Wireless charger with hidden air port

Abstract

The wireless charger comprises an outer shell, a heat dissipation module, a charging module and an air duct are arranged in the outer shell, the heat dissipation module comprises a heat dissipation base, a semiconductor chilling plate and a fan, the charging module comprises a control circuit board, the heat dissipation base is made of heat conduction materials, and the semiconductor chilling plate is made of a heat conduction material. The upper side and the lower side of the heat dissipation base abut against the semiconductor chilling plate and the control circuit board respectively, the fan is arranged below the control circuit board, an air outlet is formed in one side of the outer shell, and the two ends of the air channel are arranged on the side face of the fan and the side face of the heat dissipation base respectively. And air blown out by the fan sequentially passes through the air duct, the heat dissipation seat and the air outlet. According to the mobile phone, the heat dissipation base made of the heat conduction material is arranged, the two sides of the heat dissipation base abut against the semiconductor chilling plate and the control circuit board respectively, the internal fan is converted into heat dissipation of the heat dissipation base and the control circuit board from traditional heat dissipation of the mobile phone, and therefore the air outlet can be formed in the side face of the outer shell and is hidden below the panel, and the heat dissipation effect is improved. External foreign matters are effectively prevented from entering, and normal work of the wireless charger is ensured.

Description

Technical Field

[0001] The utility model relates to the technical field of wireless charging, and in particular to a wireless charger with a hidden air outlet. Background Art

[0002] A wireless charger refers to a charger that does not use a traditional charging power cord to connect to the terminal device that needs to be charged. With the widespread use of mobile phones with wireless charging functions, the addition of wireless charging functions for mobile phones in mobile phone storage boxes in cars has become more and more widely used. In order to ensure that the mobile phone can be charged continuously and stably and safely while the vehicle is driving, a panel or anti-slip mat for placing the mobile phone is usually installed above the car wireless charger; when the mobile phone is wirelessly charged, the mobile phone coil will heat up, causing the temperature of the mobile phone to rise, triggering the temperature protection of the mobile phone, resulting in a decrease in charging power and prolonged charging time; as the charging power supported by the mobile phone becomes larger and larger, the heat generated by the mobile phone during charging becomes larger and larger, and the heat dissipation demand for the mobile phone during wireless charging is further increased. More and more car wireless chargers use fans to dissipate heat from the mobile phone to extend the time the mobile phone enters temperature protection, thereby shortening the charging time of the mobile phone and improving the user experience.

[0003] At present, most of the in-vehicle wireless charging modules on the market use fans to dissipate heat for mobile phones, mainly by opening an air outlet on the panel or anti-skid mat where the mobile phone is placed for charging, connecting the fan blades through an air duct, and using the air duct to allow the fan wind to blow directly to the mobile phone placed on the panel through the air outlet, thereby cooling the mobile phone; the air outlet needs to be exposed on the panel or anti-skid mat where the mobile phone is placed for charging; in this structure where the air outlet is set on the surface, foreign objects (such as biscuit crumbs, milk tea) may fall into the wireless charger through the air outlet during use, and fall into the fan position through the air duct, causing the fan to be blocked, abnormal noise, etc., making the wireless charger The heat dissipation effect of the appliance is reduced, and the noise generated will also affect the user experience; secondly, other structures in the wireless charger, such as the PCB board, will also generate a certain amount of heat during operation. Since the wind blown by the fan is directly sent to the mobile phone on the panel through the air duct and the air outlet, the heat generated by the PCB board is easily accumulated and cannot be dissipated in time. If it is exposed to high temperature for a long time, it is easy to cause damage to the PCB board; in addition, since the air outlet is exposed, the panel or anti-slip mat where the mobile phone is placed for charging needs to take into account the design of the air duct and the air outlet, which will affect the selectivity of the appearance and shape to a certain extent, and cannot bring a good sensory experience to the user. Utility Model Content

[0004] In view of this, in order to solve the problems existing in the above-mentioned prior art, the utility model provides a wireless charger with a hidden air vent.

[0005] A wireless charger with hidden air outlet comprises an outer shell, wherein a heat dissipation module, a charging module and an air duct are arranged inside the outer shell, the heat dissipation module comprises a heat sink, a semiconductor cooling sheet and a fan, the charging module comprises a control circuit board, the heat sink is made of a heat-conducting material, the upper and lower sides of the heat sink are respectively abutted against the semiconductor cooling sheet and the control circuit board, the fan is arranged below the control circuit board, an air outlet is opened on one side of the outer shell, the two ends of the air duct are respectively arranged on the sides of the fan and the heat sink, and the wind blown by the fan passes through the air duct, the heat sink and the air outlet in sequence.

