Image reading module for reducing overall thickness and portable electronic device

Abstract

The utility model provides an image reading module for reducing the overall thickness and a portable electronic device. The image reading module includes a circuit substrate, an image sensing chip, an insulating connection structure and a lens assembly. The image sensing chip is arranged in the through opening of the circuit substrate and is electrically connected to the circuit substrate through a plurality of metal leads. The insulation connection structure is arranged in the through opening of the circuit substrate and is connected between the image sensing chip and the circuit substrate. The lens assembly includes a lens carrier disposed on the circuit substrate and a lens module carried by the lens carrier. Therefore, under the condition that the image sensing chip is not in contact with the circuit substrate, the image sensing chip can still be stably fixed in the through opening of the circuit substrate through the connection of the insulating connection structure, so that the overall thickness of the image reading module is reduced.

Description

Technical Field

[0001] The utility model relates to an image reading module, in particular to an image reading module for reducing the overall thickness and a portable electronic device using the image reading module. Background Art

[0002] In the prior art, the image sensing chip of the image reading module can be disposed on the top of a circuit substrate without an opening by wire bonding, or the image sensing chip of the image reading module can be disposed on the bottom of a circuit substrate with an opening by flip-chip bonding. However, the existing image reading module still has room for improvement. Utility Model Content

[0003] The problem to be improved or solved by the present invention is to provide an image reading module for reducing the overall thickness and a portable electronic device using the image reading module in view of the deficiencies in the prior art.

[0004] In order to improve or solve the above-mentioned problems, one of the technical means adopted by the utility model is to provide an image reading module for reducing the overall thickness, which includes: a circuit substrate, an image sensing chip, an insulating connection structure and a lens assembly. The circuit substrate has an upper surface, a lower surface and a through opening connected between the upper surface and the lower surface. The image sensing chip is arranged in the through opening of the circuit substrate and is electrically connected to the circuit substrate through a plurality of metal leads. The insulating connection structure is arranged in the through opening of the circuit substrate and is connected between the image sensing chip and the circuit substrate. The lens assembly includes a lens carrier arranged on the circuit substrate and a lens module carried by the lens carrier. Among them, an upper surface of the image sensing chip has an image sensing area corresponding to the lens module. Among them, a lower surface of the image sensing chip is exposed and not covered by the insulating connection structure. Among them, the image reading module further includes a filter element, which is supported by a plurality of supporting bodies or a surrounding support to be arranged above the image sensing chip, and the filter element is surrounded by a plurality of metal leads.

[0005] Preferably, the upper surface of the circuit substrate has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate through a plurality of metal leads; wherein the insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate; wherein the inner surrounding surface of the through opening of the circuit substrate is configured as a roughened surrounding surface, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate; wherein all or part of the outer surrounding surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the bonding force between the insulating connection structure and the image sensing chip or contact area; wherein the thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit substrate; wherein the insulating connection structure has a lower surrounding surface that is exposed to the outside and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate and the lower surface of the image sensing chip are aligned with each other; wherein the lower surrounding surface of the insulating connection structure has a colloid separation mark generated after being separated from a temporary carrier substrate; wherein the lower surrounding surface of the insulating connection structure has a colloid deformation mark generated after being heated by a heat source generated by a heating module; wherein the insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate.

[0006] Preferably, the insulating connection structure includes a bottom surrounding insulating layer and a top surrounding insulating layer connected to the bottom surrounding insulating layer, and the bottom surrounding insulating layer and the top surrounding insulating layer are both arranged in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate; wherein the thickness of the bottom surrounding insulating layer is less than the thickness of the top surrounding insulating layer, the viscosity of the bottom surrounding insulating layer is less than the viscosity of the top surrounding insulating layer, and the melting point of the bottom surrounding insulating layer is lower than the melting point of the top surrounding insulating layer; wherein the bonding force between the bottom surrounding insulating layer and the image sensing chip is less than the bonding force between the top surrounding insulating layer and the image sensing chip, and the bonding force between the bottom surrounding insulating layer and the circuit substrate is less than the bonding force between the top surrounding insulating layer and the circuit substrate; wherein an inner surrounding surface of the through opening of the circuit substrate The surface is configured to contact a roughened surrounding surface of the top surrounding insulating layer, thereby increasing the adhesion or contact area between the top surrounding insulating layer and the circuit substrate; wherein the insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate and the lower surface of the image sensing chip are aligned with each other; wherein the lower surrounding surface of the bottom surrounding insulating layer has a colloid separation mark generated after being separated from a temporary supporting substrate; wherein the lower surrounding surface of the bottom surrounding insulating layer has a colloid deformation mark generated after being heated by a heat source generated by a heating module; wherein the top surrounding insulating layer of the insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate.

[0007] Preferably, the insulating connection structure has a lower surrounding surface that is exposed and not covered, and there is a predetermined vertical height between the lower surrounding surface of the insulating connection structure and the lower surface of the circuit substrate, thereby generating a surrounding unoccupied space between the circuit substrate, the image sensing chip and the insulating connection structure; wherein the insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate, and the lower surrounding surface of the insulating connection structure, a portion of the inner surrounding surface of the through opening of the circuit substrate and a portion of the outer surrounding surface of the image sensing chip are exposed from the bottom end of the through opening of the circuit substrate; wherein the insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate.

[0008] In order to improve or solve the above-mentioned problems, another technical means adopted by the utility model is to provide an image reading module for reducing the overall thickness, which includes: a circuit substrate, an image sensing chip, an insulating connection structure and a lens assembly. The circuit substrate has an upper surface, a lower surface and a through opening connected between the upper surface and the lower surface. The image sensing chip is arranged in the through opening of the circuit substrate and is electrically connected to the circuit substrate through a plurality of metal leads. The insulating connection structure is arranged in the through opening of the circuit substrate and is connected between the image sensing chip and the circuit substrate. The lens assembly includes a lens carrier arranged on the circuit substrate and a lens module carried by the lens carrier. Among them, an upper surface of the image sensing chip has an image sensing area corresponding to the lens module. Among them, a lower surface of the image sensing chip is exposed to the outside and is not covered by the insulating connection structure.

