Heat dissipation device and motor controller

Abstract

The utility model relates to a heat dissipation device and a motor controller, and relates to the technical field of heat dissipation of power electronic equipment, the heat dissipation device is connected with a plurality of heat sources of electronic components, the heat dissipation device comprises a shell and a heat dissipation part, the shell is provided with a closed cavity, and a phase-change heat exchange working medium is arranged in the closed cavity; a gaseous space is formed between the liquid level of the liquid phase-change heat transfer working medium and the shell, the gaseous phase-change heat transfer working medium is in the gaseous space, and the outer side, away from the gaseous space, of the shell is connected with a plurality of heat sources; the heat dissipation part is arranged on the side, close to the gaseous space, of the shell. According to the invention, heat dissipation and cooling are carried out on a plurality of heat sources of the electronic component through the conversion between the liquid state and the gas state of the phase-change heat exchange working medium, and the temperatures of the liquid phase-change heat exchange working medium in the closed chamber are the same, so that the heat exchange effects of the plurality of heat sources of the electronic component are the same; therefore, the heat dissipation effects of a plurality of heat sources of the electronic component are the same, and the heat dissipation effects of the electronic component and the motor controller are improved.

Description

Technical Field

[0001] The present application relates to the technical field of heat dissipation of power electronic equipment, and in particular to a heat dissipation device and a motor controller. Background Art

[0002] At present, the heat dissipation method of the electronic components used in the motor controller is mainly: a water channel is provided at the electronic components, and a coolant flows in the water channel, so as to perform convection heat dissipation and conduction heat dissipation on the electronic components.

[0003] However, for electronic components with multiple heat sources, heat dissipation will be in series, showing that the temperature of the water channel is higher than the inlet temperature, resulting in uneven temperature distribution of the coolant at multiple heat sources, and poor heat dissipation effect on electronic components. Utility Model Content

[0004] Based on this, a heat dissipation device and a motor controller are provided. The heat dissipation device transforms the phase change heat medium into gas and liquid in a closed chamber, so that the heat dissipation effect of multiple heat sources of electronic components is the same, thereby improving the heat dissipation effect of the electronic components.

[0005] To this end, on the first aspect, an embodiment of the present application provides a heat dissipation device connected to multiple heat sources of electronic components, the heat dissipation device comprising: a shell, provided with a closed chamber, a phase change heat medium being provided in the closed chamber, a gaseous space being formed between the liquid surface of the liquid phase change heat medium and the shell, the gaseous phase change heat medium is in the gaseous space, the shell is connected to the multiple heat sources away from the outside of the gaseous space; and a heat dissipation portion, arranged on a side of the shell close to the gaseous space.

[0006] In one embodiment, the shell is provided with a heat conductive module, and the heat conductive module is used to improve the heat exchange effect between the multiple heat sources and the liquid phase change heat working medium, and / or, the heat conductive module is used to improve the heat exchange effect between the gaseous phase change heat working medium and the heat dissipation part.

[0007] In one of the embodiments, the heat conduction module includes a first heat conduction module, the first heat conduction module is arranged on a side of the housing away from the heat dissipation portion, and the first heat conduction module is located in the liquid phase change heat medium.

[0008] In one embodiment, a plurality of the first heat-conducting modules are provided, and the plurality of first heat-conducting modules are arranged at intervals and correspond to the plurality of heat sources respectively; the first heat-conducting module includes a plurality of first heat-conducting columns, and the first heat-conducting columns are connected to the shell.

[0009] In one embodiment, the heat conduction module includes a second heat conduction module, which is arranged on a side of the shell close to the heat dissipation part, and the second heat conduction module is located in the gaseous space, and the second heat conduction module corresponds to the first heat conduction module.

[0010] In one embodiment, the second heat-conducting module includes a plurality of second heat-conducting columns, the second heat-conducting columns are connected to the housing, and the projections of the second heat-conducting columns on the first heat-conducting module are staggered with the first heat-conducting columns.

