Code printing device

Abstract

The utility model provides a code printing device which comprises a main conveying line, a shunting conveying mechanism, a first transfer mechanism and a code printing operation line, and the code printing operation line comprises a branch conveying line, a code printing mechanism and a decoding mechanism. The main conveying line is provided with a flow dividing station and a first transferring station. The flow dividing conveying mechanism divides the silicon wafers located at the flow dividing station to a branch conveying line of the coding operation line, the branch conveying line is provided with a coding station, a decoding station and a first discharging station, and the coding mechanism is used for coding the silicon wafers located at the coding station. And the decoding mechanism is used for decoding the coded silicon wafers at the decoding station to determine whether the coded silicon wafers are qualified or not. And the first transfer mechanism is used for collecting the silicon wafers with qualified code printing on the first blanking station to a material collecting box or transferring the silicon wafers with qualified code printing to the first transfer station. According to the coding device, the silicon wafers are coded on the coding operation line, and normal conveying of the main conveying line is not affected, so that the conveying efficiency of the main conveying line is ensured.

Description

Technical Field

[0001] The utility model relates to the field of silicon wafer production, in particular to a coding device. Background Art

[0002] After the silicon wafer is produced, it is generally necessary to write the silicon wafer model, production batch, performance parameters and other information on the silicon wafer by laser coding.

[0003] The existing processing method is to directly set the coding mechanism above the main conveyor line of silicon wafers. When the silicon wafers are conveyed to the bottom of the coding mechanism, the main conveyor line of silicon wafers is controlled to stop conveying. After the coding mechanism completes the coding operation on the silicon wafers, the main conveyor line is started again. The existing coding method requires frequent start and stop of the main conveyor line, which reduces the conveying efficiency of the main conveyor line and affects the work rhythm. Utility Model Content

[0004] In order to solve the above technical problems, the utility model provides a coding device, which adopts the following technical solutions:

[0005] A coding device comprises a main conveying line, a branch conveying mechanism, a first transfer mechanism and at least one coding operation line, wherein the coding operation line comprises a branch conveying line, a coding mechanism and a decoding mechanism, wherein:

[0006] The main conveyor line is configured to convey silicon wafers along a first horizontal direction, and a diversion station and a first transfer station are sequentially arranged on the conveying path of the main conveyor line;

[0007] The coding operation line is arranged on the side of the main conveying line, and the diversion conveying mechanism is configured to divert the silicon wafers located at the diversion station to the branch conveying line of the coding operation line;

[0008] The branch conveyor line is configured to convey silicon wafers along a first horizontal direction. At least one coding station, a decoding station and a first unloading station are sequentially arranged on the conveying path of the branch conveyor line. A coding mechanism is correspondingly arranged at each coding station, and the coding mechanism is used to code the silicon wafer located at the coding station. A decoding mechanism is arranged at the decoding station, and the decoding mechanism is used to decode the coded silicon wafer located at the decoding station to determine whether the coding is qualified.

[0009] The first transfer mechanism is configured to pick up silicon wafers with qualified coding from the first unloading station, and transport the picked silicon wafers with qualified coding to a receiving box located beside the first unloading station, or transfer the picked silicon wafers with qualified coding to the first transfer station.

[0010] The coding device provided by the present application has a coding line for coding silicon wafers on the side of the main conveyor line, and the silicon wafers complete the coding operation on the coding line. Compared with the prior art, the coding device of the present application will not affect the normal conveying of the main conveyor line, thereby ensuring the conveying efficiency of the main conveyor line and improving the work rhythm.

[0011] In some embodiments, the coding operation line also includes an NG material box, which is arranged at the output end of the branch conveyor line, and the NG material box is used to receive silicon wafers with unqualified coding output by the branch conveyor line.

[0012] Automatic recycling of silicon wafers with unqualified coding on the branch conveyor line that have not been taken away by the first transfer mechanism is realized.

[0013] In some embodiments, a lifting basket is provided at the output end of the main conveyor line, and the basket is used to collect silicon wafers output by the main conveyor line.

[0014] Collecting silicon wafers into the material basket makes it easier for subsequent processing equipment to take out the silicon wafers.

[0015] In some embodiments, the diversion conveying mechanism includes a sheet picking part and a diversion conveying part, and the conveying directions of the sheet picking part and the diversion conveying part are both perpendicular to the conveying direction of the main conveying line, wherein: the sheet picking part is located above the diversion station, and the diversion conveying part is connected to the sheet picking part; the sheet picking part is configured to absorb silicon wafers from the diversion station, and is configured to convey the absorbed silicon wafers to the diversion conveying part, and the diversion conveying part is configured to convey the silicon wafers to the branch conveying line of the coding operation line.

[0016] Through the cooperation between the wafer taking part and the diversion conveying part, the diversion conveying mechanism can absorb the silicon wafers from the diversion station and divert and convey the absorbed silicon wafers to the branch conveying line of the coding operation line.

[0017] In some embodiments, there are at least two coding operation lines, and the at least two coding operation lines are respectively located on both sides of the main conveyor line. The diversion conveying parts are set into two groups, and the two groups of diversion conveying parts are both connected to the sheet picking part and are located on both sides of the sheet picking part; the sheet picking part is also configured to absorb silicon wafers from the diversion station, and is configured to convey the absorbed silicon wafers to one of the two groups of diversion conveying parts, and the two groups of diversion conveying parts are configured to respectively convey the silicon wafers to the corresponding branch conveyor lines.