[0009] Preferably, the upper surface of the circuit substrate has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate through a plurality of metal leads; wherein the insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate; wherein the inner surrounding surface of the through opening of the circuit substrate is configured as a roughened surrounding surface, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate; wherein all or part of the outer surrounding surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the bonding force between the insulating connection structure and the image sensing chip or contact area; wherein the thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit substrate; wherein the insulating connection structure has a lower surrounding surface that is exposed to the outside and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate and the lower surface of the image sensing chip are aligned with each other; wherein the lower surrounding surface of the insulating connection structure has a colloid separation mark generated after being separated from a temporary carrier substrate; wherein the lower surrounding surface of the insulating connection structure has a colloid deformation mark generated after being heated by a heat source generated by a heating module; wherein the insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate.

[0010] Preferably, the insulating connection structure includes a bottom surrounding insulating layer and a top surrounding insulating layer connected to the bottom surrounding insulating layer, and the bottom surrounding insulating layer and the top surrounding insulating layer are both arranged in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate; wherein the thickness of the bottom surrounding insulating layer is less than the thickness of the top surrounding insulating layer, the viscosity of the bottom surrounding insulating layer is less than the viscosity of the top surrounding insulating layer, and the melting point of the bottom surrounding insulating layer is lower than the melting point of the top surrounding insulating layer; wherein the bonding force between the bottom surrounding insulating layer and the image sensing chip is less than the bonding force between the top surrounding insulating layer and the image sensing chip, and the bonding force between the bottom surrounding insulating layer and the circuit substrate is less than the bonding force between the top surrounding insulating layer and the circuit substrate; wherein an inner surrounding surface of the through opening of the circuit substrate The surface is configured to contact a roughened surrounding surface of the top surrounding insulating layer, thereby increasing the adhesion or contact area between the top surrounding insulating layer and the circuit substrate; wherein the insulating connection structure has a lower surrounding surface that is exposed and not covered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate and the lower surface of the image sensing chip are aligned with each other; wherein the lower surrounding surface of the bottom surrounding insulating layer has a colloid separation mark generated after being separated from a temporary supporting substrate; wherein the lower surrounding surface of the bottom surrounding insulating layer has a colloid deformation mark generated after being heated by a heat source generated by a heating module; wherein the top surrounding insulating layer of the insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate.

[0011] Preferably, the insulating connection structure has a lower surrounding surface that is exposed and not covered, and there is a predetermined vertical height between the lower surrounding surface of the insulating connection structure and the lower surface of the circuit substrate, thereby generating a surrounding unoccupied space between the circuit substrate, the image sensing chip and the insulating connection structure; wherein the insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate, and the lower surrounding surface of the insulating connection structure, a portion of the inner surrounding surface of the through opening of the circuit substrate and a portion of the outer surrounding surface of the image sensing chip are exposed from the bottom end of the through opening of the circuit substrate; wherein the insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate.

[0012] In order to improve or solve the above-mentioned problems, another technical means adopted by the utility model is to provide a portable electronic device, which is configured to use an image reading module, characterized in that the image reading module includes: a circuit substrate, an image sensing chip, an insulating connection structure and a lens assembly. The circuit substrate has an upper surface, a lower surface and a through opening connected between the upper surface and the lower surface. The image sensing chip is arranged in the through opening of the circuit substrate and is electrically connected to the circuit substrate through a plurality of metal leads. The insulating connection structure is arranged in the through opening of the circuit substrate and is connected between the image sensing chip and the circuit substrate. The lens assembly includes a lens carrier arranged on the circuit substrate and a lens module carried by the lens carrier. Among them, an upper surface of the image sensing chip has an image sensing area corresponding to the lens module. Among them, a lower surface of the image sensing chip is exposed to the outside and is not covered by the insulating connection structure.

[0013] Preferably, the upper surface of the circuit substrate has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate through a plurality of metal leads;

[0014] Wherein, the insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate; wherein the inner surrounding surface of the through opening of the circuit substrate is configured as a roughened surrounding surface, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate; wherein all or part of the outer surrounding surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the adhesion or contact area between the insulating connection structure and the image sensing chip; wherein the thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit substrate; wherein the insulating connection structure has a lower surrounding surface that is exposed and not covered, and the insulating connection The lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate and the lower surface of the image sensing chip are aligned with each other; wherein the lower surrounding surface of the insulating connection structure has a colloid separation mark generated after being separated from a temporary supporting substrate; wherein the lower surrounding surface of the insulating connection structure has a colloid deformation mark generated after being heated by a heat source generated by a heating module; wherein the insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the adhesion or contact area between the insulating connection structure and the circuit substrate; wherein the image reading module further includes a filter element, which is supported by multiple supporting bodies or a surrounding support member to be arranged above the image sensing chip, and the filter element is surrounded by multiple metal leads.

[0015] One of the beneficial effects of the present invention is that the present invention provides an image reading module for reducing the overall thickness, which can reduce the overall thickness of the image reading module by adopting the technical solutions of "the circuit substrate has an upper surface, a lower surface and a through opening connected between the upper surface and the lower surface", "the image sensing chip is arranged in the through opening of the circuit substrate and is electrically connected to the circuit substrate through a plurality of metal leads" and "the insulating connection structure is arranged in the through opening of the circuit substrate and is connected between the image sensing chip and the circuit substrate", so that the image sensing chip can be firmly fixed in the through opening of the circuit substrate through the connection of the insulating connection structure without contacting the circuit substrate, thereby reducing the overall thickness of the image reading module.

[0016] To further understand the features and technical contents of the present invention, please refer to the following detailed description and drawings of the present invention. However, the drawings are only used for reference and description and are not intended to limit the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 The utility model provides a flowchart of a method for manufacturing an image reading module for reducing the overall thickness.

[0018] Figure 2 It is a schematic diagram of step S100 of a method for manufacturing an image reading module for reducing the overall thickness provided by the first embodiment of the present invention.

[0019] Figure 3 It is a schematic diagram of steps S102 and S104 of a method for manufacturing an image reading module for reducing the overall thickness provided by the first embodiment of the present invention.

[0020] Figure 4 It is a schematic diagram of step S106 of a method for manufacturing an image reading module for reducing overall thickness provided by the first embodiment of the present invention.

[0021] Figure 5 It is a schematic diagram of step S108 of a method for manufacturing an image reading module for reducing overall thickness provided by the first embodiment of the present invention.

[0022] Figure 6 It is a schematic diagram of an image reading module for reducing the overall thickness provided by the first embodiment of the utility model.

[0023] Figure 7A schematic diagram of one of the feasible implementation methods of a method for manufacturing an image reading module for reducing the overall thickness provided in the first embodiment of the utility model (after the step of electrically connecting the image sensing chip to the circuit substrate, the temporary carrier substrate is removed from the circuit substrate).

