Cooling device of test board and test board

Abstract

The utility model relates to a cooling device of a test board and the test board, the test board is provided with a test area and a controller installation area, the cooling device comprises an insulation heat conduction silica gel pad, a heat dissipation metal layer, a first cooling pipeline, a second cooling pipeline and a cooling pump, the insulation heat conduction silica gel pad is arranged on a controller, and the heat dissipation metal layer is arranged on the first cooling pipeline. The heat dissipation metal layer is arranged on the insulating heat conduction silica gel pad, one end of the first cooling pipeline is arranged on the heat dissipation metal layer, the other end of the first cooling pipeline is connected with the cooling pump, the first cooling pipeline is used for providing cooling liquid for the heat dissipation metal layer under the action of the cooling pump, and one end of the second cooling pipeline is arranged on the heat dissipation metal layer. And the other end of the second cooling pipeline is connected with the cooling pump, and the second cooling pipeline is used for recycling the cooling liquid from the heat dissipation metal layer to the cooling pump. According to the invention, on the premise of maintaining a high-temperature test environment of the tested module, efficient thermal isolation and heat dissipation control can be independently carried out on the controller area, and the temperature of the controller is ensured to be always in a safe range.

Description

Technical Field

[0001] This application relates to the field of reliability testing technology, and in particular to a cooling device for a test board and a test board. Background Technology

[0002] In high-temperature reliability testing of embedded modules (such as eMMC / UFS), the development board test fixture needs to be subjected to a high-temperature environment (e.g., 85°C and above) for extended periods to verify device performance. However, the controller (such as the CPU) on the test motherboard is limited to an operating temperature range of 0°C to 70°C as specified in the datasheet. When the entire fixture operates in a high-temperature environment, the CPU not only has to withstand the heat conducted from the ambient temperature but also generates additional temperature rise due to its own operation, causing its internal temperature to rapidly exceed the threshold and fail. Once the CPU stops working, the test signal of the connected module under test (such as eMMC / UFS) will be interrupted, making it impossible to complete the high-temperature test objective.

[0003] Existing test fixtures typically employ passive cooling (such as metal heat sinks) or single-path active cooling (such as fans or simple liquid cooling). However, while maintaining a high-temperature testing environment for the module under test, passive cooling is insufficient for CPU cooling efficiency under high ambient temperatures and high CPU loads, while single-pipe liquid cooling has a limited heat exchange area, making it difficult to quickly transfer the heat accumulated by the CPU. Utility Model Content

[0004] In view of the above, it is necessary to provide a cooling device and test board for the test board, which can perform efficient thermal isolation and heat dissipation control of the controller area separately while maintaining the high temperature test environment of the module under test, so as to ensure that the controller temperature is always within a safe range.

[0005] This application first provides a cooling device for a test board. The test board has a test area and a controller mounting area. The test area is used to place the module under test, and the controller mounting area is used to install the controller. The cooling device includes an insulating thermally conductive silicone pad, a heat dissipation metal layer, a first cooling pipe, a second cooling pipe, and a cooling pump. The insulating thermally conductive silicone pad is disposed on the controller, and the heat dissipation metal layer is disposed on the insulating thermally conductive silicone pad. One end of the first cooling pipe is disposed on the heat dissipation metal layer, and the other end of the first cooling pipe is connected to the cooling pump. The first cooling pipe is used to provide coolant to the heat dissipation metal layer under the action of the cooling pump. One end of the second cooling pipe is disposed on the heat dissipation metal layer, and the other end of the second cooling pipe is connected to the cooling pump. The second cooling pipe is used to recover coolant from the heat dissipation metal layer to the cooling pump.

[0006] In the cooling device of this application, firstly, a low thermal resistance interface material (i.e., an insulating thermally conductive silicone pad) is used to efficiently conduct heat from the controller to the heat dissipation metal layer. Simultaneously, the test board is divided into a test area and a controller mounting area, reducing thermal coupling between the heat dissipation structure and other components of the test board, thereby minimizing interference with the test temperature field of the module under test. Secondly, by placing the insulating thermally conductive silicone pad on the controller for direct heat conduction, and enhancing heat dissipation through the heat dissipation metal layer, the first and second cooling pipes form a circulating coolant flow under the action of a cooling pump, achieving active heat dissipation of the heat dissipation metal layer. This controls the controller temperature to stay within limits, overcoming the problem of the controller failing to function properly due to its own temperature rise in high-temperature test environments (e.g., 85°C). In other words, this application can maintain the high-temperature test environment of the module under test while independently performing efficient thermal isolation and heat dissipation control of the controller area, ensuring that the controller temperature remains within a safe range.