[0018] By setting up at least two coding operation lines on both sides of the main conveyor line and correspondingly setting up two groups of diverting and conveying parts, the two groups of diverting and conveying parts can alternately divert the silicon wafers sucked from the main conveyor line by the wafer picking part to the corresponding coding operation line. At least two coding operation lines can implement silicon wafer coding in parallel, thereby further improving the coding efficiency.

[0019] In some embodiments, the coding operation line also includes a tidying mechanism, and a tidying station located in front of the coding station is also provided on the conveying path of the branch conveyor line; the tidying mechanism is arranged at the tidying station, and the tidying mechanism is used to correct the position of the silicon wafer located at the tidying station.

[0020] The position of the silicon wafer can be corrected before coding to ensure that the coding mechanism can accurately code the target specified position.

[0021] In some embodiments, the branch conveyor line includes a first conveying section, a second conveying section, a third conveying section and a fourth conveying section arranged in sequence along the conveying path of the branch conveyor line, wherein: the tidying station is located on the conveying path of the first conveying section, the coding station is located on the conveying path of the second conveying section, the decoding station is located on the conveying path of the third conveying section, and the first unloading station is located on the conveying path of the fourth conveying section; the second conveying section is configured to be able to adsorb silicon wafers.

[0022] By setting the second conveying section, the second conveying section can suck and fix the silicon wafer during the coding process, thereby ensuring the coding effect of the silicon wafer. The first conveying section, the third conveying section and the fourth conveying section only need to convey the silicon wafer, and ordinary conveying belts can be used without setting an adsorption mechanism, thereby saving the cost of the branch conveying line.

[0023] In some embodiments, the second conveying section includes an adsorption member and two parallel conveyor belts, the adsorption surface of the adsorption member is lower than the conveying surfaces of the two conveyor belts, and the adsorption member is used to adsorb the silicon wafers on the two conveyor belts; or, the second conveying section includes a conveyor belt, and the conveyor belt is provided with adsorption holes connected to the vacuum device, and the conveyor belt adsorbs the silicon wafers through the adsorption holes.

[0024] The second conveying section is configured so that the second conveying section can adsorb and fix the silicon wafer.

[0025] In some embodiments, the coding mechanism includes a coding laser, a positioning camera and a surface light source, wherein: the positioning camera is arranged below the branch conveyor line, and the positioning camera is configured to position the silicon wafer at the coding station to obtain the position information of the silicon wafer; the coding laser is arranged above the branch conveyor line, and the coding laser is configured to perform laser coding on the silicon wafer based on the position information of the silicon wafer; the coding laser is arranged on the lifting mechanism, and the lifting mechanism is configured to drive the coding laser to lift and lower so as to adjust the distance between the coding laser and the silicon wafer at the coding station; the surface light source is arranged above the branch conveyor line, the surface light source is located between the coding laser and the positioning camera, and an optical channel for the laser to pass through is arranged on the surface light source; the surface light source is used to irradiate the silicon wafer at the coding station to cooperate with the positioning camera to position the silicon wafer, and the laser emitted by the coding laser reaches the silicon wafer through the optical channel.

[0026] Through the cooperation of the positioning camera and the surface light source, the precise positioning of the silicon wafer at the coding station is achieved, and by setting the coding laser on the lifting mechanism, the distance between the coding laser and the silicon wafer can be adjusted, ultimately ensuring that the coding laser can accurately code the designated position of the silicon wafer.

[0027] In some embodiments, the coding operation line further includes a dust removal mechanism disposed on the side of the coding station, and the dust removal mechanism is used to absorb dust generated during the coding process.

[0028] By setting up a dust removal mechanism on the side of the coding station, the dust generated during the coding process can be removed in time to prevent dust from contaminating the silicon wafer and the machine.

[0029] In some embodiments, the decoding mechanism includes an angle adjustment bracket and a barcode scanning gun arranged on the angle adjustment bracket; the barcode scanning gun is connected to the host computer signal, the barcode scanning gun is used to identify the graphics formed by the coding on the silicon wafer, and provide the recognition result to the host computer, and the host computer determines whether the coding is qualified based on the recognition result.

[0030] By setting up the decoding mechanism, the decoding mechanism can accurately identify the images and texts formed by the coding on the silicon wafer, and finally ensure that the host computer determines whether the coding is qualified.

[0031] In some embodiments, the first transfer mechanism includes an intermediate transfer section and a first transfer conveying section, and the conveying directions of the intermediate transfer section and the first transfer conveying section are both perpendicular to the conveying direction of the main conveyor line, wherein: the intermediate transfer section is located above the first transfer station, the first end of the first transfer conveying section is connected to the intermediate transfer section, and a material receiving box is provided below the second end of the first transfer conveying section; the first transfer conveying section is configured to pick up silicon wafers with qualified coding from the first unloading station of the branch conveyor line, and to convey the picked up silicon wafers with qualified coding into the material receiving box; or, the first transfer conveying section is configured to convey the picked up silicon wafers with qualified coding to the intermediate transfer section, and the intermediate transfer section is configured to convey the qualified silicon wafers with qualified coding to the first transfer station; the intermediate transfer section is also configured to pick up silicon wafers from the first transfer station, and to convey the picked up silicon wafers to the first transfer conveying section, and the first transfer conveying section is configured to convey the silicon wafers into the material receiving box.