[0024] Figure 8 A schematic diagram of another feasible implementation of a method for manufacturing an image reading module for reducing the overall thickness provided in the first embodiment of the utility model (after the step of disposing the lens assembly on the circuit substrate, the temporary carrier substrate is removed from the circuit substrate).

[0025] Fig. 9 A schematic diagram of one possible implementation of a method for manufacturing an image reading module for reducing the overall thickness provided by the second embodiment of the utility model.

[0026] Fig.10 It is a schematic diagram of an image reading module for reducing the overall thickness provided by the second embodiment of the utility model.

[0027] Fig.11 It is a schematic diagram of an image reading module for reducing the overall thickness provided by the third embodiment of the utility model.

[0028] Fig.12 It is a schematic diagram of steps S200 and S202 of a method for manufacturing an image reading module for reducing the overall thickness provided by the fourth embodiment of the present invention.

[0029] Fig.13 It is a schematic diagram of step S204 of a method for manufacturing an image reading module for reducing overall thickness provided by the fourth embodiment of the present invention.

[0030] Fig.14 It is a schematic diagram of step S206 of a method for manufacturing an image reading module for reducing overall thickness provided by the fourth embodiment of the present invention.

[0031] Fig.15 A functional block diagram of a portable electronic device using an image reading module provided by a fifth embodiment of the present invention. DETAILED DESCRIPTION

[0032] The following is an explanation of the implementation of the "image reading module and portable electronic device for reducing the overall thickness" disclosed in the utility model through specific embodiments. Those skilled in the art can understand the advantages and effects of the utility model from the contents disclosed in this specification. The utility model can be implemented or applied through other different specific embodiments, and the details in this specification can also be modified and changed in various ways based on different viewpoints and applications without departing from the concept of the utility model. In addition, it should be stated in advance that the drawings of the utility model are only simple schematic illustrations and are not depicted according to actual dimensions. The following embodiments will further explain the relevant technical contents of the utility model in detail, but the disclosed contents are not intended to limit the scope of protection of the utility model. In addition, the term "or" used in this article may include any one or more combinations of the associated listed items depending on the actual situation.

[0033] First embodiment

[0034] See also Figures 1 to 6 As shown, the first embodiment of the utility model provides a method for manufacturing an image reading module for reducing the overall thickness, which comprises: first, Figure 1 and Figure 2 As shown, a circuit substrate 1 and a temporary carrier substrate C (or a movable substrate, a separable substrate or a detachable substrate) are brought close to each other so that the circuit substrate 1 is disposed on the temporary carrier substrate C (or until the circuit substrate 1 and the temporary carrier substrate C are completely in contact with each other), wherein the circuit substrate 1 has an upper surface 1001, a lower surface 1002 and a through opening 1003 connected between the upper surface 1001 and the lower surface 1002 (or a through opening 1003 that penetrates the circuit substrate 1), and the bottom end of the through opening 1003 of the circuit substrate 1 is closed by the temporary carrier substrate C (step S100); then, the circuit substrate 1 is matched with the temporary carrier substrate C to form a circuit substrate 1002; Figure 1 and Figure 3 As shown, an image sensor chip 2 is placed in the through opening 1003 of the circuit substrate 1 and disposed on a temporary carrier substrate C (step S102), and then an insulating connection structure 3 is formed in the through opening 1003 of the circuit substrate 1 and connected between the image sensor chip 2 and the circuit substrate 1 (step S104); then, Figure 1 and Figure 4 As shown, the temporary carrier substrate C is removed from the circuit substrate 1 (step S106); next, Figure 1 and Figure 5 As shown, the image sensor chip 2 is electrically connected to the circuit substrate 1 through a plurality of metal wires W (which can be any conductive metal material, such as gold, silver or copper) (step S108); then, Figure 1 and Figure 6As shown, a lens assembly 4 is disposed on the circuit substrate 1, wherein the lens assembly 4 includes a lens carrier 41 disposed on the circuit substrate 1 and a lens module 42 carried by the lens carrier 41 (step S110). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0035] For example, with Figure 1 and Figure 2 As shown, in step S100 of bringing the circuit substrate 1 and the temporary carrier substrate C close to each other so that the circuit substrate 1 is disposed on the temporary carrier substrate C, the utility model can operate the processing machine to gradually bring the circuit substrate 1 close to the temporary carrier substrate C, or to gradually bring the temporary carrier substrate C close to the circuit substrate 1, until the circuit substrate 1 and the temporary carrier substrate C are completely in contact. In other words, any method of "bringing the circuit substrate 1 and the temporary carrier substrate C close to each other so that the circuit substrate 1 is disposed on the temporary carrier substrate C" can be applied to the manufacturing method of the image reading module for reducing the overall thickness provided in the first embodiment of the utility model. However, the above example is only one feasible embodiment and is not intended to limit the utility model.

[0036] For example, with Figure 1 and Figure 3 As shown, in step S102 of accommodating the image sensing chip 2 in the through opening 1003 of the circuit substrate 1 and setting it on the temporary carrier substrate C, the utility model can first confirm the position of the through opening 1003 of the circuit substrate 1 through an image sensing module (not shown), and then accurately accommodate the image sensing chip 2 in the through opening 1003 of the circuit substrate 1 and set it on the temporary carrier substrate C, thereby improving the optical alignment accuracy of the image sensing chip 2. It is worth noting that the image sensing chip 2 can be directly set on the temporary carrier substrate C without any medium, or the image sensing chip 2 can also be set on the temporary carrier substrate C through a low-viscosity adhesive layer. However, the above example is only one feasible embodiment and is not intended to limit the utility model.

[0037] For example, with Figure 1 and Figure 3As shown, in step S104 of generating the insulating connection structure 3 in the through opening 1003 of the circuit substrate 1 and connecting the image sensing chip 2 and the circuit substrate 1, the utility model can first confirm a vacant position between the image sensing chip 2 and the circuit substrate 1 (that is, the space of the through opening 1003 not occupied by the image sensing chip 2) through an image sensing module (not shown), and then fill an insulating material (such as silicone or epoxy resin) in the through opening 1003, and then bake the insulating material through a heating device (not shown) (or allow the insulating material to harden naturally at room temperature), thereby completing the production of the insulating connection structure 3. However, the above example is only one feasible embodiment and is not intended to limit the utility model.