[0006] In the above technical scheme, the wireless charger is arranged below the vehicle interior panel or other panel structure, the top of the outer shell is connected to the panel structure, and the mobile phone (or other electronic device) is placed on the panel structure when charging; the top surface of the semiconductor refrigeration element in the outer shell can be actively cooled, and the cold air is transferred to the mobile phone above to dissipate the heat of the mobile phone, thereby extending the time for the mobile phone to enter temperature protection when charging. While the top surface of the semiconductor refrigeration sheet is cooled, the bottom surface will generate heat. The two sides of the heat sink are respectively in contact with the bottom surface of the semiconductor refrigeration sheet and the control circuit board. Since the heat sink is made of heat-conducting material, the heat generated on the bottom surface of the semiconductor refrigeration sheet and part of the heat on the control circuit board are concentrated on the heat sink through contact conduction. The wind blown out by the fan below the control circuit board reaches the heat sink after passing through the air duct, takes away the heat on the heat sink and the control circuit board, and discharges it from the air outlet, thereby avoiding damage to the control circuit board due to excessive temperature.

[0007] It should be noted that the present application uses a semiconductor refrigeration sheet for active cooling, and collects the heat of the semiconductor refrigeration sheet through a heat sink, so the air outlet is arranged on the side of the outer shell, so that the heat concentrated on the heat sink and the heat generated on the control circuit board can be taken away from the air outlet in cooperation with the fan, and the fan transforms the traditional heat dissipation of the mobile phone into the heat dissipation of the heat sink and the control circuit board, wherein the heat sink can absorb the heat around the control circuit board to a certain extent, accelerate the heat dissipation rate, so that the control circuit board is always in a lower temperature environment, ensuring its normal operation, while in the prior art, since it is necessary to use a fan to directly blow air to the mobile phone for heat dissipation, it is necessary to open an air outlet on the panel so that the wind blown by the fan can Blown out from the air outlet, this design can easily cause external foreign matter to fall into the wireless charger from the air outlet on the panel, increasing the risk of fan blocking and seriously affecting the normal use of the wireless charger. The present application converts the heat dissipation of the mobile phone by the fan into heat dissipation of the heat sink, so there is no need to open an air outlet on the panel. The air outlet can be set on the side of the outer shell so that the air outlet is hidden under the panel, so that the wireless charger is completely placed in the interior space of the vehicle in a dustproof and waterproof environment, avoiding the entry of external foreign matter, which is conducive to ensuring the normal operation of the wireless charger and its service life. At the same time, since there is no need to open an air outlet on the panel where the mobile phone is placed, the appearance of the panel can also be richer, helping to enhance the user's sensory experience.

[0008] Furthermore, the charging module and the heat dissipation module are located on the same side of the outer shell, the air duct is located on the other side of the outer shell, and the air outlet is provided on the surface of the outer shell away from the air duct.

[0009] In the above technical solution, the air duct is integrally arranged on the sides of the charging module and the heat dissipation module to ensure that all the wind blown out by the fan is sent to the heat dissipation seat through the air duct, thereby increasing the air volume reaching the heat dissipation seat and enhancing the heat dissipation effect of the heat dissipation seat.

[0010] Furthermore, the semiconductor refrigeration plate includes a cooling surface and a heating surface that are arranged opposite to each other, the cooling surface faces the top of the outer shell, and the heating surface faces the heat sink and abuts against the heat sink.

[0011] In the above technical solution, the two sides of the semiconductor refrigeration sheet are respectively a cooling surface and a heating surface. When the cooling surface performs active cooling, the heating surface generates heat. The cooling surface faces the top of the outer shell and is used to transfer cold air to electronic devices such as mobile phones placed on the panel to dissipate heat. The heating surface faces the heat sink and contacts the heat sink to transfer the generated heat to the heat sink.

[0012] Furthermore, a receiving groove is formed on the top surface of the heat sink, the semiconductor cooling plate is installed in the receiving groove, and the heating surface abuts against the bottom surface of the receiving groove.

[0013] In the above technical solution, the heat-generating surface of the semiconductor cooling plate is installed downward in the receiving groove, and the heat-generating surface contacts the bottom surface of the receiving groove to ensure that the heat can be transferred to the heat sink.