[0032] By setting the first transfer mechanism, the first transfer mechanism can collect the silicon wafers with good coding on the branch conveyor line into the receiving box located at the side of the branch conveyor line, or transfer the silicon wafers with good coding on the branch conveyor line back to the main conveyor line, and the main conveyor line will transport them to the back-end workstation or collect them into the material basket. In addition, the first transfer mechanism can collect the silicon wafers on the main conveyor line into the receiving box located at the side of the branch conveyor line. In this way, the silicon wafers can be flexibly transferred according to various application requirements.

[0033] In some embodiments, there are at least two coding operation lines, and at least two coding operation lines are respectively located on both sides of the main conveyor line. The first transfer conveying parts are set into two groups, and the two groups of first transfer conveying parts are connected to the intermediate transfer part and are located on both sides of the intermediate transfer part; the two groups of first transfer conveying parts respectively pick up silicon wafers with good coding from the first unloading station of the corresponding branch conveyor line, and respectively convey the picked up silicon wafers with good coding to the corresponding receiving boxes; or, respectively convey the picked up silicon wafers with good coding to the intermediate transfer part; the intermediate transfer part is also configured to pick up silicon wafers from the first transfer station, and convey the picked up silicon wafers to one of the two groups of first transfer conveying parts.

[0034] By providing at least two coding conveying lines and two sets of first transfer conveying parts, the coding efficiency is improved.

[0035] In some embodiments, a second unloading station located behind the first unloading station is also provided on the conveying path of the branch conveyor line of the coding operation line; the coding device also includes a second transfer mechanism, which is configured to pick up silicon wafers that have passed the coding from the second unloading station of the branch conveyor line, and transport the picked silicon wafers that have passed the coding to a receiving box located on the side of the second unloading station.

[0036] By setting a second unloading station after the first unloading station and correspondingly setting a second transfer mechanism, the second transfer mechanism can collect the silicon wafers with qualified coding that are not collected in time by the first transfer mechanism into the receiving box, ensuring that all silicon wafers with qualified coding on the branch conveyor line can be collected into the receiving box.

[0037] In some embodiments, there are at least two coding operation lines, which are respectively located on both sides of the main conveyor line. The second transfer mechanism is set into two groups, which are located on both sides of the main conveyor line. The two groups of second transfer mechanisms respectively pick up silicon wafers with qualified coding from the corresponding branch conveyor lines, and transport the picked silicon wafers with qualified coding to the corresponding receiving boxes.

[0038] By providing at least two coding conveying lines and two sets of second transfer mechanisms, the coding efficiency is improved.

[0039] In some embodiments, a reject station located in front of the diversion station is also provided on the conveying path of the main conveying line; the coding device also includes a reject mechanism arranged at the reject station, and the reject mechanism is used to reject defective silicon wafers located at the reject station.

[0040] The defective silicon wafers can be removed and prevented from flowing into the coding work line. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] Figure 1It is a schematic diagram of the structure of the coding device in an embodiment of the present application at one viewing angle;

[0042] Figure 2 It is a schematic diagram of the structure of the coding device in the embodiment of the present application from another perspective;

[0043] Figure 3 It is a structural schematic diagram of the flow diversion and conveying mechanism in the embodiment of the present application;

[0044] Figure 4 This is a schematic diagram of the structure of the first transport mechanism in the embodiment of the present application;

[0045] Figure 5 This is a schematic diagram of the structure of the second transport mechanism in an embodiment of the present application;

[0046] Figure 6 It is a structural schematic diagram of the coding mechanism in the embodiment of the present application;

[0047] Figure 7 It is a structural schematic diagram of a decoding mechanism in an embodiment of the present application;

[0048] Figure 8 It is a structural schematic diagram of the regular mechanism in the embodiment of the present application.

[0049] Figures 1 to 8 Included:

[0050] Main conveyor line 1;

[0051] Dividing and conveying mechanism 2: a sheet taking part 21, a diverting and conveying part 22;

[0052] The first transfer mechanism 3: an intermediate transfer section 31, a first transfer conveying section 32, a first conveying segment 321, and a second conveying segment 322;

[0053] Coding operation line 4: branch conveyor line 41, coding mechanism 42, decoding mechanism 43, tidying mechanism 44, dust removal mechanism 45, material receiving box 46, NG material box 47, first conveying section 411, second conveying section 412, third conveying section 413, fourth conveying section 414, coding laser 421, surface light source 422, lifting mechanism 423, lifting column 424, mounting plate 425, adjustment handle 426, angle adjustment bracket 431, code scanning gun 432, tidying drive unit 441, first tidying plate 442, second tidying plate 443;

[0054] The second transfer mechanism 5: a second transfer conveying unit 51 and a third transfer conveying unit 52;

[0055] Elimination mechanism 6;

[0056] Silicon wafer 100. DETAILED DESCRIPTION

[0057] In order to make the above-mentioned purposes, features and advantages of the present invention more obvious and easy to understand, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0058] like Figure 1 to Figure 2 As shown, the coding device in the embodiment of the present application includes a main conveying line 1, a diversion conveying mechanism 2, a first transfer mechanism 3 and at least one coding operation line 4, and the coding operation line 4 includes a branch conveying line 41, a coding mechanism 42 and a decoding mechanism 43, wherein:

[0059] The main conveying line 1 is configured to be arranged along a first horizontal direction (such as Figure 1 The main conveyor line 1 is used to convey silicon wafers in the X-axis direction, and a diversion station A and a first transfer station B are sequentially arranged on the conveying path of the main conveyor line 1.