[0038] For example, with Figure 1 and Figure 4 As shown, in step S106 of removing the temporary carrier substrate C from the circuit substrate 1, since the circuit substrate 1 can be fixed in advance, the temporary carrier substrate C can be directly moved downward relative to the circuit substrate 1, so that the temporary carrier substrate C can be directly separated from the circuit substrate 1. In another feasible embodiment, the bonding force or adhesion between the insulating connection structure 3 and the temporary carrier substrate C can be weakened or reduced by "direct irradiation of the laser (heat source) generated by the laser generator (not shown)" or "indirect heating of the heat source generated by the heater (not shown)", so that the temporary carrier substrate C can be separated from the circuit substrate 1 in a more labor-saving manner, and the configuration position (or optical alignment) of the image sensing chip 2 is not easily affected by the separation of the temporary carrier substrate C. It is worth noting that when the temporary carrier substrate C is directly moved downward and separated from the circuit substrate 1, the lower surrounding surface 3000 of the insulating connection structure 3 will generate a colloid separation mark T1 generated "after separation from the temporary carrier substrate C". In addition, when the temporary carrier substrate C is separated from the circuit substrate 1 by "direct irradiation of laser light generated by the laser generator" or "indirect heating by the heat source generated by the heater", the lower surrounding surface 3000 of the insulating connection structure 3 will generate a colloid deformation mark (not shown) generated by "being heated by the heat source generated by the laser generator or the heater". However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0039] For example, with Figure 1 , Figure 3 and Figure 5As shown, in step S108 of electrically connecting the image sensing chip 2 to the circuit substrate 1 through a plurality of metal leads W, the upper surface 1001 of the circuit substrate 1 has a plurality of substrate conductive pads 10P, the upper surface 2001 of the image sensing chip 2 has a plurality of chip conductive pads 20P, and the plurality of chip conductive pads 20P of the image sensing chip 2 can be respectively connected through a plurality of metal leads W (for example, Figure 5 The presented jumper-shaped metal leads, or continuous metal traces generated simultaneously on the surface of the image sensor chip 2, the surface of the insulating connection structure 3, and the surface of the circuit substrate 1, are respectively electrically connected to the plurality of substrate conductive pads 10P of the circuit substrate 1. However, the above example is only one possible embodiment and is not intended to limit the present invention.

[0040] For example, if Figure 5 As shown, the manufacturing method of the image reading module for reducing the overall thickness provided by the first embodiment of the utility model further includes: a filter element 5 is arranged above the image sensing chip 2 through the support of multiple supporting bodies (unnumbered) or a surrounding support member (unnumbered). That is, in the step S108 of electrically connecting the image sensing chip 2 to the circuit substrate 1 through multiple metal wires W, the filter element 5 can be arranged at a predetermined position above the image sensing chip 2 through the support of multiple supporting bodies (unnumbered) or a surrounding support member (unnumbered). However, the above example is only one feasible embodiment and is not intended to limit the utility model.

[0041] It is worth noting that, for example, Figure 7 As shown, in one of the feasible embodiments, after step S104 of forming the insulating connection structure 3 in the through opening 1003 of the circuit substrate 1, the temporary carrier substrate C may not be removed from the circuit substrate 1 temporarily, but may be Figure 7 As shown, after the step of electrically connecting the image sensing chip 2 to the circuit substrate 1 through a plurality of metal wires W (or after the step of arranging the filter element 5 above the image sensing chip 2 through a plurality of support bodies or a surrounding support member), the temporary carrier substrate C is removed from the circuit substrate 1. Figure 8 As shown, in one of the feasible embodiments, after step S104 of forming the insulating connection structure 3 in the through opening 1003 of the circuit substrate 1, the temporary carrier substrate C may not be removed from the circuit substrate 1 temporarily, but may be Figure 8As shown, after the step of setting the lens assembly 4 on the circuit substrate 1, the temporary carrier substrate C is removed from the circuit substrate 1. That is, according to different processing requirements, the temporary carrier substrate C can be removed from the circuit substrate 1 after the step of "generating the insulating connection structure 3 in the through opening 1003 of the circuit substrate 1", or the temporary carrier substrate C can be removed from the circuit substrate 1 after the step of "electrically connecting the image sensor chip 2 to the circuit substrate 1 through a plurality of metal leads W", or the temporary carrier substrate C can be removed from the circuit substrate 1 after the step of "setting the lens assembly 4 on the circuit substrate 1". However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0042] Furthermore, cooperation Figures 2 to 6 As shown, the first embodiment of the utility model further provides an image reading module M (or image sensing module, or image capturing module) for reducing the overall thickness, which includes: a circuit substrate 1, an image sensing chip 2, an insulating connection structure 3 and a lens assembly 4.

[0043] Furthermore, with Figure 5 and Figure 6 As shown, the circuit substrate 1 has an upper surface 1001, a lower surface 1002, and a through opening 1003 connected between the upper surface 1001 and the lower surface 1002, and the image sensor chip 2 is disposed in the through opening 1003 of the circuit substrate 1 and is electrically connected to the circuit substrate 1 through a plurality of metal leads W. For example, the upper surface 1001 of the circuit substrate 1 has a plurality of substrate conductive pads 10P, the upper surface 2001 of the image sensor chip 2 has a plurality of chip conductive pads 20P, and the plurality of chip conductive pads 20P of the image sensor chip 2 are respectively electrically connected to the plurality of substrate conductive pads 10P of the circuit substrate 1 through a plurality of metal leads W. In addition, according to different use requirements, the image sensor chip 2 can be a charge coupled device (CCD) or a complementary metal-oxide semiconductor (CMOS). However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0044] Furthermore, with Figure 5 and Figure 6As shown, the insulating connection structure 3 is disposed in the through opening 1003 of the circuit substrate 1 and connected between the image sensing chip 2 and the circuit substrate 1. In addition, the lens assembly 4 includes a lens carrier 41 disposed on the circuit substrate 1 and a lens module 42 (for example, it can be composed of a plurality of optical lenses) carried by the lens carrier 41, and the upper surface 2001 of the image sensing chip 2 has an image sensing area 20S corresponding to the lens module 42. It is worth noting that a lower surface 2002 of the image sensing chip 2 is exposed and not covered by the insulating connection structure 3, and the insulating connection structure 3 has a lower surrounding surface 3000 exposed and not covered, and the lower surrounding surface 3000 of the insulating connection structure 3, the lower surface 1002 of the circuit substrate 1 and the lower surface 2002 of the image sensing chip 2 can be completely or substantially (substantially) aligned with each other. However, the above example is only one of the feasible embodiments and is not intended to limit the present invention.