[0007] In some embodiments, an insulating thermally conductive silicone pad is disposed on the controller and the test board in a manner that covers the controller.

[0008] In some embodiments, a heat dissipation metal layer is disposed on the insulating thermally conductive silicone pad and the test plate in such a way as to cover the insulating thermally conductive silicone pad.

[0009] In some embodiments, the heat dissipation metal layer has a cavity, a first cooling pipe is connected to the cavity at one end near the heat dissipation metal layer, and a second cooling pipe is connected to the cavity at one end near the heat dissipation metal layer.

[0010] In some embodiments, the bottom area of ​​the chamber is greater than or equal to the upper surface area of ​​the insulating thermally conductive silicone pad.

[0011] In some embodiments, the chambers are arranged in a curved or meandering manner to form multiple U-shaped bends.

[0012] In some embodiments, both the first cooling pipe and the second cooling pipe are disposed on the upper surface of the heat dissipation metal layer, and the first cooling pipe and the second cooling pipe are interconnected. The portion of the first cooling pipe disposed on the heat dissipation metal layer and the portion of the second cooling pipe disposed on the heat dissipation metal layer are arranged in a curved or meandering manner to form a plurality of U-shaped bends.

[0013] In some embodiments, the lengths of both the first cooling pipe and the second cooling pipe are greater than or equal to 30 cm.

[0014] In some embodiments, the heat dissipation metal layer is made of silver, tungsten, platinum, aluminum, copper, or related alloys, and the coolant includes water-based coolant, dielectric coolant, organic coolant, or phase change coolant.

[0015] This application also provides a test board for the test and development of embedded multimedia cards and general-purpose flash memory, including a test motherboard and a cooling device according to any of the above embodiments of this application. The test motherboard is provided with a test area and a controller mounting area. The test area is used to place the embedded multimedia card or general-purpose flash memory, and the controller mounting area is used to install a controller. The test temperature of the test board is greater than 85°C.

[0016] In the test board of this application, the heat dissipation area is controlled by partitioning. Then, by integrating the cooling device of any of the above embodiments of this application, when the test board is running in an environment above 85°C, the dual effects of the high temperature environment outside the controller and the temperature rise of the controller itself are blocked. The controller temperature is maintained within its operating specifications through the heat dissipation mechanism of coolant circulation, thereby effectively controlling the controller temperature and ensuring its stable operation. At the same time, it supports the extreme high temperature testing requirements of the module under test (such as embedded multimedia cards and general flash memory). Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the test board according to an embodiment of this application.

[0018] Figure 2 This is a schematic diagram of the assembly between the heat dissipation metal layer, the insulating thermally conductive silicone pad, the controller, and the test board in the cooling device of this application embodiment.

[0019] Figure 3 This is a schematic diagram of the heat dissipation metal layer in the cooling device of this application embodiment.

[0020] Figure 4 This is a schematic diagram of the structure of the heat dissipation metal layer in a cooling device according to another embodiment of this application.

[0021] Explanation of main component symbols:

[0022] 1. Test board; 10. Cooling device; 11. Test motherboard; 12. Module under test; 13. Controller; 101. Insulating thermally conductive silicone pad; 102. Heat dissipation metal layer; 103. First cooling pipe; 104. Second cooling pipe; 105. Cooling pump; 1020. Chamber.

[0023] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0024] In the description of the embodiments in this application, the words "exemplary," "or," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the words "exemplary," "or," and "for example" is intended to present the relevant concepts in a specific manner.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. It should be understood that, unless otherwise stated, " / " in this application means "or". For example, A / B can mean A or B. "And / or" in this application is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. "At least one" refers to one or more. "More than one" refers to two or more. For example, at least one of a, b, or c can represent: a, b, c, a and b, a and c, b and c, and a, b, and c (seven cases).

[0026] It should also be noted that the terms "first" and "second" in the specification, claims and drawings of this application are used to distinguish similar objects, rather than to describe a specific order or sequence.

