Semiconductor film for vehicle-mounted biological recognition identity authentication camera

Abstract

The utility model relates to the technical field of semiconductor films, in particular to a semiconductor film for a vehicle-mounted biological recognition identity authentication camera, which comprises an interface in threaded connection with the vehicle-mounted camera, and the upper end of the inner wall of the interface is fixedly connected with a semiconductor film body. The semiconductor film body comprises a protective layer, an anti-reflection layer, an optical filtering layer, a transparent conducting layer and a thermal isolation layer, the lower end of the protective layer is fixedly connected with the anti-reflection layer, the lower end of the anti-reflection layer is fixedly connected with the optical filtering layer, the lower end of the optical filtering layer is fixedly connected with the transparent conducting layer, and the thermal isolation layer is fixedly connected with the transparent conducting layer. The lower end of the transparent conductive layer is fixedly connected with the thermal isolation layer, and the upper end of the protection layer is fixedly connected with a plurality of transparent resin protruding blocks at equal intervals. The problems that the identification time of a camera at the rear end of the semiconductor film is greatly shortened and the accuracy is reduced when the surface of the semiconductor film is not clear and the surrounding light is relatively strong due to the fact that fingerprints are easy to adhere to the surface of the semiconductor film in the prior art are solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor films, in particular to a semiconductor film for a vehicle-mounted biometric identity verification camera. Background Art

[0002] The in-vehicle biometric authentication camera is a security device that integrates advanced biometric technology and is designed to improve the safety and convenience of vehicles. It achieves fast and accurate identity authentication by capturing the driver's biometrics, such as facial recognition or iris recognition. Among them, semiconductor film, as an important component of the camera, plays a vital role. With its unique conductivity and photoelectric properties, semiconductor film has become a key material in biometric technology. In the in-vehicle biometric authentication camera, semiconductor film can efficiently capture and convert biometric information, improving recognition accuracy and speed.

[0003] When performing biometric identification, the on-board biometric identity verification camera mainly uses fingerprint identification and face recognition. When performing fingerprint identification, the user's finger is required to contact the semiconductor film at the front end of the camera. The surface of the existing semiconductor film is very easy to stick to the fingerprint after contacting the finger, resulting in contamination and unclear surface of the semiconductor film, which affects the operation of the rear camera. In addition, when performing face recognition, if the light around the surrounding cameras is strong, the recognition time of the rear camera of the semiconductor film will be greatly increased and the accuracy will decrease. Furthermore, we disclose a semiconductor film for an on-board biometric identity verification camera to meet the actual needs of the prior art that the surface of the semiconductor film is easy to stick to the fingerprint, resulting in unclear surface of the semiconductor film and the recognition time of the rear camera of the semiconductor film will be greatly increased when the surrounding light is strong and the accuracy will decrease. Utility Model Content

[0004] In view of this, the purpose of the utility model is to propose a semiconductor film for a vehicle-mounted biometric identity authentication camera, so as to solve the problem in the prior art that the surface of the semiconductor film is easily sticky with fingerprints, resulting in an unclear surface of the semiconductor film, and that when the surrounding light is strong, the recognition time of the rear-end camera of the semiconductor film will be greatly increased and the accuracy will decrease.

[0005] Based on the above purpose, the utility model provides a semiconductor film for a vehicle-mounted biometric identity authentication camera, including an interface threadedly connected to the vehicle-mounted camera, the upper end of the inner wall of the interface is fixedly connected to a semiconductor film body, the semiconductor film body includes a protective layer, an anti-reflection layer, an optical filter layer, a transparent conductive layer and a thermal isolation layer, the lower end of the protective layer is fixedly connected to the anti-reflection layer, the lower end of the anti-reflection layer is fixedly connected to the optical filter layer, the lower end of the optical filter layer is fixedly connected to the transparent conductive layer, the lower end of the transparent conductive layer is fixedly connected to the thermal isolation layer, and the upper end of the protective layer is evenly spaced and fixedly connected to a plurality of transparent resin bumps.

[0006] Preferably, the outer wall of the interface is provided with a connecting thread, and the interface is threadably connected to the vehicle-mounted camera via the connecting thread.

[0007] Preferably, a light shield is fixedly connected to the upper end surface of the interface.

[0008] Preferably, an anti-reflection layer is provided on the inner wall of the interface located at the lower end of the semiconductor film body.

[0009] Preferably, the corners of the upper end surface of the protrusion are rounded.