[0011] In one embodiment, the heat conduction module includes a third heat conduction module, which is arranged on a side of the shell close to the heat dissipation part, and the third heat conduction module is located in the gaseous space, and the third heat conduction module is located between two adjacent first heat conduction modules.

[0012] In one embodiment, the third heat-conducting module includes a plurality of third heat-conducting columns, the third heat-conducting columns are connected to the housing, and the length of the third heat-conducting columns is greater than the length of the second heat-conducting columns.

[0013] In one of the embodiments, the heat conduction module further includes a fourth heat conduction module, and the fourth heat conduction module is located on a side of the shell facing the heat dissipation portion.

[0014] In one of the embodiments, the heat dissipation portion is connected to the shell and forms a heat exchange channel, and a cooling fluid for heat exchange with the phase change heat working medium flows through the heat exchange channel.

[0015] In a second aspect, an embodiment of the present application provides a motor controller, comprising electronic components and a heat dissipation device as described in any one of the above items, wherein a plurality of heat sources of the electronic components are arranged on the outside of a shell of the heat dissipation device away from the gaseous space.

[0016] According to the heat dissipation device and motor controller provided in the embodiment of the present application, the heat dissipation device is connected to multiple heat sources of electronic components, and the heat dissipation device includes a shell and a heat dissipation part. The shell is provided with a closed chamber, and a phase change heat medium is provided in the closed chamber. A gaseous space is formed between the liquid surface of the liquid phase change heat medium and the shell. The gaseous phase change heat medium is in the gaseous space, and the shell is connected to multiple heat sources outside the gaseous space away from the gaseous space; the heat dissipation part is provided on the side of the shell close to the gaseous space. When working, multiple heat sources of electronic components generate heat, and the heat is transferred to the liquid phase change heat medium through the shell. The liquid phase change heat medium absorbs heat in the closed chamber and evaporates into the gaseous space and becomes a gaseous phase change heat medium. The gaseous phase change heat medium exchanges heat with the heat dissipation part, and the gaseous phase change heat medium is condensed and becomes a liquid phase change heat medium. Repeated heat exchange is performed, thereby reducing the temperature of multiple heat sources of electronic components. The present application dissipates heat and cools down multiple heat sources of electronic components through the transition between the liquid and gaseous states of a phase change heat medium. Since the temperature of the liquid phase change heat medium in a closed chamber is the same, the heat exchange effect on the multiple heat sources of the electronic components is the same, so that the heat dissipation effect of the multiple heat sources of the electronic components is the same, thereby improving the heat dissipation effect of the electronic components and the motor controller. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 An exploded view of a heat dissipation device provided in an embodiment of the present application is shown;

[0018] Figure 2 A schematic diagram showing the structure of a base plate and a heat source provided in an embodiment of the present application Figure 1 ;

[0019] Figure 3 A schematic diagram showing the structure of a base plate and a heat source provided in an embodiment of the present application Figure 2 ;

[0020] Figure 4 A cross-sectional view of a heat dissipation device provided in an embodiment of the present application is shown. Figure 1 ;

[0021] Figure 5 A cross-sectional view of a heat dissipation device provided in an embodiment of the present application is shown. Figure 2 ;

[0022] Figure 6 A schematic diagram showing the structure of a cover provided in an embodiment of the present application Figure 1 ;

[0023] Figure 7 A schematic diagram showing the structure of a cover provided in an embodiment of the present application Figure 2 .

[0024] Description of reference numerals:

[0025] 1. Heat source; 2. Shell; 21. Enclosed chamber; 22. Bottom plate; 23. Cover; 24. Sealing ring; 3. Heat dissipation unit; 31. Heat exchange channel; 4. Heat conduction module; 41. First heat conduction module; 411. First heat conduction column; 42. Second heat conduction module; 421. Second heat conduction column; 43. Third heat conduction module; 431. Third heat conduction column; 44. Fourth heat conduction module. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0027] It should be noted that the illustrations provided in this embodiment are only used to schematically illustrate the basic concept of the present invention. Therefore, the drawings only show components related to the present invention rather than being drawn according to the number, shape and size of components in actual implementation. In actual implementation, the type, quantity and proportion of each component may be changed arbitrarily, and the component layout may also be more complicated.