[0027] In high-temperature reliability testing of embedded modules, such as embedded multi-media cards (eMMC) and universal flash storage (UFS), development board test fixtures need to be subjected to high-temperature environments (such as ovens at 85°C and above) for extended periods to verify device performance. However, this testing scenario presents a significant technical contradiction: the CPU on the test motherboard is limited to an operating temperature range of 0-70°C as specified in the datasheet. When the entire fixture operates in a high-temperature environment, the CPU not only bears the heat conducted from the ambient temperature but also generates additional temperature rise due to its own operation, causing its internal temperature to rapidly exceed the threshold and fail. Once the CPU stops working, the test signal of the connected module under test (such as eMMC / UFS) will be interrupted, making it impossible to complete the high-temperature test objective.

[0028] Existing test fixtures typically employ passive cooling (such as metal heatsinks) or single-path active cooling (such as fans or simple liquid cooling). However, passive cooling is inefficient under high ambient temperatures and high CPU loads, while single-pipe liquid cooling has a limited heat exchange area, making it difficult to quickly transfer accumulated heat from the CPU. Furthermore, traditional designs often exhibit high thermal resistance at the interface between the heatsink and the CPU (due to unoptimized interface materials or structures), hindering efficient heat transfer to the cooling module and further exacerbating CPU temperature rise. Some solutions attempt to reduce the overall fixture temperature through external cooling, but such methods may interfere with the actual high-temperature testing conditions of the module under test, failing to meet testing standards.

[0029] Therefore, there is an urgent need for a directional cooling device for development board test fixtures that can efficiently isolate and control the heat dissipation of the CPU area while maintaining the high-temperature test environment (>85℃) of the module under test, ensuring that its temperature is always within a safe range.

[0030] Therefore, this application provides a cooling device and test board for a test board, which can efficiently isolate and control the controller area independently while maintaining the high-temperature testing environment of the module under test, ensuring that the controller temperature is always within a safe range. Some embodiments will be described below with reference to the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0031] Figure 1 This is a schematic diagram of the structure of test board 1 according to an embodiment of this application.

[0032] Please see Figure 1 This application provides a test board 1, also known as a "development board" or "development board test fixture". The test board 1 can be applied to the test development of embedded multimedia cards and general flash memory. The test board 1 includes a test motherboard 11 and a cooling device 10 according to any of the following embodiments of this application.

[0033] The test motherboard 11 in this embodiment may have a test area and a controller mounting area. The test area is used to place the module under test 12 (such as an embedded multimedia card or a general-purpose flash memory), and the controller mounting area is used to mount the controller 13. The test temperature of the test board 1 is greater than 85°C. It should be noted that the controller mounting area of ​​the test motherboard 11 is the area occupied by the controller 13 when it is installed on the test motherboard 11. Normally, the controller mounting area is fixed, while the test area can be any area other than the controller mounting area used to mount the module under test 12. Test temperature refers to the temperature of the test environment, such as the ambient temperature inside an oven.

[0034] In the test board 1 of this application, the heat dissipation area is controlled by partitioning. Then, by integrating the cooling device 10 of any of the following embodiments of this application, when the test board 1 is running in an environment above 85°C, the dual effects of the external high temperature environment and the temperature rise of the controller 13 are blocked. The temperature of the controller 13 is maintained within its operating specifications through the heat dissipation mechanism of coolant circulation. This effectively controls the temperature of the controller 13, ensures its stable operation, and supports the extreme high temperature testing requirements of the module under test 12 (such as embedded multimedia cards and general flash memory).

[0035] Please continue reading. Figure 1 The embodiments of this application also provide a cooling device 10 for a test board 1. As described above, the cooling device 10 can be used to dissipate heat from the controller 13 in the test board 1. The test board 1's main test board 11 can be provided with a test area and a controller mounting area. The test area can be used to place the module under test 12, and the controller mounting area can be used to mount the controller 13.

