Chip test temperature control device

Abstract

The utility model relates to the technical field of chip sealing test, in particular to a chip test temperature control device, which comprises a test device, a temperature control device, a temperature control device and a temperature control device, and is characterized in that the test device comprises a test board and a plurality of test stations; the temperature control device comprises a testing machine, a temperature controller, an air blowing system and a plurality of temperature sensors; the temperature sensors are in one-to-one correspondence with the test stations, the temperature sensors are arranged in the corresponding test stations, and the temperature sensors are in communication connection with the test board; the test board is in communication connection with the test machine, and the test machine is in communication connection with the temperature controller; the blowing system comprises a main pipeline and a plurality of blowing pipelines connected with the main pipeline, air outlets of the blowing pipelines are in one-to-one correspondence with the test stations, air valves are arranged on the blowing pipelines, each air valve is in communication connection with a temperature controller, and the temperature controller controls the opening degree of each air valve according to comparison information. The structure is simple, the risk of chip damage is reduced, and the test yield is improved.

Description

Technical Field

[0001] The present disclosure relates to the field of chip packaging and testing technology, and in particular to a chip testing temperature control device. Background Art

[0002] In the field of chip packaging and testing, when testing some chips, it is currently necessary to strictly control the test temperature.

[0003] Currently, the conventional solution for controlling the temperature of the test chip is to use a temperature control system. This system requires the purchase of dedicated tooling, which is expensive. In addition, different products need to purchase corresponding tooling separately, which is costly. Utility Model Content

[0004] In order to solve the above technical problems, the present disclosure provides a chip testing device.

[0005] The present disclosure provides a chip testing device, comprising: a testing device, the testing device comprising a testing board and a plurality of testing stations located on one side of the testing board; a temperature control device, the temperature control device comprising a testing machine, a temperature controller, a blowing system and a plurality of temperature sensors; the temperature sensors correspond to the testing stations one by one, the temperature sensors are arranged in the testing stations corresponding thereto, the temperature sensors are communicatively connected with the testing board, the temperature sensors are used to detect the real-time temperature of the testing stations corresponding thereto and transmit the real-time temperature to the testing board; the testing board is communicatively connected with the testing machine, the testing machine is communicatively connected with the temperature controller, the testing machine is used to receive the real-time temperature transmitted by the testing board and compare the real-time temperature with the set temperature, and transmit the comparison information to the temperature controller; the blowing system comprises a main pipeline and a plurality of blowing pipelines connected with the main pipeline, the air outlets of the blowing pipelines correspond to the testing stations one by one, the blowing pipelines are provided with air valves, each air valve is communicatively connected with the temperature controller, and the temperature controller controls the opening of each air valve according to the comparison information.

[0006] Optionally, the chip test temperature control device also includes an execution system, which is communicatively connected to the test machine, and the execution system is used to input a set temperature and transmit the set temperature to the test machine.

[0007] Optionally, each test station is arranged along a first direction; along a second direction, the air outlet of the blowing duct and the temperature sensor are respectively located on both sides of the corresponding test station, wherein the first direction and the second direction intersect.

[0008] Optionally, the temperature sensor is located inside the corresponding test station.

[0009] Optionally, the blowing system also includes multiple air outlet ducts, which correspond to the blowing ducts one by one. The air outlet ducts are strip structures, and the air outlet ducts are located on one side of the corresponding test station; the air inlet of the air outlet duct is connected to the air outlet of the corresponding blowing duct, and the air outlet duct includes multiple air outlets.

[0010] Optionally, the blowing system also includes multiple air outlet ducts, which correspond to the blowing ducts one by one. The air outlet ducts are semi-annular structures, and the air outlet ducts partially surround the corresponding test stations; the air inlet of the air outlet duct is connected to the air outlet of the corresponding blowing duct, and the air outlet duct includes multiple air outlets.

[0011] Optionally, the air outlets in the air outlet duct are evenly arranged.

[0012] Optionally, a baffle is provided between two adjacent test stations.

[0013] Optionally, the temperature control device also includes multiple air outlet channels, which correspond to the test stations one by one. The test stations are located in the corresponding air outlet channels, and the air inlets of the air outlet channels are connected to the air outlets of the corresponding blowing ducts. The air outlets of the air outlet channels and the air inlets of the air outlet channels are respectively located on opposite sides of the air outlet channels.