[0014] Furthermore, ventilation openings are provided on both sides of the heat sink.

[0015] In the above technical solution, the ventilation opening on one side of the heat sink is arranged corresponding to the air outlet, and the ventilation opening on the other side is arranged corresponding to one end of the air duct. The wind blown out by the fan passes through the air duct and reaches the air outlet through the ventilation openings on both sides of the heat sink, taking away the heat on the heat sink, thereby achieving heat dissipation of the heat sink.

[0016] Furthermore, a plurality of heat dissipation fins which are distributed in parallel and at intervals are provided at the bottom of the heat dissipation seat, and the heat dissipation fins are distributed between the two ventilation openings.

[0017] In the above technical solution, the heat dissipation fins are used to help increase the heat dissipation area of ​​the heat sink and speed up the heat dissipation. The heat dissipation fins are distributed between the two ventilation openings and are cooled by the wind blown by the fan.

[0018] Furthermore, the outer shell includes an upper cover, a base and a fan box seat which are sequentially arranged and connected from top to bottom, the fan is arranged in the fan box seat, and an air inlet is opened at the bottom of the fan box seat.

[0019] In the above technical solution, the outer shell is composed of an upper cover, a base and a fan box seat. The fan is installed in the fan box seat. The fan box seat is connected to the bottom of the base by screws and other parts, which makes it convenient to disassemble the fan box seat to clean the fan. An air inlet is provided at the bottom of the fan box seat for air intake when the fan is working.

[0020] Furthermore, matching slots and buckles are respectively provided on both sides of the upper cover and the base, and a receiving cavity is formed inside when the upper cover and the base are buckled and connected, and the heat sink, the semiconductor cooling plate and the control circuit board are all arranged in the receiving cavity.

[0021] In the above technical solution, the upper cover and the base are connected in a detachable snap-fitting manner through the card slots and the buckles, which facilitates disassembly and assembly. After the upper cover and the base are snap-fitted, a receiving cavity for accommodating other components is formed inside.

[0022] Furthermore, a cavity is provided on one side of the fan box seat, and the cavity and one side of the accommodating cavity together constitute the air duct.

[0023] In the above technical solution, an opening is provided on one side of the cavity at the top of the fan box seat, and an opening is also provided correspondingly at the bottom of the base, so that after the fan box seat is connected to the bottom of the base, this section of the cavity of the fan box seat is connected to the accommodating cavity, thereby forming an air duct.

[0024] Furthermore, the charging module also includes a charging coil and a filter plate. The charging coil is arranged on the inner side of the upper cover and above the semiconductor cooling plate. The filter plate is arranged on the top of the outer side of the upper cover.

[0025] In the above technical solution, the charging coil is located above the semiconductor refrigeration plate. The cold air emitted by the cooling surface of the semiconductor refrigeration plate passes through the charging coil and then reaches the bottom of the panel. The filter plate is arranged on the top of the outer side of the upper cover to reduce electromagnetic interference during charging and filter out clutter.

[0026] Compared with the prior art, the beneficial effects of this application are:

[0027] The present application is provided with a heat sink made of thermally conductive material, and the two sides of the heat sink are respectively in contact with the semiconductor refrigeration plate and the control circuit board, so that the heat generated by the semiconductor refrigeration plate is concentrated on the heat sink, thereby preventing the control circuit board from being damaged due to excessive temperature. At the same time, the wind blown by the fan can take away the heat concentrated on the heat sink and the heat on the control circuit board from the air outlet. The fan transforms the traditional heat dissipation of the mobile phone into heat dissipation of the heat sink and the control circuit board. Therefore, there is no need to open an air outlet on the panel. The present application arranges the air outlet on the side of the outer shell so that the air outlet is hidden under the panel, realizing a hidden design of the air outlet, so that the wireless charger is completely placed in the interior space of the vehicle, effectively preventing the entry of external foreign matter, which is conducive to ensuring the normal operation of the wireless charger and its service life. At the same time, since there is no need to open an air outlet on the panel where the electronic equipment is placed, the appearance of the panel can also be richer, which helps to enhance the user's sensory experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0029] Figure 1 FIG. 1 is an exploded view of a wireless charger according to an embodiment of the present invention.

[0030] Figure 2 for Figure 1 Enlarged view of position A in the middle.

[0031] Figure 3This is a schematic diagram of the structure of the wireless charger of the present application installed behind a panel.

[0032] Figure 4 for Figure 3 Top view of the .

