Proximity sensor and electronic device

Abstract

The utility model provides a proximity sensor and electronic equipment, belongs to the technical field of sensors, and can solve the problems of complicated debugging process, low error-tolerant rate, low assembly efficiency and poor consistency of an existing proximity sensor. The proximity sensor comprises a coil, a magnetic core, a printed circuit board and a shell. Wherein the magnetic core comprises the coil outer wall, the printed circuit board comprises a main board, a first bonding pad and a second bonding pad which are arranged at the first end of the main board, and a debugging assembly arranged at the second end of the main board; a first lead end of the coil is connected with the first bonding pad, and a second lead end of the coil is connected with the second bonding pad; the housing is sleeved outside the printed circuit board, and the debugging assembly is exposed outside the housing. The proximity sensor disclosed by the utility model has the advantages of simple assembly, simple debugging operation, high error-tolerant rate and high product consistency.

Description

Technical Field

[0001] The present disclosure belongs to the technical field of sensors, and in particular relates to a proximity sensor and an electronic device. Background Art

[0002] As a type of position sensor, inductive proximity sensors can realize non-contact position detection of metal target objects. They have the advantages of good reliability, strong anti-interference ability, high repeated positioning accuracy, long life, and can avoid wear of metal targets. They are widely used in machinery manufacturing, electronics, automobiles, aerospace, food plastics and other industries.

[0003] Inductive proximity sensors, also known as proximity switches, are mainly composed of a high-frequency oscillation circuit and a detection circuit, and their sensitive element is a detection coil. In short, their detection principle is to use the eddy current loss principle to control the start and stop states of the oscillation circuit, and output discrete level signals to the outside, thereby realizing the detection of the location of the metal target object.

[0004] During the production process of the inductive proximity sensor, multiple debugging is required to determine the optimal parameters of the circuit to ensure that the inductive proximity sensor has the maximum detection distance to ensure the measurement performance of the proximity sensor; during the assembly process of the inductive proximity sensor, it is necessary to ensure the accuracy of the relative position of each component and the stability of the connection relationship to ensure the measurement stability of the proximity sensor. Utility Model Content

[0005] The utility model aims to solve at least one of the technical problems existing in the prior art. On the one hand, a proximity sensor is provided, which includes a coil, a magnetic core, a printed circuit board, and a shell; wherein the magnetic core includes the outer wall of the coil, the printed circuit board includes a mainboard, a first soldering pad and a second soldering pad arranged at a first end of the mainboard, and a debugging component arranged at the second end of the mainboard; the first lead end of the coil is connected to the first soldering pad, and the second lead end of the coil is connected to the second soldering pad; the shell sleeve is arranged outside the printed circuit board, and the debugging component is exposed outside the shell.

[0006] In some embodiments, the first end of the mainboard has a first connecting portion; the proximity sensor also includes a connecting component, the connecting component includes a first main body portion and a second connecting portion; wherein the first main body portion includes a first surface and a second surface arranged opposite to each other; the first surface is opposite to the magnetic core, the second connecting portion is connected to the second surface, and the second connecting portion has a first limiting groove; the first connecting portion is fixed in the first limiting groove.

[0007] In some embodiments, the first end of the mainboard has a first connecting portion; the proximity sensor also includes a connecting component, the connecting component includes a first main body; the first main body includes a first surface and a second surface arranged opposite to each other; the first surface is opposite to the magnetic core; a first limiting groove is provided on the second surface side of the first main body; and the first connecting portion is fixed in the first limiting groove.

[0008] In some examples, the magnetic core has a second limiting groove; the connecting component also includes a third connecting portion connected to the first surface; and the third connecting portion is fixed in the second limiting groove.

[0009] In some examples, the third connecting portion includes a third main body portion and a third end portion connected to the third main body portion; the third end portion includes a third surface and a fourth surface arranged opposite to each other, and a third connecting side surface connecting the third surface and the fourth surface; the fourth surface is connected to the third main body portion, and the area of ​​the third surface is smaller than the area of ​​the fourth surface.

[0010] In some examples, the connection component further includes a first probe and a second probe connected to the second surface; and the first lead end and the second lead end of the coil are connected to the first probe and the second probe, respectively.

[0011] In some examples, when the first connection portion is fixed in the first limiting groove, the first probe and the first pad are opposite and there is a gap between them; the second probe and the second pad are opposite and there is a gap between them.

[0012] In some examples, the magnetic core has a first accommodating portion and a second accommodating portion; the first main body portion also has a first connecting side surface connecting the first surface and the second surface; the first connecting side surface has a third accommodating portion and a fourth accommodating portion; the first lead end of the coil extends to the first soldering pad via the first accommodating portion and the third accommodating portion and is connected thereto; the second lead end of the coil extends to the second soldering pad via the second accommodating portion and the fourth accommodating portion and is connected thereto.

[0013] In some examples, the orthographic projection of the first surface on the magnetic core is located inside the magnetic core; the depth of the third accommodating portion is not less than the depth of the first accommodating portion, and the depth of the fourth accommodating portion is not less than the depth of the second accommodating portion.

[0014] In some examples, the third accommodating portion has a third bottom opposite to its opening, and a first connecting surface and a second connecting surface connected to the first connecting side surface; the fourth accommodating portion has a fourth bottom opposite to its opening, and a third connecting surface and a fourth connecting side surface connected to the first connecting side surface; at least one of the third bottom, fourth bottom, first connecting surface, second connecting surface, third connecting surface and fourth connecting surface is a curved surface.

[0015] In some examples, the first surface and the magnetic core are connected via colloid.

[0016] In some examples, the proximity sensor further includes a cable, a first cover body, and a second cover body; wherein the first end of the cable is connected to the main board; the magnetic core is located in the first cover body, and the second end of the main board is located in the second cover body; the second cover body has a through hole, and the second end of the cable extends through the through hole to the outside of the proximity sensor.

[0017] In some examples, the main board includes a first circuit board and a second circuit board; the second end of the first circuit board is connected to the first end of the second circuit board and is located in the shell; the second end of the second circuit board is exposed outside the shell, and the debugging component is arranged at the second end of the second circuit board.

[0018] In some examples, the proximity sensor also includes a first cover body, a second cover body, and a socket located at the second end of the second circuit board; the second cover body has a pin; the magnetic core is located in the first cover body, the second end of the second circuit board is located in the second cover body, and the socket is connected to the pin.