[0045] For example, with Figure 5 and Figure 6 As shown, the thickness of the insulating connection structure 3 may be "less than or equal to the thickness of the image sensing chip 2" and "less than or equal to the thickness of the circuit substrate 1", and the insulating connection structure 3 may be tightly connected between an outer surrounding surface 2000 of the image sensing chip 2 and an inner surrounding surface 1004 of the through opening 1003 of the circuit substrate 1. In one of the feasible embodiments, when the inner surrounding surface 1004 of the through opening 1003 of the circuit substrate 1 may be configured as a roughened surrounding surface, the roughened surrounding surface may be used to increase the adhesion or contact area between the insulating connection structure 3 and the circuit substrate 1. In one of the feasible embodiments, all or part of the outer surrounding surface 2000 of the image sensing chip 2 may be covered by the insulating connection structure 3, thereby adjusting the adhesion or contact area between the insulating connection structure 3 and the image sensing chip 2 (that is, when the area of ​​the outer surrounding surface 2000 of the image sensing chip 2 covered by the insulating connection structure 3 is larger, the adhesion or contact area between the insulating connection structure 3 and the image sensing chip 2 will also be larger). However, the above example is only one feasible implementation example and is not intended to limit the present invention.

[0046] For example, with Figure 4 and Figure 6As shown, the lower surrounding surface 3000 of the insulating connection structure 3 has a colloid separation mark T1 generated after being separated from a temporary carrier substrate C. In one feasible embodiment, when the temporary carrier substrate C is separated from the circuit substrate 1 by "direct irradiation of laser generated by a laser generator" or "indirect heating by a heat source generated by a heater", the lower surrounding surface 3000 of the insulating connection structure 3 will generate a colloid deformation mark (not shown) generated by "being heated by a heat source generated by a laser generator or a heater". However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0047] For example, with Figure 5 and Figure 6 As shown, the image reading module M further includes a filter element 5, which can be supported by a plurality of supporting bodies (not labeled) or a surrounding support member (not labeled) to be disposed above the image sensing chip 2, and the filter element 5 can be surrounded by a plurality of metal leads W, and the height of the filter element 5 relative to the image sensing chip 2 can be higher or lower than the height of the plurality of metal leads W relative to the image sensing chip 2. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0048] For example, in one of the feasible embodiments, the insulating connection structure 3 may have an extended connection portion (not shown) extending onto the upper surface 1001 of the circuit substrate 1, thereby increasing the adhesion or contact area between the insulating connection structure 3 and the circuit substrate 1. In other words, the insulating connection structure 3 can overlap the upper surface 1001 of the circuit substrate 1 by extending the extended connection portion, so there will be more contact area between the insulating connection structure 3 and the circuit substrate 1 (or the insulating connection structure 3 can get more support from the circuit substrate 1), which will make it less likely for the insulating connection structure 3 to be damaged by external forces (such as Figure 4 As shown, the temporary carrier substrate C is separated from the through opening 1003 of the circuit substrate 1 by the external force generated when the temporary carrier substrate C is removed from the circuit substrate 1. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0049] Second embodiment

[0050] See also Figure 1 , Fig. 9 and Fig.10 As shown, the second embodiment of the present invention provides a method for manufacturing an image reading module for reducing the overall thickness and an image reading module M for reducing the overall thickness. Fig. 9 and Figure 3 comparison, and Fig.10 and Figure 6It can be seen from the comparison that the main difference between the second embodiment of the utility model and the first embodiment is that: after step S100 of bringing the circuit substrate 1 and the temporary carrier substrate C close to each other so that the circuit substrate 1 is disposed on the temporary carrier substrate C, the manufacturing method of the image reading module for reducing the overall thickness provided by the second embodiment of the utility model further includes: generating a bottom surrounding insulation layer 31 in the through opening 1003 of the circuit substrate 1 and connecting between the image sensing chip 2 and the circuit substrate 1 (step S104 (A)); and, generating a top surrounding insulation layer 32 in the through opening 1003 of the circuit substrate 1 and connecting between the image sensing chip 2 and the circuit substrate 1 (step S104 (B)).

[0051] Furthermore, with Fig. 9 and Fig.10 As shown, the bottom surrounding insulating layer 31 and the top surrounding insulating layer 32 can be connected to each other, and both the bottom surrounding insulating layer 31 and the top surrounding insulating layer 32 can be accommodated in the through opening 1003 of the circuit substrate 1 and tightly connected between the image sensing chip 2 and the circuit substrate 1. It is worth noting that the bottom surrounding insulating layer 31 of the insulating connection structure 3 has a lower surrounding surface 3000 that is exposed and not covered, and the lower surrounding surface 3000 of the bottom surrounding insulating layer 31 of the insulating connection structure 3, the lower surface 1002 of the circuit substrate 1 and the lower surface 2002 of the image sensing chip 2 can be completely or substantially (substantially) aligned with each other. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0052] For example, with Fig. 9 and Fig.10 As shown, in one of the feasible embodiments, the thickness of the bottom surrounding insulating layer 31 can be less than the thickness of the top surrounding insulating layer 32, or the viscosity of the bottom surrounding insulating layer 31 can be less than the viscosity of the top surrounding insulating layer 32, or the melting point of the bottom surrounding insulating layer 31 can be lower than the melting point of the top surrounding insulating layer 32, so the bonding force between the bottom surrounding insulating layer 31 and the image sensing chip 2 will be less than the bonding force between the top surrounding insulating layer 32 and the image sensing chip 2, and the bonding force between the bottom surrounding insulating layer 31 and the circuit substrate 1 will be less than the bonding force between the top surrounding insulating layer 32 and the circuit substrate 1, which will help the temporary carrier substrate C to be more easily separated from the circuit substrate 1. However, the above example is only one of the feasible embodiments and is not intended to limit the present invention.

[0053] For example, with Fig. 9 and Fig.10As shown, in one of the feasible embodiments, when the inner surrounding surface 1004 of the through opening 1003 of the circuit substrate 1 can be configured to contact a roughened surrounding surface of the top surrounding insulating layer 32, the roughened surrounding surface can be used to increase the adhesion or contact area between the top surrounding insulating layer 32 and the circuit substrate 1. However, the above example is only one of the feasible embodiments and is not intended to limit the present invention.