[0033] Figure 5 for Figure 4 Cross-sectional view at position AA.

[0034] Figure 6 This is a schematic diagram of the internal status of the wireless charger when it is working (the arrow in the figure indicates the wind direction).

[0035] Description of reference numerals in the figures:

[0036] 1-outer shell; 11-upper cover; 111-card slot; 12-base; 121-clip; 13-fan box seat; 131-screw; 14-air duct; 15-air outlet; 16-air inlet; 2-semiconductor refrigeration plate; 21-cooling surface; 22-heating surface; 3-heat sink; 31-receiving groove; 32-ventilation opening; 33-heat sink fin; 4-control circuit board; 5-fan; 6-charging coil; 7-filter board; 8-panel; 9-mobile phone. DETAILED DESCRIPTION

[0037] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, rather than all the embodiments. The components of the embodiments of the present application described and shown in the drawings here can be arranged and designed in various different configurations.

[0038] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for which protection is sought, but merely represents selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0039] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0040] Please refer to Figures 1 to 6In a preferred embodiment of the present application, a wireless charger with a hidden air outlet is provided, which is mainly used for wireless charging of a mobile phone 9 in a vehicle environment. The wireless charger comprises an outer shell 1, in which a heat dissipation module, a charging module and an air duct 14 are arranged. The heat dissipation module comprises a heat dissipation seat 3, a semiconductor cooling sheet 2 and a fan 5. The charging module comprises a control circuit board 4. The heat dissipation seat 3 is made of a thermally conductive material. The upper and lower sides of the heat dissipation seat 3 are respectively in contact with the semiconductor cooling sheet 2 and the control circuit board 4. The fan 5 is arranged below the control circuit board 4. An air outlet 15 is provided on one side of the outer shell 1. The two ends of the air duct 14 are respectively arranged on the sides of the fan 5 and the heat dissipation seat 3. The wind blown out by the fan 5 passes through the air duct 14, the heat dissipation seat 3 and the air outlet 15 in sequence.

[0041] In specific settings, this wireless charger is installed under the vehicle interior panel or the charging dedicated panel (hereinafter referred to as the panel). Figure 3 As shown, the top of the outer shell 1 is connected to the bottom of the panel 8, and the mobile phone 9 is placed on the panel 8 structure when charging; the top surface of the semiconductor refrigeration element in the outer shell 1 can be actively cooled, and the cold air is transferred to the mobile phone 9 above to dissipate the heat of the mobile phone 9, thereby extending the time for the mobile phone 9 to enter the temperature protection when charging. While the top surface of the semiconductor refrigeration sheet 2 is cooled, the bottom surface will generate heat. The two sides of the heat sink 3 are respectively in contact with the bottom surface of the semiconductor refrigeration sheet 2 and the control circuit board 4. Since the heat sink 3 is made of heat-conducting material, the heat generated on the bottom surface of the semiconductor refrigeration sheet 2 and the heat on the control circuit board 4 are concentrated on the heat sink 3 through contact conduction. The wind blown out by the fan 5 under the control circuit board 4 reaches the heat sink 3 after passing through the air duct 14, and the heat on the heat sink 3 and the heat on the control circuit board 4 are taken away and discharged from the air outlet 15, thereby avoiding the control circuit board 4 from being damaged due to excessive temperature. Among them, the heat sink 3 can absorb the heat around the control circuit board 4 to a certain extent, accelerate the heat loss rate, so that the control circuit board 4 is always in a relatively low temperature environment, ensuring its normal and safe working environment.

[0042] In this embodiment, since the heat generated by the semiconductor refrigeration sheet 2 and the control circuit board 4 is concentrated on the heat sink 3, it is only necessary to dissipate the heat from the heat sink 3. In this way, the air outlet 15 is arranged on the side of the outer shell 1 at the same height as the heat sink 3. After the wind blown by the fan 5 dissipates the heat from the heat sink 3, it can be directly blown out from the air outlet 15 on one side. The air outlet 15 is hidden under the panel 8, so that the wireless charger can be completely placed in the interior space of the vehicle, not easily affected by the outside world, and avoiding the entry of external foreign objects, which is conducive to ensuring the normal operation of the wireless charger and its service life. At the same time, since there is no need to open an air outlet on the panel 8 where the mobile phone 9 is placed, the appearance of the panel 8 can also be richer, helping to enhance the user's sensory experience.