[0014] Optionally, the gas in the blowing system is nitrogen or compressed air.

[0015] Compared with the prior art, the technical solution provided by the present invention has the following advantages:

[0016] The chip test temperature control device provided by the present disclosure can monitor the temperature of each test station in real time, and cool down the test station with too high temperature, so as to avoid the situation where the temperature of the test station is too high and affects the chip test, reduce the risk of chip damage, and help improve the test yield. In addition, the structure of the temperature control device in the chip test temperature control device is simple, which is conducive to reducing costs. At the same time, the blowing system includes a plurality of blowing ducts, and the air outlets of the blowing ducts correspond to the test stations one by one. The blowing ducts are provided with air valves, that is, each blowing duct can control whether to blow air to cool down the test station through each air valve corresponding to it, that is, the test station with abnormal temperature can be blown to cool down in a targeted manner, and while cooling down the test station with abnormal temperature, it avoids affecting the test station with normal temperature. Furthermore, the temperature controller controls the opening of each air valve according to the comparison information, that is, the temperature controller can adjust the opening of the corresponding air valve according to the difference between the real-time temperature and the set temperature. That is, when the difference between the real-time temperature and the set temperature of the test station is large, the opening of the corresponding air valve is adjusted to increase, thereby increasing the cooling effect on the test station; when the difference between the real-time temperature and the set temperature of the test station is small, the opening of the corresponding air valve is adjusted to decrease, thereby reducing the cooling effect on the test station and avoiding the temperature of the test station being too low. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0018] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0019] Figure 1 A schematic diagram of the structure of a chip testing temperature control device provided by the present disclosure;

[0020] Figure 2 A schematic diagram of the structure of another chip testing temperature control device provided by the present disclosure;

[0021] Figure 3 A schematic diagram of the structure of another chip testing temperature control device provided by the present disclosure;

[0022] Figure 4 yes Figure 3 A schematic diagram of the structure of the air outlet duct in the chip test temperature control device;

[0023] Figure 5A schematic diagram of the structure of another chip testing temperature control device provided by the present disclosure;

[0024] Figure 6 yes Figure 5 A schematic diagram of the structure of the air outlet duct in the chip test temperature control device;

[0025] Figure 7 A schematic diagram of the structure of another chip testing temperature control device provided by the present disclosure;

[0026] Figure 8 This is a schematic diagram of the structure of another chip testing temperature control device provided by the present invention. DETAILED DESCRIPTION

[0027] In order to more clearly understand the above-mentioned objectives, features and advantages of the present disclosure, the scheme of the present disclosure will be further described below. It should be noted that the embodiments of the present disclosure and the features in the embodiments can be combined with each other without conflict.

[0028] In the following description, many specific details are set forth to facilitate a full understanding of the present disclosure, but the present disclosure may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present disclosure, rather than all of the embodiments.

[0029] Figure 1 This is a schematic diagram of the structure of a chip test temperature control device provided by the present disclosure, referring to Figure 1 , this embodiment provides a chip test temperature control device, including:

[0030] A testing device 10, the testing device 10 comprises a testing board 11 and a plurality of testing stations 12 located on one side of the testing board 11;

[0031] A temperature control device 20, the temperature control device 20 includes a testing machine 21, a temperature controller 22, a blowing system 23 and a plurality of temperature sensors 24;

[0032] The temperature sensor 24 corresponds to the test station 12 one by one. The temperature sensor 24 is arranged in the test station 12 corresponding thereto. The temperature sensor 24 is connected to the test board 11 for communication. The temperature sensor 24 is used to detect the real-time temperature of the test station 12 corresponding thereto and transmit the real-time temperature to the test board 11.

[0033] The test board 11 is connected to the test machine 21 for communication, and the test machine 21 is connected to the temperature controller 22 for communication. The test machine 21 is used to receive the real-time temperature transmitted by the test board 11 and compare the real-time temperature with the set temperature, and transmit the comparison information to the temperature controller 22;

[0034] The blowing system 23 includes a main pipeline 231 and multiple blowing pipelines 232 connected to the main pipeline 231. The air outlets of the blowing pipelines 232 correspond one-to-one to the test stations 12. Air valves 233 are provided on the blowing pipelines 232. Each air valve 233 is communicated with the temperature controller 22. The temperature controller 22 controls the opening of each air valve 233 according to the comparison information.