[0010] The beneficial effects of the utility model: the semiconductor film used in the vehicle-mounted biometric identity authentication camera effectively solves two major problems in the prior art. First, the contact area between the film surface and the finger is reduced by setting the protrusions, which effectively prevents the adhesion of fingerprints and ensures the cleanliness and clarity of the semiconductor film surface, thereby avoiding the camera operation being affected by pollution; secondly, the semiconductor film also has excellent resistance to strong light interference, and is provided with a light blocking cover to block the light. The anti-reflection layer arranged inside the interface makes the refractive index gradually change from the film surface to the inside, reducing light reflection, and being able to maintain stable performance in a strong light environment, greatly reducing the camera recognition time, and significantly improving the recognition accuracy. Through the above structural design, not only the performance of the vehicle-mounted biometric identity authentication camera is improved, but also the safety of the vehicle and the user experience are enhanced. BRIEF DESCRIPTION OF THE DRAWINGS

[0011] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings in the following description are only for the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0012] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0013] Figure 2This is a schematic diagram of the internal structure of the utility model;

[0014] Figure 3 for Figure 2 Enlarged view of point A in the middle.

[0015] The markings in the figure are:

[0016] 1. Interface; 2. Connecting thread; 3. Light shield; 4. Semiconductor film body; 5. Bump; 6. Protective layer; 7. Anti-reflection layer; 8. Optical filter layer; 9. Transparent conductive layer; 10. Thermal isolation layer; 11. Anti-reflection layer. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with specific embodiments.

[0018] It should be noted that, unless otherwise defined, the technical terms or scientific terms used in the present invention should be understood by people with ordinary skills in the field to which the present invention belongs. The words "first", "second" and similar words used in the present invention do not indicate any order, quantity or importance, but are only used to distinguish different components. "Include" or "comprise" and similar words mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0019] like Figures 1 to 3As shown, a semiconductor film for a vehicle-mounted biometric identity authentication camera comprises an interface 1 threadedly connected to the vehicle-mounted camera, a semiconductor film body 4 is fixedly connected to the upper end of the inner wall of the interface 1, the semiconductor film body 4 comprises a protective layer 6, an anti-reflection layer 7, an optical filter layer 8, a transparent conductive layer 9 and a thermal isolation layer 10, the lower end of the protective layer 6 is fixedly connected to the anti-reflection layer 7, the lower end of the anti-reflection layer 7 is fixedly connected to the optical filter layer 8, the lower end of the optical filter layer 8 is fixedly connected to the transparent conductive layer 9, the lower end of the transparent conductive layer 9 is fixedly connected to the thermal isolation layer 10, the upper end of the protective layer 6 is evenly spaced and fixedly connected to a plurality of transparent resin bumps 5, the vehicle-mounted biometric identity authentication camera The semiconductor film effectively solves two major problems in the prior art. First, the contact area between the film surface and the finger is reduced by setting the protrusion 5, which effectively prevents the adhesion of fingerprints and ensures the cleanliness and clarity of the semiconductor film surface, thereby avoiding the impact of camera operation due to pollution; secondly, the semiconductor film also has excellent resistance to strong light interference, and is provided with a light blocking cover to block the light. It can maintain stable performance in a strong light environment, greatly reducing the camera recognition time and significantly improving the recognition accuracy. Through the above structural design, not only the performance of the vehicle-mounted biometric identity authentication camera is improved, but also the safety of the vehicle and the user experience are enhanced.

[0020] Further, such as Figure 1 As shown, the outer wall of the interface 1 is provided with a connecting thread 2, and the interface 1 is threadedly connected to the vehicle-mounted camera through the connecting thread 2. When the interface 1 needs to be connected to the vehicle-mounted camera, the user only needs to align the threaded portion of the interface 1 with the corresponding threaded portion of the vehicle-mounted camera, and then rotate the interface 1 so that its thread is tightly engaged with the thread of the vehicle-mounted camera. This connection method utilizes the tightening force of the thread, thereby ensuring a firm connection between the interface 1 and the vehicle-mounted camera, and while facilitating installation and disassembly, effectively prevents loosening or falling off due to vibration or external force, thereby ensuring the stability of the camera during driving.

