Cutting device for semiconductor processing

Abstract

The utility model relates to the field of semiconductor cutting, and discloses a cutting device for semiconductor processing, which is characterized in that the upper surface of a base is fixedly connected with a support frame, the upper surface of the support frame is provided with a second motor, the output end of the second motor is fixedly connected with a gear, and the motor drives the gear to be meshed with a rack; a fixing block is fixedly connected to the top of the rack, the vertical rod is located in the first sliding groove and the second sliding groove, a cutter is fixedly connected to the lower portion of the vertical rod, a base is placed below the base, electric guide rails are placed on the two sides of the base, a baffle is fixedly connected to the upper portions of the electric guide rails, and hydraulic cylinders are installed on the two sides of the baffle. A first motor is installed in the base, and a tray is fixed to the upper portion of the first motor. According to the semi-conductor cutting device, the motor is used for driving the gear to mesh to control the cutting position of the cutter, and the motor in the base can drive the semi-conductor in the tray to rotate for cutting at different positions.

Description

Technical Field

[0001] The utility model relates to the field of semiconductor cutting, in particular to a cutting device for semiconductor processing. Background Art

[0002] In the process of semiconductor manufacturing, chip cutting is an important link. It not only determines the size and shape of the chip, but also directly affects the performance and use of the chip. With the continuous advancement of science and technology, chip cutting technology is also constantly developing and becoming a technological door to fine craftsmanship in the field of semiconductor manufacturing.

[0003] After searching, a semiconductor wafer cutting device and its working method are disclosed in the announcement number: CN109049376B. It relates to the field of semiconductor manufacturing technology, and in particular to a wafer cutting device and its working method. The base is provided with a tray for placing wafers, and the tray is rotatably connected to the base; the winding mechanism includes a motor and a winding shaft, and the motor is arranged on the horizontal end of the support frame. The motor drives the winding shaft, and the top ends of several positioning rods are respectively connected to the winding shaft by pull ropes. After the technical solution uses the motor-driven gear meshing method, the motor can be driven to drive the gear to rotate and mesh with the rack, thereby driving the tool to cut the semiconductor. The advantage of using the gear meshing method is that it is easy to maintain and the cost is not high. After the cutting process is completed, the hydraulic cylinders on both sides of the base can be controlled to push the baffle to reciprocate on the electric guide rail, thereby pushing the residual waste on the base, thereby avoiding manual cleaning and greatly reducing the danger. This technology and method not only improves the efficiency of semiconductor cutting, but also reduces the manufacturing cost and ensures the comprehensiveness of the equipment in operation.

[0004] Although the method of using a motor to drive the gear in the above application can achieve efficient semiconductor cutting, it is difficult to perform quick repairs when the gear is stuck. Utility Model Content

[0005] In order to make up for the above shortcomings, the utility model provides a cutting device for semiconductor processing, aiming to improve the problem that when a gear is stuck during the cutting process of the prior art, it is impossible to quickly repair it.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a cutting device for semiconductor processing, comprising a base, a first slide groove is arranged in the middle of the base, a vertical rod is arranged inside the first slide groove, a cross rod is slidably connected to the upper surface of the base, a support frame is fixedly connected to the upper surface of the base, a second slide groove is arranged on the upper surface of the support frame, a base is placed below the base, a first motor is installed inside the base, a telescopic mechanism is rotatably connected to the output end of the first motor, a tray is fixedly connected to the output end of the telescopic mechanism, electric guide rails are respectively arranged on both sides of the base, an electric slider is installed inside the electric guide rail, a baffle is fixedly connected to the upper surface of the electric slider, hydraulic cylinders are respectively arranged on the outer sides of the baffles on both sides, the hydraulic cylinders on both sides are fixedly connected to the base, the bottom of the vertical rod is fixedly connected to the support plate, and a cutting head is fixedly connected to the support plate below.

[0007] Preferably, the vertical rod and the horizontal rod are in a cross shape.

[0008] Preferably, the support frame has a horizontal end and a pair of vertical ends, a second motor is provided on the upper surface of the horizontal end of the support frame, and a gear is fixedly connected to the output end of the second motor.