[0035] Specifically, the chip testing temperature control device provided in this embodiment includes a testing device 10 , and the testing device 10 includes a testing board 11 and a plurality of testing stations 12 . The testing stations 12 are used to place chips, and each chip can be tested through the testing board 11 .

[0036] The chip test temperature control device also includes a temperature control device 20, which includes a test machine 21, a temperature controller 22, a blowing system 23 and a plurality of temperature sensors 24. Among them, the temperature sensors 24 correspond to the test stations 12 one by one, and the temperature sensors 24 are arranged in the test stations 12 corresponding thereto, so that the temperature sensors 24 can perform real-time temperature detection on the test stations 12 corresponding thereto, that is, the temperature sensors 24 can detect the real-time temperature of the test stations 12 corresponding thereto, and the temperature sensors 24 are connected in communication with the test board 11, and the temperature sensors 24 can transmit the real-time temperature of the test stations 12 corresponding thereto detected by the temperature sensors 24 to the test board 11. The test board 11 is connected in communication with the test machine 21, and the test machine 21 can receive the real-time temperature of each test station 12 transmitted by the test board 11, and the test machine 21 can compare the real-time temperature of each test station 12 with the set temperature stored in the test machine 21 to form comparison information, so as to monitor whether each test station 12 has temperature abnormality. The test machine 21 is connected in communication with the temperature controller 22. When the test machine 21 detects that the test station 12 has abnormal temperature, the comparison information can be transmitted to the temperature controller 22. The blowing system 23 includes a main pipeline 231 and a plurality of blowing pipelines 232 connected to the main pipeline 231. The air outlets of the blowing pipelines 232 correspond to the test stations 12 one by one. The blowing pipelines 232 are provided with air valves 233. Each air valve 233 is connected in communication with the temperature controller 22. The temperature controller 22 controls the opening of each air valve 233 according to the comparison information. That is, when the test station 12 has abnormal temperature, the temperature controller 22 can control the air valve 233 on the blowing pipeline 232 corresponding to the test station 12 to open, so that the corresponding blowing pipeline 232 blows the test station 12, thereby achieving the cooling of the test station 12. That is, the chip test temperature control device provided in this embodiment can monitor the temperature of each test station 12 in real time, and cool down the test station 12 with too high temperature, so as to avoid the situation where the temperature of the test station 12 is too high and affects the chip test, thereby reducing the risk of chip damage and improving the test yield. In addition, the temperature control device 20 in the chip test temperature control device provided in this embodiment has a simple structure, which is conducive to reducing costs.

[0037] At the same time, the blowing system 23 includes a plurality of blowing ducts 232, and the air outlets of the blowing ducts 232 correspond one-to-one to the test stations 12. The blowing ducts 232 are provided with air valves 233, that is, each blowing duct 232 can control whether to blow air to cool down the test station 12 through the corresponding air valves 233, so that the test station 12 with abnormal temperature can be blown to cool down in a targeted manner, and while cooling down the test station 12 with abnormal temperature, it avoids affecting the test station 12 with normal temperature.

[0038] Furthermore, the temperature controller 22 controls the opening of each air valve 233 according to the comparison information, that is, the temperature controller 22 can adjust the opening of the corresponding air valve 233 according to the difference between the real-time temperature and the set temperature. That is, when the difference between the real-time temperature of the test station 12 and the set temperature is large, the opening of the corresponding air valve 233 is adjusted to increase, thereby increasing the cooling effect on the test station 12; when the difference between the real-time temperature of the test station 12 and the set temperature is small, the opening of the corresponding air valve 233 is adjusted to decrease, thereby reducing the cooling effect on the test station 12 and avoiding the temperature of the test station 12 being too low.

[0039] What is needed is, Figure 1 It is exemplarily shown that the test device 10 includes four test stations 12. In other embodiments of the present disclosure, the test device 10 may also include other numbers of test stations 12, which will not be described in detail herein.

[0040] Continue to refer Figure 1 In some optional embodiments, the chip test temperature control device also includes an execution system 25, which is communicatively connected to the test machine 21, and the execution system 25 is used to input the set temperature and transmit the set temperature to the test machine 21.