[0019] In some examples, the first cover and the housing are filled with colloid.

[0020] In some examples, the debugging component includes a potentiometer or a sliding resistor.

[0021] In a second aspect, the utility model provides an electronic device, comprising the proximity sensor described in any example of the first aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1A It is a structural explosion diagram of an existing wire lead-out type proximity sensor;

[0023] Figure 1B for Figure 1A a perspective cutaway view of the proximity sensor shown;

[0024] Figure 1C It is a structural explosion diagram of an existing connector type proximity sensor;

[0025] Figure 1D for Figure 1C a perspective cutaway view of the proximity sensor shown;

[0026] Figure 2A An exploded diagram of the structure of a proximity sensor provided by an embodiment of the present disclosure;

[0027] Figure 2B for Figure 2A The schematic diagram of the assembly of the proximity sensor shown;

[0028] Figure 3 A schematic diagram of the structure and position of a connection assembly provided in an embodiment of the present disclosure;

[0029] Figure 4A is an example of a connected component;

[0030] Figure 4B for Figure 4A a top view of the illustrated connection assembly;

[0031] Figure 4C for Figure 4A a bottom view of the illustrated connection assembly;

[0032] Figure 5 is an example of a first connecting portion;

[0033] Fig. 6A is another example of a connected component;

[0034] Figure 6B for Fig. 6A a top view of the illustrated connection assembly;

[0035] Figure 6C for Fig. 6A a bottom view of the illustrated connection assembly;

[0036] Figure 7 is another example of the first connecting portion;

[0037] Fig. 8A and Figure 8B is a schematic diagram of the position and structure of the third connecting part;

[0038] Fig.9A and Fig. 9B is a schematic diagram of the positions and structures of the first probe and the second probe;

[0039] Fig. 10A The location of the wire lead type proximity sensor debugging component and the structural diagram of the main board;

[0040] Fig. 10B for Fig. 10A Schematic diagram of the installation position of the mainboard and the housing;

[0041] Fig. 10C for Fig. 10B an enlarged view of the second cover shown;

[0042] Fig.11A The location of the connector type proximity sensor debugging component and the structural diagram of the main board;

[0043] Fig. 11B for Fig.11A An assembly diagram of the proximity sensor shown;

[0044] Fig. 11C is a structural schematic diagram of a first circuit board;

[0045] Fig.11D It is a schematic diagram of the structure of the second circuit board.

[0046] The accompanying drawings are denoted as follows:

[0047] 1. Coil; 2. Magnetic core; 3. Main board; 4-1. First solder pad; 4-2. Second solder pad; 6. Shell; 7. First cover; 8. Second cover; 3-1. First connecting part; 9. Cable; 11-debugging assembly; 10. Pin; 12. Connecting assembly; 12-1. First main body; 12-2. Second connecting part; 12-3. First limiting groove; 12-4. Third accommodating part; 12-5. Fourth accommodating part; S1. First surface; S2. Second surface; 2-1. First accommodating part; 14-1. First probe; 14-2. Second probe; 14. First connecting surface; 15. Second connecting surface; 16. Third connecting surface; 17. Fourth connecting surface; 13. Third connecting part; 13-1. Third end; 13-2. Third main body; 3-2. First circuit board; 3-3. Second circuit board; 20-socket. DETAILED DESCRIPTION

[0048] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0049] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0050] As used herein, "parallel" and "perpendicular" include the described situation and the situation similar to the described situation, and the range of the similar situation is within the acceptable deviation range, wherein the acceptable deviation range is determined by a person of ordinary skill in the art taking into account the measurement in question and the error associated with the measurement of a specific quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, wherein the acceptable deviation range of approximate parallelism can be, for example, a deviation within 5°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, wherein the acceptable deviation range of approximate perpendicularity can also be, for example, a deviation within 5°.

[0051] It will be understood that when a layer or an element is referred to as being on another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may be present between the layer or element and the other layer or substrate.

[0052] Exemplary embodiments are described herein with reference to cross-sectional views and / or plan views that are idealized exemplary drawings. In the drawings, the thickness of layers and regions are exaggerated for clarity. Therefore, variations in shape relative to the drawings due to, for example, manufacturing techniques and / or tolerances are conceivable. Therefore, the exemplary embodiments should not be interpreted as being limited to the shapes of the regions shown herein, but include deviations in shape due to, for example, manufacturing. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to illustrate the actual shapes of regions of the device, and are not intended to limit the scope of the exemplary embodiments.

[0053] Proximity sensors include capacitive proximity sensors and inductive proximity sensors. Among them, the inductive proximity sensor is a sensor based on the eddy current effect, which can measure the distance between a metal target object and the inductive proximity sensor without contact, and has the advantages of high linearity and high resolution. The embodiments of the present disclosure mainly relate to inductive proximity sensors, hereinafter referred to as proximity sensors.

[0054] The proximity sensor mainly includes a high-frequency oscillation circuit and a detection circuit. Among them, the high-frequency oscillation circuit can generate an alternating magnetic field, and its core component is the coil 1. Specifically, when an alternating voltage U1 is applied to both ends of the coil 1, an alternating current I1 flows through the coil 1, generating an alternating magnetic field H1; when the metal target object to be measured approaches the proximity sensor, according to the principle of electromagnetic induction, an eddy current I2 is generated in the metal target object, and at the same time, a magnetic field H2 in the opposite direction to the alternating magnetic field H1 is generated, so that part of the alternating magnetic field H1 is offset; at this time, in order for the coil 1 to maintain the alternating magnetic field H1, the alternating current I1 flowing through it must be increased, that is, the inductance L, impedance Z or quality factor Q of the coil 1 must be changed. Therefore, in simple terms, the principle of the proximity sensor is: the change in the distance between the metal target object and the coil 1 causes the change in the coil inductance L, impedance Z or quality factor Q, or in other words, the change in the coil 1 inductance L, impedance Z or quality factor Q can reflect the change in the distance between the metal target object and the proximity sensor, so in principle, by measuring the change in the coil 1 inductance L, impedance Z or quality factor Q, the distance between the metal target object and the proximity sensor can be known. Specifically, when the proximity sensor is used to implement the measurement, the metal target object is brought close to the proximity sensor. Once the distance between the two reaches the sensing distance of the proximity sensor, an eddy current will be generated in the proximity sensor, causing the oscillation of the high-frequency oscillation circuit to attenuate and even stop oscillation; the change generated by the high-frequency oscillation circuit, that is, the oscillation attenuation and oscillation stop, is detected by the detection circuit and the change is modulated, for example, the inductance change is converted into a voltage or current signal, which is amplified and then converted into a switch signal (for example, a low level "0" or a high level "1"); finally, the switch signal is output to the drive control device, and the drive control device performs an "on" or "off" operation according to the switch signal to achieve the purpose of non-contact detection and control. In general, the inductive proximity sensor uses the eddy current loss principle to control the start and stop states of the high-frequency oscillation circuit and output a discrete level signal to the outside.