[0028] The structures, proportions, sizes, etc. illustrated in the drawings in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0029] The directions or positional relationships indicated by the terms "upper", "lower", "left", "right", "middle", "longitudinal", "lateral", "horizontal", "inner", "outer", "radial", "circumferential" and the like in this specification are based on the directions or positional relationships shown in the drawings and are only for the convenience of simplifying the description. They do not indicate or imply that the devices or elements referred to must have a specific direction, be constructed and operate in a specific direction, and therefore cannot be understood as limiting the present invention. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0030] When an electronic component has multiple heat sources 1, the heat dissipation will be in series, showing that the temperature of the water channel is higher than the inlet temperature, resulting in uneven temperature distribution of the coolant at the multiple heat sources 1, and different heat dissipation effects on the multiple heat sources 1, so the heat dissipation effect on the electronic components is not good.

[0031] To solve the above problems, refer to Figure 1-Figure 3 , Figure 1 An exploded view of a heat dissipation device provided in an embodiment of the present application is shown. Figure 2 A schematic diagram showing the structure of a base plate and a heat source provided in an embodiment of the present application Figure 1 , Figure 3 A schematic diagram showing the structure of a base plate and a heat source provided in an embodiment of the present application Figure 2 The embodiment of the present application provides a heat dissipation device, which is connected to multiple heat sources 1 of electronic components. The heat dissipation device includes a shell 2 and a heat dissipation portion 3. The shell 2 is provided with a closed chamber 21. A phase change heat medium is provided in the closed chamber 21. A gaseous space is formed between the liquid surface of the liquid phase change heat medium and the shell 2. The gaseous phase change heat medium is in the gaseous space. The side of the shell 2 facing away from the gaseous space is connected to the multiple heat sources 1. The heat dissipation portion 3 is provided on the side of the shell 2 close to the gaseous space.

[0032] It should be understood that the electronic component has multiple heat sources 1. The present application does not limit the number of heat sources 1. The heat sources 1 may be two, three, or other numbers. In one example, the number of heat sources 1 is three. The multiple heat sources 1 of the electronic component are arranged at intervals in the horizontal direction. When the multiple heat sources 1 of the electronic component are connected to the heat sink, the length of the heat sink extends along the arrangement direction of the multiple heat sources 1.

[0033] The heat dissipation device includes a shell 2, which includes a base plate 22 and a cover 23. One side of the base plate 22 is connected to multiple heat sources 1 of electronic components. In order to improve the heat exchange effect between the base plate 22 and the multiple heat sources 1, the base plate 22 is a heat-conductive heat dissipation substrate. The base plate 22 and the multiple heat sources 1 can be connected by thermal conductive glue or by a thermal conductive plate to fill the gap between the base plate 22 and the multiple heat sources 1, thereby improving the thermal conductivity of the base plate 22 and the multiple heat sources 1.

[0034] The cover body 23 is integrally formed and provided with an inner cavity. The side of the bottom plate 22 facing away from the multiple heat sources 1 covers the inner cavity of the cover body 23 and is connected to the cover body 23, so that the bottom plate 22 and the cover body 23 enclose a closed chamber 21. The connection between the bottom plate 22 and the cover body 23 can be a fixed connection or a detachable connection. In one example, the bottom plate 22 and the cover body 23 are welded; in one example, the bottom plate 22 and the cover body 23 are detachably connected by fixing parts such as bolts. In order to improve the airtightness between the bottom plate 22 and the cover body 23, the housing 2 further includes a sealing ring 24, which is arranged between the bottom plate 22 and the cover body 23.