[0054] For example, with Fig. 9 and Fig.10 As shown, when the temporary carrier substrate C is separated from the circuit substrate 1 by "direct irradiation of laser generated by a laser generator (or direct irradiation of the bottom surrounding the insulating layer 31 by laser generated by a laser generator)" or "indirect heating by a heat source generated by a heater (or indirect heating of the bottom surrounding the insulating layer 31 by a heat source generated by a heater)", the lower surrounding surface 3000 of the bottom end of the insulating connection structure 3 surrounding the insulating layer 31 will generate a colloid deformation mark T2 "generated after being heated by a heat source generated by a heating module L (such as a laser generator or a heater)". In one of the feasible embodiments, when the temporary carrier substrate C is directly moved downward and separated from the circuit substrate 1, the lower surrounding surface 3000 of the bottom end of the insulating connection structure 3 surrounding the insulating layer 31 will generate a colloid separation mark (not shown) "generated after being separated from the temporary carrier substrate C". However, the above example is only one of the feasible embodiments and is not intended to limit the present invention.

[0055] For example, in one of the feasible embodiments, the top surrounding insulating layer 32 of the insulating connection structure 3 has an extended connection portion (not shown) extending to the upper surface 1001 of the circuit substrate 1, thereby increasing the adhesion or contact area between the top surrounding insulating layer 32 of the insulating connection structure 3 and the circuit substrate 1. In other words, the top surrounding insulating layer 32 of the insulating connection structure 3 can overlap on the upper surface 1001 of the circuit substrate 1 through the extension of the extended connection portion, so there will be more contact area between the top surrounding insulating layer 32 of the insulating connection structure 3 and the circuit substrate 1 (or the top surrounding insulating layer 32 of the insulating connection structure 3 can get more support from the circuit substrate 1), which will make the insulating connection structure 3 less likely to be damaged by external forces (such as Figure 4 As shown, the temporary carrier substrate C is separated from the through opening 1003 of the circuit substrate 1 by the external force generated when the temporary carrier substrate C is removed from the circuit substrate 1. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0056] Third embodiment

[0057] See also Fig.11As shown, the third embodiment of the present invention provides an image reading module M for reducing the overall thickness. Fig.11 and Fig.10 From the comparison, it can be seen that the main difference between the third embodiment of the utility model and the second embodiment is that the top surrounding insulation layer 32 of the insulating connection structure 3 has a lower surrounding surface 3000 that is exposed and not covered, and there is a predetermined vertical height between the lower surrounding surface 3000 of the top surrounding insulation layer 32 of the insulating connection structure 3 and the lower surface 1002 of the circuit substrate 1, thereby allowing a surrounding unoccupied space S to be generated between the circuit substrate 1, the image sensing chip 2 and the insulating connection structure 3.

[0058] For example, the surrounding unoccupied space S can be generated by removing a portion of the bottom material of the insulating connection structure 3 (for example, it can be removed by a laser generator or a heater), so the top of the insulating connection structure 3 surrounds the lower surrounding surface 3000 of the insulating layer 32, a portion of the inner surrounding surface 1004 of the through opening 1003 of the circuit substrate 1, and a portion of the outer surrounding surface 2000 of the image sensor chip 2 can be exposed from the bottom of the through opening 1003 of the circuit substrate 1. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0059] Fourth embodiment

[0060] See also Figure 1 as well as Figure 12 to Figure 14 As shown, the fourth embodiment of the utility model provides a method for manufacturing an image reading module for reducing the overall thickness, which comprises: first, Figure 1 and Fig.12 As shown, a circuit substrate 1 and a temporary carrier substrate C (or a movable substrate, a separable substrate or a detachable substrate) are brought close to each other so that the circuit substrate 1 is disposed on the temporary carrier substrate C (or until the circuit substrate 1 and the temporary carrier substrate C are completely in contact with each other), wherein the circuit substrate 1 has an upper surface 1001, a lower surface 1002 and a through opening 1003 connected between the upper surface 1001 and the lower surface 1002 (or a through opening 1003 that penetrates the circuit substrate 1), and the bottom end of the through opening 1003 of the circuit substrate 1 is closed by the temporary carrier substrate C (step S200); then, the circuit substrate 1 is matched with the temporary carrier substrate C to form a circuit substrate 1002; Figure 1 and Fig.12 As shown, an image sensor chip 2 is placed in the through opening 1003 of the circuit substrate 1 through an adhesive layer C100 (such as double-sided adhesive or any type of adhesive layer) and is disposed on the temporary carrier substrate C (step S202); then, Figure 1 and Fig.13As shown, the image sensing chip 2 is electrically connected to the circuit substrate 1 through a plurality of metal wires W (which can be any conductive metal material, such as gold, silver or copper) (or it can also include a plurality of support bodies or a surrounding support member to support a filter element 5 disposed above the image sensing chip 2) (step S204); next, with the cooperation of Figure 1 and Fig.14 As shown, an insulating connection structure 3 is generated in the through opening 1003 of the circuit substrate 1 and connected between the image sensor chip 2 and the circuit substrate 1 (step S206); then, as shown in FIG. Figure 1 As shown, the temporary carrier substrate C is removed from the circuit substrate 1 (step S208); then, as shown Figure 1 As shown, a lens assembly 4 is disposed on the circuit substrate 1, wherein the lens assembly 4 includes a lens carrier 41 disposed on the circuit substrate 1 and a lens module 42 carried by the lens carrier 41 (step S210). It is worth noting that, according to different requirements, step S208 and step S210 can also be performed inversely. For example, in one of the feasible embodiments, the adhesive layer C100 can be disposed only between the image sensing chip 2 and the temporary carrier substrate C. In another feasible embodiment, the adhesive layer C100 can also be distributed on the entire temporary carrier substrate C in a larger area, so that the adhesive layer C100 can also be disposed between the circuit substrate 1 and the temporary carrier substrate C, and the adhesive layer C100 can also be disposed between the insulating connection structure 3 and the temporary carrier substrate C. However, the above example is only one of the feasible embodiments and is not intended to limit the present invention.

[0061] In other words, cooperation Figure 3 , Figure 5 , Fig.12 , Fig.13 and Fig.14 As shown, the “wire bonding step (or chip electrical connection step)” of electrically connecting the image sensing chip 2 to the circuit substrate 1 through a plurality of metal wires W and the “glue filling step (chip positioning step)” of forming an insulating connection structure 3 in the through opening 1003 of the circuit substrate 1 and connecting the image sensing chip 2 and the circuit substrate 1 can be two steps performed in sequence (coordinated with the step of Figure 3 and Figure 5 As shown, that is, the glue filling step is performed first and then the wire bonding step) or two steps are performed in reverse (with Fig.12 , Fig.13 and Fig.14 As shown, the wire bonding step is performed first and then the glue filling step is performed).