[0009] Preferably, the vertical rod is in both the first slide groove and the second slide groove, a fixed block is fixedly connected to the top of the vertical rod, a rack is fixedly connected to the lower surface of the fixed block, and the bottom side of the rack is meshedly connected to the outer side of the gear.

[0010] Preferably, the telescopic mechanism is composed of an electric push rod and a hydraulic cylinder.

[0011] Preferably, the bottom of the telescopic mechanism is rotatably connected to a base, and a waste trough is provided below the base.

[0012] Preferably, baffles are placed on both sides of the base, and the baffles are symmetrically distributed about the central axis of the base.

[0013] Preferably, a storage groove is provided inside the base, and the storage groove runs through the upper and lower surfaces of the base.

[0014] The utility model has the following beneficial effects:

[0015] 1. In the utility model, the motor drives the gear meshing to drive the vertical rod to reciprocate in the slide slot. A cutter is fixedly connected to the lower part of the vertical rod. A base is installed under the base. A first motor is installed inside the base. The motor rotates to drive the semiconductor in the upper tray to adjust the position for cutting. A telescopic mechanism is rotatably connected above the first motor, which can control the telescopic mechanism to rotate. The telescopic mechanism controls the semiconductor in the tray to rise and fall, so as to achieve the cutting requirements of semiconductors at different positions.

[0016] 2. In the utility model, the fixing block can be stuck on the vertical rod, which is conducive to adjusting the position of the fixing block, so that the gear can be quickly disassembled and installed when the gear is stuck.

[0017] 3. In the utility model, a storage groove is provided in the base, and the storage groove runs through the upper and lower surfaces of the base. When the cutting waste residue falls onto the base, the hydraulic cylinder can be controlled to push the baffle to push the cutting waste residue into the storage groove, so that the waste residue can fall into the waste trough. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic structural diagram of a cutting device for semiconductor processing proposed by the utility model;

[0019] Figure 2 This is a cross-sectional view of a base of a semiconductor processing cutting device proposed by the utility model;

[0020] Figure 3 for Figure 2 Enlarged view of point A in the middle;

[0021] Figure 4 for Figure 2 Enlarged view of point B in the middle;

[0022] Figure 5 This is a schematic diagram of a storage slot of a cutting device for semiconductor processing proposed by the utility model.

[0023] Legend:

[0024] 1. Base; 2. First slide; 3. Support frame; 4. Vertical rod; 5. Cross rod; 6. Hydraulic cylinder; 7. Baffle; 8. Tray; 9. Telescopic mechanism; 10. First motor; 11. Base; 12. Waste trough; 13. Electric guide rail; 14. Electric slide block; 15. Support plate; 16. Cutting head; 17. Fixed block; 18. Rack; 19. Gear; 20. Second motor; 21. Second slide; 22. Storage slot. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings of the specification of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] Reference Figure 1-Figure 2, an embodiment of the utility model is: a cutting device for semiconductor processing, a first slide groove 2 is arranged in the middle of the base 1, a vertical rod 4 is arranged inside the first slide groove 2, a cross rod 5 is slidably connected to the upper surface of the base 1, a support frame 3 is fixedly connected to the upper surface of the base 1, a second slide groove 21 is arranged on the upper surface of the support frame 3, a base 11 is placed below the base 1, a first motor 10 is installed inside the base 11, a telescopic mechanism 9 is rotatably connected to the output end of the first motor 10, the first motor 10 drives the telescopic mechanism 9 to rotate, a tray 8 is fixedly connected to the output end of the telescopic mechanism 9, and the telescopic mechanism 9 can make the tray 8 move upward, electric guide rails 13 are respectively arranged on both sides of the base 11, an electric slider 14 is installed inside the electric guide rail 13, a baffle 7 is fixedly connected to the upper surface of the electric slider 14, hydraulic cylinders 6 are respectively arranged on the outer sides of the baffles 7 on both sides, the hydraulic cylinders 6 on both sides are fixedly connected to the base 1, and the hydraulic cylinders 6 The baffle plate 7 is pushed to reciprocate on the upper surface of the electric guide rail 13. A support plate 15 is fixedly connected to the bottom of the vertical rod 4, and a cutting head 16 is fixedly connected to the bottom of the support plate 15. Specifically, the design of the first slide groove 2 allows the vertical rod 4 to have moving space in the first slide groove 2, and the cross bar 5 can limit the vertical rod 4 to prevent the vertical rod 4 from falling from the first slide groove 2. The telescopic mechanism 9 is driven to rotate by the first motor 10, and then the tray 8 is driven to rise and fall by the telescopic mechanism 9 to achieve cutting at different positions. Among them, the installation method of the first motor 10 and the telescopic mechanism 9 is the existing technology, so it will not be described in detail. The baffle plate 7 is pushed to reciprocate on the electric guide rail 13 by the hydraulic cylinder 6, so that the baffle plate 7 can push the waste residues fallen on the base 11 into the storage groove 22, so that it flows into the waste groove 12 below. The cutting head 16 fixedly connected to the bottom of the vertical rod 4 can realize that the vertical rod 4 drives the cutting head 16 to cut.

