Silicon wafer bagging mechanism and packaging machine

Abstract

The utility model relates to a silicon wafer bagging mechanism and a packaging machine provided with the same, which are provided with: a bagging conveying line, which is provided with a bagging position and a bag folding position; the bagging mechanism is in butt joint with the bagging position, is provided with a push rod and can sleeve the silicon wafers into the bin bags; and the bag folding mechanism is in butt joint with the bag folding position and is provided with bag folding battens and a stacking and pushing plate, and all the bag folding battens are arranged on one side of the bagging conveying line side by side and are crossed with the stacking and pushing plate. The device is reasonable in structural design, automatic in operation in the whole process, accurate and safe in matching, high in automation degree, capable of continuously conducting double-layer folding on bag openings during bag folding so that silicon wafers can be neatly attached to bin bags, high in bagging efficiency and good in bagging quality, secondary damage to the surfaces of the silicon wafers can be avoided, the rate of finished products is increased, and the production cost is reduced. And subsequent boxing operation is facilitated.

Description

Technical Field

[0001] The present application belongs to the field of solar photovoltaic packaging technology, and in particular relates to a silicon wafer bagging mechanism and a packaging machine provided with the bagging mechanism. Background Art

[0002] The existing silicon wafer bagging is still a semi-automatic and semi-manual operation, and the bag mouth can only be folded once. The folded bag mouth is very likely to rebound and withdraw, making it impossible for the silicon wafer to fit tightly against the packaging bag, which directly affects the subsequent boxing operation. Not only is the packaging quality poor and the efficiency low, but it is also very easy to cause secondary damage to the silicon wafer, resulting in a low silicon wafer yield. Summary of the invention

[0003] The present application provides a silicon wafer bagging mechanism and a packaging machine equipped with the bagging mechanism, which solves the technical problem that the poor packaging effect in the existing bagging process easily leads to a low yield.

[0004] In order to solve at least one of the above technical problems, the technical solution adopted in this application is:

[0005] A silicon wafer bagging mechanism, comprising:

[0006] A bagging conveyor line, which is provided with bagging and bag folding positions;

[0007] A bagging mechanism, which is connected to the bagging position and is provided with a push rod, and can put the silicon wafer into the bag;

[0008] A bag folding mechanism, which is connected to the bag folding position and is provided with bag folding strips and stacking and pushing plates, all of which are arranged side by side on one side of the bagging conveyor line and are arranged crosswise with the stacking and pushing plates;

[0009] Taking the edge of the bag folding strip away from the bag filling conveyor line as a reference, the suspended section at the open end of the bin bag containing silicon wafers is made to droop, and then the stacking and pushing plate is pushed to stack the bent suspended section under the bag folding strip, and the bag folding strip is controlled to be pulled away from the folding mouth so that the open end of the bin bag can be continuously folded.

[0010] Furthermore, the bagging mechanism further comprises:

[0011] A pusher conveyor line is used to move silicon wafers, and the pusher is arranged at its midline position;

[0012] A long strip plate, which is arranged side by side with the bagging conveyor line and is provided with adsorption holes at a position where it is connected with the bagging position;

[0013] A hole suction column, suspended above the adsorption hole;

[0014] After the upper and lower planes of the opening end of the bag are respectively opened by the suction column and the suction hole, the push rod can drive the silicon wafer to move along the material pushing conveyor line toward the opening end of the bag, and push the silicon wafer into the bag at one end of the bagging position;

[0015] Preferably, the bagging conveyor line is configured as a conveyor belt provided with a plurality of vacuum suction holes, and a plurality of the suction holes are further provided at the bagging position.

[0016] Furthermore, the long strip is located between the pushing material conveyor line and the bagging conveyor line; a bag-supporting assembly is also provided between the long strip and the pushing material conveyor line, and the bag-supporting assembly includes bag-supporting guide rods arranged relatively, and the bag-supporting guide rods are all arranged toward one side of the bagging position and suspended above the long strip;

[0017] Preferably, a fixing plate for fixing the bag-supporting guide rod, and vertically arranged slide rails 1 and 2 are provided below the hole suction column, wherein cylinder 1 cooperating with slide rail 1 can drive the bag-supporting guide rod to move horizontally along the length direction of the bagging conveyor line; cylinder 2 cooperating with slide rail 2 can drive the bag-supporting guide rod to move horizontally and longitudinally along the direction of the pushing conveyor line.

[0018] Furthermore, a bag pressing position is provided on the bagging conveyor line, which is located between the bagging position and the bag folding position;

[0019] A bag pressing mechanism docking with the bag pressing position is also provided, which is located on a side of the bagging conveyor line away from the bagging structure and is suspended just above the bag pressing position.

