Laser annealing system

Abstract

The utility model provides a laser annealing system which comprises a machine table, a horizontal movement unit and a laser unit are installed on the machine table, a closed cavity and a vertical movement unit are arranged on the horizontal movement unit, a product to be machined is placed in the closed cavity, transparent glass is arranged on the top of the closed cavity, and the closed cavity is installed on the vertical movement unit. The horizontal movement unit drives the closed chamber to move in the x direction and the y direction, and the vertical movement unit drives the closed chamber to move in the z direction; and the gas inlet unit and the gas exhaust unit are both communicated with the closed cavity, and under the action of the gas exhaust unit, the gas inlet unit introduces inert gas into the closed cavity while air in the closed cavity is exhausted, so that the time for establishing a stable pressure and low-oxygen environment in the closed cavity is effectively shortened. And the height of the closed cavity can be automatically adjusted according to the flatness of the to-be-machined product, so that the product after laser annealing has good consistency and uniformity.

Description

Technical Field

[0001] The present application belongs to the field of laser processing technology, and in particular, relates to a laser annealing system for processing and manufacturing semiconductor devices. Background Art

[0002] In the process of processing semiconductor devices, laser scanning processing is a commonly used processing technology, and some laser scanning processing requires the workpiece to be processed (such as silicon carbide) to be carried out in a specific gas atmosphere.

[0003] The laser annealing system currently used in the silicon carbide processing process mainly includes: a laser unit, a closed chamber for accommodating silicon carbide wafers, a motion unit that drives the closed chamber to move in the horizontal direction, and a processing platform is provided in the closed chamber, on which the silicon carbide wafer to be processed is placed. Specifically, the laser unit is fixed, and the motion unit drives the closed chamber to move in the horizontal direction, so that the laser unit can scan the entire wafer for laser annealing.

[0004] The closed chamber control pipeline in the prior art is relatively complex, generally including an air intake pipeline, an air release pipeline and an air exhaust pipeline, and the closed chamber only moves in the horizontal direction. If the flatness of the product or the processing platform is insufficient, the processing results may be uneven. Utility Model Content

[0005] In view of this, the present application provides a laser annealing system that can effectively shorten the time to establish a stable pressure and low-oxygen environment in a closed chamber, and ensure that the product has good consistency and uniformity after processing.

[0006] A laser annealing system, comprising:

[0007] A machine platform, wherein a horizontal motion unit and a laser unit are installed on the machine platform, a closed chamber and a vertical motion unit are arranged on the horizontal motion unit, a product to be processed is placed in the closed chamber, the top of the closed chamber is transparent glass, the closed chamber is installed on the vertical motion unit, the horizontal motion unit drives the closed chamber to move in the x direction and the y direction, and the vertical motion unit drives the closed chamber to move in the z direction;

[0008] An air intake unit and an air exhaust unit, wherein both the air intake unit and the air exhaust unit are connected to the closed chamber, and under the action of the air exhaust unit, the air in the closed chamber is exhausted while the air intake unit introduces inert gas into the closed chamber.

[0009] Preferably, the horizontal motion unit comprises an x-direction motion mechanism and a y-direction motion mechanism, and the x-direction motion mechanism comprises a first guide rail mounted on the machine platform and a first slider slidably connected to the first guide rail;

[0010] The y-axis motion mechanism includes a second guide rail and a second slider, the second guide rail is mounted on the first slider, the second slider is slidably connected to the second guide rail, and the closed chamber is mounted on the second slider via a mounting plate.

[0011] Preferably, the vertical motion unit includes a driving member, a vertical guide rail and a vertical slider, the driving member is mounted on the mounting plate via a mounting frame, the vertical guide rail is vertically mounted on the outer wall of the closed chamber, the vertical slider is mounted on the mounting frame, the vertical slider is slidably connected to the vertical guide rail, and the power output end of the driving member is connected to the closed chamber.

[0012] Preferably, the air extraction unit comprises a vacuum generator and an air extraction pipeline, the vacuum generator is connected to the closed chamber through the air extraction pipeline, and the air extraction pipeline is provided with an air outlet pneumatic diaphragm valve and an oxygen content sensor.

[0013] Preferably, the air intake unit comprises an air supply portion and an air intake pipe, the air supply portion is connected to the closed chamber through the air intake pipe, and the air intake pipe is provided with a pressure reducing valve, an air intake pneumatic diaphragm valve and a flow control meter.