[0055] According to the principle of inductive proximity sensor, the changes of parameters such as impedance Z, inductance L and quality factor Q of coil 1 can reflect the change of measuring distance, so coil 1 is the core component of inductive proximity sensor. Therefore, the parameters of coil 1 are the key factors affecting the maximum detection distance of proximity sensor. The parameters of coil 1 usually include but are not limited to the number of coil turns, coil cross-sectional area, coil diameter, coil winding diameter and coil resistance, among which the number of coil turns is the most important factor affecting inductance L. The more turns, the greater the output inductance, the greater the difference between the inductance of the proximity and the principle, and the detection distance of the proximity sensor will increase accordingly. In addition, the relative position relationship, installation direction and accuracy between the various accessories of the proximity sensor will affect the detection performance of the proximity sensor. Moreover, the accuracy of the coordination between the various accessories of the proximity sensor will also affect the stability and consistency of the proximity sensor during production and use. Usually, in order to determine the optimal parameters of the coil when the proximity sensor reaches the maximum detection distance, the operator is often required to debug the design parameters of the proximity sensor repeatedly, which is a very cumbersome process.

[0056] More specifically, the proximity sensor includes a wire lead type proximity sensor and a connector type proximity sensor. Figure 1A It is a structural schematic diagram of a wire lead-out type proximity sensor in the related art. Figure 1B for Figure 1A The perspective cutaway view of the wire lead type proximity sensor is shown in FIG. Figure 1A and Figure 1B As shown, the wire lead-out type proximity sensor includes a coil 1, a magnetic core 2, a printed circuit board, a housing 6, a first cover 7, a second cover 8, and a cable 9. The coil 1 is combined with the magnetic core 2, and the magnetic core 2 includes the outer wall of the coil 1. The printed circuit board includes a main board 3, a first pad 4-1 and a second pad 4-2 arranged at the first end of the main board 3, and a debugging component 11 arranged on the main board 3. The second cover 8 has a through hole (not shown) for the cable 9 to pass through, the first end of the cable 9 is connected to the main board 3, and the second end is led out to the outside of the proximity sensor through the through hole opened on the second cover 8.

[0057] Figure 1C is a schematic diagram of the structure of a connector type proximity sensor in the related art, Figure 1D for Figure 1C A perspective cutaway view of a connector type proximity sensor is shown. Figure 1C and Figure 1DAs shown, the connector type proximity sensor includes a coil 1, a magnetic core 2, a printed circuit board, a housing 6, a first cover 7, a second cover 8, and a pin 10. The coil 1 is combined with the magnetic core 2, and the magnetic core 2 includes the outer wall of the coil 1. The printed circuit board includes a main board 3, a first pad 4-1 and a second pad 4-2 arranged at the first end of the main board 3, and a debugging component 11 arranged on the main board 3. In addition, the main board 3 is also provided with a socket for connecting the first end of the pin 10, and the second end of the pin 10 is connected to the second cover 8.

[0058] In the related art, whether it is a wire lead-out type proximity sensor or a connector type proximity sensor, the length of its housing 6 is always greater than the length of the mainboard 3 and is sleeved on the outside of the mainboard 3, so the debugging component 11 set on the mainboard 3 is always inside the housing 3. The principle of debugging the parameters of the coil 1 or other components to obtain the optimal parameters for the proximity sensor to achieve the maximum detection distance is roughly as follows: first, by adjusting various parameters of the coil 1, such as the number of turns of the coil 3, whether the wire used when winding the coil is single-strand or double-strand, the diameter of the coil 3, etc., a plurality of coils 3 with different inductances L and impedances Z are obtained; the plurality of coils 3 with different inductances L and impedances Z are respectively connected in parallel with a plurality of capacitors with different capacitances F to form a plurality of high-frequency oscillation circuits with different characteristics; finally, the maximum distance that the proximity sensor can detect under each high-frequency oscillation circuit is tested; the maximum distance value with the highest value corresponds to the optimal parameters of the high-frequency oscillation circuit. For the proximity sensor in the prior art, the above debugging process is roughly as follows: the mainboard 3 is placed in the shell 6, and after assembly, the debugging component 11 is adjusted multiple times, a high-frequency oscillation circuit with different characteristics is selected, and the selected high-frequency oscillation circuit is tested to obtain the maximum distance that the proximity sensor can detect under the high-frequency oscillation circuit.

[0059] Since the debugging component 11 is always inside the housing 6 in the prior art, the above existing debugging process often has the following problems: 1. Each time the debugging component 11 is adjusted, the housing 6 mounted on the outside of the mainboard 3 needs to be disassembled in advance. After the adjustment is completed, the housing 6 needs to be assembled with the mainboard 3 again. On the one hand, the operation is cumbersome and inconvenient. On the other hand, it is difficult to ensure that the housing 6 remains consistent during multiple assemblies, thereby affecting the debugging accuracy; 2. After the debugging is completed, the housing 6 equipped with the mainboard 3 needs to be filled with colloid to fix the mainboard 3. However, after the colloid is cured, if the inductance L or impedance Z of the coil 1 changes, the debugging component 11 that has been cured in the housing 6 cannot be adjusted at this time. In short, since the debugging component 11 of the proximity sensor in the prior art is inside the housing 6, on the one hand, the debugging process is cumbersome and inconvenient, and multiple disassembly of the housing 6 is likely to affect the accuracy of the debugging result; on the other hand, it is impossible to adjust the debugging component again after the colloid is cured, and it is not fault-tolerant.

