copper and the fourth heat-conducting member 8 is aluminum foil, and the two can be integrally formed by mold injection molding, which simplifies the preparation process and ensures heat dissipation efficiency; the fourth heat-conducting member 8 can also be the same as the second heat-conducting member 2, for example, both are in the form of a heat spreader or a heat pipe. Under this setting mode, a non-bendable second heat-conducting member 2 is respectively arranged in the first body 5 and the second body 7, and its higher heat dissipation efficiency is used to improve the overall heat dissipation efficiency, and the first heat-conducting member 1 is arranged at the rotating member 9 to perform a bendable transition connection to form a complete heat-conducting device. Of course, it can be understood that under this setting mode, the third heat-conducting member 3 is arranged at both ends of the first heat-conducting member 1 to make it weldable.

[0061] In one possible case, the electronic device provided in this embodiment also includes a display device (not shown in the figure), which is rotatably connected to the first body 5, and the display device has a display area, and the size of the display area is variable; the first heat conductor 1 passes through the rotating connection between the first body 5 and the display device and extends into the display device.

[0062] Specifically, when setting up a heat-conducting device corresponding to a deformable structure such as a roll-up screen laptop computer or a flexible screen display, in the present embodiment, the second heat-conducting member 2 can also be set in the first non-deformable or rollable first body 5, and the first heat-conducting member 1 can be correspondingly set in the deformable or rollable display device, and the first heat-conducting member 1 can be thinned or bent by utilizing the bendability to extend into the display device; for example, when the display device can be flipped relative to the first body 5 and can adjust the size of the display area by telescoping relative to the first basic body 5, the first heat-conducting member 1 can bypass the rotating connection and extend to the display area.

[0063] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art who is familiar with the present technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A heat conduction device, characterized in that: include: A first heat-conducting member, wherein the first heat-conducting member is bendable; A second heat-conducting member, an end of which is connected to an end of the first heat-conducting member, and the second heat-conducting member is not bendable; Wherein, the thickness of the heat conducting device is not greater than the thickness of the first heat conducting member or the thickness of the second heat conducting member.

2. The heat conducting device according to claim 1, characterized in that: Also comprising a third heat conducting member; The end of the first heat conducting member is butted against the end of the second heat conducting member through the third heat conducting member.

3. The heat conducting device according to claim 2, characterized in that: The third heat conducting member is a metal member; The third heat conducting member is disposed on the end of the first heat conducting member by magnetron sputtering.

4. An electronic device, characterized in that: include: A first body, wherein a heating element is disposed in the first body; A heat-conducting device, the heat-conducting device comprising a first heat-conducting member and a second heat-conducting member, the first heat-conducting member being bendable, and the first heat-conducting member extending toward an area of ​​the electronic device where the heating element is not located; The end of the second heat-conducting member is connected to the end of the first heat-conducting member, the second heat-conducting member cannot be bent, and the second heat-conducting member is in contact with the heating element; Wherein, the thickness of the heat conducting device is not greater than the thickness of the first heat conducting member or the thickness of the second heat conducting member.

5. The electronic device according to claim 4, characterized in that: The first body comprises a support plate, a first opening is provided on the support plate, and the heating element and the electricity storage element are provided at intervals on a first side of the support plate along the axial direction of the first opening; The heat conducting device is arranged on the second side of the support plate along the axial direction of the first opening, and the second heat conducting member is arranged in the first opening to fit the heating element; the first heat conducting member extends from the end of the second heat conducting member toward the direction of the power storage element.

6. The electronic device according to claim 5, characterized in that: A surface of the first heat conducting member facing away from the electricity storage element and a surface of the second heat conducting member facing away from the heating element meet a coplanar condition.

7. The electronic device according to claim 4, characterized in that: It also includes a second body, which is rotatably connected to the first body through a rotating member; The first heat conducting member at least partially extends to the rotating member.

8. The electronic device according to claim 7, characterized in that: It also includes a fourth heat-conducting member, which is connected to an end of the first heat-conducting member facing away from the second heat-conducting member and extends into the second body.

9. The electronic device according to claim 8, characterized in that: The fourth heat-conducting member is the same as the first heat-conducting member; and / or the fourth heat-conducting member is integrally formed with the first heat-conducting member; or The fourth heat conducting member is the same as the second heat conducting member.

10. The electronic device according to claim 4, characterized in that: It also includes a display device, the display device is rotatably connected to the first body, the display device has a display area, and the size of the display area is variable; The first heat conducting member passes through a rotational connection between the first body and the display device and extends into the display device.

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