[0041] Specifically, the chip test temperature control device also includes an execution system 25, in which a set temperature can be input. The execution system 25 is communicatively connected with the test machine 21. The execution system 25 can transmit the set temperature to the test machine 21. That is, different set temperatures can be set based on different chips through the execution system 25. Thus, the chip test temperature control device can adapt to the testing of various chips and has strong versatility.

[0042] Optionally, the execution system 25 may be a manufacturing enterprise's production process execution system (Manufacturing Execution System, MES).

[0043] Continue to refer Figure 1 , in some optional embodiments, each test station 12 is arranged along a first direction;

[0044] Along the second direction, the air outlet of the blowing duct 232 and the temperature sensor 24 are respectively located on two sides of the corresponding test station 12 , wherein the first direction intersects with the second direction.

[0045] Specifically, along the direction intersecting with the arrangement direction of each test station 12, the air outlet of the blowing duct 232 is located on one side of the corresponding test station 12, thereby reducing the impact of the air outlet of the blowing duct 232 on other test stations 12 when blowing air to cool down the corresponding test station 12.

[0046] Along the direction intersecting with the arrangement direction of each test station 12, the temperature sensor 24 is located on the other side of the corresponding test station 12, so that the setting of the temperature sensor 24 and the setting of the blowing duct 232 do not affect each other. At the same time, the temperature sensor 24 can detect the real-time temperature of the corresponding test station 12.

[0047] Figure 2 This is a schematic diagram of another chip test temperature control device provided by the present invention, referring to Figure 2 In some optional embodiments, the temperature sensor 24 is located inside the corresponding test station 12 .

[0048] Specifically, the temperature sensor 24 is located inside the corresponding test station 12 , so that the temperature sensor 24 can more accurately detect the real-time temperature of the corresponding test station 12 .

[0049] Figure 3 This is a schematic diagram of the structure of another chip testing temperature control device provided by the present disclosure, Figure 4 yes Figure 3 A schematic diagram of the structure of the air outlet duct in the chip test temperature control device, referring to Figure 3 and Figure 4 In some optional embodiments, the blowing system 23 further includes a plurality of air outlet ducts 234, the air outlet ducts 234 correspond to the blowing ducts 232 one by one, the air outlet ducts 234 are strip-shaped structures, and the air outlet ducts 234 are located on one side of the corresponding test station 12;

[0050] The air inlet 2341 of the air outlet duct 234 is connected to the air outlet of the corresponding blowing duct 232 , and the air outlet duct 234 includes a plurality of air outlets 2342 .

[0051] Specifically, the blowing system 23 also includes a plurality of air outlet ducts 234, and the air outlet ducts 234 correspond to the blowing ducts 232 one by one. The air inlet 2341 of the air outlet duct 234 is connected to the air outlet of the corresponding blowing duct 232, so that the gas in the blowing duct 232 can enter the air outlet duct 234 through the air inlet 2341 of the air outlet duct 234 and come out from the air outlet 2342 of the air outlet duct 234. The air outlet duct 234 is a strip structure, and the air outlet duct 234 is located on one side of the corresponding test station 12. The air outlet duct 234 includes a plurality of air outlets 2342, so that each air outlet 2342 of the air outlet duct 234 can blow air to cool down the corresponding test station 12, thereby cooling down multiple positions in the test station 12, thereby improving the efficiency of cooling down the test station 12 and making the temperatures at various locations of the test station 12 tend to be the same.

[0052] In some optional embodiments, the air outlets 2342 in the air outlet duct 234 are evenly arranged, so as to cool the entire test station 12 more evenly, so that the temperature at each location of the test station 12 tends to be the same.

[0053] Figure 5 This is a schematic diagram of the structure of another chip testing temperature control device provided by the present disclosure, Figure 6 yes Figure 5 A schematic diagram of the structure of the air outlet duct in the chip test temperature control device, referring to Figure 5 and Figure 6 In some optional embodiments, the blowing system 23 further includes a plurality of air outlet ducts 234, the air outlet ducts 234 correspond to the blowing ducts 232 one by one, the air outlet ducts 234 are semi-annular structures, and the air outlet ducts 234 partially surround the corresponding test stations 12;

[0054] The air inlet 2341 of the air outlet duct 234 is connected to the air outlet of the corresponding blowing duct 232 , and the air outlet duct 234 includes a plurality of air outlets 2342 .