[0060] In addition, in the related art, whether it is a wire lead-out type proximity sensor or a connector type proximity sensor, there are still the following problems: 3. When assembling the magnetic core 2 and the main board 3 equipped with the coil 1, it is necessary to keep the main board 3 parallel to the central axis of the shell 6, and at the same time, the main board 3 is parallel to the central axis of the magnetic core 2, so as to avoid the main board 3 and the shell 6 from contacting during the assembly process, causing electrical short circuits and other defects. In the prior art, manual calibration or relatively complex jig calibration is mostly used to ensure the relative position relationship between the magnetic core 2 and the main board 3. This method is inefficient and has poor consistency; 4. The first lead end and the second lead end (not shown) of the coil 1 are connected. 5. The contact surface between the mainboard 3 and the magnetic core 2 is small. After the two are connected by colloid, it is easy to disconnect again due to the small contact surface. Even if the colloid is filled in the magnetic core 2 to reinforce the connection between the magnetic core 2 and the mainboard 3, it is difficult to ensure that the relative position of the mainboard 3 and the magnetic core 2 does not change while waiting for the colloid to solidify because the colloid usually takes more than 20 hours to solidify. In general, the existing assembly process of proximity sensors has the problems of difficult operation, low efficiency and poor product consistency.

[0061] In order to solve at least one of the above technical problems, on the one hand, an embodiment of the present disclosure provides a proximity sensor. Figure 2A An exploded diagram of the structure of a proximity sensor provided by an embodiment of the present disclosure; Figure 2B This is a schematic diagram of the assembled proximity sensor provided by the embodiment of the present disclosure. Figure 2A As shown, it includes a coil 1 (not shown), a magnetic core 2, a printed circuit board, and a housing 6. The magnetic core 2 includes the outer wall of the coil 1; the printed circuit board includes a main board 3, a first pad 4-1 and a second pad 4-2 (not shown) arranged at the first end of the main board 3, and a debugging component 11 arranged at the second end of the main board 3; the first lead end (not shown) of the coil 1 is connected to the first pad 4-1, and the second lead end (not shown) of the coil 1 is connected to the second pad 4-2. The housing 6 is sleeved on the outside of the printed circuit board, and the debugging component 11 is exposed outside the housing 6. For example, the debugging component 11 includes a potentiometer or a sliding rheostat.

[0062] In the embodiment of the present disclosure, the debugging component 11 is disposed at the second end of the mainboard 3 and the second end thereof is exposed outside the shell 6, so that the debugging component 11 is exposed outside the shell 6. In multiple debugging processes, it is not necessary to disassemble the shell 6 before each adjustment of the debugging component 11, thereby improving the debugging efficiency, especially reducing the debugging work of the operator in the subsequent mass production process, saving time and labor costs; on the other hand, it is avoided that the shell 6 is disassembled and installed multiple times, resulting in poor product consistency; on the other hand, if Figure 2B As shown, after the proximity sensor is assembled, the debugging component 11 is located outside the shell 6 and will not be solidified by the colloid filled in the shell 6. Therefore, after debugging and assembly, even if the colloid changes the inductance L and impedance Z of the coil 1 and affects the previous debugging results, since the debugging component 11 is located outside the shell 6, it can be debugged again, thereby improving the fault tolerance of the product.

[0063] In some embodiments, Figure 3 As shown, the proximity sensor not only includes the above structure, but also includes a connecting component 12, Figure 3 It is a schematic diagram of the installation position of the connecting component 12.

[0064] The present disclosure provides several structural examples of the connection assembly 12 .

[0065] Figure 4A-4C This is a first structural example of the connection component 12. Figure 4A As shown, the connection assembly 12 includes a first main body portion 12 - 1 and a second connection portion 12 - 2 . Figure 4B for Figure 4A The top view of the connecting assembly 12 is shown, wherein the first main body portion 12 - 1 includes a first surface S1 and a second surface S2 that are arranged opposite to each other, and the first surface S1 is opposite to the magnetic core 2 ; Figure 4C for Figure 4A The bottom view of the connecting assembly 12 is shown from Figure 4C As can be seen, the second connection portion 12 - 2 is connected to the second surface S2 , and the second connection portion 12 - 2 has a first limiting groove 12 - 3 .

[0066] In some examples, the first end of the main board 3 has a first connection portion 3-1. Figure 5 is a schematic diagram of the first connecting portion 3-1, wherein the first connecting portion 3-1 is fixed to Figure 4A The connecting assembly 12 is shown in the first limiting groove 12 - 3 .

[0067] In the above example, by setting the first limiting groove 12-3 on the second surface S2 of the connecting component 12 and reasonably setting the position, shape and size of the first limiting groove 12-3, the first connecting part 3-1 of the mainboard 3 is fixed in the first limiting groove 12-3, and the first connecting part 3-1 can be snapped into the first limiting groove 12-3 to achieve a fixed connection between the mainboard 3 and the connecting component 12, so as to maintain the relative position relationship between the mainboard 3 and the magnetic core 2 during the subsequent assembly process. This process does not require the use of manual or other complex jigs, so that electrical short circuits caused by the contact between the mainboard 3 and the shell 6 can be avoided, and at the same time, the difficulty of assembly can be reduced, and the assembly efficiency and accuracy can be improved.

[0068] Figure 6A-6C This is a second example of the structure of the connecting component 12. Fig. 6A As shown, the connecting assembly 12 includes a first main body 12. The first main body 12 includes a first surface S1 and a second surface S2 that are oppositely disposed. Figure 6B for Fig. 6A The top view of the connecting assembly 12 is shown from Figure 6B The shape of the first surface S1 can be seen, and the first surface S1 is opposite to the magnetic core 2; Figure 6C for Fig. 6A The bottom view of the connecting assembly 12 is shown from Figure 6C It can be seen that a first limiting groove 12 - 3 is provided on the second surface S2 side of the first main body portion 12 .