[0020] Furthermore, the bag pressing mechanism includes a bag pressing panel, a bag pressing bracket for fixing the bag pressing panel, and a bag pressing cylinder, wherein the bag pressing bracket is constructed as an L-shaped structure; the bag pressing cylinder drives the bag pressing panel to move up and down along the thickness direction of the silicon wafer through the bag pressing bracket to compress the bag space so that the air inside it is discharged.

[0021] Furthermore, the bag folding mechanism is provided with two bag folding slats, and a lifting cylinder for controlling the vertical upward and downward movement of the bag folding slats and a transverse cylinder for horizontal movement along the length direction of the bag folding slats are provided below the bag folding slats, and the two bag folding slats are pulled out in opposite directions.

[0022] Furthermore, a group of blowing pipes suspended downwardly are provided above the outermost bag folding strips, and the airflow blown out from the blowing pipes can blow the suspended section of the open end of the warehouse bag to bend it downward; the blowing pipes are arranged on the outermost bag folding strip close to the stacking and pushing plate;

[0023] Preferably, lower pressure plates for folding the bag opening during secondary bag folding are provided on both outer sides of the blowing tube in the width direction. The lower pressure plate is an L-shaped structure, and its downwardly bent end is arranged close to the bag opening, and can be embedded in the gap between the two bag folding strips during secondary bag folding.

[0024] Furthermore, the stacking push plate is arranged directly below the blowing pipe, and is driven by the push plate cylinder to be telescopically movable in a direction perpendicular to the bagging conveyor line; the stacking push plate is constructed as a flat plate surface structure, and is arranged below the upper limit of the two bag folding strips.

[0025] Furthermore, a bag loading mechanism for loading the bin bag is provided, which is docked with the bag loading position placed on the bag loading conveyor line, arranged side by side with the bag loading mechanism, and located on the side of the bag loading mechanism away from the bag folding mechanism;

[0026] Preferably, the bag loading mechanism includes: a bag loading platform, a bag storage position arranged on the bag loading platform, a bag suction plate for taking and placing bin bags, and a bag loading transfer machine. The bag loading transfer machine can drive the bag suction plate to transfer the bin bags in the bag storage position to the bag loading position.

[0027] A packaging machine is provided with the bagging mechanism as described above.

[0028] The silicon wafer bagging mechanism designed by the present application has a reasonable structural design, fully automatic operation, no need for human assistance, accurate and safe coordination, high degree of automation, and can continuously double-fold the bag opening when folding the bag, so that the silicon wafers are neatly placed close to the bag, with high bagging efficiency and good quality, and can also avoid secondary damage to the surface of the silicon wafers, improve the yield rate, and facilitate subsequent boxing operations. The present application also proposes a packaging machine equipped with the bagging mechanism. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] Figure 1 is a three-dimensional diagram of a bagging unit according to an embodiment of the present application;

[0030] Figure 2 is a three-dimensional diagram of a bagging unit from another angle of an embodiment of the present application;

[0031] Figure 3 is a three-dimensional diagram of a bag support assembly according to an embodiment of the present application;

[0032] Figure 4 It is a three-dimensional diagram of the position of the bag folding strips of one embodiment of the present application.

[0033] In the figure:

[0034] 100, bagging mechanism 10, bagging conveyor line 11, bagging position

[0035] 12. Bagging position 13. Bag pressing position 14. Bag folding position

[0036] 20. Bag loading mechanism 21. Bag loading platform 22. Bag suction plate

[0037] 23. Bag transfer machine 24. Tray 25. Bag storage

[0038] 26, slide 30, bagging mechanism 31, push material conveyor line

[0039] 32. Long strip plate 33. Hole suction column 34. Adsorption hole

[0040] 35. Push rod 36. Bag support assembly 361. Bag support guide rod

[0041] 362, fixed plate 363, slide rail 1 364, slide rail 2

[0042] 365, Cylinder 1 366, Cylinder 2 40, Bag pressing mechanism

[0043] 41. Bag pressing panel 42. Bag pressing bracket 43. Bag pressing cylinder

[0044] 50. Bag folding mechanism 51. First bag folding strip 52. Second bag folding strip

[0045] 53, stacking plate 54, air blowing pipe 55, lower pressure plate

[0046] 56, suspension frame 60, storage bag 70, silicon wafer DETAILED DESCRIPTION

[0047] The present application is described in detail below with reference to the accompanying drawings and specific embodiments.