[0060] The coding operation line 4 is arranged on the side of the main conveying line 1 , and the diversion conveying mechanism 2 is configured to divert the silicon wafers located at the diversion station A to the branch conveying line 41 of the coding operation line 1 .

[0061] The branch conveyor line 41 is configured to convey silicon wafers along the first horizontal direction. At least one coding station, a decoding station and a first unloading station are sequentially arranged on the conveying path of the branch conveyor line 41. A coding mechanism 42 is correspondingly arranged at each coding station, and the coding mechanism 42 is used to code the silicon wafer located at the coding station. A decoding mechanism 43 is arranged at the decoding station, and the decoding mechanism 43 is used to decode the coded silicon wafer located at the decoding station to determine whether the coding is qualified.

[0062] The first transfer mechanism 3 is configured to pick up silicon wafers with qualified coding from the first unloading station, and convey the picked silicon wafers with qualified coding to the receiving box 46 located at the side of the first unloading station, or to convey the picked silicon wafers with qualified coding to the first transfer station B, and the main conveyor line 1 continues to convey the silicon wafers with qualified coding to the downstream.

[0063] The coding device in the embodiment of the present application has a coding operation line for coding silicon wafers on the side of the main conveyor line 1. The silicon wafers complete the coding operation on the coding operation line. The silicon wafers that have passed the coding are directly collected into the receiving box or put back to the main conveyor line, and are further conveyed to the downstream by the main conveyor line.

[0064] Since the coding operation is not performed on the main conveyor line 1, compared with the prior art, the coding device in the embodiment of the present application will not affect the normal conveying of the main conveyor line 1, thereby ensuring the conveying efficiency of the main conveyor line 1 and improving the working rhythm.

[0065] In order to recycle the silicon wafers with unqualified coding on the branch conveyor line 41 that have not been taken away by the first transfer mechanism 3, optionally, the coding operation line 4 also includes an NG material box 47, which is arranged at the output end of the branch conveyor line 41. The NG material box is used to receive the silicon wafers with unqualified coding output by the branch conveyor line 41.

[0066] Optionally, a basket that can be raised and lowered is provided at the output end of the main conveyor line 1, and the basket is used to collect the silicon wafers with qualified coding output from the main conveyor line 1. Optionally, the basket is fixed on a basket lifting device, and a plurality of slots are provided in the basket along the vertical direction, and each slot is used to collect a silicon wafer. After the basket collects each silicon wafer, the basket lifting device immediately drives the basket to descend or rise to a predetermined height, so that another empty slot is aligned with the output end of the main conveyor line 1 to receive another silicon wafer. The basket full of silicon wafers with qualified coding is transferred as a whole to the back-end workstation, so that the silicon wafers with qualified coding can be conveniently taken out one by one.

[0067] The coding device in the embodiment of the present application can also be used only for collecting silicon wafers without coding the silicon wafers. For example, the main conveyor line 1 first conveys the silicon wafers that have passed the inspection of the front-end detection mechanism to the diversion station A, and the diversion conveyor mechanism 2 then diverts the silicon wafers to the branch conveyor line 41 of the coding operation line 1, and the branch conveyor line 41 directly conveys the silicon wafers to the first unloading station, and the first transfer mechanism 3 finally collects the silicon wafers into the receiving box 46. For another example, the main conveyor line 1 first conveys the silicon wafers that have passed the inspection of the front-end detection mechanism to the first transfer station B, and then the first transfer mechanism 3 collects the silicon wafers into the receiving box 46. For another example, the main conveyor line 1 directly conveys the silicon wafers that have passed the inspection of the front-end detection mechanism to the material basket located at the output end of the main conveyor line 1.

[0068] like Figure 1 to Figure 2 As shown, optionally, a rejection station C located in front of the diversion station A is also provided on the conveying path of the main conveying line 1. Correspondingly, the coding device in the embodiment of the present application also includes a rejection mechanism 6 provided at the rejection station C, and the rejection mechanism 6 is used to reject defective silicon wafers located at the rejection station C. In this way, it can be ensured that the silicon wafers conveyed to the diversion station A are all defective and qualified silicon wafers.

[0069] like Figure 3 As shown, optionally, the diversion conveying mechanism 2 includes a sheet picking part 21 and a diversion conveying part 22, and the conveying directions of the sheet picking part 21 and the diversion conveying part 22 are both perpendicular to the conveying direction of the main conveying line 1. Wherein: the sheet picking part 21 is located above the diversion station A, and the diversion conveying part 22 is docked with the sheet picking part 21. The sheet picking part 21 is configured to suck silicon wafers from the diversion station A, and is configured to convey the sucked silicon wafers to the diversion conveying part 22, and the diversion conveying part 22 is configured to convey the silicon wafers to the branch conveying line 41 of the coding operation line 4.

[0070] Both the wafer taking part 21 and the diversion conveying part 22 can adopt an existing suction conveying assembly capable of sucking and conveying the silicon wafer below. For example, the suction conveying assembly includes a conveyor belt and an adsorption assembly. The adsorption assembly (for example, a Bernoulli suction cup) is used to suck the silicon wafer upward so that the silicon wafer is adsorbed on the lower conveying surface of the conveyor belt, and the conveyor belt is used to transport the silicon wafer adsorbed thereon. When the adsorption assembly stops sucking the silicon wafer, the silicon wafer falls from the conveyor belt.