[0069] In some examples, the first end of the main board 3 has a first connection portion 3-1. Figure 7 Another schematic diagram of the shape and position of the first connecting portion 3-1 is shown. The first connecting portion 3-1 is fixed to Fig. 6A In the first limiting groove 12-3 of the connecting assembly 12 shown. In this example, the size of the first limiting groove 12-3 is not less than the size of the first connecting portion 3-1 of the mainboard 3. For example, for the first connecting portion 3-1 with a thickness of 0.6mm-0.8mm, a length of 1.6mm-1.8mm, and a width of 1.4mm-1.6mm, the size of the corresponding first limiting groove 12-3 can be set as follows: its depth can be 1.5mm-1.7mm, and the size of the cross section can be 0.8mm×1.8mm~1mm×2.2mm. Specifically, when the length of the first connecting portion 3-1 is 1.8mm, the width is 1.5mm, and the thickness is 0.8mm, the size of the corresponding first limiting groove 12-3 can be set as: the depth is 1.7mm, and the cross-sectional size is 1mm×2mm. It should be noted that the length of the first connecting portion 3-1 corresponds to the depth of the first limiting groove 12-3, and the thickness and height correspond to the cross-sectional size of the first limiting groove 12-3.

[0070] In the above example, by setting the first limiting groove 12-3 on the second surface S2 of the connecting component 12, and by reasonably setting the position, shape and size of the first limiting groove 12-3, the first connecting part 3-1 of the mainboard 3 is fixed in the first limiting groove 12-3, the mainboard 3 can be quickly limited and calibrated to ensure the relative position relationship between the mainboard 3 and the magnetic core 2 in the subsequent assembly process. This process does not require the use of manual or other complex jigs, so that the mainboard 3 can be prevented from contacting the shell 6 to cause electrical short circuits, etc., and at the same time, the difficulty of assembly can be reduced and the assembly efficiency and accuracy can be improved.

[0071] In some examples, the magnetic core 2 has a second limiting groove (not shown). Fig. 8A and Figure 8B As shown, the connection component 12 also includes a third connection portion 13 connected to the first surface S1. The third connection portion 13 is fixed in the second limiting groove of the magnetic core 2. In this example, the size of the third connection portion 13 is smaller than the size of the second limiting groove to prevent the third connection portion 13 from squeezing the magnetic core 2 and causing cracks in the magnetic core 2. For example, for an M8 model proximity sensor, the diameter of the second limiting groove of its magnetic core 2 is approximately 1.2mm-1.4mm, and the diameter of the third connection portion 13 can be set to 0.8mm-1mm accordingly, and the length can be set to 1.3mm-1.5mm, depending on the depth of the second limiting groove in the magnetic core 2. Specifically, when the diameter of the second limiting groove of the magnetic core 2 is 1.2mm, preferably, the diameter of the third connection portion 13 is set to 0.8mm.

[0072] In the above example, by setting a third connecting portion 13 on the first surface S1 of the connecting component 12, the third connecting portion 13 can be inserted into the second limiting groove of the magnetic core 2, so as to fix and limit the magnetic core 2 and the connecting component 12, so as to ensure that the central axes of the magnetic core 2 and the connecting component 12 coincide with each other, so that the relative positions of the mainboard 3 and the magnetic core 2 can be quickly calibrated, so that the mainboard 3 remains parallel to the central axis of the magnetic core 2, thereby improving assembly efficiency and accuracy.

[0073] Further, such as Fig. 8A and 8B As shown, the third connecting portion 13 includes a third main body portion 13-2 and a third end portion 13-1 connected to the third main body portion 13-2. The third end portion 13-1 includes a third surface and a fourth surface arranged opposite to each other, and a third connecting side surface connecting the third surface and the fourth surface. The fourth surface is connected to the third main body portion 13-2, and the area of ​​the third surface is smaller than the area of ​​the fourth surface. For example, the third end portion 13-1 can be a table (such as a frustum or a prism).

[0074] In the above example, by setting the top of the third connection part 13, that is, the third end 13-1, to be chamfered, such a setting is easier to assemble and can also prevent the third connection part 13 from damaging the magnetic core 2 and affecting the performance of the proximity sensor.

[0075] In some examples, the connection assembly 12 further includes a first probe 14 - 1 and a second probe 14 - 2 connected to the second surface S2 . Fig.9A Schematic diagram of the first probe 14 - 1 and the second probe 14 - 2 . The first lead end and the second lead end of the coil 1 are connected to the first probe 14 - 1 and the second probe 14 - 2 respectively. Fig. 9B Schematic diagram of the relative positions of the first probe 14 - 1 and the second probe 14 - 2 and the main board 3, as shown in Fig. 9B As shown, when the first connection portion 3-1 is fixed in the first limiting groove 12-3, the first probe 14-1 and the first pad 4-1 are opposite, and there is a gap between the first probe 14-1 and the first pad 4-1; the second probe 14-2 and the second pad 4-2 are opposite, and there is a gap between the second probe 14-2 and the second pad 4-2. In some examples, the cross-sectional shape of the first probe 14-1 and the second probe 14-2 can be square or circular, for example, the cross-sectional size of the first probe 14-1 and the second probe 14-2 can be 0.4mm×0.4mm~0.5mm×0.5mm, and the length can be 2mm-2.5mm; the spacing between the first probe 14-1 and the second probe 14-2 is determined by the spacing between the first pad 4-1 and the second pad 4-2, for example, it can be 2.8mm-3mm. The interval between the first probe 14-1 and the first pad 4-1 can be 0.3mm-0.5mm, and the interval between the second probe 14-2 and the second pad 4-2 can also be 0.3mm-0.5mm. Preferably, the cross-sectional shape of the first probe 14-1 and the second probe 14-2 is square, and the cross-sectional size is 0.4mm×0.4mm; the spacing between the first probe 14-1 and the second probe 14-2 is 2.8mm; the spacing between the first probe 14-1 and the first pad 4-1, and the spacing between the second probe 14-2 and the second pad 4-2 are both 0.5mm. In this way, it can be avoided that the first pad 4-1 and the second pad 4-2 and the first probe 14-1 and the second probe 14-2 are scratched each other during the insertion of the mainboard 3 into the connection component 12, thereby affecting the electrical connection performance.

[0076] In the above example, the first lead end and the second lead end of the coil 1 are respectively connected to the first probe 14-1 and the second probe 14-2, and then connected to the first pad 4-1 and the second pad 4-2 of the mainboard 3 through the first probe 14-1 and the second probe 14-2, so as to realize the connection between the coil 1 and the mainboard 3. Compared with the method in the prior art in which the first lead end and the second lead end of the coil 1 are respectively connected to the first pad 4-1 and the second pad 4-2 with solder, this method can avoid the problem of the coil 1 and the mainboard 3 being broken during the assembly process, causing the high-frequency oscillation circuit to fail.