[0048] This embodiment provides a silicon wafer bagging mechanism, such as Figure 1As shown, the device is used to load the silicon wafers 70 that have passed the inspection into the packaging bin bag 60, and includes a bagging conveyor line 10, a bagging mechanism 20 for loading the bin bag 60, a bagging mechanism 30 for pushing the regular silicon wafers 70 into the bin bag 60 with a single-side opening, a bag pressing mechanism 40 for squeezing the air in the bin bag, and a bag folding mechanism 50 for continuously folding the bag opening of the bin bag 60 containing the silicon wafers. Among them, the bagging mechanism 20, the bagging mechanism 30 and the bag folding mechanism 50 are all placed on the same side of the bagging conveyor line 10, the bag pressing mechanism 40 is located on the other side of the bagging conveyor line 10, the bagging mechanism 20 and the bag folding mechanism 50 are respectively placed on both ends of the length of the bagging conveyor line 10, and the bagging mechanism 30 and the bag pressing mechanism 40 are located between the bagging mechanism 20 and the bag folding mechanism 50. On the bagging conveyor line 10, a bag loading position 11, a bag loading position 12, a bag pressing position 13 and a bag folding position 14 are sequentially arranged along its transmission direction, which are respectively connected to the bag loading mechanism 20, the bag loading mechanism 30, the bag pressing mechanism 40 and the bag folding mechanism 50.

[0049] In this embodiment, the silicon wafer 70 is collectively referred to as a stack of stacked substrates, which can be a square-structured substrate or a rectangular-structured substrate, both of which meet all the units in this application and are within the protection scope of this case. For the transfer of the rectangular silicon wafer 70, other components in this application can be applied to this type of silicon wafer, and only the regular width needs to be changed; the following only takes the square-structured silicon wafer 70 as an example.

[0050] Along the transmission direction of the bagging conveyor line 10, the automatic operations of loading the bin bag, stretching the bin bag opening, bagging the silicon wafers, pressing the bin bag containing the silicon wafers, and continuously folding the bin bag opening are carried out in sequence. The whole process is automatic, no human assistance is required, the coordination is accurate and safe, the structural design is reasonable, and the degree of automation is high. When folding the bag, the bag opening can also be folded in two layers continuously so that the silicon wafers are neatly placed close to the bin bag. The bagging efficiency is high and the quality is good. It can also avoid secondary damage to the surface of the silicon wafers, improve the yield rate, and facilitate the subsequent boxing operation.

[0051] like Figure 2 As shown, the bagging conveyor line 10 is constructed as a conveyor belt with a plurality of vacuum suction holes, and the width of the conveyor belt is adapted to the width of the silicon wafer, and thus the width is smaller than the length of the bin bag 60. Since the opening ends of the bin bag 60 are all arranged toward the side of the bagging mechanism 30, a part of the opening end will be arranged outside the loading conveyor line 10. In order to ensure that the bin bag 60 can move forward horizontally and stably without deformation after being placed in the upper bagging position 11, a long strip board 32 as an auxiliary pad is provided on the side of the bagging conveyor line 10 close to the bagging mechanism 30, and its length only spans the upper bagging position 11 and the bagging position 12.

[0052] That is, a long strip 32 parallel to the bagging conveyor line 10 is provided on the side of the bagging conveyor line 10 close to the bagging mechanism 30. The long strip 32 can support the opening section of the bin bag 60 when the silicon wafers are transported into the bin bag 60 by the bagging conveyor line 10 to prevent the risk of the bin bag rolling or falling. The end of the pusher conveyor line 31 and the upper bag placement platform 21 are arranged close to the side of the long strip 32, and the pusher conveyor line 31 and the bagging conveyor line 10 are both movable conveyor lines with conveyor belts.

[0053] The bag loading mechanism 20 includes a bag loading platform 21 , a bag loading transfer machine 23 disposed on one side of the bag loading platform 21 , a bag storage position 25 disposed on the bag loading platform 21 , and a bag suction plate 22 for sucking the bin bag 60 .

[0054] The upper bag placement platform 21 is a fixed placement rack, on which two bag storage positions 25 for storing the bag 60 are arranged in parallel and arranged in the same column as the upper bag position 11. The upper bag placement platform 21 is also provided with a tray 24 for placing the bag 60 and a slideway 26 that can drive the tray 24 to slide to the bag storage position 25. The bag 60 is pre-placed and stacked on the tray 24 in advance, and the tray 24 then slides to the bag storage position 25 along the slideway 26 in the same direction as the bagging transmission. When the bag 60 in one of the trays 24 is used up, the bag 60 is sucked from the other tray 24, and the empty tray 24 can be controlled to move along the slideway 26 to the external bagging position to store the bag 60, and then return to the bag storage position, so that the bag 60 can be taken and put uninterruptedly throughout the whole process.

