Tensile test device for multi-chip device

Abstract

The utility model discloses a tensile test device for a multi-chip device. The tensile test device comprises a stretcher, a stretching die and a stretching connecting assembly, the stretcher comprises a stretching platform, an upper chuck and a lower chuck; the stretching platform is fixedly connected to the lower chuck; a plurality of stretching dies are arranged and are of hollow rectangular structures; the drawing die is provided with an inner cavity matched with the SiP chip; the stretching connecting assembly comprises a stretching connecting block and a stretching rod used for being connected between the stretching connecting block and the upper chuck. The number of the stretching connecting blocks is the same as that of the stretching dies; in the stretching state, the stretching connecting block is located in the inner cavity of the stretching die and adheres to the SiP chip. The tensile test device not only can adhere and fix the substrates of the chips, but also solves the problems that all parts of the SiP chips are not uniform in height and difficult to adhere and overflow is caused when more binders are used, and is suitable for tensile tests of devices with a plurality of chips.

Description

Technical Field

[0001] The utility model relates to a tensile testing device, in particular to a tensile testing device for multi-chip devices. Background Art

[0002] SiP technology is an advanced chip system integration and packaging technology that integrates multiple functional chips, including processors, memory, field programmable logic gate arrays, etc., into one package to form a basically complete system or subsystem. SiP can vertically stack or horizontally arrange active electronic components with different functions and optional passive devices, such as micro-electromechanical systems, optical devices, RF devices, and other devices of different materials and different process nodes to achieve wafer-level packaging.

[0003] Chip bonding strength and pull-off tests are important components of chip performance testing. The test process generally involves applying vertical pulling force to the chip until the chip is separated from the substrate or base or reaches a specified force value. Traditional chip stretching devices such as Figure 1-2 As shown, the substrate b of the device is fixed by a fixing fixture a, and the stretching tool d is connected to the back of the chip e using a high-strength adhesive c. The connection area should generally exceed 60% of the chip surface. The chip is pulled in the normal direction of the chip at a certain rate until failure or the set test force is reached.

[0004] The existing traditional chip stretching device is mainly used for single chip stretching test, and is not suitable for SiP chip stretching containing multiple functional modules. The main problems are as follows:

[0005] (1) The heights of different functional modules in the SiP chip are different, and more adhesive is needed to level them before they can be connected to the stretching tool. The traditional stretching device does not have a template or other design to prevent the adhesive from flowing or overflowing onto the substrate or adjacent SiP chips.

[0006] (2) In some SiP chips, the chip occupies most of the substrate area, resulting in the edge of the substrate being available for Figure 1 The fixed part in the middle is narrow, less than 0.5mm, so it cannot be fixed by pressing. Utility Model Content

[0007] The purpose of the utility model is to overcome the above-mentioned problems and provide a tensile test device for multi-chip devices. The tensile test device can not only adhere and fix the substrate of the chip, but also solve the problem that the components of the SiP chip are uneven in height and difficult to bond, and overflow when more adhesive is used. The utility model is suitable for tensile testing of devices with multiple chips.

[0008] The purpose of the utility model is achieved through the following technical solutions:

[0009] A stretching test device for a multi-chip device, comprising a stretching machine, a stretching die and a stretching connection assembly;

[0010] The stretching machine comprises a stretching platform, an upper chuck and a lower chuck; the stretching platform is fixedly connected to the lower chuck;

[0011] The stretching die is provided with a plurality of hollow rectangular structures; the stretching die is provided with an inner cavity matching the SiP chip;

[0012] The stretching connection assembly includes a stretching connection block and a stretching rod used to connect between the stretching connection block and the upper clamp; the number of the stretching connection blocks is the same as the number of the stretching molds; in the stretched state, the stretching connection block is located in the inner cavity of the stretching mold and adhered to the SiP chip.

[0013] The working principle of the above-mentioned tensile test device for multi-chip devices is:

[0014] During operation, the device substrate is bonded to the stretching platform through an adhesive, and then several stretching mold sleeves are placed on the periphery of the corresponding SiP chip, wherein the inner wall of the stretching mold is pasted with transparent tape and other materials that are not easy to be bonded, so as to facilitate removal after the adhesive is cured; then, epoxy adhesive is poured into the stretching mold to form a horizontal surface, and then the stretching connection block is fixed on the adhesive; after the adhesive is cured, the stretching mold is removed; the relative position of the SiP chip to be stretched and the upper chuck of the stretching machine is adjusted so that the SiP chip to be stretched is located directly below the upper chuck; the lower end of the stretching rod is fixedly connected to the corresponding stretching connection block, and the upper end of the stretching rod is clamped by the upper chuck of the stretching machine to form a stretching loading chain, and then the stretching operation is performed; the stretching test of the current SiP chip is completed; the stretching rod is removed, the relative position of the next SiP chip is adjusted, and then the stretching rod is installed and the stretching operation is performed. Repeat the above steps to complete the stretching test of the remaining SiP chips in sequence.