[0014] Preferably, the laser unit comprises a laser and a sealed shell, an optical component is provided in the sealed shell, a light outlet of the sealed shell is located above the closed chamber, and a laser beam emitted by the laser is transmitted out of the sealed shell from the light outlet through the optical component.

[0015] Preferably, a laser rangefinder is installed in the sealed housing, a test end of the laser rangefinder is facing the light outlet, and the vertical motion unit drives the sealed chamber to move upward or downward according to the test result of the laser rangefinder.

[0016] Preferably, it also includes a sealed gas supply unit, which includes a compressed air supply part, a compressed air triplet, a compressed air water-gas separation component and a filter, the compressed air supply part, the compressed air triplet, the compressed air water-gas separation component, the filter and the sealed shell are connected in sequence through an air supply pipe, and a pressure regulating valve is provided on the air supply pipe between the filter and the sealed shell.

[0017] Preferably, an adsorption platform is provided in the closed chamber, and the product to be processed is adsorbed on the adsorption platform.

[0018] Preferably, a pressure gauge is installed on the mounting plate, and the pressure in the sealed chamber is detected by the pressure gauge; and / or,

[0019] The side wall of the sealed chamber is provided with an opening, which is opened or closed by an automatic valve.

[0020] The beneficial effects of the present application are: under the action of the air extraction unit, the air in the closed chamber is exhausted, and the air intake unit introduces inert gas into the closed chamber, optimizing the control pipeline of the closed chamber, and effectively shortening the time to establish a stable pressure and low oxygen environment in the closed chamber. In addition, the present application can adjust the height of the closed chamber through the vertical motion unit according to the detection results of the laser rangefinder, so that the product has better consistency and uniformity after processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the related technologies, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0022] The structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with this technology. They are not used to limit the conditions under which this application can be implemented, and therefore have no substantive technical significance. Any structural modification, change in proportion or adjustment of size, without affecting the effects and purposes that can be achieved by this application, should still fall within the scope of the technical contents disclosed in this application.

[0023] Figure 1 A schematic diagram of the structure of a laser annealing system provided in this application;

[0024] Figure 2 It is a structural schematic diagram of the air intake unit and the air extraction unit;

[0025] Figure 3 It is a schematic diagram of the structure of the horizontal motion unit, the vertical motion unit and the closed chamber;

[0026] Figure 4 Schematic diagram of the structure of the laser unit.

[0027] In the figure: 1-machine platform; 11-vacuum generator; 2-horizontal motion unit; 21-x-motion mechanism; 211-first guide rail; 212-first slider; 22-y-motion mechanism; 221-second guide rail; 222-second slider; 3-laser unit; 31-laser; 32-sealed housing; 4-sealed chamber; 41-transparent glass; 42-mounting plate; 43-adsorption platform; 44-pressure gauge; 45-automatic valve; 5-vertical motion unit; 51-drive Parts; 52-vertical guide rail; 53-vertical slider; 6-air intake unit; 61-air intake pipe; 62-pressure reducing valve; 63-air intake pneumatic diaphragm valve; 64-flow control meter; 7-air extraction unit; 71-vacuum generator; 72-air extraction pipe; 73-air outlet pneumatic diaphragm valve; 74-oxygen content sensor; 8-laser rangefinder; 9-sealed gas supply unit; 91-compressed air triplex; 92-compressed air water vapor separation component; 93-filter; 94-pressure regulating valve. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the embodiments in the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.

[0029] In order to make the above-mentioned objects, features and advantages of the present application more obvious and easy to understand, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0030] This application provides a laser annealing system, referring to Figure 1-4 ,include:

[0031] A machine platform 1, wherein a horizontal motion unit 2 and a laser unit 3 are installed on the machine platform 1, a closed chamber 4 and a vertical motion unit 5 are arranged on the horizontal motion unit 2, a product to be processed is placed in the closed chamber 4, the top of the closed chamber 4 is a transparent glass 41, the closed chamber 4 is installed on the vertical motion unit 5, the horizontal motion unit 2 drives the closed chamber 4 to move in the x direction and the y direction, and the vertical motion unit 5 drives the closed chamber 4 to move in the z direction;

[0032] The air intake unit 6 and the air exhaust unit 7 are both connected to the closed chamber 4. Under the action of the air exhaust unit 7, the air in the closed chamber 4 is discharged while the air intake unit 6 introduces inert gas into the closed chamber 4.