[0027] Reference Figure 1 The vertical rod 4 and the cross rod 5 are in a cross shape. The vertical rod 4 is located inside the first slide groove 2. The upper surface of the base 1 is slidably connected with the cross rod 5. The cross rod 5 can limit the position of the vertical rod 4 when the vertical rod 4 reciprocates, and the vertical rod 4 can move on the slide groove. Specifically, the design of the first slide groove 2 allows the vertical rod 4 to have moving space in the first slide groove 2, and the cross rod 5 can limit the vertical rod 4 to prevent the vertical rod 4 from falling from the first slide groove 2.

[0028] Reference Figure 4The support frame 3 has a horizontal end and a pair of vertical ends. A second motor 20 is provided on the upper surface of the horizontal end of the support frame 3. A gear 19 is fixedly connected to the output end of the second motor 20. The second motor 20 drives the gear 19 to rotate. The vertical rod 4 is simultaneously in the first slide groove 2 and the second slide groove 21. A fixed block 17 is fixedly connected to the top of the vertical rod 4. A rack 18 is fixedly connected to the lower surface of the fixed block 17. The bottom side of the rack 18 is meshed and connected to the outer side of the gear 19. The second motor 20 drives the gear 19 to rotate and mesh with the rack 18 to drive the vertical rod 4 to reciprocate in the first slide groove 2 and the second slide groove 21, thereby driving the cutting head 16 to cut. Specifically, the gear 19 is driven to rotate by the second motor 20, and the gear 19 is meshed with the rack 18, so that the vertical rod 4 has a moving space in the first slide groove 2 and the second slide groove 21, thereby driving the cutting head 16 to cut the semiconductor. Among them, the fixed block 17 can be stuck on the vertical rod 4, which is conducive to adjusting the position of the fixed block, so that the gear can be quickly disassembled and installed when the gear is stuck.

[0029] Reference Figure 2 The telescopic mechanism 9 can control the upper tray 8 to move upward so that the semiconductor can be cut. The telescopic mechanism 9 is rotatably connected to the first motor 10. A waste trough 12 is provided under the base 11. The waste trough 12 is used to recycle the cut semiconductor waste. The installation method of the first motor 10 and the telescopic mechanism 9 is the existing technology, so it will not be described in detail.

[0030] Reference Figure 1-Figure 5 Baffles 7 are placed on both sides of the base 11, and the baffles 7 are symmetrically distributed about the central axis of the base 11. The hydraulic cylinders 6 on both sides push the baffles 7 to reciprocate, pushing the cutting waste into the waste trough 12. A storage groove 22 is provided inside the base 11, and the storage groove 22 runs through the upper and lower surfaces of the base 11. When the cutting waste residue falls onto the base 11, the hydraulic cylinder 6 can be controlled to push the baffle 7, so that the cutting waste residue is pushed into the storage groove 22, thereby realizing that the waste residue falls into the waste trough 12.