[0021] Further, such as Figure 3As shown, the protective layer 6 is made of silicon nitride material, the anti-reflection layer 7 is made of titanium dioxide material, the optical filter layer 8 is made of zirconium oxide material, the transparent conductive layer 9 is made of indium tin oxide material, and the thermal isolation layer 10 is made of quartz material. In the multi-layer structure design of the semiconductor film, the protective layer 6 is made of silicon nitride material and is located at the outermost layer. With its high hardness and wear resistance, it effectively protects the internal layers from external physical damage. The anti-reflection layer 7 is composed of titanium dioxide material, which significantly improves the transmittance of light by optimizing the refraction and reflection of light, making the camera imaging clearer. The optical filter layer 8 that follows is made of zirconium oxide material, which can accurately filter out unnecessary light wavelengths and only allow light of specific wavelengths to pass, thereby enhancing the recognition accuracy of biometric features. The transparent conductive layer 9 utilizes the excellent conductivity and transparency of indium tin oxide material to provide a camera with a clearer image. The electronic components inside the head provide stable current transmission. Finally, the thermal isolation layer 10 is made of quartz material, which has good thermal stability and insulation properties, effectively reducing the impact of temperature changes on camera performance. These different material layers are tightly combined through fixed connections to form a whole, working together to realize the function of the semiconductor film. The protective layer 6 ensures the durability of the overall structure. The anti-reflection layer 7 and the optical filter layer 8 work together to optimize the propagation and filtering of light. The transparent conductive layer 9 provides stable current support, and the thermal isolation layer 10 ensures that the camera can work stably under various temperature conditions, so that the on-board biometric identity authentication camera can work stably and efficiently in a complex and changeable on-board environment. At the same time, the fixed connection between the layers ensures the stability and reliability of the semiconductor film body and extends the service life of the camera.

[0022] Further, such as Figure 1 to Figure 2 As shown, the inner wall of the interface 1 is located at the lower end of the semiconductor film body 4 and is provided with an anti-reflection layer 11, the anti-reflection layer 11 is made of silicon dioxide material, the upper end face corner of the bump 5 is provided with a rounded corner, the bump 5 is made of a transparent resin material, and this layer is made of silicon dioxide material. Silicon dioxide has excellent anti-reflection properties and can effectively reduce the reflection loss of light between the interface 1 and the semiconductor film, thereby improving the transmittance of light. When light passes through the semiconductor film and enters the interior of the interface 1, the anti-reflection layer 11 can maximize the penetration of light and reduce the light energy lost due to reflection, ensuring that the image captured by the camera is clearer and brighter. The purpose of setting the bump 5 is to reduce the contact area between the surface of the film and the finger, effectively preventing the adhesion of fingerprints, thereby ensuring the cleanliness and clarity of the surface of the semiconductor film, and the transparent resin material has the same transparency as glass, so that the bump 5 will not block the light.

[0023] Those skilled in the art should understand that the discussion of any of the above embodiments is merely illustrative and is not intended to imply that the scope of the present invention (including the claims) is limited to these examples. Under the concept of the present invention, the technical features in the above embodiments or different embodiments may be combined, the steps may be implemented in any order, and there are many other variations of the different aspects of the present invention as described above, which are not provided in detail for the sake of simplicity.

[0024] The utility model is intended to cover all such substitutions, modifications and variations that fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the utility model should be included in the scope of protection of the utility model.

Claims

1. A semiconductor film for an on-board biometric identity verification camera, comprising an interface (1) threadedly connected to the on-board camera, a semiconductor film body (4) fixedly connected to the upper end of the inner wall of the interface (1), characterized in that: The semiconductor film body (4) comprises a protective layer (6), an anti-reflection layer (7), an optical filter layer (8), a transparent conductive layer (9) and a thermal isolation layer (10); the lower end of the protective layer (6) is fixedly connected to the anti-reflection layer (7), the lower end of the anti-reflection layer (7) is fixedly connected to the optical filter layer (8), the lower end of the optical filter layer (8) is fixedly connected to the transparent conductive layer (9), the lower end of the transparent conductive layer (9) is fixedly connected to the thermal isolation layer (10), and the upper end of the protective layer (6) is evenly and fixedly connected with a plurality of transparent resin bumps (5).

2. The semiconductor film for a vehicle-mounted biometric identity verification camera according to claim 1, characterized in that: The outer wall of the interface (1) is provided with a connecting thread (2), and the interface (1) is threadably connected to the vehicle-mounted camera via the connecting thread (2).

3. The semiconductor film for a vehicle-mounted biometric identity verification camera according to claim 1, characterized in that: The upper end surface of the interface (1) is fixedly connected with a light shield (3).

4. The semiconductor film for a vehicle-mounted biometric identity verification camera according to claim 1, characterized in that: The inner wall of the interface (1) is located at the lower end of the semiconductor film body (4) and is provided with an anti-reflection layer (11).

5. The semiconductor film for a vehicle-mounted biometric identity verification camera according to claim 1, characterized in that: The upper end face corner of the projection (5) is provided with a rounded corner.

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