Automatic glue filling device for instrument processing
By designing a glue filling assembly including a split box, a glue filling head, a return pipe, a rubber suction head and an electric telescopic rod, the problem of cumbersome adjustment of the glue filling amount in the prior art is solved, and the effect of efficient glue filling without adjustment is achieved.
Patent Information
- Application Number
- CN202420895025.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-11
- Publication Date
- 2025-04-29
- Estimated Expiration
- 2035-03-11
AI Technical Summary
The existing automatic glue filling device for instrument processing needs to adjust the glue filling amount according to the specifications of the circuit board before filling the glue. The process is cumbersome and is not conducive to efficient operation.
An automatic glue filling device is designed, including body components and glue filling components. The glue filling assembly consists of a split box, a glue filling head, a return pipe, a rubber suction head and an electric telescopic rod. The glue filling is controlled through a rubber filling pump. After the glue filling is completed, the glue suction head extracts glue beyond the standard position and reflows it into the reflow bucket for later use.
There is no need to adjust the amount of glue filling according to the specifications of the circuit board, which greatly improves the practicality of the device, facilitates efficient operation, and accelerates the glue flow through the vibrator and vibrator to improve glue filling efficiency.
Smart Images

Figure CN222805455U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of glue pouring devices, in particular to an automatic glue pouring device for instrument and meter processing. Background Art
[0002] Glue dispensing machine, also known as AB double-liquid glue dispensing machine, is an automated machine that specifically controls fluids and drips, coats, and fills liquids on the surface or inside of products to achieve sealing, fixing, waterproofing and other functions. Generally, two-component glue is used, which is mainly used for bonding, pouring, coating, sealing, and filling of glue, oil and other liquids in product processes. The automated glue dispensing machine can realize the dispensing of irregular shapes such as points, lines, arcs, and circles.
[0003] The existing automatic glue pouring devices for instrumentation processing generally directly perform quantitative glue pouring. However, due to the different circuit board structures of different instruments and meters, there are more components on complex circuit boards. In order to maintain the uniformity of the glue pouring plane, the required glue pouring amount is less, and vice versa. However, it is cumbersome to adjust before each glue pouring, which is not conducive to efficient operation. Therefore, we propose an automatic glue pouring device for instrumentation processing. Utility Model Content
[0004] The utility model aims to solve one of the technical problems existing in the prior art or related technology.
[0005] To this end, the technical solution adopted in this utility model is:
[0006] An automatic glue pouring device for instrument and meter processing, comprising: a body component and a glue pouring component; wherein the body component comprises a mounting frame, a hydraulic rod fixed on the mounting frame, a glue pouring pump installed on the mounting frame, and a liquid inlet pipe and a liquid outlet pipe connected to the glue pouring pump; the glue pouring component is arranged on the mounting frame, and the glue pouring component comprises an adjusting frame sleeved on the mounting frame, a diverter box fixed to the middle of the adjusting frame, a one-way valve 1 installed on the diverter box and connected to the liquid outlet pipe, a glue pouring head fixed to the bottom of the diverter box, a reflux pipe connected to the liquid outlet pipe, a one-way valve 2 arranged on the reflux pipe, a positioning plate fixed to the bottom of the mounting frame, a glue suction head installed on the adjusting frame and connected to the reflux pipe, and an electric telescopic rod fixed between the adjusting frame and the positioning plate.
[0007] In a preferred example, the utility model can be further configured as follows: a reflux funnel connected to the liquid inlet pipe is installed on the mounting frame.
[0008] In a preferred example, the utility model can be further configured as follows: a vibrating rod is embedded in the interior of the positioning plate, and a vibrator electrically connected to the vibrating rod is provided on the positioning plate.
[0009] In a preferred example, the present invention can be further configured as follows: a rubber plate is connected between the adjustment frame and the positioning plate.
[0010] In a preferred example, the utility model can be further configured as follows: the glue suction heads are symmetrically distributed in multiple groups on the adjustment frame.