[0033] In this embodiment, the product to be processed is placed in the sealed chamber 4, and then the exhaust unit 7 starts to start, exhausting the air in the sealed chamber 4, while the air intake unit 6 introduces inert gas into the sealed chamber 4 until the pressure and oxygen content in the sealed chamber 4 reach a preset value. Under the action of the horizontal motion unit 2, the sealed chamber 4 moves in the x direction and the y direction (such as Figure 3 The laser unit 3 is started and fixed, and the product to be processed (the product to be processed in this embodiment refers to a silicon carbide wafer) is moved by moving the closed chamber 4 in the horizontal direction, so as to achieve the purpose of the laser unit scanning the entire product to be processed for laser annealing. The setting of the vertical motion unit 5 can make the closed chamber 4 move up and down in the z direction, so as to adapt to products to be processed of different thicknesses, and the product to be processed and the platform on which the product to be processed is placed may be uneven. The vertical motion unit 5 can adjust the height of the closed chamber 4 in real time according to the detected flatness of the product to be processed, thereby adjusting the height between the product to be processed and the light output point of the laser unit 3 in real time, ensuring the flatness of the processing focal plane of the product to be processed, so that the processed product has better consistency and uniformity.

[0034] The top of the sealed chamber 4 is provided with a transparent glass 41 , and the light transmittance of the transparent glass 41 should be such that the laser beam emitted by the laser unit 3 can pass through the transparent glass 41 and irradiate the product to be processed to complete laser annealing.

[0035] Specifically, refer to Figure 3 , the horizontal motion unit 2 includes an x-direction motion mechanism 21 and a y-direction motion mechanism 22, the x-direction motion mechanism 21 includes a first guide rail 211 mounted on the machine platform 1 and a first slider 212 slidably connected to the first guide rail 211;

[0036] The y-axis motion mechanism 22 includes a second guide rail 221 and a second slider 222 . The second guide rail 221 is mounted on the first slider 212 . The second slider 222 is slidably connected to the second guide rail 221 . The sealed chamber 4 is mounted on the second slider 222 via a mounting plate 42 .

[0037] It can be understood that the x-direction motion mechanism 21 of the present embodiment further includes an x-direction driving member (not shown in the figure), and the y-direction motion mechanism 22 further includes a y-direction driving member (not shown in the figure). Under the action of the x-direction driving member, the first slider 212 slides on the first guide rail 211, so that the y-direction motion mechanism 22 and the closed chamber 4 move together in the x-direction, and under the action of the y-direction driving member, the second slider 222 slides on the second guide rail 221, so that the closed chamber 4 moves in the y-direction, so that the entire width of the product to be processed in the closed chamber 4 is scanned by the laser.

[0038] refer to Figure 4 The laser unit 3 includes a laser 31 and a sealed shell 32. An optical component is provided in the sealed shell 32. The light outlet of the sealed shell 32 is located above the closed chamber 4. The laser beam emitted by the laser 31 is transmitted out of the sealed shell 32 from the light outlet through the optical component.

[0039] The laser beam generated by the laser 31 is shaped and focused by optical components to obtain the required processing spot, and then passes through the transparent glass 41 through the light outlet to act on the product to be processed, so as to perform laser scanning on the product to be processed and complete laser annealing.

[0040] Furthermore, a laser rangefinder 8 is installed in the sealed housing 32 , and a testing end of the laser rangefinder 8 is facing the light outlet, so that the flatness of the entire surface of the product to be processed is detected by the laser rangefinder 8 .

[0041] Continue to refer Figure 3 The vertical motion unit 5 includes a driving member 51, a vertical guide rail 52 and a vertical slider 53. The driving member 51 is installed on the mounting plate 42 through a mounting frame. The vertical guide rail 52 is vertically installed on the outer wall of the closed chamber 4. The vertical slider 53 is installed on the mounting frame. The vertical slider 53 is slidably connected to the vertical guide rail 52. The power output end of the driving member 51 is connected to the closed chamber 4.

[0042] The x-axis driving member, y-axis driving member and driving member 51 used in this embodiment are all existing technologies, such as air cylinders, oil cylinders, etc. This embodiment does not make any specific limitations on this, as long as it can provide power to enable the closed chamber 4 to move in the x-direction, y-direction and z-direction.

[0043] In this embodiment, the laser annealing system also includes a control system (not shown in the figure). The laser rangefinder 8 transmits the full-width surface flatness detection result of the product to be processed to the control system. The control system starts the driving member 51 according to the detection result. Under the action of the driving member 51, the closed chamber 4 moves up and down along the z direction, and the vertical guide rail 52 slides up and down relative to the vertical slider 53, thereby adjusting the height of the closed chamber 4 relative to the machine 1 in real time to ensure the flatness of the focal plane of the product to be processed, so that the processed products have good consistency and uniformity.