[0071] Continue to refer Figure 1 and Figure 2 As shown, optionally, the coding operation line 4 is set to two, and the two coding operation lines 4 are respectively located on both sides of the main conveying line 1. Figure 3 As shown, correspondingly, the diversion conveying part 32 is set into two groups, and the two groups of diversion conveying parts 22 are both connected to the sheet picking part 21 and are located on both sides of the sheet picking part 21. The sheet picking part 21 sucks the silicon wafer from the diversion station A, and conveys the sucked silicon wafer to one of the two groups of diversion conveying parts 22, for example, alternately conveying the sucked silicon wafer to the two groups of diversion conveying parts 22. The two groups of diversion conveying parts 22 convey the silicon wafers to the corresponding branch conveying lines 41 respectively. The two coding operation lines 4 implement silicon wafer coding in parallel, which can further improve the coding efficiency of the coding device in the embodiment of the present application.

[0072] Of course, three or more coding lines 4 may be arranged on both sides of the main conveying line 1 .

[0073] Continue to refer Figure 1 and Figure 2 As shown, optionally, the coding operation line 4 in the embodiment of the present application further includes a regularization mechanism 44, and a regularization station located in front of the coding station is also provided on the conveying path of the branch conveying line 41. The regularization mechanism 44 is provided at the regularization station, and the regularization mechanism 44 is used to correct the position of the silicon wafer located at the regularization station, so that the coding mechanism 42 can ensure that the coding is performed on the designated position of the silicon wafer.

[0074] like Figure 8 As shown, optionally, the tidying mechanism 44 includes a tidying driving unit 441, a first tidying plate 442, and a second tidying plate 443, wherein the tidying driving unit 441 is located below the branch conveyor line 41, and the first tidying plate 442 and the second tidying plate 443 are located on both sides of the branch conveyor line 41, and are both connected to the tidying driving unit 441 by transmission. In the initial state, the first tidying plate 442 and the second tidying plate 443 are both away from the branch conveyor line 41. When the silicon wafer arrives at the tidying station, the tidying driving unit 441 drives the first tidying plate 442 and the second tidying plate 443 to move toward the branch conveyor line 41, thereby implementing tidying of the silicon wafer.

[0075] When the coding mechanism 42 is coding the silicon wafer, in order to ensure the coding effect, the silicon wafer needs to be fixed on the branch conveyor line 41 and remain stationary. Figure 2 , Figure 6 and Figure 7 As shown, the branch conveyor line 41 includes a first conveying section 411, a second conveying section 412, a third conveying section 413 and a fourth conveying section 414 which are sequentially arranged along the conveying path of the branch conveyor line, wherein: the tidying station is located on the conveying path of the first conveying section 411, the coding station is located on the conveying path of the second conveying section 412, the decoding station is located on the conveying path of the third conveying section 413, and the first unloading station is located on the conveying path of the fourth conveying section 414. In particular, the second conveying section 412 is configured to absorb the silicon wafer, thereby ensuring that the silicon wafer located at the coding station is sucked and fixed on the second conveying section 412 during the coding process.

[0076] Optionally, the second conveying section 412 includes an adsorbent and two parallel conveyor belts, wherein the adsorption surface of the adsorbent is lower than the conveying surfaces of the two conveyor belts, and the adsorbent is used to adsorb the silicon wafers on the two conveyor belts. Of course, the second conveying section 412 can also be only a conveyor belt with a larger width, and the conveyor belt is provided with adsorption holes connected to the air extraction device, and the conveyor belt adsorbs the silicon wafers through the adsorption holes. The conveyor belt with a larger width can stably support the entire surface of the silicon wafer to ensure the coding effect.

[0077] The first conveying section 411 , the third conveying section 413 and the fourth conveying section 414 only need to convey the silicon wafers, and ordinary conveying belts can be used without setting adsorption parts and adsorption devices, thereby saving the cost of branch conveying lines.

[0078] like Figure 6As shown, optionally, the coding mechanism 42 includes a coding laser 421, a positioning camera (not shown in the figure) and a surface light source 422, wherein: the positioning camera is arranged below the branch conveyor line 41, and the positioning camera is configured to position the silicon wafer 100 located at the coding station to obtain the position information of the silicon wafer. The coding laser 421 is arranged above the branch conveyor line 41, and the coding laser 421 is configured to perform laser coding on the silicon wafer 100 based on the position information of the silicon wafer. The coding laser 421 is arranged on a lifting mechanism 423. The lifting mechanism 423 is configured to drive the coding laser 421 to rise and fall, so as to adjust the distance between the coding laser 421 and the silicon wafer 100 located at the coding station. In this way, it can be ensured that the coding laser 421 accurately hits the code at the specified position of the silicon wafer 100. The surface light source 422 is arranged above the branch conveyor line 41, and is located between the coding laser 421 and the positioning camera. An optical channel for the laser to pass through is arranged on the surface light source 422. The surface light source 422 is used to illuminate the silicon wafer 100 located at the coding station, so as to cooperate with the positioning camera to position the silicon wafer 100, and the laser emitted by the coding laser 421 reaches the silicon wafer 100 through the optical channel.

[0079] By cooperating with the positioning camera and the surface light source 422, precise positioning of the silicon wafer at the coding station is achieved, and by setting the coding laser 421 on the lifting mechanism 423, the distance between the coding laser 421 and the silicon wafer can be adjusted, ultimately ensuring that the coding laser 421 can implement precise coding of the designated position of the silicon wafer.