[0077] like Fig. 6A As shown, in some examples, the magnetic core 2 has a first accommodation portion 2-1 and a second accommodation portion (not shown). Figures 4A-4C as well as Figures 6A-6C As shown, the first main body 12 also has a first connection side surface connecting the first surface S1 and the second surface S2; the first connection side surface has a third accommodating portion 12-4 and a fourth accommodating portion 12-5. The first lead end of the coil 1 extends to the first pad 4-1 and is connected to it via the first accommodating portion 2-1 and the third accommodating portion 12-4; the second lead end of the coil 1 extends to the second pad 4-2 and is connected to it via the second accommodating portion and the fourth accommodating portion 12-5.

[0078] In some examples, the first surface S1 is connected to the magnetic core 2 through a colloid; and the orthographic projection of the first surface S1 on the magnetic core 2 is located inside the magnetic core 2, that is, the area of ​​the first surface S1 of the connecting component 12 is smaller than the area of ​​the magnetic core 2 that fits therewith. For example, for an M8 type proximity sensor, the cross-sectional diameter of its magnetic core 2 is 5.1mm-5.3mm, and the diameter of the first surface S1 of the connecting component 12 can be set to 4.8mm-5mm; specifically, for a magnetic core 2 with a cross-sectional diameter of 5.3mm, the diameter of the first surface S1 of the connecting component 12 can be set to 5mm, so as to avoid affecting the subsequent glue filling operation of the magnetic core 2. The depth of the third accommodating portion 12-4 is not less than the depth of the first accommodating portion 2-1, and the depth of the fourth accommodating portion 12-5 is not less than the depth of the second accommodating portion. For example, for the M8 model proximity sensor, the depth of the first accommodating portion 2-1 and the second accommodating portion is 0.5mm-0.7mm. In this example, the depth of the third accommodating portion 12-4 and the fourth accommodating portion 12-5 can be set to 0.7mm-0.9mm. Specifically, when the depth of the first accommodating portion 2-1 and the second accommodating portion is 0.7mm, the depth of the third accommodating portion 12-4 and the fifth accommodating portion 12-5 is preferably set to 0.9mm. In this way, the first lead end of the coil 1 can be prevented from being bent and cut at the junction of the first accommodating portion 2-1 and the third accommodating portion 12-4, and the second lead end can be prevented from being bent and cut at the junction of the second accommodating portion and the fourth accommodating portion 12-5, thereby affecting the electrical performance of the high-frequency oscillation circuit.

[0079] Continue to refer to Figure 6B In some examples, the third accommodating portion 12-4 has a third bottom opposite to its opening, and a first connection surface 14 and a second connection surface 15 connected to the first connection side surface; the fourth accommodating portion 12-5 has a fourth bottom opposite to its opening, and a third connection surface 16 and a fourth connection side surface 17 connected to the first connection side surface. At least one of the third bottom, the fourth bottom, the first connection surface 14, the second connection surface 15, the third connection surface 16 and the fourth connection surface 17 is an arc surface. In this way, the first lead end and the second lead end of the coil can be prevented from being bent and cut when they come into contact with a sharp point, causing the high-frequency oscillation circuit to fail.

[0080] In some examples, the proximity sensor in the embodiments of the present disclosure may be a wire lead type proximity sensor, referring to Figure 2A and Figure 2B The proximity sensor not only includes the above structure, but also includes a cable 9, a first cover body 7 and a second cover body 8. Among them, the first end of the cable 9 is connected to the main board 3; the magnetic core 2 is located in the first cover body 7, and the second end of the main board 3 is located in the second cover body 8. The second cover body 8 has a through hole, and the second end of the cable 9 extends through the through hole to the outside of the proximity sensor. Specifically, in this example, for the M8 type proximity sensor, the length of its shell can be set to 38mm-40mm, and the material can be stainless steel, brass nickel-plated, or zinc nickel-plated, etc. Preferably, the shell length is 38mm, the material is stainless steel, and it can be processed by a CNC lathe. There is no restriction on the process and material here. The size parameters and position settings of the main board 3 and the shell 6 can be as follows Fig. 10A and 10B As shown, specifically, for the M8 type proximity sensor, the length of its main board 3 is a∈[38,40]mm, and the width matches the diameter of the shell 6, for example, it can be set to b∈[3.8,4]mm; the length of the first connecting part 3-1 is c∈[1.4,1.5]mm; preferably, the length a of the main board 3 is 38mm, the width b is 4mm, and the length c of the first connecting part 3-1 is 1.5mm. The size of the debugging component 11 is about 2.8mm×1.8mm×1.2mm~3mm×2mm×1.2mm, and the rightmost end of the debugging component 11 can have a certain distance from the rightmost end of the mainboard 3, for example, the distance can be d∈[0.4,0.5]mm; wherein the second end of the mainboard 3 exceeds the length of the housing 6 by about e∈[2.7,3]mm; preferably, the size of the debugging component 11 is 3mm×2mm×1.2mm, the distance d between the rightmost end thereof and the rightmost end of the mainboard 3 is 0.5mm, and the length e of the second end of the mainboard 3 exceeding the second end of the housing 6 by about 2.7mm. The processing method of the mainboard 3 can be SMT, which is not limited here. Fig. 10CAn example of the second cover 8, wherein the second cover 8 has an inner groove for accommodating the second end of the mainboard 3, the length of the inner groove is f, the diameter is g, the difference between the inner diameter and the outer diameter of the second cover 8 is h, and the above parameters should satisfy: f>e, that is, the length of the inner groove is greater than the length of the second end of the mainboard 3 beyond the shell 6; g>b, that is, the diameter of the inner groove is greater than the width of the mainboard 3; in order to ensure that the second cover 8 has a certain strength, preferably, the difference h between the inner diameter and the outer diameter of the second cover 8 is set to h≥0.8mm. Preferably, the second cover 8 is preferably made of translucent PC material, so that it is easy to observe the changes of the indicator light located at the second end of the proximity sensor. The processing method of the second cover 8 can be injection molding, which is not limited here.

[0081] For the wire-out proximity sensor described in the example above, the assembly process generally includes:

[0082] Step S101 , winding the enameled wire on a coil frame to form a coil 1 , and assembling the coil 1 with a magnetic core 2 to form a magnetic core 2 equipped with the coil 1 .