[0036] The cooling device 10 of this application embodiment may include an insulating thermally conductive silicone pad 101, a heat dissipation metal layer 102, a first cooling pipe 103, a second cooling pipe 104, and a cooling pump 105. The insulating thermally conductive silicone pad 101 is disposed on the controller 13, the heat dissipation metal layer 102 is disposed on the insulating thermally conductive silicone pad 101, one end of the first cooling pipe 103 is disposed on the heat dissipation metal layer 102, and the other end of the first cooling pipe 103 is connected to the cooling pump 105. The first cooling pipe 103 is used to provide coolant to the heat dissipation metal layer 102 under the action of the cooling pump 105. One end of the second cooling pipe 104 is disposed on the heat dissipation metal layer 102, and the other end of the second cooling pipe 104 is connected to the cooling pump 105. The second cooling pipe 104 is used to recover coolant from the heat dissipation metal layer 102 to the cooling pump 105.

[0037] In the cooling device 10 of this application, heat from the controller 13 is efficiently transferred to the heat dissipation metal layer 102 through a low thermal resistance interface material (i.e., an insulating thermally conductive silicone pad 101). Simultaneously, the test board 1 is divided into a test area and a controller mounting area, reducing thermal coupling between the heat dissipation structure and other components of the test board 1, thereby reducing interference with the test temperature field of the module under test 12. Secondly, by placing the insulating thermally conductive silicone pad 101 on the controller 13 for direct heat conduction, and enhancing heat dissipation capability through the heat dissipation metal layer 102, and with the first cooling pipe 103 and the second cooling pipe 104 forming a circulating coolant flow under the action of the cooling pump 105, active heat dissipation of the heat dissipation metal layer 102 is achieved. This controls the temperature of the controller 13 to remain within limits, overcoming the problem that the controller 13 cannot function properly in high-temperature test environments (such as 85°C) due to its own temperature rise.

[0038] In some embodiments, the controller 13 may be one of the control components used for development and testing, such as MCU, ECU, or CPU, and the module under test 12 may be an embedded multi-media card (eMMC) or a universal flash storage (UFS), etc.

[0039] In some embodiments, the lengths of both the first cooling pipe 103 and the second cooling pipe 104 are greater than or equal to 30 cm. For example, the lengths of the first cooling pipe 103 and the second cooling pipe 104 can be 30 cm, 40 cm, 80 cm, 120 cm, 150 cm, or longer. In this case, the design of cooling pipes with a length greater than or equal to 30 cm can extend the one-way heat exchange time of the coolant in circulation. At the same time, the longer pipes allow the coolant to absorb more heat on the heat dissipation metal layer 102 before returning to the cooling pump 105, thereby maintaining a more stable temperature control capability in high-temperature testing environments.

[0040] In some embodiments, the width of both the first cooling pipe 103 and the second cooling pipe 104 can be greater than or equal to 4.8 mm.

[0041] In some embodiments, the heat dissipation metal layer 102 may be made of silver, tungsten, platinum, aluminum, copper, or related alloys. In this case, using a material with high thermal conductivity, such as silver or copper, can increase the rate of heat transfer from the silicone pad to the coolant.

[0042] In some embodiments, the coolant may include one of water-based coolant, dielectric coolant, organic coolant, or phase change coolant. In this case, by selecting different coolants (such as water-based or dielectric fluids), the conductivity, boiling point, and specific heat capacity requirements of different testing environments can be adapted. For example, coolants with high specific heat capacity can absorb more heat, while dielectric coolants are suitable for scenarios requiring electrical isolation.

[0043] Figure 2 This is a schematic diagram of the assembly between the heat dissipation metal layer 102, the insulating thermally conductive silicone pad 101, the controller 13, and the test board 1 in the cooling device 10 of this application embodiment.

[0044] In some embodiments, such as Figure 2As shown, the area of ​​the insulating thermally conductive silicone pad 101 near the controller 13 can be larger than the area of ​​the controller 13. The insulating thermally conductive silicone pad 101 can be disposed on the controller 13 and the test board 1 in a manner that covers the controller 13. In this case, the insulating thermally conductive silicone pad 101 covers the surface of the controller 13 and the test board 1 in a covering manner, which can increase the contact area between the insulating thermally conductive silicone pad 101 and the controller 13 and the test board 1. Through direct covering, heat can be conducted from the controller 13 chip in multiple directions (including the sides) to the silicone pad, reducing the impedance in the heat transfer path, further improving the heat dissipation efficiency, and reducing the overheating of the controller 13 caused by local hot spots.