[0080] Optionally, the lifting mechanism 423 includes a lifting column 424, a mounting plate 425, a slider, an adjustment handle 426 and a screw. The adjustment handle 426 is fixed to the upper end of the screw, the screw is arranged in the lifting column 424, the slider is fixed to the screw nut, the mounting plate 425 is fixed to the slider, and the coding laser 421 is fixed to the mounting plate. By rotating the adjustment handle 426, the height of the coding laser 421 in the vertical direction can be manually adjusted. Of course, the lifting mechanism 423 can also adopt an existing linear drive module that can drive the coding laser 421 to automatically rise and fall.

[0081] It should be noted that for some coding lasers 421 , the silicon wafer does not need to be stationary, that is, the silicon wafer can also be normally coded during normal transportation on the second conveying section 412 .

[0082] like Figure 6 As shown, optionally, the coding operation line 4 also includes a dust removal mechanism 45 arranged on the side of the coding station, and the dust removal mechanism 45 is used to absorb the dust generated during the coding process, so as to prevent the dust generated during the coding process from contaminating the silicon wafer and the machine.

[0083] The dust removal mechanism 45 includes, for example, a dust removal pipe connected to the air extraction device and a suction nozzle connected to the dust removal pipe, wherein the suction port of the suction nozzle faces the coding station.

[0084] like Figure 7 As shown, the decoding mechanism 43 includes an angle adjustment bracket 431 and a barcode scanner 432 disposed on the angle adjustment bracket 431. The barcode scanner 432 is connected to the host computer signal, and the barcode scanner 432 is used to identify the graphics formed by the coding on the silicon wafer 100, and provide the recognition result to the host computer. The host computer determines whether the coding is qualified according to the recognition result.

[0085] As 1 and Figure 4 As shown, optionally, the first transfer mechanism 3 includes an intermediate transfer part 31 and a first transfer conveying part 32, and the conveying directions of the intermediate transfer part 31 and the first transfer conveying part 32 are both perpendicular to the conveying direction of the main conveying line 1, wherein: the intermediate transfer part 31 is located above the first transfer station B, the first end of the first transfer conveying part 32 is docked with the intermediate transfer part 31, and a receiving box 46 is provided below the second end of the first transfer conveying part 32. The first transfer conveying part 32 is configured to pick up silicon wafers with good coding from the first unloading station of the branch conveying line 41, and to convey the picked silicon wafers with good coding to the receiving box 46. Alternatively, the first transfer conveying part 32 is configured to convey the picked silicon wafers with good coding to the intermediate transfer part 31, and the intermediate transfer part 31 is configured to convey the silicon wafers with good coding to the first transfer station B, so that the main conveying line 1 can continue to convey the silicon wafers with good coding to the back-end, for example, to collect the silicon wafers into a liftable basket located at the output end of the main conveying line 1.

[0086] In addition, as mentioned in the previous embodiment, where only silicon wafers are collected but not coded, the intermediate transfer section 31 can also be configured to pick up silicon wafers from the first transfer station B, and transport the picked up silicon wafers to the first transfer conveying section 32, and the first transfer conveying section 32 transports the silicon wafers to the receiving box 36.

[0087] It can be seen that by configuring the first transport mechanism 3 , the first transport mechanism 3 can flexibly transport silicon wafers according to various application requirements.

[0088] Continue to refer Figure 4As shown, optionally, the first transfer conveying section 32 includes a first conveying section 321 and a second conveying section 322, wherein the first conveying section 321 is docked with the intermediate transfer section 31 and is located above the branch conveying line 41, and the receiving box 36 is arranged below the output end of the second conveying section 322. The second conveying section 322 can receive the silicon wafers conveyed by the intermediate transfer section 31 and convey them to the second conveying section 322, and the second conveying section 322 collects the silicon wafers into the receiving box 46; it can also pick up silicon wafers from the branch conveying line 41 and convey them to the intermediate transfer section 31, and the intermediate transfer section 31 puts the silicon wafers back to the main conveying line 1.

[0089] The intermediate transfer section 31, the first conveying section 321 and the second conveying section 322 can all use existing suction and conveying components that can suck and convey the silicon wafers below. For example, the suction and conveying components include a conveyor belt and an adsorption component. The adsorption component (for example, a Bernoulli suction cup) is used to suck the silicon wafer upward so that the silicon wafer is adsorbed on the lower conveying surface of the conveyor belt, and the conveyor belt is used to transport the silicon wafer adsorbed thereon. When the adsorption component stops sucking the silicon wafer, the silicon wafer falls from the suction and conveying component.

[0090] Continue to refer Figure 1 and Figure 2 As shown, optionally, the coding operation line 4 is set to two, and the two coding operation lines 4 are respectively located on both sides of the main conveying line 1. Figure 4 As shown, correspondingly, the first transfer and conveying parts 32 are set to two groups, and the two groups of first transfer and conveying parts 32 are docked with the intermediate transfer part 31 and are located on both sides of the intermediate transfer part 32. The two groups of first transfer and conveying parts 32 respectively pick up silicon wafers with qualified coding from the first unloading station of the corresponding branch conveyor line 41, and respectively convey the picked silicon wafers with qualified coding to the corresponding receiving box 46. Alternatively, the picked silicon wafers with qualified coding are respectively conveyed to the intermediate transfer part 31. The intermediate transfer part 31 is also configured to pick up silicon wafers from the first transfer station B, and convey the picked silicon wafers to one of the two groups of first transfer and conveying parts. For example, the picked silicon wafers are conveyed to the two groups of first transfer and conveying parts 32 alternately.

[0091] Of course, three or more coding lines 4 may be arranged on both sides of the main conveying line 1 .