[0083] Step S102 , coating the first surface S1 of the connection component 12 with colloid, and embedding the third connection portion 13 of the connection component 12 into the second limiting groove of the magnetic core 2 , so that the connection component 12 and the magnetic core 2 are fixedly connected.

[0084] Step S103 , embed the first connection portion 3 - 1 of the mainboard 3 into the first limiting groove 12 - 3 of the connecting component 12 , so that the mainboard 3 and the connecting component 12 are fixedly connected.

[0085] Step S104, weld the first lead end of the coil 1 to the first probe 14-1 via the first accommodating portion 2-1 and the third accommodating portion 12-4, weld the second lead end of the coil 1 to the second probe 14-2 via the second accommodating portion and the fourth accommodating portion 12-5; and weld the first probe 14-1 and the second probe 14-2 to the first soldering pad 4-1 and the second soldering pad 4-2, respectively, to electrically connect the coil 1 and the mainboard 3.

[0086] Step S105 , assembling the magnetic core 2 equipped with the coil 1 and the first cover 7 , and further installing the first cover 7 on the first end of the shell 6 ; those skilled in the art should understand that the mainboard 3 is sleeved in the shell 6 .

[0087] Step S106 , first adjusting the debugging component 11 located at the second end of the mainboard 3 and exposed outside the housing 6 to obtain optimal parameters for the proximity sensor to achieve a maximum detection distance.

[0088] Step S107 , filling the first cover 7 and the shell 6 with colloid, and waiting for the colloid to solidify.

[0089] Step S108: After the colloid is solidified, if the parameters of the coil 1 are changed, the debugging component 11 is adjusted for the second time to re-acquire the optimal parameters for the proximity sensor to achieve the maximum detection distance.

[0090] Step S109, embed the second end of the mainboard 3 into the second cover 8, extend the cable 9 welded on the mainboard 3 through the through hole on the second cover 8 to the outside of the proximity sensor, fill the second cover 8 with colloid, and install the second cover 8 on the second end of the shell 6, and wait for the colloid to solidify.

[0091] In some examples, the proximity sensor in the embodiment of the present disclosure may be a connector type proximity sensor. The proximity sensor not only includes the above structure, but also includes the following structure: Figures 11A-11D , the main board 3 includes a first circuit board 3-2 and a second circuit board 3-3, wherein the second end of the first circuit board 3-2 is connected to the first end of the second circuit board 3-3 and is located in the shell 6. The second end of the second circuit board 3-3 is exposed outside the shell 6, and the debugging component 11 is arranged at the second end of the second circuit board 3-3. Further, in some examples, the proximity sensor also includes a first cover body 7, a second cover body 8, and a socket 20 located at the second end of the second circuit board 3-3. The second cover body 8 has a pin 10. The magnetic core 2 is located in the first cover body 7, the second end of the second circuit board 3-3 is located in the second cover body 8, and the socket 20 is connected to the pin 10. Specifically, in this example, for the M8 type proximity sensor, the length of its shell 6 can be set to 52mm-54mm, and the material can be stainless steel, brass nickel-plated or zinc nickel-plated, etc., preferably stainless steel, and is formed by CNC lathe technology, which is not limited here. Reference Fig. 11C , the length of the first circuit board 3-2 is A, and the width of the connection area of ​​the second circuit board 3-3 is B, and the length of the first connection part 3-1 is C, optionally, A∈[52,54]mm, B∈[5.0,5.2]mm; the length of the first connection part 3-1 can be set according to the length of the first limit groove of the magnetic core 2, for example, for the M8 type proximity sensor, C∈[1.4,1.5]mm; the processing method of the first circuit board 3-2 uses the SMT process, which is not limited here. Specifically, the length A of the first circuit board 3-2 can be 54mm, the width B of the connection area of ​​the first circuit board 3-2 can be 5.2mm, and the length C of the first connection part 3-1 can be 1.5mm. The second circuit board 3-3 uses a bendable flexible circuit board, so that it can be stretched to the outside of the shell 6 for debugging during the adjustment of the debugging component 11, refer to Fig.11DThe second circuit board 3-3 is reserved with positions for a debugging component 11, an indicator light (not shown) and a socket 20. Its length is D, thickness is H, width of the connection area with the first circuit board 3-2 is E, width of the bending area is F, and the distance between the debugging component 11 and the rightmost end of the second circuit board 3-3 is G. For an M8 type proximity sensor, the above parameters can be set in the range of: D∈[35,37]mm, E∈[5.0,5.2]mm, F∈[3.8,4]mm, G∈[7.4,7.5]mm, H∈[0.18,0.2]mm. Specifically, the parameters of the second circuit board 3-3 can be set as follows: the length D is 37 mm, the width E of the connection area is 5.2 mm (the same as the width B of the connection area of ​​the first circuit board 3-2), the width F of the bending area is 4 mm, the distance G between the rightmost end of the debugging component 11 and the rightmost end of the second circuit board 3-3 is 7.5 mm, and the thickness H of the second circuit board 3-3 is 0.2 mm. Fig.11A As shown, the debugging component 11 is exposed outside the housing 6 .

[0092] For the connector-type proximity sensor described in the above example, the assembly process generally includes:

[0093] Step S201 , winding the enameled wire on a coil frame to form a coil 1 , and assembling the coil 1 with a magnetic core 2 to form a magnetic core 2 equipped with the coil 1 .

[0094] Step S202 , coating the first surface S1 of the connection component 12 with colloid, and embedding the third connection portion 13 of the connection component 12 into the second limiting groove of the magnetic core 2 , so that the connection component 12 and the magnetic core 2 are fixedly connected.

[0095] Step S203, embed the first connection part 3-1 of the first circuit board 3-2 into the first limiting groove 12-3 of the connecting component 12, so that the first circuit board 3-2 and the connecting component 12 are fixedly connected; and bind the second end of the first circuit board 3-2 to the first end of the second circuit board 3-3; weld the jack 20 to the second end of the second circuit board 3-3.

[0096] Step S204, weld the first lead end of the coil 1 to the first probe 14-1 via the first accommodating portion and the third accommodating portion 12-4, weld the second lead end of the coil 1 to the second probe 14-2 via the second accommodating portion and the fourth accommodating portion 12-5; and weld the first probe 14-1 and the second probe 14-2 to the first soldering pad 4-1 and the second soldering pad 4-2, respectively, to electrically connect the coil 1 and the mainboard 3.