[0035] During installation, the phase change heat medium is first placed in the inner cavity of the cover 23, and then the bottom plate 22 is connected to the cover 23 to form a closed chamber 21 with the phase change heat medium. If the bottom plate 22 and the cover 23 are detachably connected, it is convenient for the user to later inspect the housing 2 and replace the phase change heat medium, thereby improving the convenience of use for the user.

[0036] Among them, the phase change heat working medium refers to a liquid with high insulation, low boiling point, stable physical and chemical properties, good flowability, high latent heat of vaporization, environmental protection and other properties. The phase change heat working medium can be ether, acetone, ammonia, freon, alcohol and other substances, etc., which are not limited in this application. The phase change heat working medium is in the closed chamber 21, and the phase change heat working medium is liquid when added. The liquid surface of the liquid phase change heat working medium and the top wall of the cover body 23 form a gaseous space. The gaseous phase change heat working medium is located in the gaseous space, that is, the liquid phase change heat working medium occupies 5%-95% of the volume of the closed chamber 21. Preferably, the liquid phase change heat working medium occupies 30% of the volume of the closed chamber 21.

[0037] The phase change heat working medium has two states in the closed chamber 21, one state is liquid and the other state is gaseous. When the liquid phase change heat working medium absorbs heat, it evaporates into the gaseous space and becomes a gaseous phase change heat working medium. When the gaseous phase change heat working medium cools down and condenses, it becomes a liquid phase change heat working medium.

[0038] The heat dissipation device also includes a heat dissipation part 3, and the heat dissipation part 3 is arranged on a side of the shell 2 close to the gaseous space. That is, the heat dissipation part 3 is located on the side of the cover 23 away from the bottom plate 22. Among them, the heat dissipation part 3 can be located in the closed chamber 21 and in the gaseous space, which can further improve the heat exchange effect between the heat dissipation part 3 and the gaseous phase change heat medium. At this time, the heat dissipation part 3 can be a heat exchange tube provided with a coolant. The heat dissipation part 3 can also be located on the outer peripheral side of the cover 23, and can be a heat dissipation fan, a cooling water pipe, a cooling water tray, etc., which is not limited in this application. When the heat dissipation part 3 is located on the outer side of the cover 23, in order to improve the heat exchange effect between the heat dissipation part 3 and the gaseous phase change heat medium, the cover 23 is made of a heat conductive material.

[0039] During operation, the multiple heat sources 1 of the electronic components generate heat, and the heat is transferred to the liquid phase change heat medium through the bottom plate 22 of the shell 2. The liquid phase change heat medium absorbs the heat of the bottom plate 22 in the closed chamber 21, evaporates into the gaseous space and becomes a gaseous phase change heat medium. The gaseous phase change heat medium exchanges heat with the heat dissipation part 3, and the gaseous phase change heat medium is condensed and becomes a liquid phase change heat medium, and the heat exchange is repeated, thereby reducing the temperature of the multiple heat sources 1 of the electronic components. The present application dissipates heat and cools the multiple heat sources 1 of the electronic components through the transition between the liquid and gaseous states of the phase change heat medium. Since the temperature of the liquid phase change heat medium in the closed chamber is the same, the multiple heat sources 1 of the electronic components are subjected to the same heat exchange effect, so that the heat dissipation effect of the multiple heat sources 1 of the electronic components is the same, thereby improving the heat dissipation effect of the electronic components and the heat exchange effect of the motor controller.

[0040] Reference Figure 4 , Figure 4 A cross-sectional view of a heat dissipation device provided in an embodiment of the present application is shown. Figure 1 .

[0041] In some optional embodiments, the shell 2 is provided with a heat conducting module 4, which is used to improve the heat exchange effect between multiple heat sources 1 and liquid phase change heat working fluid, and / or, the heat conducting module 4 is used to improve the heat exchange effect between gaseous phase change heat working fluid and the heat dissipation part 3.