[0062] Fifth embodiment

[0063] See also Fig.15 As shown, the fifth embodiment of the present invention provides a portable electronic device P, which can be configured to use any image reading module M provided in the first to third embodiments. For example, the portable electronic device P can be a smart phone, a desktop computer, a laptop computer, a tablet computer, or any other type of electronic device. However, the above example is only one feasible embodiment and is not intended to limit the present invention.

[0064] Advantageous Effects of Embodiments

[0065] One of the beneficial effects of the present invention is that the present invention provides an image reading module M for reducing the overall thickness, which can reduce the overall thickness of the image reading module M by adopting the technical solutions of "the circuit substrate 1 has an upper surface 1001, a lower surface 1002 and a through opening 1003 connected between the upper surface 1001 and the lower surface 1002", "the image sensing chip 2 is arranged in the through opening 1003 of the circuit substrate 1 and is electrically connected to the circuit substrate 1 through a plurality of metal leads W", and "the insulating connection structure 3 is arranged in the through opening 1003 of the circuit substrate 1 and is connected between the image sensing chip 2 and the circuit substrate 1", so that the image sensing chip 2 can still be firmly fixed in the through opening 1003 of the circuit substrate 1 through the connection of the insulating connection structure 3 without contacting the circuit substrate 1, thereby reducing the overall thickness of the image reading module M.

[0066] Another beneficial effect of the present invention is that the present invention provides a method for manufacturing an image reading module for reducing the overall thickness, which can reduce the overall thickness of the image reading module M by the technical solutions of "bringing a circuit substrate 1 and a temporary carrier substrate C close to each other so that the circuit substrate 1 is arranged on the temporary carrier substrate C, wherein the circuit substrate 1 has an upper surface 1001, a lower surface 1002 and a through opening 1003 connected between the upper surface 1001 and the lower surface 1002", "accommodating an image sensing chip 2 in the through opening 1003 of the circuit substrate 1 and arranged on the temporary carrier substrate C" and "generating an insulating connection structure 3 in the through opening 1003 of the circuit substrate 1 and connecting the image sensing chip 2 and the circuit substrate 1", so that the image sensing chip 2 can still be firmly fixed in the through opening 1003 of the circuit substrate 1 through the connection of the insulating connection structure 3 without contacting the circuit substrate 1, thereby reducing the overall thickness of the image reading module M.

[0067] The contents disclosed above are only optional feasible embodiments of the present utility model, and do not limit the protection scope of the claims of the present utility model. Therefore, all equivalent technical changes made using the contents of the description and drawings of the present utility model are included in the protection scope of the claims of the present utility model.

Claims

1. An image reading module for reducing overall thickness, characterized in that: The image reading module for reducing the overall thickness includes: A circuit substrate having an upper surface, a lower surface, and a through opening connected between the upper surface and the lower surface; an image sensing chip, the image sensing chip being disposed in the through opening of the circuit substrate and being electrically connected to the circuit substrate through a plurality of metal leads; an insulating connection structure, the insulating connection structure being disposed in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate; and A lens assembly, the lens assembly comprising a lens carrier disposed on the circuit substrate and a lens module carried by the lens carrier; Wherein, an upper surface of the image sensing chip has an image sensing area corresponding to the lens module; Wherein, a lower surface of the image sensing chip is exposed and not covered by the insulating connection structure; The image reading module further includes a filter element, which is supported by a plurality of supporting bodies or a surrounding support member to be disposed above the image sensing chip, and is surrounded by a plurality of metal leads.

2. The image reading module for reducing overall thickness according to claim 1, characterized in that: in, The upper surface of the circuit substrate has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate through a plurality of metal leads; Wherein, the insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate; Wherein, the inner surrounding surface of the through opening of the circuit substrate is configured as a roughened surrounding surface, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate; Wherein, all or part of the outer surrounding surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the bonding force or contact area between the insulating connection structure and the image sensing chip; Wherein, the thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit substrate; The insulating connection structure has a lower surrounding surface that is exposed and uncovered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate, and the lower surface of the image sensing chip are aligned with each other; Wherein, the lower surrounding surface of the insulating connection structure has a colloid separation mark generated after being separated from a temporary supporting substrate; Wherein, the lower surrounding surface of the insulating connection structure has a colloid deformation mark generated after being heated by a heat source generated by a heating module; The insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate.

3. The image reading module for reducing overall thickness according to claim 1, characterized in that: in, The insulating connection structure includes a bottom surrounding insulating layer and a top surrounding insulating layer connected to the bottom surrounding insulating layer, and the bottom surrounding insulating layer and the top surrounding insulating layer are both arranged in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate; The thickness of the insulating layer surrounding the bottom end is smaller than the thickness of the insulating layer surrounding the top end, the viscosity of the insulating layer surrounding the bottom end is smaller than the viscosity of the insulating layer surrounding the top end, and the melting point of the insulating layer surrounding the bottom end is lower than the melting point of the insulating layer surrounding the top end; The bonding force between the bottom surrounding insulating layer and the image sensing chip is smaller than the bonding force between the top surrounding insulating layer and the image sensing chip, and the bonding force between the bottom surrounding insulating layer and the circuit substrate is smaller than the bonding force between the top surrounding insulating layer and the circuit substrate; wherein an inner surrounding surface of the through opening of the circuit substrate is configured to contact a roughened surrounding surface of the top surrounding insulating layer, thereby increasing the bonding force or contact area between the top surrounding insulating layer and the circuit substrate; The insulating connection structure has a lower surrounding surface that is exposed and uncovered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate, and the lower surface of the image sensing chip are aligned with each other; Wherein, the lower surrounding surface of the bottom surrounding insulating layer has a colloid separation mark generated after being separated from a temporary supporting substrate; Wherein, the lower surrounding surface of the bottom surrounding insulating layer has a colloid deformation mark generated after being heated by a heat source generated by a heating module; The top of the insulating connection structure surrounds the insulating layer and has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate.