[0092] like Figure 1 to Figure 2 As shown, optionally, a second unloading station located after the first unloading station is also provided on the conveying path of the branch conveyor line 4 of the coding operation line. Correspondingly, the coding device in the embodiment of the present application also includes a second transfer mechanism 5, which is configured to pick up silicon wafers with good coding quality from the second unloading station of the branch conveyor line 41, and transport the picked silicon wafers with good coding quality to a receiving box 46 located on the side of the second unloading station.

[0093] By setting a second unloading station after the first unloading station and correspondingly setting a second transfer mechanism 5, the second transfer mechanism 5 can collect the silicon wafers with good coding that are not collected in time by the first transfer mechanism 3 into the receiving box 46, ensuring that all the silicon wafers with good coding on the branch conveyor line 41 can be collected into the receiving box 46.

[0094] like Figure 1 and Figure 5 As shown, optionally, the second transfer mechanism 5 includes a second transfer conveying part 51 and a third transfer conveying part 52. The second transfer conveying part 51 is located above the branch conveying line 41, the input end of the third transfer conveying part 52 is docked with the second transfer conveying part 51, and a receiving box 46 is provided below the output end of the third transfer conveying part 52. The second transfer conveying part 51 is configured to absorb silicon wafers with qualified coding from the second unloading station and convey the absorbed silicon wafers to the third transfer conveying part 52. After receiving the silicon wafers conveyed by the second transfer conveying part 51, the third transfer conveying part 52 conveys the silicon wafers to the receiving box 46.

[0095] The second transfer conveying part 51 and the third transfer conveying part 52 can both adopt an existing suction conveying component capable of sucking and conveying the silicon wafer below. For example, the suction conveying component includes a conveyor belt and an adsorption component. The adsorption component (for example, a Bernoulli suction cup) is used to suck the silicon wafer upward so that the silicon wafer is adsorbed on the lower conveying surface of the conveyor belt, and the conveyor belt is used to transport the silicon wafer adsorbed thereon. When the adsorption component stops sucking the silicon wafer, the silicon wafer falls from the suction conveying component.

[0096] The above description of the utility model is sufficiently detailed and has certain particularities. Those skilled in the art should understand that the description in the embodiments is merely exemplary, and all changes made without departing from the true spirit and scope of the utility model should fall within the scope of protection of the utility model. The scope of protection claimed by the utility model is defined by the claims, not by the above description in the embodiments. Moreover, the embodiments mentioned in this application are not limited to being implemented individually, and some embodiments can also be implemented in combination.

Claims

1. A coding device, characterized in that: The coding device comprises: a main conveying line, a branch conveying mechanism, a first transfer mechanism and at least one coding operation line, wherein the coding operation line comprises a branch conveying line, a coding mechanism and a decoding mechanism, wherein: The main conveyor line is configured to convey silicon wafers along a first horizontal direction, and a diversion station and a first transfer station are sequentially arranged on the conveying path of the main conveyor line; The coding operation line is arranged at the side of the main conveying line, and the diversion conveying mechanism is configured to divert the silicon wafers located at the diversion station to the branch conveying line of the coding operation line; The branch conveyor line is configured to convey silicon wafers along the first horizontal direction. At least one coding station, a decoding station and a first unloading station are sequentially arranged on the conveying path of the branch conveyor line. A coding mechanism is correspondingly arranged at each coding station, and the coding mechanism is used to code the silicon wafers located at the coding station. The decoding station is provided with a decoding mechanism, and the decoding mechanism is used to decode the coded silicon wafers located at the decoding station to determine whether the coding is qualified. The first transfer mechanism is configured to pick up silicon wafers with qualified coding from the first unloading station, and transport the picked silicon wafers with qualified coding to a receiving box located at the side of the first unloading station, or transfer the picked silicon wafers with qualified coding to the first transfer station.

2. The coding device according to claim 1, characterized in that: The coding operation line also includes an NG material box, which is arranged at the output end of the branch conveyor line, and the NG material box is used to receive silicon wafers with unqualified coding output by the branch conveyor line.

3. The coding device according to claim 1, characterized in that: A lifting basket is provided at the output end of the main conveyor line, and the basket is used to collect the silicon wafers output by the main conveyor line.

4. The coding device according to claim 1, characterized in that: The diversion conveying mechanism comprises a sheet taking part and a diversion conveying part, and the conveying direction of the sheet taking part and the conveying direction of the diversion conveying part are both perpendicular to the conveying direction of the main conveying line, wherein: The sheet taking part is located above the diversion station, and the diversion conveying part is connected to the sheet taking part; The wafer picking section is configured to pick up silicon wafers from the diversion station, and is configured to convey the sucked silicon wafers to the diversion conveying section, and the diversion conveying section is configured to convey the silicon wafers to the branch conveying line of the coding operation line.

5. The coding device according to claim 4, characterized in that: There are at least two coding operation lines, which are respectively located on both sides of the main conveying line. The diversion conveying parts are provided in two groups, and both groups of diversion conveying parts are connected to the sheet taking part and are located on both sides of the sheet taking part. The wafer picking section is also configured to pick up silicon wafers from the diversion station, and is configured to convey the sucked silicon wafers to one of the two groups of diversion conveying sections, and the two groups of diversion conveying sections are configured to convey the silicon wafers to the corresponding branch conveying lines respectively.