[0011] In a preferred example, the utility model can be further configured as follows: the glue filling head is arranged on the diversion box from the inside to the outside.
[0012] The above technical solution of the utility model has the following beneficial technical effects:
[0013] The utility model uses a glue filling component to discharge glue from the glue filling head at the bottom of the diverter box under the control of the glue filling pump. When the glue filling is completed, the glue filling pump works in reverse, so that the glue suction head extracts glue beyond the standard position and flows the glue back into the reflux hopper for use in the next glue filling. This solution does not need to adjust the glue filling amount according to the specifications of the circuit board, greatly improves the practicality of the device, and facilitates efficient operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 This is a cross-sectional view of the automatic glue filling device for instrument processing of the utility model;
[0015] Figure 2 This is a schematic diagram of the distribution of the glue filling heads of the utility model.
[0016] Reference numerals:
[0017] 100, machine body assembly; 110, mounting frame; 111, positioning plate; 112, reflux bucket; 113, vibrating rod; 114, vibrator; 120, hydraulic rod; 130, glue filling pump; 140, liquid inlet pipe; 150, liquid outlet pipe;
[0018] 200, glue pouring assembly; 210, adjustment frame; 211, rubber plate; 220, electric telescopic rod; 230, diverter box; 240, one-way valve 1; 250, glue pouring head; 260, return pipe; 270, one-way valve 2; 280, glue suction head. DETAILED DESCRIPTION
[0019] In order to make the purpose, technical solution and advantages of the utility model clearer, the utility model is further described in detail below in combination with specific implementation methods and with reference to the accompanying drawings. It should be noted that the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.
[0020] An automatic glue pouring device for instrument processing provided by some embodiments of the utility model will be described below in conjunction with the accompanying drawings.
[0021] Combination Figure 1-2 As shown, the utility model provides an automatic glue pouring device for instrument processing, comprising: a body component 100 and a glue pouring component 200; wherein, the body component 100 comprises a mounting frame 110, a hydraulic rod 120 fixed on the mounting frame 110, a glue pouring pump 130 mounted on the mounting frame 110, and a liquid inlet pipe 140 and a liquid outlet pipe 150 connected to the glue pouring pump 130, and the mounting frame 110 is driven to move by the hydraulic rod 120 and falls on the instrument to perform glue pouring.
[0022] The glue pouring assembly 200 is arranged on the mounting frame 110, and the glue pouring assembly 200 includes an adjustment frame 210 mounted on the mounting frame 110, a shunt box 230 fixed to the middle of the adjustment frame 210, a one-way valve 240 installed on the shunt box 230 and connected to the liquid outlet pipe 150, a glue pouring head 250 fixed to the bottom of the shunt box 230, a reflux pipe 260 connected to the liquid outlet pipe 150, a one-way valve 270 arranged on the reflux pipe 260, a positioning plate 111 fixed to the bottom of the mounting frame 110, and a one-way valve 240 installed on the adjustment frame 110. The glue suction head 280 connected to the section frame 210 and the reflux pipe 260 and the electric telescopic rod 220 fixed between the adjustment frame 210 and the positioning plate 111, through the glue filling assembly 200, can make the glue be discharged from the glue filling head 250 at the bottom of the diversion box 230 under the control of the glue filling pump 130. When the glue filling is completed, the glue filling pump 130 works in reverse, so that the glue suction head 280 extracts the glue beyond the standard position and flows the glue back into the reflux bucket 112 for the next glue filling. This solution does not need to adjust the glue filling amount according to the specifications of the circuit board, greatly improves the practicality of the device, and facilitates efficient operation.
[0023] Specifically, the mounting frame 110 is provided with a reflux hopper 112 connected to the liquid inlet pipe 140, which can temporarily store the refluxed glue. Before the glue pump 130 performs the glue filling operation, it is only necessary to input one to two times of glue filling amount into the reflux hopper 112. In this way, there will not be too much glue in the reflux hopper 112 to hinder the entry of recycled glue during reflux, and the practicability is relatively high.