4. The image reading module for reducing overall thickness according to claim 1, characterized in that: in, The insulating connection structure has a lower surrounding surface that is exposed and not covered, and there is a predetermined vertical height between the lower surrounding surface of the insulating connection structure and the lower surface of the circuit substrate, so that a surrounding unoccupied space is generated between the circuit substrate, the image sensing chip and the insulating connection structure; The insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate, and the lower surrounding surface of the insulating connection structure, a portion of the inner surrounding surface of the through opening of the circuit substrate, and a portion of the outer surrounding surface of the image sensing chip are exposed from the bottom end of the through opening of the circuit substrate; The insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate.

5. An image reading module for reducing overall thickness, characterized in that: The image reading module for reducing the overall thickness includes: A circuit substrate having an upper surface, a lower surface, and a through opening connected between the upper surface and the lower surface; an image sensing chip, the image sensing chip being disposed in the through opening of the circuit substrate and being electrically connected to the circuit substrate through a plurality of metal leads; an insulating connection structure, the insulating connection structure being disposed in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate; and A lens assembly, the lens assembly comprising a lens carrier disposed on the circuit substrate and a lens module carried by the lens carrier; Wherein, an upper surface of the image sensing chip has an image sensing area corresponding to the lens module; Wherein, a lower surface of the image sensing chip is exposed and not covered by the insulating connection structure.

6. The image reading module for reducing overall thickness according to claim 5, characterized in that: in, The upper surface of the circuit substrate has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate through a plurality of metal leads; Wherein, the insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate; Wherein, the inner surrounding surface of the through opening of the circuit substrate is configured as a roughened surrounding surface, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate; Wherein, all or part of the outer surrounding surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the bonding force or contact area between the insulating connection structure and the image sensing chip; Wherein, the thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit substrate; The insulating connection structure has a lower surrounding surface that is exposed and uncovered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate, and the lower surface of the image sensing chip are aligned with each other; Wherein, the lower surrounding surface of the insulating connection structure has a colloid separation mark generated after being separated from a temporary supporting substrate; Wherein, the lower surrounding surface of the insulating connection structure has a colloid deformation mark generated after being heated by a heat source generated by a heating module; The insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate.

7. The image reading module for reducing overall thickness according to claim 5, characterized in that: in, The insulating connection structure includes a bottom surrounding insulating layer and a top surrounding insulating layer connected to the bottom surrounding insulating layer, and the bottom surrounding insulating layer and the top surrounding insulating layer are both arranged in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate; The thickness of the insulating layer surrounding the bottom end is smaller than the thickness of the insulating layer surrounding the top end, the viscosity of the insulating layer surrounding the bottom end is smaller than the viscosity of the insulating layer surrounding the top end, and the melting point of the insulating layer surrounding the bottom end is lower than the melting point of the insulating layer surrounding the top end; The bonding force between the bottom surrounding insulating layer and the image sensing chip is smaller than the bonding force between the top surrounding insulating layer and the image sensing chip, and the bonding force between the bottom surrounding insulating layer and the circuit substrate is smaller than the bonding force between the top surrounding insulating layer and the circuit substrate; wherein an inner surrounding surface of the through opening of the circuit substrate is configured to contact a roughened surrounding surface of the top surrounding insulating layer, thereby increasing the bonding force or contact area between the top surrounding insulating layer and the circuit substrate; The insulating connection structure has a lower surrounding surface that is exposed and uncovered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate, and the lower surface of the image sensing chip are aligned with each other; Wherein, the lower surrounding surface of the bottom surrounding insulating layer has a colloid separation mark generated after being separated from a temporary supporting substrate; Wherein, the lower surrounding surface of the bottom surrounding insulating layer has a colloid deformation mark generated after being heated by a heat source generated by a heating module; The top of the insulating connection structure surrounds the insulating layer and has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate.

8. The image reading module for reducing overall thickness according to claim 5, characterized in that: in, The insulating connection structure has a lower surrounding surface that is exposed and not covered, and there is a predetermined vertical height between the lower surrounding surface of the insulating connection structure and the lower surface of the circuit substrate, so that a surrounding unoccupied space is generated between the circuit substrate, the image sensing chip and the insulating connection structure; The insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate, and the lower surrounding surface of the insulating connection structure, a portion of the inner surrounding surface of the through opening of the circuit substrate, and a portion of the outer surrounding surface of the image sensing chip are exposed from the bottom end of the through opening of the circuit substrate; The insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate.

9. A portable electronic device, the portable electronic device being configured to use an image reading module, characterized in that: The image reading module comprises: A circuit substrate having an upper surface, a lower surface, and a through opening connected between the upper surface and the lower surface; an image sensing chip, the image sensing chip being disposed in the through opening of the circuit substrate and being electrically connected to the circuit substrate through a plurality of metal leads; an insulating connection structure, the insulating connection structure being disposed in the through opening of the circuit substrate and connected between the image sensing chip and the circuit substrate; and A lens assembly, the lens assembly comprising a lens carrier disposed on the circuit substrate and a lens module carried by the lens carrier; Wherein, an upper surface of the image sensing chip has an image sensing area corresponding to the lens module; Wherein, a lower surface of the image sensing chip is exposed and not covered by the insulating connection structure.

10. The portable electronic device according to claim 9, wherein: in, The upper surface of the circuit substrate has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and the plurality of chip conductive pads of the image sensing chip are respectively electrically connected to the plurality of substrate conductive pads of the circuit substrate through a plurality of metal leads; Wherein, the insulating connection structure is tightly connected between an outer surrounding surface of the image sensing chip and an inner surrounding surface of the through opening of the circuit substrate; Wherein, the inner surrounding surface of the through opening of the circuit substrate is configured as a roughened surrounding surface, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate; Wherein, all or part of the outer surrounding surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the bonding force or contact area between the insulating connection structure and the image sensing chip; Wherein, the thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit substrate; The insulating connection structure has a lower surrounding surface that is exposed and uncovered, and the lower surrounding surface of the insulating connection structure, the lower surface of the circuit substrate, and the lower surface of the image sensing chip are aligned with each other; Wherein, the lower surrounding surface of the insulating connection structure has a colloid separation mark generated after being separated from a temporary supporting substrate; Wherein, the lower surrounding surface of the insulating connection structure has a colloid deformation mark generated after being heated by a heat source generated by a heating module; Wherein, the insulating connection structure has an extended connection portion extending to the upper surface of the circuit substrate, thereby increasing the bonding force or contact area between the insulating connection structure and the circuit substrate; The image reading module further includes a filter element, which is supported by a plurality of supporting bodies or a surrounding support member to be disposed above the image sensing chip, and is surrounded by a plurality of metal leads.

Images