[0015] In a preferred embodiment of the present invention, the stretching platform comprises a fixed platform and a movable platform, wherein the fixed platform is fixedly connected to the lower clamping head; and the movable platform is arranged above the fixed platform;

[0016] A position adjustment structure for adjusting the relative position of the SiP chip is provided between the fixed platform and the movable platform.

[0017] Further, the position adjustment structure includes a first adjustment elongated hole, a second adjustment elongated hole and a locking assembly;

[0018] The length direction of the first adjusting strip hole is perpendicular to the length direction of the second adjusting strip hole; the first adjusting strip hole is arranged on a fixed platform; the second adjusting strip hole is arranged on a movable platform;

[0019] The locking assembly comprises a bolt and a nut, wherein the bolt passes through the first adjusting elongated hole and the second adjusting elongated hole, and the nut is locked on the bolt.

[0020] Through the above structure, after loosening the nut, the movable platform can be moved to any position on the horizontal plane, thereby adjusting the relative position of each SiP chip, so that each SiP chip can be aligned with the upper clamp of the stretching machine, so as to complete the tensile test of multiple chips in sequence, ensuring the integrity of the device, and it is not necessary to cut it into independent SiP chips before testing. Furthermore, the fixed platform and the movable platform are connected by bolts, which can withstand higher tension than the traditional mobile platform, preventing the situation where the device is not pulled off but the mobile platform is damaged when the test tension is large.

[0021] Furthermore, the first adjusting elongated holes, the second adjusting elongated holes and the locking components are each provided with two groups; each group of locking components is provided with two bolts and two nuts.

[0022] Furthermore, the fixed platform is fixedly connected to the lower clamp via a connecting rod; the upper end of the connecting rod is connected to the fixed platform via a threaded connection structure, and the lower end of the connecting rod is clamped by the lower clamp.

[0023] In a preferred solution of the utility model, the stretching rod is connected to the stretching connection block through a threaded connection structure, so that both fixed connection and detachable separation can be achieved.

[0024] Compared with the prior art, the utility model has the following beneficial effects:

[0025] 1. Since the heights of the various components of the SiP chip vary greatly, more adhesive needs to be poured for leveling so that they can be fully bonded to the stretching connection block. The stretching mold of the utility model can prevent the adhesive from overflowing, avoid the tested position from bonding with other positions, and affect the test results. It is suitable for the stretching test of multi-chip devices.

[0026] 2. The stretching rod of the utility model can be removed from the stretching connection block, and the stretching rod is not installed when adjusting the position, so as to avoid the stretching rod hindering the free movement of the device.

[0027] 3. The tensile test device of the utility model can adhere and fix the substrate of the chip, and is suitable for devices with narrow substrate edges. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1-2 Schematic diagram of the tensile test device in the prior art.

[0029] Figure 3 It is a three-dimensional schematic diagram of a partial structure of a tensile test device for multi-chip devices of the utility model from one viewing angle.

[0030] Figure 4 It is a three-dimensional schematic diagram of a partial structure of the tensile test device for multi-chip devices of the utility model from another perspective. DETAILED DESCRIPTION

[0031] In order to enable those skilled in the art to better understand the technical solution of the utility model, the utility model is further described below in conjunction with embodiments and drawings, but the implementation methods of the utility model are not limited thereto.

[0032] See also Figure 3-4 The tensile test device for multi-chip devices of this embodiment includes a tensile machine, a tensile die 1 and a tensile connection assembly; the tensile machine includes a tensile platform, an upper chuck and a lower chuck (not shown in the figure); wherein the tensile platform includes a fixed platform 2 and a movable platform 3, the fixed platform 2 is fixedly connected to the lower chuck; the movable platform 3 is arranged above the fixed platform 2; a position adjustment structure for adjusting the relative position of the SiP chip is arranged between the fixed platform 2 and the movable platform 3. Specifically, other structures of the tensile machine of this embodiment can refer to the prior art.

[0033] Furthermore, the position adjustment structure includes a first adjustment strip hole 2-1, a second adjustment strip hole 3-1 and a locking assembly; the length direction of the first adjustment strip hole 2-1 is perpendicular to the length direction of the second adjustment strip hole 3-1; the first adjustment strip hole 2-1 is arranged on the fixed platform 2; the second adjustment strip hole 3-1 is arranged on the movable platform 3; the locking assembly includes a bolt 4 and a nut 5, the bolt 4 passes through the first adjustment strip hole 2-1 and the second adjustment strip hole 3-1, and the nut 5 is locked on the bolt 4.

[0034] Through the above structure, after loosening the nut 5, the movable platform 3 can be moved to any position on the horizontal plane, so as to adjust the relative position of each SiP chip, so that each SiP chip can be aligned with the upper clamp of the stretching machine, so as to complete the tensile test of multiple chips in sequence, ensuring the integrity of the device, and it is not necessary to cut it into independent SiP chips before testing. Furthermore, the fixed platform 2 and the movable platform 3 are connected by bolts 4, which can withstand higher tension than traditional mobile platforms, preventing the situation where the device is not pulled off but the mobile platform is damaged when the test tension is large.