[0024] Furthermore, a vibrating rod 113 is embedded inside the positioning plate 111, and a vibrator 114 electrically connected to the vibrating rod 113 is provided on the positioning plate 111. The vibration operation of the vibrating rod 113 is controlled by the vibrator 114, and the vibration can be transmitted to the instruments below, thereby accelerating the flow of glue to the sides of the instruments, so that the glue can be quickly flattened, effectively improving the glue filling efficiency.
[0025] On the other hand, a rubber plate 211 is connected between the adjustment frame 210 and the positioning plate 111 to reduce the vibration transmitted to the adjustment frame 210 and achieve an upward vibration reduction effect.
[0026] Furthermore, the electric telescopic rod 220 is used to adjust the height of the adjustment frame 210, and then adjust the position of the bottom of the glue suction head 280, which is the standard line for qualified glue filling.
[0027] It should be noted that the glue suction heads 280 are symmetrically distributed in multiple groups on the adjustment frame 210. Multiple groups means that there are at least two groups, so that excess glue can be recovered at multiple locations at the same time, which is more efficient.
[0028] Furthermore, the glue pouring heads 250 are arranged on the diverter box 230 from the inside to the outside. The arrangement of multiple groups of glue pouring heads 250 can make the glue fall evenly at multiple positions and increase the glue leveling rate.
[0029] The working principle and use process of the utility model are as follows: first, the mounting frame 110 is driven by the hydraulic rod 120 to fall above the instrument to be glued, and then the glue pump 130 is used to extract glue from the glue head 250 at the bottom of the shunt box 230 to flow downward. When the glue level is adjusted, the glue exceeding the bottom of the glue suction head 280 is sucked into the reflux bucket 112 by the glue pump 130 and retained for the next glue filling. The one-way valve 1 240 prevents the glue in the shunt box 230 from being extracted when the glue is recovered, and the one-way valve 270 prevents the glue from flowing out from the glue suction head 280 during glue filling.
[0030] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.
Claims
1. An automatic glue filling device for instrument processing, characterized in that: include: A machine body assembly (100) comprises a mounting frame (110), a hydraulic rod (120) fixed on the mounting frame (110), a glue pouring pump (130) mounted on the mounting frame (110), and a liquid inlet pipe (140) and a liquid outlet pipe (150) connected to the glue pouring pump (130); A glue pouring assembly (200) is arranged on the mounting frame (110), and the glue pouring assembly (200) comprises an adjusting frame (210) sleeved on the mounting frame (110), a shunt box (230) fixed to the middle of the adjusting frame (210), a one-way valve (240) installed on the shunt box (230) and connected to the liquid outlet pipe (150), a glue pouring head (250) fixed to the bottom of the shunt box (230), a return pipe (260) connected to the liquid outlet pipe (150), a one-way valve (270) arranged on the return pipe (260), a positioning plate (111) fixed to the bottom of the mounting frame (110), a glue suction head (280) installed on the adjusting frame (210) and connected to the return pipe (260), and an electric telescopic rod (220) fixed between the adjusting frame (210) and the positioning plate (111).
2. The automatic glue pouring device for instrument processing according to claim 1 is characterized in that: A reflux funnel (112) connected to the liquid inlet pipe (140) is mounted on the mounting frame (110).
3. The automatic glue pouring device for instrument processing according to claim 1 is characterized in that: A vibrating rod (113) is embedded inside the positioning plate (111), and a vibrator (114) electrically connected to the vibrating rod (113) is provided on the positioning plate (111).
4. The automatic glue pouring device for instrument processing according to claim 1 is characterized in that: A rubber plate (211) is connected between the adjustment frame (210) and the positioning plate (111).
5. The automatic glue pouring device for instrument processing according to claim 1 is characterized in that: The glue suction heads (280) are symmetrically distributed in multiple groups on the adjustment frame (210).
6. The automatic glue pouring device for instrument processing according to claim 1 is characterized in that: The glue filling head (250) is arranged around the diversion box (230) from the inside to the outside.