[0055] The upper bag transfer machine 23 is a slidable mobile platform, which is provided with a horizontal slide rail arranged in a direction perpendicular to the bagging conveyor line 10 and a lifting slide rail moving up and down in the vertical direction. The bag suction plate 22 is placed at the lower end of the lifting slide rail, and the lifting slide rail is connected to the horizontal slide rail. The upper bag transfer machine 23 is located on one side of the upper bag placement platform 21 close to the bagging mechanism 30, that is, between the upper bag placement platform 21 and the material pushing conveyor line 31.

[0056] The bag suction plate 22 sucks the bag 60 through the cylinder, and the bag upper transfer machine 23 drives the bag suction plate 22 to move back and forth between the bag storage position 25 and the bag upper position 11, and transfers and places the bag 60 in the bag storage position 25 on the bag upper position 11, and spreads the bag 60 horizontally on the bag upper position 11. After the bag 60 is transferred to the bag upper position 11, the bag upper transfer machine 23 drives the bag suction plate 22 to continue to withdraw, preparing for the next bag 60 to be taken and placed.

[0057] like Figure 1As shown, the bagging mechanism 30 includes a pusher conveyor line 31 for transferring silicon wafers for bagging, a long strip plate 32 arranged side by side with the bagging conveyor line 10, and a push rod 35 placed at the middle axis position of the pusher conveyor line 31. Among them, an adsorption hole 34 is configured at the docking position between the long strip plate 32 and the bagging position 12, and a hole suction column 33 is suspended just above the adsorption hole 34. After the pusher 35 is adsorbed and opened by the hole suction column 33 and the adsorption hole 34 at the upper and lower planes of the opening end of the warehouse bag 60, the silicon wafer 70 is moved along the pusher conveyor line 31 toward the opening end of the warehouse bag 60, and the silicon wafer 70 is pushed to the side end of the warehouse bag 60 located at the bagging position 12, that is, the silicon wafer 70 is inserted into the warehouse bag 60.

[0058] The push rod 35 is arranged side by side with the push conveyor line 31, and moves horizontally along the side of the open end of the bin bag 60; the push rod 35 is located below the silicon wafer, and can push the silicon wafer into the bin bag 60. The push conveyor line 31 and the upper bag placement table 21 are arranged side by side and spaced apart, and the push conveyor line 31 is arranged perpendicular to the bagging conveyor line 10, and is indirectly interconnected with the bagging conveyor line 10 through the long strip 32. The bin bag 60 transferred to the upper bag position 11 is driven by the bagging conveyor line 10 to move toward the position close to the push conveyor line 31, and rests on the bagging position 12. At the bagging position 12 on the bagging conveyor line 10, located between the two conveyor belts of the bagging conveyor line 10, a vacuum adsorption hole 34 for adsorbing the lower plane of the bin bag 60 is provided, the purpose of which is to fix the bin bag 60 on the bagging position 12.

[0059] At the location of the open end in the bagging position, there is a suction hole 34 near the location of the long strip plate 32, and a vacuum hole suction column 33 for sucking the upper plane of the open end of the warehouse bag 60 is also provided directly above the group of suction holes 34, so as to open the open end of the warehouse bag 60 and wait for the silicon wafer sleeve to be placed therein. The long strip plate 32 is located between the material pushing conveyor line 31 and the bagging conveyor line 10, and a bag support component 36 is also provided between the long strip plate 32 and the material pushing conveyor line 31.

[0060] like Figure 3 As shown, the bag support assembly 36 includes bag support guide rods 361 arranged opposite to each other, and the bag support guide rods 361 are all arranged toward the bag loading position 12 and suspended above the long strip plate 32. Below the hole suction column 33, there are provided a fixing plate 362 for fixing the bag support guide rods 361, a vertically arranged slide rail 1 363 and a slide rail 2 364, a cylinder 1 365 matched with the slide rail 1 363, and a cylinder 2 366 matched with the slide rail 2 364. Preferably, the bag support guide rods 361 are arranged on both sides of the hole suction column 33, and are used to support the opened bag opening, so that the silicon wafers can be quickly and accurately placed in the center when they are bagged.

[0061] Among them, the slide rail 1 363 and the slide rail 2 364 are both fixedly arranged on the fixed plate 362, and the two bag-supporting guide rods 361 are respectively connected to the output ends of the cylinder 1 365 on both sides, and the cylinder 2 366 is arranged on the side of the fixed plate 362 away from the bagging position 12. The cylinder 1 365 can drive the bag-supporting guide rod 361 to move horizontally and laterally on the slide rail 1 363 along the length direction of the bagging conveyor line 10 to adjust the opening size of the supporting bin bag 60. The cylinder 2 366 can drive the bag-supporting guide rod 361 to move horizontally and longitudinally on the slide rail 2 363 along the direction of the material pushing conveyor line 31 to extend into or leave the bin bag opening.

