BMS cooling structure based on phase change heat dissipation

Abstract

The utility model discloses a BMS cooling structure based on phase change heat dissipation, which comprises a shell, a heat dissipation plate is arranged on the front surface of the shell, a heat conduction paste is adhered to the back surface of the heat dissipation plate, a heat conduction rod is bolted to the back surface of the heat dissipation plate, one end of the heat conduction rod penetrates into the shell, a user can place a BMS main sub-plate in the shell, and the BMS main sub-plate and the heat conduction rod are connected in a bolted manner. The BMS main sub-board is installed through the bolts A, then the paraffin is poured into the shell, the BMS main sub-board is cooled through phase change absorption heat of the paraffin, and therefore the BMS main sub-board can be effectively and conveniently cooled rapidly. According to the device, the heat conduction rod is inserted into the shell, so that the heat conduction rod is in direct contact with paraffin. And then the heat conduction rod transfers the heat of the paraffin to the heat dissipation plate, and meanwhile, the temperature of the shell is transferred to the heat dissipation plate through the heat conduction paste, so that the heat dissipation plate releases the heat through the fins, and rapid heat dissipation of the paraffin can be effectively facilitated.

Description

Technical Field

[0001] The utility model belongs to the technical field of BMS main sub-boards, and particularly relates to a BMS cooling structure based on phase change heat dissipation. Background Art

[0002] The BMS main board is the core component of the battery management system.

[0003] At present, the Chinese utility model with the announcement number CN213847391U discloses a BMS cooling structure based on phase change heat dissipation, including a cooling shell for accommodating a BMS circuit board and containing paraffin, and a first opening is provided at the top of the cooling shell, and the first opening is used to install the BMS circuit board and put paraffin into the cooling shell, and facilitate the BMS wiring harness to pass through. The BMS cooling structure based on phase change heat dissipation of the device has a simple structure and good cooling effect.

[0004] However, the existing BMS cooling structure cannot effectively and quickly dissipate the heat of the BMS main board, and cannot effectively and quickly dissipate the heat of the paraffin. To solve the above problems, we provide a BMS cooling structure based on phase change heat dissipation. Utility Model Content

[0005] The purpose of the utility model is to provide a BMS cooling structure based on phase change heat dissipation to solve the problems raised by the above background technology.

[0006] The above technical purpose of the utility model is achieved through the following technical solutions: a BMS cooling structure based on phase change heat dissipation, including a shell, a heat sink is arranged on the front side of the shell, a thermal paste is adhered to the back side of the heat sink, a thermal rod is bolted to the back side of the heat sink, one end of the thermal rod passes through the interior of the shell, a circular hole matching the thermal rod is opened on the front side of the shell, fins are integrally processed on the front side of the heat sink, bolts A are sleeved on both sides of the shell, and through holes matching the bolts A are opened on both sides of the shell.

[0007] Adopting the above technical solution: the user can place the BMS main sub-board inside the shell, and then install it with bolt A, and then pour paraffin into the shell, and dissipate the heat of the BMS main sub-board through the phase change of paraffin to dissipate the heat, so that the BMS main sub-board can be effectively and quickly dissipated. The device is inserted into the shell through a heat-conducting rod, so that the heat-conducting rod is in direct contact with the paraffin. The heat-conducting rod then transfers the heat of the paraffin to the heat sink, and at the same time, the temperature of the shell is transferred to the heat sink through the thermal paste, so that the heat sink releases the heat through the fins, so that the paraffin can be effectively and quickly dissipated.

[0008] The utility model is further configured that both sides of the shell are bolted with fixing blocks, and bolts B are sleeved inside the fixing blocks.

[0009] By adopting the above technical solution: by setting the bolt B, the device can be effectively installed.

[0010] The utility model is further configured that a bolt C is sleeved inside the heat sink, and one end of the bolt C is threadedly connected to the shell.

[0011] By adopting the above technical solution, the heat sink can be effectively installed by arranging the bolts C.

[0012] The utility model is further configured that a threaded hole 1 adapted to the bolt C is opened on the front side of the shell.

[0013] By adopting the above technical solution: by setting the threaded hole 1, it can be effectively used in conjunction with the bolt C.

[0014] The utility model is further configured that a top cover is provided on the top of the shell, and a bolt D is sleeved inside the top cover.

[0015] By adopting the above technical solution, the top cover can be effectively installed by arranging the bolts D.

[0016] The utility model is further configured that one end of the bolt D is threadedly connected to the housing, and a second threaded hole matched with the bolt D is opened on the top of the housing.

[0017] By adopting the above technical solution: by setting the threaded hole 2, the bolt D can be effectively used.

[0018] In summary, the utility model has the following beneficial effects:

[0019] 1. The user can place the BMS main sub-board inside the shell, and then install it with bolt A, and then pour paraffin into the shell. The paraffin phase changes to absorb heat to dissipate the heat of the BMS main sub-board, which can effectively facilitate the rapid heat dissipation of the BMS main sub-board;

[0020] 2. The device is inserted into the shell through the heat-conducting rod, so that the heat-conducting rod is in direct contact with the paraffin. Then the heat-conducting rod transfers the heat of the paraffin to the heat sink, and at the same time, the temperature of the shell is transferred to the heat sink through the heat-conducting paste, so that the heat sink releases the heat through the fins, thereby effectively facilitating the rapid heat dissipation of the paraffin. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 It is a three-dimensional schematic diagram of the structure of the utility model;

[0022] Figure 2It is an exploded schematic diagram of the utility model structure.