[0044] In order to form a closed space in the sealed housing 32, the present application introduces sealed gas into the sealed housing 32 through a sealed gas supply unit 9. Specifically, the sealed gas supply unit 9 includes a compressed air supply unit (not shown in the figure), a compressed air triplet 91, a compressed air water-gas separation component 92 and a filter 93. The compressed air supply unit, the compressed air triplet 91, the compressed air water-gas separation component 92, the filter 93 and the sealed housing 32 are sequentially connected through an air supply pipeline (not shown in the figure), and a pressure regulating valve 94 is provided on the air supply pipeline between the filter 93 and the sealed housing 32.

[0045] The compressed air provided by the compressed air supply unit is processed by the compressed air triplet 91, the compressed air moisture separation component 92 and the filter 93 in sequence and then transmitted to the sealed housing 32. Before being transmitted to the sealed housing 32, the pressure is adjusted by the pressure regulating valve 94, so that the compressed air entering the sealed housing 32 has a high degree of cleanliness and a stable pressure, ensuring that the optical components are in a clean micro-positive pressure environment, thereby eliminating the need for regular cleaning and maintenance of the optical components, so that the optical path of the laser beam emitted by the laser 31 in the sealed housing 32 will not be disturbed by dust and the like.

[0046] In order to further save the installation space of the equipment, in this embodiment, the compressed air triplex 91 , the compressed air water-gas separation component 92 , the filter 93 and the pressure regulating valve 94 are preferably installed on the same side wall of the machine 1 .

[0047] Continue to refer Figure 3 An adsorption platform 43 is provided in the closed chamber 4. The adsorption platform 43 includes an adsorption cavity and a plurality of adsorption holes connected to the adsorption cavity. The adsorption cavity is connected to a vacuum generator 11 installed on the machine 1. When the product to be processed is placed on the adsorption platform 43, the vacuum generator 11 is started to evacuate the adsorption cavity, and the product to be processed is adsorbed on the adsorption platform 43 through the plurality of adsorption holes to avoid the product to be processed from moving during the laser scanning process of the closed chamber 4, which may affect the laser annealing effect.

[0048] Furthermore, an opening is provided on one side wall of the sealed chamber 4, and the opening is opened or closed by an automatic valve 45. When the product to be processed needs to be placed on the adsorption platform 43, the automatic valve 45 is opened, and when the product to be processed is placed on the adsorption platform 43, the automatic valve 45 is closed, so that a sealed space is formed in the sealed chamber 4.

[0049] A pressure gauge 44 is also installed on the mounting plate 42 of the present embodiment, and the pressure in the sealed chamber is detected by the pressure gauge 44 .

[0050] like Figure 2As shown, the air extraction unit 7 includes a vacuum generator 71 and an air extraction pipeline 72. The vacuum generator 71 is connected to the closed chamber 4 through the air extraction pipeline 72. The air extraction pipeline 72 is provided with an air outlet pneumatic diaphragm valve 73 and an oxygen content sensor 74.

[0051] The air intake unit 6 includes an air supply part and an air intake pipe 61 . The air supply part is connected to the closed chamber 4 through the air intake pipe 61 . The air intake pipe 61 is provided with a pressure reducing valve 62 , an air intake pneumatic diaphragm valve 63 and a flow control meter 64 .

[0052] The inert gas supplied by the gas supply unit of this embodiment is preferably nitrogen. The nitrogen supplied by the gas supply unit passes through the pressure reducing valve 62, the air intake pneumatic diaphragm valve 63 and the flow control meter 64 in sequence and then is transmitted to the closed chamber 4. The nitrogen first passes through the pressure reducing valve 62 to ensure that the nitrogen transmitted in the air intake pipe 61 has a stable pressure and protects the various components arranged on the air intake pipe 61. The settings of the air intake pneumatic diaphragm valve 63 and the air outlet pneumatic diaphragm valve 73 can automatically open or close the corresponding airway. The setting of the flow control meter 64 can control the size of the gas flow entering the closed chamber 4. The setting of the oxygen content sensor 74 can monitor the oxygen content of the gas entering the exhaust pipe 72 of the closed chamber 4.