[0062] The silicon wafers that have passed the appearance inspection are gripped by the robot and transferred to the end of the pusher conveyor line 31 away from the bagging conveyor line 10, and then driven by the pusher conveyor line 31 to move toward the side close to the long strip 32. The bin bag 60 placed on the bagging position 12 is already in place before the silicon wafers are transferred to the bagging position 12, waiting for the silicon wafers to be loaded.

[0063] The lower plane of the warehouse bag 60 near the bagging conveyor line 10 is fixed by the adsorption hole 34; the upper plane of the open end side is adsorbed by the hole suction column 33, and the lower plane of the open end side is adsorbed by the adsorption hole 34 directly below the hole suction column 33, so that the open end can be quickly opened. After the open end of the warehouse bag is adsorbed and opened, the bag support guide rod 361 is controlled to move to the open end of the warehouse bag and open the open end of the warehouse bag 60 to form a rectangular feed port. At this time, the silicon wafer is pushed forward together with the push conveyor line 31 and the push rod 35, and directly drives the silicon wafer to be placed in the bagging position 12 of the warehouse bag 60. After the silicon wafer is placed in the warehouse bag, the bag support guide rod 361 is withdrawn; the hole suction column 33 and the adsorption hole 34 are deflated, and the upper and lower planes of the open end of the warehouse bag 60 are released.

[0064] like Figure 2 As shown, the bag containing silicon wafers is transferred from the bagging position 12 to the bag pressing position 13 which can be used to squeeze the air in the bag 60 along the bagging conveyor line 10. The bag pressing position 13 is located between the bagging position 12 and the bag folding position 14. A bag pressing mechanism 40 is provided at the side of the bagging position 12 away from the pushing conveyor line 31 and connected to the bag pressing position 13. The bag pressing mechanism 40 is suspended just above the bag pressing position 13 and is mainly used to squeeze the bag to discharge the air in the bag before folding.

[0065] The bag pressing mechanism 40 includes a bag pressing panel 41, a bag pressing bracket 42 for fixing the bag pressing panel 41, and a bag pressing cylinder 43 for driving the bag pressing diameter 42 to move up and down. Among them, the bag pressing diameter 42 is configured as an L-shaped structure, which can suspend the bag pressing panel 41 just above the bag pressing position 13, and make the bag pressing panel 41 be arranged close to the push material conveyor line 31. The bag pressing panel 41 is a flexible member, and its downward pressure cannot be too large to prevent the silicon wafer from being crushed. The bag pressing cylinder 43 drives the bag pressing panel 41 to move up and down along the thickness direction of the silicon wafer through the bag pressing bracket 42 to compress the space in the warehouse bag 60 so that the air in the warehouse bag is discharged before folding.

[0066] When the bagging conveyor line 10 moves forward with the silicon wafers to the bag pressing position, the bag pressing panel 41 moves downward and squeezes the air in the bin bag 60 together with the panel opposite to it, so that the upper and lower surfaces of the bin bag 60 are closely attached to the packaging material. After the bag pressing is completed, the bag pressing panel 41 rises and retreats, and the bagging conveyor line 10 drives the bin bag 60 carrying the silicon wafers forward and moves it to the bag folding position 14.

[0067] like Figure 4 As shown, the bag folding mechanism 50 is provided with two bag folding strips and a stacking push plate 53 for helping the bag folding strips to fold the open end of the bin bag. The bag folding strips are arranged side by side on the side of the bagging conveyor line 10, and are respectively the primary bag folding strips 51 and the secondary bag folding strips 52. The bag folding strips are arranged side by side and at intervals, and are arranged in parallel with the bagging conveyor line 10, and the primary bag folding strips 51 are arranged on the side away from the bagging conveyor line 10, and the secondary bag folding strips 52 are arranged between the primary bag folding strips 51 and the bagging conveyor line 10.

[0068] Taking the edge of the bag folding strip away from the bagging conveyor line 10 as a reference, the suspended section of the open end of the warehouse bag 60 containing silicon wafers is pressed down and bent, and then the stacking and pushing plate 53 is pushed to stack the bent suspended section below the bag folding strip, and then the bag folding strip is controlled to be withdrawn from the folding mouth, so that the open end of the warehouse bag 60 is folded twice in succession, so that the silicon wafer can be completely put into the warehouse bag 60 and set close to the warehouse bag 60. Not only does it automatically load, open, pack, press and fold bags throughout the process, without the need for human assistance, the coordination is accurate and safe; and when folding bags, the bag mouth can be folded in two layers continuously, so that the silicon wafer is neatly placed close to the warehouse bag, and the folding buckle will not rebound and withdraw, and secondary damage to the surface of the silicon wafer can be avoided. The bagging efficiency is high and the quality is good, which improves the yield rate and is also conducive to the subsequent boxing operation.