[0045] In some embodiments, the portion of the insulating thermally conductive silicone pad 101 that adheres to the test plate 1 can be fixed to the test plate 1 by at least one of screws, snap-fit, or adhesive. In this case, the structural stability between the insulating thermally conductive silicone pad 101, the controller 13, and the test plate 1 can be improved, and the controller 13 can be easily replaced through disassembly.

[0046] In some embodiments, such as Figure 2 As shown, the area of ​​the heat dissipation metal layer 102 near the insulating thermally conductive silicone pad 101 can be larger than the area of ​​the insulating thermally conductive silicone pad 101 near the heat dissipation metal layer 102. The heat dissipation metal layer 102 can be disposed on the insulating thermally conductive silicone pad 101 and the test plate 1 in a manner that covers the insulating thermally conductive silicone pad 101. In this case, the heat dissipation metal layer 102 covers the surface of the insulating thermally conductive silicone pad 101 and the test plate 1 in a covering manner, forming all-round contact with the thermally conductive silicone. This covering structure can expand the heat exchange area between the heat dissipation metal layer 102 and the thermally conductive silicone, and accelerate the transfer of heat to the coolant through the high thermal conductivity of the metal. At the same time, it can enhance the structural stability of the heat dissipation components (i.e., the insulating thermally conductive silicone pad 101 and the heat dissipation metal layer 102) and reduce poor contact caused by thermal expansion differences.

[0047] In some embodiments, the portion of the heat-dissipating metal layer 102 that is attached to the test plate 1 can be fixed to the test plate 1 by at least one of screws, snap-fitting, or adhesive. In this case, the structural stability between the heat-dissipating metal layer 102, the insulating thermally conductive silicone pad 101, the controller 13, and the test plate 1 can be improved, and the controller 13 or the insulating thermally conductive silicone pad 101 can be easily replaced through disassembly.

[0048] Figure 3 This is a schematic diagram of the structure of the heat dissipation metal layer 102 in the cooling device 10 of this application embodiment.

[0049] In some embodiments, such as Figure 3As shown, the heat dissipation metal layer 102 may have a cavity 1020. One end of the first cooling pipe 103 near the heat dissipation metal layer 102 is connected to the cavity 1020, and the other end of the second cooling pipe 104 near the heat dissipation metal layer 102 is also connected to the cavity 1020. In this configuration, the heat dissipation metal layer 102 has an internal cavity 1020, which is connected to the first cooling pipe 103 and the second cooling pipe 104. When the coolant passes through the cavity 1020, it undergoes sufficient heat exchange within the metal layer. The cavity 1020 increases the contact time and contact area between the coolant and the heat dissipation metal, improving the heat absorption efficiency per unit time, thereby more efficiently reducing the temperature of the controller 13.

[0050] In some embodiments, the bottom area of ​​the chamber 1020 is greater than or equal to the upper surface area of ​​the insulating thermally conductive silicone pad 101. By matching the areas of the two, it can be ensured that all the heat transferred by the thermally conductive silicone pad can be absorbed by the coolant in the chamber 1020, reducing heat dissipation blind spots caused by insufficient local coverage of the chamber 1020, and ensuring a uniform temperature reduction of the controller 13.

[0051] In some embodiments, such as Figure 3 As shown, the chamber 1020 can be arranged in a curved or meandering shape to form multiple U-shaped bends. The curved shape can extend the flow path of the coolant within the chamber 1020, increase the heat exchange time with the heat dissipation metal layer 102, and enhance the heat transfer efficiency through turbulence, further improving the rate of heat transfer from the heat dissipation metal layer 102 to the coolant.

[0052] Figure 4 This is a schematic diagram of the structure of the heat dissipation metal layer 102 in the cooling device 10 according to another embodiment of this application.

[0053] In some embodiments, such as Figure 4 As shown, both the first cooling pipe 103 and the second cooling pipe 104 can be disposed on the upper surface of the heat dissipation metal layer 102. The first cooling pipe 103 and the second cooling pipe 104 are interconnected. The portion of the first cooling pipe 103 disposed on the heat dissipation metal layer 102 and the portion of the second cooling pipe 104 disposed on the heat dissipation metal layer 102 are arranged in a curved or meandering manner to form multiple U-shaped bends. In this case, the first cooling pipe 103 and the second cooling pipe 104 are arranged in a meandering manner on the upper surface of the heat dissipation metal layer 102 to form U-shaped bends. By increasing the flow distance and coverage area of ​​the coolant on the heat dissipation metal surface, the curved pipes can improve the local heat exchange efficiency, and the heat distribution between adjacent pipe sections is more uniform, which can reduce the excessively high local temperature gradient of the heat dissipation metal layer 102.