[0053] In order to further save the installation space of the equipment, the pressure reducing valve 62, the air inlet pneumatic diaphragm valve 63, the flow control meter 64, the vacuum generator 71, the air outlet pneumatic diaphragm valve 73 and the oxygen content sensor 74 are all installed on the side wall of the machine 1, preferably, installed on the same side wall of the machine 1 as the sealing gas supply unit 9.

[0054] It can be understood that the automatic valve 45, vacuum generator 11, x-axis drive, y-axis drive, drive 51, laser rangefinder 8, axis vacuum generator 71, air inlet pneumatic diaphragm valve 63, air outlet pneumatic diaphragm valve 73, flow control meter 64, oxygen content sensor 74, pressure gauge 44 and laser 31 of the present application are all connected to the control system, so that the automatic operation of each component is realized through the control system.

[0055] Specifically, when the product to be processed is adsorbed on the adsorption platform 43 and the control system controls the automatic valve 45 to close, the air inlet pneumatic diaphragm valve 63 and the air outlet pneumatic diaphragm valve 73 are opened, so that the air inlet pipe 61 connects the air supply part and the closed chamber 4, and the air exhaust pipe 72 connects the vacuum generator 72 and the closed chamber 4; then the vacuum generator 71 starts to start, extracts the air in the closed chamber 4, and passes the inert gas in the air supply part into the closed chamber 4. When the pressure gauge 44 reaches a certain pressure value, the flow controller 64 automatically adjusts the air intake according to the pressure in the closed chamber 4 detected by the pressure gauge 44. In this process, the oxygen content detected by the oxygen content sensor 74 continues to decrease. When the oxygen content drops to the set value, the air outlet pneumatic diaphragm valve 73 is closed. At this time, there will be a slight leakage in the closed chamber 4. The flow controller 64 adjusts the air intake according to the pressure value detected by the pressure gauge 44, so that the pressure and oxygen content in the closed chamber 4 finally reach the required values.

[0056] After the pressure and oxygen content in the closed chamber 4 are adjusted, the horizontal motion unit 2 drives the closed chamber 4 to move to the bottom of the laser rangefinder 8 to detect the flatness of the full-width surface of the product to be processed, and uploads the detection results to the control system. Then the laser 31 is started, and the closed chamber 4 is moved in the x-direction and y-direction through the x-direction motion mechanism 21 and the y-direction motion mechanism 22 to perform a full-width laser scan of the product to be processed. In this process, the driving member 51 automatically starts according to the results detected by the laser rangefinder 8, drives the closed chamber 4 to move upward or downward, adjusts the height between the product to be processed and the light-emitting point of the laser beam, ensures the consistency of the flatness of the focal plane during the processing of the product to be processed, and makes the product have high consistency and uniformity after laser annealing.

[0057] After the laser annealing is completed, the automatic valve 45 is opened, and the above steps are repeated to perform laser annealing on the next wafer to be processed.

[0058] The specific structure of the control system used in this embodiment is the existing technology. For example, the control system can be a PLC, as long as it can realize the automatic operation of each component.

[0059] The laser annealing system provided in the present application can quickly establish a stable pressure and low-oxygen environment atmosphere for the closed chamber 4, and can detect the flatness of the product to be processed in real time, and automatically adjust the processing height according to the detection results, so that the product has better consistency and uniformity after laser annealing.

[0060] In addition, the x-axis motion mechanism 21 and the y-axis motion mechanism 22 of the present application can ensure a faster speed and higher positioning accuracy during the processing, thereby effectively improving the pulse width of the laser 31. All optical components are arranged in the sealed housing 32, and the sealed gas supply unit 9 is used to provide sealing gas to the sealed housing 32 to ensure that each optical component is in a clean environment, thereby eliminating the need for cleaning and maintenance of each optical component.

[0061] The optical components used in this application are existing technologies, as long as they can shape the laser beam emitted by the laser 31 to obtain the required processing spot.

[0062] In this specification, each embodiment is described in a progressive, parallel, or progressive and parallel manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other. For the device disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part.

[0063] It should be noted that in the description of the present application, it should be understood that the terms "upper", "lower", "top", "bottom", "inside", "outside" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the drawings, which are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. When a component is considered to be "connected" to another component, it may be directly connected to the other component or there may be a centrally arranged component at the same time.

[0064] It should also be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprises", "comprising" or any other variants thereof are intended to cover non-exclusive inclusion, so that an article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, the elements defined by the sentence "comprising a ..." do not exclude the existence of other identical elements in the article or device including the above elements.