[0042] In one example, the heat conductive module 4 is disposed at the bottom plate 22 of the shell 2, and the heat conductive module 4 is located in the closed chamber 21 and immersed in the liquid phase change heat medium, thereby increasing the heat exchange area between the liquid phase change heat medium and the bottom plate 22, thereby improving the heat exchange effect between the multiple heat sources 1 and the liquid phase change heat medium.

[0043] In one example, the heat conducting module 4 is disposed at the cover 23 of the shell 2, and the heat conducting module 4 is located in the closed chamber 21 and in the gaseous space, thereby increasing the contact area between the gaseous phase change heat medium and the heat dissipation part 3, thereby improving the heat exchange effect between the gaseous phase change heat medium and the heat dissipation part 3.

[0044] In one example, the heat conduction module 4 is disposed on the bottom plate 22 of the housing 2 or on the cover 23 of the housing 2 .

[0045] Reference Figure 1-Figure 4 In some optional embodiments, the heat conducting module 4 includes a first heat conducting module 41, and the first heat conducting module 41 is arranged on the side of the shell 2 away from the heat dissipation part 3, and the first heat conducting module 41 is located in the liquid phase change heat medium. The first heat conducting module 41 is arranged at the bottom plate 22, and the first heat conducting module 41 is a heat conducting material. The first heat conducting module 41 is fixedly connected to the bottom plate 22, and can be welded or integrally formed, which is not limited in this application. The first heat conducting module 41 can be a fin, a heat conducting column or other shapes, which is not limited in this application. The setting of the first heat conducting module 41 can increase the heat exchange area between the liquid phase change heat medium and the bottom plate 22, thereby improving the heat exchange effect between multiple heat sources 1 and the liquid phase change heat medium.

[0046] In some optional embodiments, a plurality of first heat-conducting modules 41 are provided, and the plurality of first heat-conducting modules 41 are arranged at intervals and correspond to the plurality of heat sources 1 respectively; the first heat-conducting module 41 includes a plurality of first heat-conducting columns 411, and the first heat-conducting columns 411 are connected to the housing 2. The number of the first heat-conducting modules 41 is the same as the number of the heat sources 1. When three heat sources 1 are provided, three first heat-conducting modules 41 are also provided, and the positions of the plurality of first heat-conducting modules 41 correspond to the positions of the plurality of heat sources 1, that is, the heat sources 1 are located on one side of the bottom plate 22, and the first heat-conducting modules 41 are located on the other side of the bottom plate 22, thereby further improving the heat exchange effect between the plurality of heat sources 1 and the liquid phase-change heat medium.

[0047] The first heat-conducting module 41 includes a plurality of first heat-conducting columns 411, which are arranged at intervals along the length direction and the width direction of the bottom plate 22. The arrangement of the first heat-conducting columns 411 allows the peripheral side walls and the top wall of the first heat-conducting columns 411 to exchange heat with the liquid phase-change heat medium, thereby further increasing the heat exchange area between the first heat-conducting module 41 and the liquid phase-change heat medium. Compared with the fins, the arrangement of the first heat-conducting columns 411 is easier to process and reduces the manufacturing cost.

[0048] Reference Figure 4-Figure 6 , Figure 5 A cross-sectional view of a heat dissipation device provided in an embodiment of the present application is shown. Figure 2 , Figure 6 A schematic diagram showing the structure of a cover provided in an embodiment of the present application Figure 1 .

[0049] In some optional embodiments, the heat conduction module 4 includes a second heat conduction module 42, and the second heat conduction module 42 is arranged on the side of the shell 2 close to the heat dissipation part 3, and the second heat conduction module 42 is located in the gaseous space. The second heat conduction module 42 is arranged at the cover body 23, and the second heat conduction module 42 is a heat-conducting material. The second heat conduction module 42 is fixedly connected to the cover body 23 and can be welded or integrally formed. This application does not limit it. The second heat conduction module 42 can be a fin, a heat conduction column or other shapes, which is not limited in this application. The setting of the second heat conduction module 42 can increase the heat exchange area between the gaseous phase change heat medium and the heat dissipation part 3, and then the condensation effect of the gaseous phase change heat medium.