[0054] like Figure 3 and Figure 4 As shown, Figure 3 The heat dissipation metal layer 102 in the embodiment and Figure 4 The structural difference of the heat dissipation metal layer 102 in the embodiment is that, Figure 3 The heat dissipation metal layer 102 in this embodiment has an internal cavity 1020. Figure 4 In this embodiment, the heat dissipation metal layer 102 is a thin sheet, wherein Figure 3 The advantage of this embodiment is that it has higher heat dissipation efficiency for controller 13. Figure 4 The advantage of this embodiment is that it has lower manufacturing costs and is better able to insulate against external heat.

[0055] In summary, this application can maintain the high-temperature test environment of the module under test 12 while performing efficient thermal isolation and heat dissipation control on the controller 13 area separately, ensuring that the temperature of the controller 13 is always within a safe range.

[0056] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A cooling device for a test board, the test board having a test area and a controller mounting area, the test area for placing a module under test, and the controller mounting area for mounting a controller, characterized in that, The cooling device includes an insulating thermally conductive silicone pad, a heat-dissipating metal layer, a first cooling pipe, a second cooling pipe, and a cooling pump. The insulating thermally conductive silicone pad is disposed on the controller, and the heat-dissipating metal layer is disposed on the insulating thermally conductive silicone pad. One end of the first cooling pipe is disposed on the heat-dissipating metal layer, and the other end of the first cooling pipe is connected to the cooling pump. The first cooling pipe is used to provide coolant to the heat-dissipating metal layer under the action of the cooling pump. One end of the second cooling pipe is disposed on the heat-dissipating metal layer, and the other end of the second cooling pipe is connected to the cooling pump. The second cooling pipe is used to recover the coolant from the heat-dissipating metal layer to the cooling pump.

2. The cooling device for the test plate according to claim 1, characterized in that, The insulating thermally conductive silicone pad is disposed on the controller and the test board in a manner that covers the controller.

3. The cooling device for the test plate according to claim 1, characterized in that, The heat dissipation metal layer is disposed on the insulating thermally conductive silicone pad and the test plate in a manner that covers the insulating thermally conductive silicone pad.

4. The cooling device for the test plate according to claim 1, characterized in that, The heat dissipation metal layer has a cavity, and the first cooling pipe is connected to the cavity at one end near the heat dissipation metal layer, and the second cooling pipe is connected to the cavity at one end near the heat dissipation metal layer.

5. The cooling device for the test plate according to claim 4, characterized in that, The bottom area of ​​the chamber is greater than or equal to the upper surface area of ​​the insulating thermally conductive silicone pad.

6. The cooling device for the test plate according to claim 4, characterized in that, The chambers are arranged in a curved or meandering manner to form multiple U-shaped bends.

7. The cooling device for the test plate according to claim 1, characterized in that, Both the first cooling pipe and the second cooling pipe are disposed on the upper surface of the heat dissipation metal layer. The first cooling pipe and the second cooling pipe are interconnected. The portion of the first cooling pipe disposed on the heat dissipation metal layer and the portion of the second cooling pipe disposed on the heat dissipation metal layer are arranged in a curved or meandering manner to form multiple U-shaped bends.

8. The cooling device for the test plate according to claim 1, characterized in that, The lengths of both the first and second cooling pipes are greater than or equal to 30 cm.

9. The cooling device for the test board according to claim 1, characterized in that, The heat dissipation metal layer is made of silver, tungsten, platinum, aluminum, copper or related alloys, and the coolant includes water-based coolant, dielectric coolant, organic coolant or phase change coolant.

10. A test board for testing and developing embedded multimedia cards and general-purpose flash memory, characterized in that, The test board includes a test motherboard and a cooling device as described in any one of claims 1 to 9. The test motherboard is provided with a test area and a controller mounting area. The test area is used to place an embedded multimedia card or a general-purpose flash memory. The controller mounting area is used to install a controller. The test temperature of the test board is greater than 85°C.

Images