[0035] Furthermore, the first adjusting strip hole 2 - 1 , the second adjusting strip hole 3 - 1 and the locking assembly are each provided with two groups; each group of the locking assembly is provided with two bolts 4 and two nuts 5 .

[0036] Furthermore, the fixed platform 2 is fixedly connected to the lower clamp via a connecting rod 6; the upper end of the connecting rod 6 is connected to the fixed platform 2 via a threaded connection structure, and the lower end of the connecting rod 6 is clamped by the lower clamp.

[0037] See also Figure 3-4 The stretching die 1 is provided with a plurality of hollow rectangular structures; the stretching die 1 is provided with an inner cavity matching the SiP chip.

[0038] See also Figure 1-2 The stretching connection assembly includes a stretching connection block 7 and a stretching rod 8 connected between the stretching connection block 7 and the upper clamp; the number of the stretching connection blocks 7 is the same as the number of the stretching molds 1; in the stretching state, the stretching connection block 7 is located in the inner cavity of the stretching mold 1 and adhered to the SiP chip.

[0039] Furthermore, the stretching rod 8 is connected to the stretching connection block 7 via a threaded connection structure, so that both fixed connection and detachable separation can be achieved.

[0040] See also Figure 3-4 The working principle of the tensile test device for multi-chip devices of this embodiment is as follows:

[0041] During operation, the device substrate is bonded to the movable platform 3 of the stretching platform by an adhesive, and then a plurality of stretching molds 1 are placed on the periphery of the corresponding SiP chip, wherein the inner wall of the stretching mold 1 is pasted with a transparent tape or other material that is not easy to be bonded, so as to facilitate removal after the adhesive is cured; then, the epoxy adhesive is poured into the stretching mold 1 to form a horizontal surface, and then the stretching connection block 7 is fixed on the adhesive; after the adhesive is cured, the stretching mold 1 is removed; the nut 5 is loosened, the movable platform 3 is moved, and the relative position of the SiP chip to be stretched and the upper chuck of the stretching machine is adjusted so that the SiP chip to be stretched is located directly below the upper chuck; the lower end of the stretching rod 8 is fixedly connected to the corresponding stretching connection block 7, and the upper end of the stretching rod 8 is clamped by the upper chuck of the stretching machine to form a stretching loading chain, and then the stretching operation is performed; the stretching test of the current SiP chip is completed; the stretching rod 8 is removed, and the relative position of the next SiP chip is adjusted, and then the stretching rod 8 is installed and the stretching operation is performed. Repeat the above steps to complete the stretching test of the remaining SiP chips in sequence.

[0042] The above is a preferred implementation mode of the present invention, but the implementation mode of the present invention is not limited by the above content. Any other changes, modifications, substitutions, combinations, and simplifications made without departing from the spirit and principle of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A tensile test device for multi-chip devices, characterized in that: It includes a stretching machine, a stretching die and a stretching connection assembly; The stretching machine comprises a stretching platform, an upper chuck and a lower chuck; the stretching platform is fixedly connected to the lower chuck; The stretching die is provided with a plurality of hollow rectangular structures; the stretching die is provided with an inner cavity matching the SiP chip; The stretching connection assembly includes a stretching connection block and a stretching rod used to connect between the stretching connection block and the upper clamp; the number of the stretching connection blocks is the same as the number of the stretching molds; in the stretched state, the stretching connection block is located in the inner cavity of the stretching mold and adhered to the SiP chip.

2. The tensile test device for multi-chip devices according to claim 1, characterized in that: The stretching platform includes a fixed platform and a movable platform, wherein the fixed platform is fixedly connected to the lower clamping head; and the movable platform is arranged above the fixed platform; A position adjustment structure for adjusting the relative position of the SiP chip is provided between the fixed platform and the movable platform.

3. The tensile test device for multi-chip devices according to claim 2, characterized in that: The position adjustment structure includes a first adjustment elongated hole, a second adjustment elongated hole and a locking assembly; The length direction of the first adjusting strip hole is perpendicular to the length direction of the second adjusting strip hole; the first adjusting strip hole is arranged on a fixed platform; the second adjusting strip hole is arranged on a movable platform; The locking assembly comprises a bolt and a nut, wherein the bolt passes through the first adjusting elongated hole and the second adjusting elongated hole, and the nut is locked on the bolt.

4. The tensile test device for multi-chip devices according to claim 3, characterized in that: The first adjusting elongated holes, the second adjusting elongated holes and the locking components are each provided with two groups; each group of locking components is provided with two bolts and two nuts.

5. The tensile test device for multi-chip devices according to claim 2, characterized in that: The fixed platform is fixedly connected to the lower clamp via a connecting rod; the upper end of the connecting rod is connected to the fixed platform via a threaded connection structure, and the lower end of the connecting rod is clamped by the lower clamp.

6. The tensile test device for multi-chip devices according to claim 1, characterized in that: The stretching rod is connected to the stretching connection block through a threaded connection structure.

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