[0069] The primary bag folding strip 51 and the secondary bag folding strip 52 can also move up and down in the vertical direction and horizontally in the length direction, and the primary bag folding strip 51 and the secondary bag folding strip 52 are withdrawn in opposite directions, that is, after the primary folding is completed, the primary bag folding strip 51 is withdrawn and moved along the conveying direction of the bagging conveyor line 10, wherein the conveying direction of the bagging conveyor line 10 is as shown in FIG. Figure 4 After the secondary folding is completed, the secondary bag folding strip 52 is pulled away and moved in the opposite direction of the bagging conveyor line 10.

[0070] At the same time, the highest position of the primary bag folding strip 51 and the highest position of the secondary bag folding strip 52 are both set at the same height as the silicon wafer; the primary bag folding strip 51 and the secondary bag folding strip 52 move up asynchronously to fold against the top. Among them, a lifting cylinder that can control the primary bag folding strip 51 and the secondary bag folding strip 52 to move up and down independently in the vertical direction and a lateral cylinder that moves horizontally along the length direction are provided below the primary bag folding strip 51 and the secondary bag folding strip 52 (specific drawings are omitted).

[0071] A set of blowing pipes 54 suspended downwardly are provided above the outermost primary bag folding strip 51, which are used to blow the suspended section of the open end of the warehouse bag to make it bend and droop downward. The width between the blowing pipes 54 spans the width of the warehouse bag 60, and is arranged close to the outer side of the primary bag folding strip 51. During the primary bag folding, the primary bag folding strip 51 first rises and abuts against the lower plane of the warehouse bag 60, and at this time, the secondary bag folding strip 52 is still at its lower limit. The blowing pipe 54 can blow a vertical downward airflow directly toward the suspended end of the warehouse bag 60 placed on the outer side of the primary bag folding strip 51, so that the suspended end droops vertically with the outer side of the primary bag folding strip 51 as the reference.

[0072] On both outer sides of the blowing pipe 54 in the width direction, there are also lower pressing plates 55 for folding the bag mouth during the secondary bag folding. The lower pressing plate 55 is an L-shaped structure, and one end of the lower pressing plate 55 that is bent downward is arranged near the bag mouth, and can be embedded in the gap between the primary bag folding strip 51 and the secondary bag folding strip 52 during the secondary bag folding. The lower pressing plate 55 is suspended on the suspension frame 56 through a vertically arranged cylinder. After the primary bag folding is completed, the lower pressing plate 55 can be moved downward so that the bag mouth end is vertically drooped again based on the outer side of the secondary bag folding strip 52. The suspension frame 56 is arranged across the width position of the blowing pipe 54, and the blowing pipe 54 is fixed on the suspension frame 56 through a plate frame, and its height position remains unchanged. When the bag mouth is folded once, the lower pressing plate 55 is suspended above the warehouse bag 60, and when the bag mouth is folded twice, it moves downward to press the bag mouth of the warehouse bag.

[0073] The stacking push plate 53 is located directly below the air blowing pipe 54, and can be telescopically moved in a direction perpendicular to the bagging conveyor line 10 by being driven by the push plate cylinder. It is arranged in parallel with the material pushing conveyor line 31, and is located together with the air blowing pipe 54 on a single side of the bagging conveyor line 10. The stacking push plate 53 is a flat plate structure, which is constructed below the upper limit position of the two bag folding strips, so that when the bag folding strips are at the uppermost position to fold the bag opening, the hanging end hanging down from the side of the bag folding strips is pushed to move toward the side where the silicon wafer is located, so as to be stacked on the lower plane of the warehouse bag.

[0074] In this process, the bag suction plate 22 transfers the bag 60 at the bag storage position 25 to the upper bag position 11, and then withdraws to the bag storage position 25 to prepare for the next bag 60 to be taken and placed. The bag 60 moves to the bagging position along the bagging conveyor line 10. The upper limit of the two bag folding strips is the bag folding position 14 of the silicon wafer; the two bag folding strips are located at the ends of the long strip 32 and are arranged side by side with the long strip 32.

[0075] When the bin bag 60 reaches the bagging position, one end of the bin bag 60 at the bagging position 12 is fixed by the vacuum suction hole and the suction hole 34, and the upper plane of the open end is sucked by the hole suction column 33, and the lower plane is sucked by the suction hole 34, so that the open end is opened. Then the bag support guide rod 361 is controlled to open its entrance end and expand the feed inlet. The silicon wafer placed on the pushing conveyor line 31 is driven by the conveyor belt and the push rod 35, directly enters the bin bag 60 from the feed inlet, and is located on the bagging conveyor line 10. The hole suction column 33 and the suction hole 34 release the open end of the bin bag 60, and the bagging conveyor line 10 drives the bin bag 60 and the silicon wafer to move forward to the bag pressing position 13.