[0043] In this embodiment, the air duct 14 is entirely arranged on the right side of the charging module and the heat dissipation module, ensuring that all the wind blown out by the fan 5 is sent to the heat dissipation seat 3 through the air duct 14, thereby increasing the air volume reaching the heat dissipation seat 3 and enhancing the heat dissipation effect of the heat dissipation seat 3.

[0044] Preferably, in some embodiments, Figure 3 , Figure 5 and Figure 6 As shown, in order to increase the width of the air duct 14 and improve the air volume passing through the air duct 14 per unit time, the outer shell 1 is protruded on one side surface of the air duct 14 .

[0045] In this embodiment, the semiconductor refrigeration sheet 2 includes a cooling surface 21 and a heating surface 22 which are arranged opposite to each other. According to the direction shown in the figure, the top surface of the semiconductor refrigeration surface 21 is the cooling surface 21, and the bottom surface is the heating surface 22. According to the thermoelectric effect, when the cooling surface 21 of the semiconductor refrigeration sheet 2 performs active cooling, the heating surface 22 generates heat. When the mobile phone 9 is placed on the panel 8 for charging, the cooling surface 21 can generate cold air upward, and the cold air is transferred to the mobile phone 9 placed on the panel 8 to dissipate heat. At this time, the heat generated by the heating surface 22 is transferred to the heat sink 3.

[0046] In this embodiment, a receiving groove 31 is opened on the top surface of the heat sink 3, and the semiconductor cooling plate 2 is installed in the receiving groove 31. The installation direction is that the cooling surface 21 faces upward and the heating surface 22 faces downward, and the heating surface 22 contacts the bottom surface of the receiving groove 31 to ensure that the heat generated by the heating surface 22 can be transferred to the heat sink 3.

[0047] In this embodiment, ventilation openings 32 are provided on both sides of the heat sink 3 (such as Figure 2 As shown in the enlarged figure), according to Figure 6 In the direction indicated by the arrow, the wind blown by the fan 5 passes through the air duct 14, enters through the ventilation opening 32 on the right side of the heat sink 3, and is discharged from the ventilation opening 32 on the left side of the heat sink 3 to reach the air outlet 15, thereby taking away the heat on the heat sink 3 and achieving heat dissipation of the heat sink 3.

[0048] In this embodiment, a plurality of heat dissipation fins 33 are provided at the bottom of the heat sink 3 and are distributed in parallel and at intervals. The heat dissipation fins 33 are distributed in the portion between the two ventilation openings 32. The wind blown out by the fan 5 directly passes through the plurality of heat dissipation fins 33 to cool the heat dissipation fins 33. The heat dissipation fins 33 are used to help increase the heat dissipation area of ​​the heat sink 3 and speed up the heat dissipation speed.

[0049] In this embodiment, the outer shell 1 includes an upper cover 11, a base 12 and a fan box seat 13 which are arranged and connected in sequence from top to bottom. The fan 5 is arranged in the fan box seat 13, and an air inlet 16 is provided at the bottom of the fan box seat 13. The fan 5 is installed in the fan box seat 13, and an air inlet 16 is provided at the bottom of the fan box seat 13 for air intake when the fan 5 is working. Specifically, the fan box seat 13 is detachably connected to the bottom of the base 12 by screws 131, which is convenient for disassembling the fan box seat 13 to clean the fan 5.

[0050] Specifically, since the side height of the base 12 is relatively small, the air outlet 15 is arranged on the side of the upper cover 11. In addition, when the side height of the base 12 meets the conditions, the air outlet 15 can also be arranged on the side of the base 12, and it is only necessary to ensure that the air outlet 15 and the heat sink 3 are at the same height.

[0051] In this embodiment, card slots 111 are provided on both sides of the upper cover 11, and buckles 121 matching the card slots 111 are provided on both sides of the base 12. The upper cover 11 and the base 12 are detachably connected through the card slots 111 and the buckles 121, which facilitates assembly and disassembly. After the upper cover 11 and the base 12 are buckled together, a accommodating cavity for accommodating other components is formed inside.

[0052] In some embodiments, matching holes are provided on both sides of the upper cover 11 and the base 12, and the upper cover 11 and the base 12 are connected by screws. The use of screws can form a detachable connection between the upper cover 11 and the base 12, which is convenient for disassembly and assembly. In addition to screws, other parts with connecting effects can also be selected, and no specific restrictions are made here.