[0023] Figure numerals: 1. shell; 2. heat sink; 3. thermal conductive paste; 4. thermal conductive rod; 5. round hole; 6. fin; 7. bolt A; 8. through hole; 9. fixing block; 10. bolt B; 11. bolt C; 12. top cover; 13. bolt D. DETAILED DESCRIPTION

[0024] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0025] Embodiment 1:

[0026] refer to Figure 1 and Figure 2 A BMS cooling structure based on phase change heat dissipation includes a shell 1, a heat sink 2 is arranged on the front of the shell 1, a heat conductive paste 3 is adhered to the back of the heat sink 2, a heat conductive rod 4 is bolted to the back of the heat sink 2, and one end of the heat conductive rod 4 penetrates into the interior of the shell 1. The user can place the BMS main sub-board inside the shell 1 and then install it with bolts A7, and then pour paraffin into the interior of the shell 1. The BMS main sub-board is dissipated by absorbing heat through the phase change of the paraffin, thereby effectively facilitating the rapid heat dissipation of the BMS main sub-board.

[0027] refer to Figure 1 The housing 1 is bolted with fixing blocks 9 on both sides, and bolts B10 are sleeved inside the fixing blocks 9. By providing the bolts B10, the device can be effectively installed.

[0028] refer to Figure 1 The heat sink 2 is sleeved with a bolt C11, and one end of the bolt C11 is threadedly connected to the housing 1. By providing the bolt C11, the heat sink 2 can be effectively installed.

[0029] refer to Figure 1 The front of the housing 1 is provided with a threaded hole 1 adapted to the bolt C11. By providing the threaded hole 1, the bolt C11 can be effectively used.

[0030] Brief description of the usage process: The user can place the BMS main sub-board inside the shell 1, and then install it through the bolt A7, and then pour paraffin into the inside of the shell 1. The paraffin phase change absorbs heat to dissipate the heat of the BMS main sub-board, thereby effectively facilitating the rapid heat dissipation of the BMS main sub-board.

[0031] Embodiment 2:

[0032] refer to Figure 1 and Figure 2The front of the housing 1 is provided with a circular hole 5 adapted to the heat-conducting rod 4, the front of the heat sink 2 is integrally processed with fins 6, bolts A7 are sleeved on both sides of the housing 1, and through holes 8 adapted to the bolts A7 are provided on both sides of the housing 1. The heat-conducting rod 4 is inserted into the housing 1 so that the heat-conducting rod 4 is in direct contact with the paraffin. Then the heat-conducting rod 4 transfers the heat of the paraffin to the heat sink 2, and at the same time, the temperature of the housing 1 is transferred to the heat sink 2 through the heat-conducting paste 3, so that the heat sink 2 releases the heat through the fins 6, thereby effectively facilitating the rapid heat dissipation of the paraffin.

[0033] refer to Figure 1 A top cover 12 is provided on the top of the housing 1, and bolts D13 are sleeved inside the top cover 12. By providing the bolts D13, the top cover 12 can be effectively installed.

[0034] refer to Figure 1 One end of the bolt D13 is threadedly connected to the housing 1, and a second threaded hole adapted to the bolt D13 is provided on the top of the housing 1. By providing the second threaded hole, the bolt D13 can be effectively used.

[0035] Brief description of the use process: The device is inserted into the housing 1 through the heat-conducting rod 4, so that the heat-conducting rod 4 is in direct contact with the paraffin. Then the heat-conducting rod 4 transfers the heat of the paraffin to the heat sink 2, and at the same time, the temperature of the housing 1 is transferred to the heat sink 2 through the heat-conducting paste 3, so that the heat sink 2 releases the heat through the fins 6, thereby effectively facilitating the rapid heat dissipation of the paraffin.

[0036] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed, but such modifications are protected by patent law as long as they are within the scope of the claims of the present invention.

Claims

1. A BMS cooling structure based on phase change heat dissipation, comprising a housing (1), characterized in that: The front of the shell (1) is provided with a heat sink (2), the back of the heat sink (2) is bonded with a heat conductive paste (3), the back of the heat sink (2) is bolted with a heat conductive rod (4), one end of the heat conductive rod (4) penetrates into the interior of the shell (1), the front of the shell (1) is provided with a circular hole (5) matched with the heat conductive rod (4), the front of the heat sink (2) is integrally processed with a fin (6), both sides of the shell (1) are sleeved with bolts A (7), and both sides of the shell (1) are provided with through holes (8) matched with the bolts A (7).

2. A BMS cooling structure based on phase change heat dissipation according to claim 1, characterized in that: Both sides of the housing (1) are bolted with fixing blocks (9), and bolts B (10) are sleeved inside the fixing blocks (9).

3. A BMS cooling structure based on phase change heat dissipation according to claim 1, characterized in that: A bolt C (11) is sleeved inside the heat dissipation plate (2), and one end of the bolt C (11) is threadedly connected to the housing (1).

4. A BMS cooling structure based on phase change heat dissipation according to claim 3, characterized in that: The front side of the housing (1) is provided with a threaded hole 1 which is compatible with the bolt C (11).

5. A BMS cooling structure based on phase change heat dissipation according to claim 1, characterized in that: A top cover (12) is provided on the top of the housing (1), and a bolt D (13) is sleeved inside the top cover (12).

6. A BMS cooling structure based on phase change heat dissipation according to claim 5, characterized in that: One end of the bolt D (13) is threadedly connected to the housing (1), and a second threaded hole matching the bolt D (13) is provided on the top of the housing (1).

Images