[0097] Step S205 , assembling the magnetic core 2 equipped with the coil 1 and the first cover 7 , and further installing the first cover 7 on the first end of the shell 6 ; those skilled in the art should understand that the mainboard 3 is sleeved in the shell 6 .

[0098] Step S206, first adjusting the debugging component 11 located at the second end of the second circuit board 3-3 and exposed outside the housing 6 to obtain optimal parameters for the proximity sensor to achieve a maximum detection distance.

[0099] Step S207 , filling the first cover 7 and the shell 6 with colloid, and waiting for the colloid to solidify.

[0100] Step S208: After the colloid is solidified, if the parameters of the coil 1 are changed, the debugging component 11 is adjusted for the second time to re-acquire the optimal parameters for the proximity sensor to achieve the maximum detection distance.

[0101] Step S209, insert the pin 10 on the second cover 8 into the socket of the second circuit board 3-3; after bending the second circuit board 3-3 toward the inside of the shell 6, fill the second cover 8 with colloid, and install the second cover 8 on the second end of the shell 6, waiting for the colloid to solidify.

[0102] In a second aspect, the present disclosure provides an electronic device comprising the proximity sensor described in any example of the first aspect.

[0103] It is understood that the above embodiments are merely exemplary embodiments used to illustrate the principles of the present invention, but the present invention is not limited thereto. For those skilled in the art, various modifications and improvements can be made without departing from the spirit and essence of the present invention, and these modifications and improvements are also considered to be within the scope of protection of the present invention.

Claims

1. A proximity sensor, comprising a coil, a magnetic core, a printed circuit board, and a housing; wherein: The magnetic core includes the outer wall of the coil, the printed circuit board includes a main board, a first solder pad and a second solder pad arranged at a first end of the main board, and a debugging component arranged at a second end of the main board; The first lead end of the coil is connected to the first pad, and the second lead end of the coil is connected to the second pad; The housing sleeve is arranged outside the printed circuit board, and the debugging component is exposed outside the housing.

2. The proximity sensor according to claim 1, wherein: The first end of the main board has a first connecting portion; The proximity sensor further includes a connecting component, the connecting component including a first main body and a second connecting part; wherein the first main body includes a first surface and a second surface arranged opposite to each other; the first surface is opposite to the magnetic core, the second connecting part is connected to the second surface, and the second connecting part has a first limiting groove; The first connecting portion is fixed in the first limiting groove.

3. The proximity sensor according to claim 1, wherein: The first end of the main board has a first connecting portion; The proximity sensor further includes a connecting assembly, the connecting assembly including a first main body; the first main body includes a first surface and a second surface arranged opposite to each other; the first surface is opposite to the magnetic core; a first limiting groove is arranged on the second surface side of the first main body; The first connecting portion is fixed in the first limiting groove.

4. The proximity sensor according to claim 2 or 3, wherein: The magnetic core has a second limiting groove; The connection assembly further includes a third connection portion connected to the first surface; The third connecting portion is fixed in the second limiting groove.

5. The proximity sensor according to claim 4, wherein: The third connecting portion includes a third main body portion and a third end portion connected to the third main body portion; The third end portion includes a third surface and a fourth surface that are arranged opposite to each other, and a third connecting side surface connecting the third surface and the fourth surface; The fourth surface is connected to the third main body, and an area of ​​the third surface is smaller than an area of ​​the fourth surface.

6. The proximity sensor according to claim 2 or 3, wherein: The connection assembly also includes a first probe and a second probe connected to the second surface; The first lead end and the second lead end of the coil are connected to the first probe and the second probe, respectively.

7. The proximity sensor according to claim 6, wherein: When the first connection portion is fixed in the first limiting groove, the first probe and the first pad are opposite to each other with a gap therebetween; the second probe and the second pad are opposite to each other with a gap therebetween.

8. The proximity sensor according to claim 2 or 3, wherein: The magnetic core has a first accommodation portion and a second accommodation portion; The first main body also has a first connecting side surface connecting the first surface and the second surface; the first connecting side surface has a third accommodating portion and a fourth accommodating portion; The first lead end of the coil extends to the first pad via the first accommodation portion and the third accommodation portion and is connected thereto; The second lead end of the coil extends to the second pad via the second accommodation portion and the fourth accommodation portion and is connected thereto.

9. The proximity sensor according to claim 8, wherein: The orthographic projection of the first surface on the magnetic core is located inside the magnetic core; The depth of the third accommodation portion is not less than the depth of the first accommodation portion, and the depth of the fourth accommodation portion is not less than the depth of the second accommodation portion.

10. The proximity sensor according to claim 8, wherein: The third accommodating portion has a third bottom opposite to its opening, and a first connecting surface and a second connecting surface connected to the first connecting side surface; the fourth accommodating portion has a fourth bottom opposite to its opening, and a third connecting surface and a fourth connecting side surface connected to the first connecting side surface; At least one of the third bottom, the fourth bottom, the first connecting surface, the second connecting surface, the third connecting surface and the fourth connecting surface is a curved surface.

11. The proximity sensor according to claim 2 or 3, wherein: The first surface is connected to the magnetic core via colloid.

12. The proximity sensor according to claim 1, wherein: The proximity sensor also includes a cable, a first cover and a second cover; Wherein, the first end of the cable is connected to the mainboard; the magnetic core is located in the first cover body, and the second end of the mainboard is located in the second cover body; The second cover has a through hole, and the second end of the cable passes through the through hole and extends to the outside of the proximity sensor.

13. The proximity sensor according to claim 1, wherein: The main board includes a first circuit board and a second circuit board; The second end of the first circuit board is connected to the first end of the second circuit board and is located in the housing; The second end of the second circuit board is exposed outside the housing, and the debugging component is arranged at the second end of the second circuit board.

14. The proximity sensor according to claim 13, wherein: The proximity sensor further includes a first cover body, a second cover body, and a socket located at a second end of the second circuit board; The second cover has a pin; The magnetic core is located in the first cover body, the second end of the second circuit board is located in the second cover body, and the socket is connected to the pin.

15. The proximity sensor according to claim 14, wherein: The first cover and the shell are filled with colloid.

16. The proximity sensor according to claim 1, wherein: The debugging component includes a potentiometer or a sliding resistor.

17. An electronic device comprising the proximity sensor according to any one of claims 1 to 16.

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