[0053] In this embodiment, according to Figure 5 and Figure 6 In the direction shown, a cavity is provided on the right side of the fan box seat 13, and the cavity and the right side of the accommodating cavity formed by the upper cover 11 and the base 12 together constitute an air duct 14. An opening is provided on the top of the fan box seat 13 on one side of the cavity, and an opening is also provided on the bottom of the base 12 accordingly, so that after the fan box seat 13 is connected to the base 12, the wind blown by the fan 5 can enter the accommodating cavity to complete the heat dissipation work.

[0054] In this embodiment, the charging module also includes a charging coil 6 and a filter plate 7. The charging coil 6 is arranged on the inner side of the upper cover 11 and is located above the semiconductor refrigeration plate 2. When the cooling surface 21 of the semiconductor refrigeration plate 2 is actively cooled, it can also have a certain degree of heat dissipation effect on the charging coil 6. The filter plate 7 is arranged on the top of the outer side of the upper cover 11. The top surface of the upper cover 11 is provided with a groove for installing the filter plate 7. The left side of the groove has a hole for the pins of the filter plate 7 to pass through. The pins of the filter plate 7 are connected to the control circuit board 4 below. The filter plate 7 is used to reduce electromagnetic interference during charging and filter out clutter to ensure the normal charging operation.

[0055] Specifically, the semiconductor refrigeration chip 2 is connected to the control circuit board 4 through a wiring harness to control the working state of the semiconductor refrigeration chip 2.

[0056] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

[0057] In the description of the present invention, it should be understood that terms such as "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0058] In addition, in the description of the present invention, “plurality” means two or more than two, unless otherwise clearly and specifically defined.

[0059] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

Claims

1. A wireless charger with a hidden air outlet, comprising an outer shell, characterized in that: A heat dissipation module, a charging module and an air duct are provided in the outer shell. The heat dissipation module includes a heat sink, a semiconductor refrigeration sheet and a fan. The charging module includes a control circuit board. The heat sink is made of a heat-conducting material. The upper and lower sides of the heat sink are respectively in contact with the semiconductor refrigeration sheet and the control circuit board. The fan is arranged below the control circuit board. An air outlet is provided on one side of the outer shell. Two ends of the air duct are respectively arranged on the sides of the fan and the heat sink. The wind blown out by the fan passes through the air duct, the heat sink and the air outlet in sequence.

2. The wireless charger with hidden air vent according to claim 1, characterized in that: The charging module and the heat dissipation module are located on the same side of the outer shell, the air duct is located on the other side of the outer shell, and the air outlet is arranged on the surface of the outer shell away from the air duct.

3. The wireless charger with hidden air vent according to claim 1, characterized in that: The semiconductor cooling plate comprises a cooling surface and a heating surface which are arranged opposite to each other. The cooling surface faces the top of the outer shell, and the heating surface faces the heat sink and abuts against the heat sink.

4. The wireless charger with hidden air vent according to claim 3, characterized in that: The top surface of the heat sink is provided with a receiving groove, the semiconductor cooling plate is installed in the receiving groove, and the heating surface is in contact with the bottom surface of the receiving groove.

5. The wireless charger with hidden air vent according to claim 4, characterized in that: Ventilation openings are provided on both sides of the heat dissipation seat.

6. The wireless charger with hidden air vent according to claim 5, characterized in that: The bottom of the heat sink is provided with a plurality of heat sink fins which are distributed in parallel and at intervals, and the heat sink fins are distributed between the two ventilation openings.

7. The wireless charger with hidden air vent according to claim 1, characterized in that: The outer shell comprises an upper cover, a base and a fan box seat which are sequentially arranged and connected from top to bottom. The fan is arranged in the fan box seat, and an air inlet is opened at the bottom of the fan box seat.

8. The wireless charger with hidden air vent according to claim 7, characterized in that: Matching slots and buckles are respectively provided on both sides of the upper cover and the base. When the upper cover and the base are buckled together, a receiving cavity is formed inside. The heat sink, the semiconductor cooling sheet and the control circuit board are all arranged in the receiving cavity.

9. The wireless charger with hidden air vent according to claim 8, characterized in that: A cavity is provided on one side of the fan box seat, and the cavity and one side of the accommodating cavity together constitute the air duct.

10. The wireless charger with hidden air vent according to claim 9, characterized in that: The charging module also includes a charging coil and a filter plate. The charging coil is arranged on the inner side of the upper cover and above the semiconductor cooling plate. The filter plate is arranged on the top of the outer side of the upper cover.

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