[0050] In some optional embodiments, the second heat conducting module 42 corresponds to the first heat conducting module 41. There are multiple second heat conducting modules 42, and the number of the second heat conducting modules 42 is the same as the number of the first heat conducting modules 41. When there are three first heat conducting modules 41, there are also three second heat conducting modules 42. The positions of the multiple second heat conducting modules 42 correspond to the positions of the multiple first heat conducting modules 41. Since the temperature of the liquid phase-change heat medium at the first heat conducting module 41 is the highest, the provision of the second heat conducting module 42 facilitates the cooling of the gas phase-change heat medium and improves the condensation effect of the gas phase-change heat medium.

[0051] In some optional embodiments, the second heat-conducting module 42 includes a plurality of second heat-conducting columns 421, which are connected to the shell 2, and the projection of the second heat-conducting columns 421 on the first heat-conducting module 41 is staggered with the first heat-conducting columns 411. The second heat-conducting module 42 includes a plurality of second heat-conducting columns 421, which are arranged at intervals along the length direction and the width direction of the cover body 23. The arrangement of the second heat-conducting columns 421 allows the peripheral side walls and the bottom wall of the second heat-conducting columns 421 to exchange heat with the gaseous phase-change heat medium, thereby further increasing the heat exchange area between the second heat-conducting module 42 and the gaseous phase-change heat medium. The arrangement of the second heat-conducting columns 421 is more convenient for processing than the fins, and reduces the manufacturing cost.

[0052] Since the second heat-conducting module 42 is arranged corresponding to the first heat-conducting module 41, in order to avoid the second heat-conducting module 42 blocking the rise of the gaseous phase-change heat medium, the projection of the second heat-conducting column 421 on the first heat-conducting module 41 is staggered with the first heat-conducting column 411, thereby improving the heat exchange effect between the gaseous phase-change heat medium and the second heat-conducting module 42.

[0053] In some optional embodiments, the heat conduction module 4 includes a third heat conduction module 43, the third heat conduction module 43 is arranged on the side of the shell 2 close to the heat dissipation part 3, and the third heat conduction module 43 is located in the gaseous space, and the third heat conduction module 43 is located between two adjacent first heat conduction modules 41. The third heat conduction module 43 is made of heat-conducting material, and the third heat conduction module 43 is fixedly connected to the cover body 23, which can be welded or integrally formed, and the present application does not limit it. The third heat conduction module 43 can be a fin, a heat conduction column or other shapes, and the present application does not limit it. The third heat conduction module 43 is located between two adjacent first heat conduction modules 41, which can further increase the heat exchange area between the gaseous phase change heat transfer medium and the heat dissipation part 3, and thus the condensation effect of the gaseous phase change heat transfer medium.

[0054] In some optional embodiments, the third heat-conducting module 43 includes a plurality of third heat-conducting columns 431, which are connected to the shell 2, and the length of the third heat-conducting column 431 is greater than the length of the second heat-conducting column 421. The third heat-conducting module 43 includes a plurality of third heat-conducting columns 431, which are arranged at intervals along the length direction and the width direction of the cover body 23, thereby further increasing the heat exchange area between the third heat-conducting module 43 and the gaseous phase-change heat medium. Since the third heat-conducting module 43 is located between two adjacent first heat-conducting modules 41, it will not block the rise of the gaseous phase-change heat medium, so the length of the third heat-conducting column 431 can be greater than the length of the second heat-conducting column 421, further increasing the heat exchange area between the third heat-conducting module 43 and the gaseous phase-change heat medium, and improving the condensation effect on the gaseous phase-change heat medium.