[0055] Specifically, the blowing system 23 also includes a plurality of air outlet ducts 234, and the air outlet ducts 234 correspond to the air outlet ducts 232 one by one. The air inlet 2341 of the air outlet duct 234 is connected to the air outlet of the corresponding air outlet duct 232, so that the gas in the air outlet duct 232 can enter the air outlet duct 234 through the air inlet 2341 of the air outlet duct 234 and come out from the air outlet 2342 of the air outlet duct 234. The air outlet duct 234 is a semi-annular structure, and the air outlet duct 234 partially surrounds the corresponding test station 12, so that the air outlet duct 234 blows out The wind carries the heat of the test station 12 out from the side of the test station 12 where the air outlet duct 234 is not set, which is conducive to blowing air to cool the test station 12 and avoiding heat accumulation in the test station 12. The air outlet duct 234 includes multiple air outlets 2342, so that each air outlet 2342 of the air outlet duct 234 can blow air to cool the corresponding test station 12 from multiple directions, thereby cooling the test station 12 in multiple directions, improving the cooling efficiency of the test station 12, and making the temperature of each part of the test station 12 tend to be the same.

[0056] Optionally, the air outlet duct 234 may be U-shaped. Of course, in other embodiments of the present disclosure, the air outlet duct 234 may also be a semi-annular structure, which will not be described in detail herein.

[0057] In some optional embodiments, the air outlets 2342 in the air outlet duct 234 are evenly arranged, so as to cool the entire test station 12 more evenly, so that the temperature at each location of the test station 12 tends to be the same.

[0058] Figure 7A schematic diagram of the structure of another chip test temperature control device provided by the present disclosure, referring to Figure 7 In some optional embodiments, a baffle 30 is disposed between two adjacent test stations 12 .

[0059] Specifically, the blowing system 23 includes a plurality of blowing ducts 232, and the air outlets of the blowing ducts 232 correspond one-to-one to the test stations 12. The blowing ducts 232 are provided with air valves 233, that is, each blowing duct 232 can control whether to blow air to cool down the test station 12 through the air valves 233 corresponding thereto, so that the test station 12 with abnormal temperature can be blown to cool down in a targeted manner. Meanwhile, a baffle 30 is provided between two adjacent test stations 12. While cooling down the test station 12 with abnormal temperature, the baffle 30 can prevent the wind blown out of the blowing duct 232 from affecting the test station 12 adjacent thereto.

[0060] Figure 8 A schematic diagram of the structure of another chip test temperature control device provided by the present disclosure, referring to Figure 8 In some optional embodiments, the temperature control device 20 also includes multiple air outlet channels 26, the air outlet channels 26 correspond to the test stations 12 one by one, the test stations 12 are located in the corresponding air outlet channels 26, the air inlet of the air outlet channels 26 is connected to the air outlet of the corresponding blowing duct 232, and the air outlet of the air outlet channel 26 and the air inlet of the air outlet channel 26 are respectively located on opposite sides of the air outlet channel 26.

[0061] Specifically, the blowing system 23 includes a plurality of blowing ducts 232, and the air outlets of the blowing ducts 232 correspond to the test stations 12 one by one. The temperature control device 20 also includes a plurality of air outlet channels 26, and the air outlet channels 26 correspond to the test stations 12 one by one. The test stations 12 are located in the corresponding air outlet channels 26, and the air inlet of the air outlet channels 26 is connected to the air outlet of the corresponding blowing duct 232. The air outlet of the air outlet channel 26 and the air inlet of the air outlet channel 26 are respectively located on opposite sides of the air outlet channel 26. An air valve 233 is provided on the blowing duct 232, that is, each blowing duct 232 can be controlled by each corresponding air valve 233. No, the corresponding air outlet channel 26 is blown, and the wind in the blowing duct 232 enters from the air inlet of the air outlet channel 26, and drives the heat on the corresponding test station 12 to go out from the air outlet of the air outlet channel 26, thereby achieving the cooling of the corresponding test station 12 by blowing, that is, the cooling of the test station 12 with abnormal temperature is carried out specifically by blowing, and at the same time, the wind blown out of the blowing duct 232 can only enter the corresponding air outlet channel 26, and will not enter other air outlet channels 26, so that while cooling the test station 12 with abnormal temperature, the wind blown out of the blowing duct 232 can be avoided from affecting the adjacent test station 12.