[0065] The above description of the disclosed embodiments enables those skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A laser annealing system, characterized in that: include: A machine platform (1), wherein a horizontal motion unit (2) and a laser unit (3) are installed on the machine platform (1), a closed chamber (4) and a vertical motion unit (5) are arranged on the horizontal motion unit (2), a product to be processed is placed in the closed chamber (4), the top of the closed chamber (4) is a transparent glass (41), the closed chamber (4) is installed on the vertical motion unit (5), the horizontal motion unit (2) drives the closed chamber (4) to move in the x-direction and the y-direction, and the vertical motion unit (5) drives the closed chamber (4) to move in the z-direction; An air intake unit (6) and an air exhaust unit (7), wherein the air intake unit (6) and the air exhaust unit (7) are both connected to the closed chamber (4); under the action of the air exhaust unit (7), the air in the closed chamber (4) is exhausted, while the air intake unit (6) allows inert gas to be introduced into the closed chamber (4).

2. A laser annealing system according to claim 1, characterized in that: The horizontal motion unit (2) comprises an x-direction motion mechanism (21) and a y-direction motion mechanism (22); the x-direction motion mechanism (21) comprises a first guide rail (211) mounted on the machine platform (1) and a first sliding block (212) slidably connected to the first guide rail (211); The Y-axis motion mechanism (22) comprises a second guide rail (221) and a second slider (222); the second guide rail (221) is mounted on the first slider (212); the second slider (222) is slidably connected to the second guide rail (221); and the sealed chamber (4) is mounted on the second slider (222) via a mounting plate (42).

3. A laser annealing system according to claim 2, characterized in that: The vertical motion unit (5) comprises a driving member (51), a vertical guide rail (52) and a vertical sliding block (53); the driving member (51) is mounted on the mounting plate (42) via a mounting frame; the vertical guide rail (52) is vertically mounted on the outer side wall of the closed chamber (4); the vertical sliding block (53) is mounted on the mounting frame; the vertical sliding block (53) is slidably connected to the vertical guide rail (52); and a power output end of the driving member (51) is connected to the closed chamber (4).

4. A laser annealing system according to claim 1, characterized in that: The air extraction unit (7) comprises a vacuum generator (71) and an air extraction pipeline (72); the vacuum generator (71) is connected to the closed chamber (4) via the air extraction pipeline (72); and the air extraction pipeline (72) is provided with an air outlet pneumatic diaphragm valve (73) and an oxygen content sensor (74).

5. A laser annealing system according to claim 1, characterized in that: The air intake unit (6) comprises an air supply portion and an air intake pipe (61); the air supply portion is connected to the closed chamber (4) via the air intake pipe (61); and the air intake pipe (61) is provided with a pressure reducing valve (62), an air intake pneumatic diaphragm valve (63) and a flow control meter (64).

6. A laser annealing system according to any one of claims 1 to 5, characterized in that: The laser unit (3) comprises a laser (31) and a sealed housing (32); an optical component is arranged inside the sealed housing (32); a light outlet of the sealed housing (32) is located above the sealed chamber (4); and a laser beam emitted by the laser (31) is transmitted from the light outlet to exit the sealed housing (32) via the optical component.

7. A laser annealing system according to claim 6, characterized in that: A laser rangefinder (8) is installed in the sealed housing (32), the test end of the laser rangefinder (8) is facing the light outlet, and the vertical motion unit (5) drives the sealed chamber (4) to move upward or downward according to the test result of the laser rangefinder (8).

8. A laser annealing system according to claim 6, characterized in that: The invention also comprises a sealing gas supply unit (9), wherein the sealing gas supply unit (9) comprises a compressed air supply part, a compressed air triplet (91), a compressed air water-gas separation part (92) and a filter (93); the compressed air supply part, the compressed air triplet (91), the compressed air water-gas separation part (92), the filter (93) and the sealing shell (32) are connected in sequence through an air supply pipeline; a pressure regulating valve (94) is provided on the air supply pipeline between the filter (93) and the sealing shell (32).

9. The laser annealing system according to claim 1, characterized in that: An adsorption platform (43) is provided in the sealed chamber (4), and the product to be processed is adsorbed on the adsorption platform (43).

10. A laser annealing system according to claim 2, characterized in that: A pressure gauge (44) is mounted on the mounting plate (42), and the pressure in the sealed chamber (4) is detected by the pressure gauge (44); and / or, The side wall of the sealed chamber (4) is provided with an opening, which is opened or closed by an automatic valve (45).

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