[0055] Reference Figure 4-Figure 7 , Figure 7 A schematic diagram showing the structure of a cover provided in an embodiment of the present application Figure 2 . In some optional embodiments, the heat conducting module 4 also includes a fourth heat conducting module 44, and the fourth heat conducting module 44 is located on the side of the shell 2 facing the heat dissipation part 3. The fourth heat conducting module 44 is arranged at the cover body 23, and the fourth heat conducting module 44 is made of heat conducting material. The fourth heat conducting module 44 is fixedly connected to the cover body 23, and can be welded or integrally formed, which is not limited in this application. The fourth heat conducting module 44 can be a fin, a heat conducting column or other shapes, which is not limited in this application. In one example, the fourth heat conducting module 44 is a fin. The setting of the fourth heat conducting module 44 can increase the heat exchange area between the cover body 23 and the heat dissipation part 3, improve the heat exchange effect between the heat dissipation part 3 and the cover body 23, and thereby improve the condensation effect of the gaseous phase change heat medium.

[0056] Reference Figure 1 , Figure 4 and Figure 5 In some optional embodiments, the heat dissipation part 3 is connected to the shell 2 and forms a heat exchange channel 31, and a cooling fluid for heat exchange with the phase change heat medium flows in the heat exchange channel 31. Among them, the cover 23 extends away from the bottom plate 22 and forms an inner cavity. The heat dissipation part 3 is connected to the cover 23 and forms a heat exchange channel 31. The connection method can be welding or detachable connection. If it is a detachable connection, a sealing ring can be provided to improve the sealing of the heat exchange channel.

[0057] The heat exchange channel 31 is provided with an inlet and an outlet for the flow of cooling fluid. The inlet and the outlet can be respectively arranged on opposite sides of the heat dissipation part 3, or on the same side of the heat dissipation part 3. The heat exchange channel 31 can be straight or curved, which is not limited in the present application. The cooling fluid can be a liquid or a gas, which is not limited in the present application. In one example, the cooling fluid is cooling water.

[0058] During operation, the cooling fluid flows into the heat exchange channel 31 of the heat dissipation part 3 from the inlet and flows out from the outlet. The cooling fluid exchanges heat with the cover body 23 in the heat exchange channel 31 to reduce the temperature of the cover body 23. The cover body 23 exchanges heat with the gaseous phase change heat working medium, thereby condensing the gaseous phase change heat working medium.

[0059] The present application also includes a motor controller, which includes electronic components and any of the heat dissipation devices described above, and multiple heat sources 1 of the electronic components are arranged on the outside of the housing 2 of the heat dissipation device away from the gaseous space.

[0060] The heat dissipation device includes a shell 2 and a heat dissipation part 3. The shell 2 is provided with a closed chamber 21. A phase change heat medium is arranged in the closed chamber 21. A gaseous space is formed between the liquid surface of the liquid phase change heat medium and the shell 2. The gaseous phase change heat medium is in the gaseous space. The side of the shell 2 facing away from the gaseous space is connected to multiple heat sources 1. The heat dissipation part 3 is arranged on the side of the shell 2 close to the gaseous space.

[0061] During operation, the multiple heat sources 1 of the electronic components generate heat, and the heat is transferred to the liquid phase change heat medium through the bottom plate 22 of the shell 2. The liquid phase change heat medium absorbs the heat of the bottom plate 22 in the closed chamber 21, evaporates into the gaseous space and becomes a gaseous phase change heat medium. The gaseous phase change heat medium exchanges heat with the heat dissipation part 3, and the gaseous phase change heat medium is condensed and becomes a liquid phase change heat medium, and the heat exchange is repeated, thereby reducing the temperature of the multiple heat sources 1 of the electronic components. The present application dissipates heat and cools the multiple heat sources 1 of the electronic components through the transition between the liquid and gaseous states of the phase change heat medium. Since the temperature of the liquid phase change heat medium in the closed chamber is the same, the multiple heat sources 1 of the electronic components are subjected to the same heat exchange effect, so that the heat dissipation effect of the multiple heat sources 1 of the electronic components is the same, which improves the heat dissipation effect of the electronic components, and further improves the heat dissipation effect of the motor controller.