6. The coding device according to claim 1, characterized in that: The coding operation line also includes a tidying mechanism, and a tidying station located in front of the coding station is also provided on the conveying path of the branch conveyor line; The aligning mechanism is arranged at the aligning station, and is used for correcting the position of the silicon wafer located at the aligning station.

7. The coding device according to claim 6, characterized in that: The branch conveyor line comprises a first conveyor section, a second conveyor section, a third conveyor section and a fourth conveyor section which are sequentially arranged along the conveying path of the branch conveyor line, wherein: The tidying station is located on the conveying path of the first conveying section, the coding station is located on the conveying path of the second conveying section, the decoding station is located on the conveying path of the third conveying section, and the first unloading station is located on the conveying path of the fourth conveying section; The second conveying section is configured to be able to absorb the silicon wafer.

8. The coding device according to claim 7, characterized in that: The second conveying section comprises an adsorbent and two parallel conveying belts, the adsorption surface of the adsorbent is lower than the conveying surfaces of the two conveying belts, and the adsorbent is used to adsorb the silicon wafer on the two conveying belts; or, The second conveying section includes a conveying belt, and the conveying belt is provided with adsorption holes connected with the air extraction device, and the conveying belt adsorbs the silicon wafers through the adsorption holes.

9. The coding device according to claim 1, characterized in that: The coding mechanism includes a coding laser, a positioning camera and a surface light source, wherein: The positioning camera is arranged below the branch conveyor line, and the positioning camera is configured to position the silicon wafer located at the coding station to obtain the position information of the silicon wafer; The coding laser is arranged above the branch conveyor line, and the coding laser is configured to perform laser coding on the silicon wafer based on the position information of the silicon wafer; The coding laser is arranged on a lifting mechanism, and the lifting mechanism is configured to drive the coding laser to rise and fall, so as to adjust the distance between the coding laser and the silicon wafer located at the coding station; The surface light source is arranged above the branch conveyor line, the surface light source is located between the coding laser and the positioning camera, and an optical channel for the laser to pass through is arranged on the surface light source; The surface light source is used to illuminate the silicon wafer located at the coding station to cooperate with the positioning camera to position the silicon wafer. The laser emitted by the coding laser reaches the silicon wafer through the optical channel.

10. The coding device according to claim 1, characterized in that: The coding operation line further includes a dust removal mechanism arranged at the side of the coding station, and the dust removal mechanism is used to absorb dust generated during the coding process.

11. The coding device according to claim 1, characterized in that: The decoding mechanism includes an angle adjustment bracket and a barcode scanning gun arranged on the angle adjustment bracket; The barcode scanner is connected to the host computer by signal. The barcode scanner is used to identify the graphics formed by the coding on the silicon wafer and provide the identification result to the host computer. The host computer determines whether the coding is qualified according to the identification result.

12. The coding device according to claim 1, characterized in that: The first transfer mechanism includes an intermediate transfer unit and a first transfer conveying unit, and the conveying directions of the intermediate transfer unit and the first transfer conveying unit are both perpendicular to the conveying direction of the main conveying line, wherein: The intermediate transfer part is located above the first transfer station, the first end of the first transfer conveying part is connected to the intermediate transfer part, and a material receiving box is provided below the second end of the first transfer conveying part; The first transfer conveying section is configured to pick up silicon wafers with good coding from the first unloading station of the branch conveying line, and convey the picked silicon wafers with good coding to the receiving box; or, the first transfer conveying section is configured to convey the picked silicon wafers with good coding to the intermediate transfer section, and the intermediate transfer section is configured to convey the silicon wafers with good coding to the first transfer station; The intermediate transfer section is also configured to pick up silicon wafers from the first transfer station and convey the picked silicon wafers to the first transfer conveying section, and the first transfer conveying section is configured to convey the silicon wafers into the receiving box.

13. The coding device according to claim 12, characterized in that: There are at least two coding operation lines, which are respectively located on both sides of the main conveying line. The first transfer and conveying parts are provided in two groups, and both groups of the first transfer and conveying parts are connected to the intermediate transfer part and are located on both sides of the intermediate transfer part. The two groups of the first transfer conveying parts respectively pick up the silicon wafers with good coding from the first unloading station of the corresponding branch conveying line, and respectively convey the picked silicon wafers with good coding to the corresponding receiving boxes; or respectively convey the picked silicon wafers with good coding to the intermediate transfer part; The intermediate transfer section is also configured to pick up silicon wafers from the first transfer station and transport the picked-up silicon wafers to one of the two groups of the first transfer conveying sections.

14. The coding device according to claim 1, characterized in that: A second unloading station located behind the first unloading station is also provided on the conveying path of the branch conveying line of the coding operation line; The coding device also includes a second transfer mechanism, which is configured to pick up silicon wafers with qualified coding from the second unloading station of the branch conveyor line and transport the picked silicon wafers with qualified coding to a receiving box located on the side of the second unloading station.

15. The coding device according to claim 14, characterized in that: There are at least two coding operation lines, which are respectively located on both sides of the main conveying line; the second transfer mechanism is provided in two groups, which are located on both sides of the main conveying line; The two groups of the second transfer mechanisms respectively pick up silicon wafers with qualified coding from the corresponding branch conveyor lines, and convey the picked silicon wafers with qualified coding to the corresponding receiving boxes.

16. The coding device according to claim 1, characterized in that: The conveying path of the main conveying line is also provided with a rejecting station located in front of the diversion station; The coding device further comprises a rejecting mechanism arranged at the rejecting station, and the rejecting mechanism is used to reject defective silicon wafers located at the rejecting station.

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