[0062] In some optional embodiments, the gas in the blowing system 23 is nitrogen or compressed air.

[0063] Specifically, the gas in the blowing system 23 may be nitrogen, which is beneficial to improving the cooling effect on the test station 12. The gas in the blowing system 23 may also be compressed air, which is beneficial to reducing the cost while achieving cooling of the test station 12.

[0064] It should be noted that in other embodiments of the present disclosure, the gas in the blowing system 23 may also be other gases, which will not be described in detail herein.

[0065] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0066] The above description is only a specific embodiment of the present disclosure, so that those skilled in the art can understand or implement the present disclosure. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the present disclosure will not be limited to the embodiments described herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A chip testing temperature control device, characterized in that: include: A testing device, the testing device comprising a testing board and a plurality of testing stations located on one side of the testing board; A temperature control device, the temperature control device comprising a testing machine, a temperature controller, a blowing system and a plurality of temperature sensors; The temperature sensor corresponds to the test station one by one, the temperature sensor is arranged in the test station corresponding thereto, the temperature sensor is communicatively connected with the test board, and the temperature sensor is used to detect the real-time temperature of the test station corresponding thereto and transmit the real-time temperature to the test board; The test board is connected to the test machine for communication, and the test machine is connected to the temperature controller for communication. The test machine is used to receive the real-time temperature transmitted by the test board, compare the real-time temperature with the set temperature, and transmit the comparison information to the temperature controller; The blowing system includes a main pipeline and multiple blowing pipelines connected to the main pipeline. The air outlets of the blowing pipelines correspond one-to-one to the test stations. Air valves are provided on the blowing pipelines. Each of the air valves is communicatively connected to the temperature controller. The temperature controller controls the opening of each of the air valves according to the comparison information.

2. The chip testing temperature control device according to claim 1, characterized in that: The chip testing temperature control device also includes an execution system, which is communicatively connected to the test machine and is used to input the set temperature and transmit the set temperature to the test machine.

3. The chip testing temperature control device according to claim 1, characterized in that: Each of the test stations is arranged along a first direction; Along the second direction, the air outlet of the blowing duct and the temperature sensor are respectively located on two sides of the corresponding test station, wherein the first direction and the second direction intersect.

4. The chip testing temperature control device according to claim 1, characterized in that: The temperature sensor is located inside the corresponding testing station.

5. The chip testing temperature control device according to claim 1, characterized in that: The blowing system further comprises a plurality of air outlet ducts, each of which corresponds to the blowing ducts one by one, and each of which is a strip-shaped structure, and is located at one side of the corresponding test station; The air inlet of the air outlet duct is connected to the corresponding air outlet of the blowing duct, and the air outlet duct includes a plurality of air outlets.

6. The chip testing temperature control device according to claim 1, characterized in that: The blowing system further comprises a plurality of air outlet ducts, each of which corresponds to the blowing ducts one by one, and each of which is a semi-annular structure, and each of which partially surrounds the corresponding test station; The air inlet of the air outlet duct is connected to the corresponding air outlet of the blowing duct, and the air outlet duct includes a plurality of air outlets.

7. The chip testing temperature control device according to claim 5 or 6, characterized in that: The air outlets in the air outlet duct are evenly arranged.

8. The chip testing temperature control device according to claim 1, characterized in that: A baffle is arranged between two adjacent test stations.

9. The chip testing temperature control device according to claim 1, characterized in that: The temperature control device also includes multiple air outlet channels, each of which corresponds to the test station one by one. The test station is located in the corresponding air outlet channel, the air inlet of the air outlet channel is connected to the air outlet of the corresponding blowing duct, and the air outlet of the air outlet channel and the air inlet of the air outlet channel are respectively located on opposite sides of the air outlet channel.

10. The chip testing temperature control device according to claim 1, characterized in that: The gas in the blowing system is nitrogen or compressed air.

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