[0062] The technical features of the above embodiments may be combined arbitrarily. To make the description concise, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0063] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A heat dissipation device connected to a plurality of heat sources (1) of electronic components, characterized in that: The heat dissipation device comprises: The shell (2) is provided with a closed chamber (21), a phase-change heat medium is arranged in the closed chamber (21), a gaseous space is formed between the liquid surface of the liquid phase-change heat medium and the shell (2), the gaseous phase-change heat medium is in the gaseous space, and the shell (2) is connected to the plurality of heat sources (1) at an outside away from the gaseous space; and The heat dissipation portion (3) is arranged on a side of the housing (2) close to the gaseous space.

2. The heat dissipation device according to claim 1, characterized in that: The shell (2) is provided with a heat conduction module (4), and the heat conduction module (4) is used to improve the heat exchange effect between the multiple heat sources (1) and the liquid phase-change heat medium, and / or the heat conduction module (4) is used to improve the heat exchange effect between the gas phase-change heat medium and the heat dissipation part (3).

3. The heat dissipation device according to claim 2, characterized in that: The heat conduction module (4) comprises a first heat conduction module (41), the first heat conduction module (41) being arranged on a side of the housing (2) away from the heat dissipation portion (3), and the first heat conduction module (41) being located in the liquid phase-change heat medium.

4. The heat dissipation device according to claim 3, characterized in that: A plurality of the first heat-conducting modules (41) are provided, and the plurality of first heat-conducting modules (41) are arranged at intervals and correspond to the plurality of heat sources (1) respectively; the first heat-conducting modules (41) include a plurality of first heat-conducting columns (411), and the first heat-conducting columns (411) are connected to the shell (2).

5. The heat dissipation device according to claim 4, characterized in that: The heat conduction module (4) comprises a second heat conduction module (42), the second heat conduction module (42) being arranged on a side of the housing (2) close to the heat dissipation portion (3), and the second heat conduction module (42) being located in the gaseous space, and the second heat conduction module (42) corresponding to the first heat conduction module (41).

6. The heat dissipation device according to claim 5, characterized in that: The second heat-conducting module (42) comprises a plurality of second heat-conducting columns (421), the second heat-conducting columns (421) being connected to the housing (2), and the projections of the second heat-conducting columns (421) on the first heat-conducting module (41) being arranged alternately with the first heat-conducting columns (411).

7. The heat dissipation device according to claim 6, characterized in that: The heat conduction module (4) comprises a third heat conduction module (43), the third heat conduction module (43) being arranged on a side of the housing (2) close to the heat dissipation portion (3), the third heat conduction module (43) being located in the gaseous space, and the third heat conduction module (43) being located between two adjacent first heat conduction modules (41).

8. The heat dissipation device according to claim 7, characterized in that: The third heat-conducting module (43) comprises a plurality of third heat-conducting columns (431), the third heat-conducting columns (431) are connected to the housing (2), and the length of the third heat-conducting columns (431) is greater than the length of the second heat-conducting columns (421).

9. The heat dissipation device according to claim 2, characterized in that: The heat conduction module (4) further comprises a fourth heat conduction module (44), and the fourth heat conduction module (44) is located on a side of the housing (2) facing the heat dissipation portion (3).

10. The heat dissipation device according to claim 1, characterized in that: The heat dissipation portion (3) is connected to the shell (2) and forms a heat exchange flow channel (31), wherein a cooling fluid for heat exchange with the phase change heat working medium flows through the heat exchange flow channel (31).

11. A motor controller, characterized in that: The invention comprises an electronic component and the heat dissipation device according to any one of claims 1 to 10, wherein a plurality of heat sources (1) of the electronic component are arranged on the outside of a housing (2) of the heat dissipation device away from the gaseous space.

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