[0031] Working principle: put the semiconductor on the tray 8, control the first motor 10 inside the base 11 to rotate, control the telescopic mechanism 9 above the first motor 10 to move the tray 8 upward, and the second motor 20 on the upper surface of the support frame 3 drives the gear 19 to rotate and mesh with the rack 18 to drive the vertical rod 4 fixedly connected to the fixed block 17 to reciprocate in the second slide groove 21. The design of the first slide groove 2 allows the vertical rod 4 to have moving space in the first slide groove 2, and the cross bar 5 can limit the vertical rod 4 to prevent the vertical rod 4 from falling from the first slide groove 2. Therefore, the vertical rod 4 moves in the first slide groove 2 and the second slide groove 21 at the same time. A cutting head 16 is fixedly connected to the bottom of the rod 4, so the second motor 20 on the upper part of the support frame 3 drives its cutting head 16 to cut. In the process of cutting semiconductors, it is inevitable that residues will fall. Electric guide rails 13 are provided on the outer sides of the baffles 7 on both sides of the base 11, and an electric slider 14 is installed in the electric guide rails 13. The baffle 7 is fixedly connected to the electric slider 14, and a hydraulic cylinder 6 is placed on the outer side of the baffle 7, so the hydraulic cylinder 6 pushes the baffle 7 to reciprocate on the electric guide rail 13. The hydraulic cylinder 6 is controlled to push the baffle 7, so that the waste residues dropped on the base 11 can be pushed into the storage groove 22 and fall into the waste groove 12.

[0032] The fixing block 17 can be stuck on the vertical rod 4, which is conducive to adjusting the position of the fixing block 17, so that the gear 19 can be quickly disassembled and installed when the gear 19 is stuck.

[0033] The installation method of the first motor 10 and the telescopic mechanism 9 is prior art, so it will not be described in detail.

[0034] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A cutting device for semiconductor processing, comprising a base (1) characterized in that: A first slide groove (2) is arranged in the middle of the base (1), a vertical rod (4) is arranged inside the first slide groove (2), a horizontal rod (5) is slidably connected to the upper surface of the base (1), a support frame (3) is fixedly connected to the upper surface of the base (1), a second slide groove (21) is arranged on the upper surface of the support frame (3), a base (11) is arranged below the base (1), a first motor (10) is installed inside the base (11), an output end of the first motor (10) is rotatably connected to a telescopic mechanism (9), and the telescopic mechanism (9) is arranged on the upper surface of the base (11). The output end of the contraction mechanism (9) is fixedly connected to a tray (8), the base (11) is provided with electric guide rails (13) on both sides, an electric slider (14) is installed inside the electric guide rails (13), a baffle (7) is fixedly connected to the upper surface of the electric slider (14), hydraulic cylinders (6) are provided on the outer sides of the baffles (7) on both sides, the hydraulic cylinders (6) on both sides are fixedly connected to the base (1), the bottom of the vertical rod (4) is fixedly connected to a support plate (15), and a cutting head (16) is fixedly connected below the support plate (15).

2. A semiconductor processing cutting device according to claim 1, characterized in that: The vertical rod (4) and the horizontal rod (5) are in a cross shape.

3. A semiconductor processing cutting device according to claim 2, characterized in that: The support frame (3) has a horizontal end and a pair of vertical ends. A second motor (20) is provided on the upper surface of the horizontal end of the support frame (3). The output end of the second motor (20) is fixedly connected to a gear (19).

4. A semiconductor processing cutting device according to claim 3, characterized in that: The vertical rod (4) is located in the first slide groove (2) and the second slide groove (21) at the same time. A fixing block (17) is clamped on the top of the vertical rod (4). A rack (18) is fixedly connected to the lower surface of the fixing block (17). The bottom side of the rack (18) is meshedly connected to the outer side of the gear (19).

5. A semiconductor processing cutting device according to claim 4, characterized in that: The telescopic mechanism (9) is composed of an electric push rod.

6. A semiconductor processing cutting device according to claim 5, characterized in that: The bottom of the telescopic mechanism (9) is rotatably connected to a base (11), and a waste trough (12) is provided below the base (11).

7. A semiconductor processing cutting device according to claim 6, characterized in that: Baffles (7) are placed on both sides of the base (11), and the baffles (7) are symmetrically distributed about the central axis of the base (11).

8. A semiconductor processing cutting device according to claim 7, characterized in that: A receiving groove (22) is provided inside the base (11), and the receiving groove (22) penetrates the upper and lower surfaces of the base (11).

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