[0076] When the bag is pressed, the bag pressing panel 41 moves downward, squeezing the air in the bag so that the upper and lower surfaces of the bag 60 are closely attached to the packaging material, so that the silicon wafer is completely wrapped. After the bag is pressed, the bagging conveyor line 10 continues to drive the bag 60 and the silicon wafer forward and transfers them to the bag folding position 14.

[0077] When the bin bag 60 carrying silicon wafers reaches the bag folding position, the primary bag folding slats 51 and the secondary bag folding slats 52 are both located at the lower limit position, and the stacking push plate 53 is located at its initial position away from the silicon wafer side. At this time, the open end of the bin bag 60 is suspended in the air, ready to start bag folding.

[0078] During the first bag folding, the first bag folding strip 51 moves from the lower limit position to the lower plane position of the bag 60, and the air blowing pipe 54 is controlled to spray a vertical downward airflow toward the suspended open end of the bag 60 placed outside the first bag folding strip 51, so that the suspended end is vertically drooped with the outer edge of the first bag folding strip 51 as the reference. Then the stacking push plate 53 is controlled to move from the initial position to the side close to the silicon wafer, and push the drooping end to bend, so that the opening end of the bag is folded below the first bag folding strip 51 for the first time, and surrounded by the first bag folding strip 51. The first bag folding strip 51 folds the bag opening section to shape, and temporarily does not move, while the stacking push plate 53 is withdrawn to prepare for the second bag folding.

[0079] During the secondary bag folding, the secondary bag folding strip 52 is controlled to move from the lower limit position to the lower plane position of the warehouse bag, and abuts against the bending section of the opening end, so that the bending section is located above the secondary bag folding strip 52 and is set closely to the lower plane of the warehouse bag. At this time, the primary bag folding strip 51 is on the inner side of the bending section, and the secondary bag folding strip 52 is on the outer side of the bending section. After the secondary bag folding strip 52 shapes the bending section, the primary bag folding strip 51 is controlled to move away from the side of the bagging mechanism 30 in the warehouse bag, and the bending section is pulled out, leaving only the secondary bag folding strip 52 to fix the bending section. After the primary bag folding strip 51 is pulled out, it immediately moves downward and resets to its lower limit position. Then the bending section at the position of the primary bag folding strip 51 is convexly placed on the outer wall surface of the secondary bag folding strip 52 and suspended, and then the lower pressure plate 55 is controlled to move downward, and the suspension end is vertically drooped with the outer side of the secondary bag folding strip 52 as the reference, and vertically shaped. The stacking and pushing plate 53 is started again to move forward and push the stacked and suspended end to be bent, so that it is arranged close to the lower bottom surface of the secondary bag folding strip 52, thereby completing the secondary bag folding action.

[0080] After the secondary bag folding is completed, the bag is completely overlapped in the shape of a silicon wafer. At this time, the stacking and pushing plate 53 still abuts against the suspension end, and the secondary bag folding strip 52 is still located below the bending section. Then the secondary bag folding strip 52 is controlled to move from the side of the bag near the bagging mechanism 30 to pull out the bending section; then the secondary bag folding strip 52 immediately descends and resets to its lower limit. At this time, only the stacking and pushing plate 53 is retained to fix the suspension end to keep it in the secondary folding state, and then the manipulator is controlled to clamp the folded bag and move upward to leave the folding position and be located directly above the bag folding position; then the stacking and pushing plate 53 is withdrawn, and the secondary folding of the bag is completed.

[0081] A packaging machine is provided with the bagging mechanism 100 as described above.

[0082] The silicon wafer bagging mechanism designed by the present application has a reasonable structural design, fully automatic operation, no need for human assistance, accurate and safe coordination, high degree of automation, and can continuously double-fold the bag opening when folding the bag, so that the silicon wafers are neatly placed close to the bag, with high bagging efficiency and good quality, and can also avoid secondary damage to the surface of the silicon wafers, improve the yield rate, and facilitate subsequent boxing operations. The present application also proposes a packaging machine provided with the bagging structure.

[0083] The above detailed description of the embodiments of the present application is only a preferred embodiment of the present application and cannot be considered to limit the scope of implementation of the present application. All equivalent changes and improvements made within the scope of the present application should still fall within the scope of the patent coverage of the present application.

Claims

1. A silicon wafer bagging mechanism, characterized in that: have: A bagging conveyor line, which is provided with bagging and bag folding positions; A bagging mechanism, which is connected to the bagging position and is provided with a push rod, and can put the silicon wafer into the bag; A bag folding mechanism, which is connected to the bag folding position and is provided with bag folding strips and stacking and pushing plates, all of which are arranged side by side on one side of the bagging conveyor line and are arranged crosswise with the stacking and pushing plates; Taking the edge of the bag folding strip away from the bag filling conveyor line as a reference, the suspended section at the open end of the bin bag containing silicon wafers is made to droop, and then the stacking and pushing plate is pushed to stack the bent suspended section under the bag folding strip, and the bag folding strip is controlled to be pulled away from the folding mouth so that the open end of the bin bag can be continuously folded.

2. A silicon wafer bagging mechanism according to claim 1, characterized in that: The bagging mechanism also includes: A pusher conveyor line is used to move silicon wafers, and the pusher is arranged at its midline position; A long strip plate, which is arranged side by side with the bagging conveyor line and is provided with adsorption holes at a position where it is connected with the bagging position; A hole suction column, suspended above the adsorption hole; After the upper and lower planes of the opening end of the warehouse bag are respectively opened by the hole suction column and the adsorption hole, the push rod can drive the silicon wafer to move along the pushing conveyor line toward the opening end of the warehouse bag, and push the silicon wafer into the warehouse bag at one end of the bagging position.

3. A silicon wafer bagging mechanism according to claim 2, characterized in that: The bagging conveyor line is configured as a conveyor belt provided with a plurality of vacuum suction holes, and a plurality of the suction holes are further provided at the bagging position.

4. A silicon wafer bagging mechanism according to claim 2 or 3, characterized in that: The long strip is located between the pushing conveyor line and the bagging conveyor line; a bag supporting assembly is also provided between the long strip and the pushing conveyor line, and the bag supporting assembly includes relatively arranged bag supporting guide rods, and the bag supporting guide rods are all arranged toward one side of the bagging position and suspended above the long strip.

5. The silicon wafer bagging mechanism according to claim 4, characterized in that: A fixing plate for fixing the bag-supporting guide rod, and vertically arranged slide rails 1 and 2 are provided below the hole suction column, wherein cylinder 1 cooperating with slide rail 1 can drive the bag-supporting guide rod to move horizontally along the length direction of the bagging conveyor line; cylinder 2 cooperating with slide rail 2 can drive the bag-supporting guide rod to move horizontally and longitudinally along the direction of the pushing conveyor line.

6. A silicon wafer bagging mechanism according to any one of claims 1 to 3 and 5, characterized in that: A bag pressing position is also provided on the bagging conveyor line, which is located between the bagging position and the bag folding position; A bag pressing mechanism docking with the bag pressing position is also provided, which is located on a side of the bagging conveyor line away from the bagging mechanism and is suspended just above the bag pressing position.

7. The silicon wafer bagging mechanism according to claim 6, characterized in that: The bag pressing mechanism includes a bag pressing panel, a bag pressing bracket for fixing the bag pressing panel, and a bag pressing cylinder, wherein the bag pressing bracket is constructed as an L-shaped structure; the bag pressing cylinder drives the bag pressing panel to move up and down along the thickness direction of the silicon wafer through the bag pressing bracket to compress the bag space so that the air inside it is discharged.

8. A silicon wafer bagging mechanism according to any one of claims 1-3, 5 and 7, characterized in that: The bag folding mechanism is provided with two bag folding slats, and a lifting cylinder for controlling the vertical upward and downward movement of the bag folding slats and a transverse cylinder for horizontal movement along the length direction of the bag folding slats are provided below the bag folding slats, and the two bag folding slats are pulled out in opposite directions.

9. The silicon wafer bagging mechanism according to claim 8, characterized in that: A group of downwardly suspended air blowing pipes are provided above the outermost bag folding strips, and the air flow blown out from the air blowing pipes can blow the suspended section of the open end of the warehouse bag to make it bend downward; the air blowing pipes are arranged on the side of the outermost bag folding strips close to the stacking and pushing plate.

10. The silicon wafer bagging mechanism according to claim 9, characterized in that: On both outer sides of the blowing tube in the width direction, there are lower pressure plates for folding the bag opening during the secondary bag folding. The lower pressure plate is an L-shaped structure, and its downwardly bent end is arranged close to the bag opening, and can be embedded in the gap between the two bag folding strips during the secondary bag folding.

11. A silicon wafer bagging mechanism according to claim 9 or 10, characterized in that: The stacking push plate is arranged directly below the blowing pipe, and is driven by a push plate cylinder to be telescopically movable in a direction perpendicular to the bagging conveyor line; the stacking push plate is constructed as a flat plate surface structure, and is arranged below the upper limit of the two bag folding strips.

12. The silicon wafer bagging mechanism according to claim 1, characterized in that: A bag loading mechanism for loading materials into the silo is also provided, which is docked with the bag loading position on the bag loading conveyor line, arranged side by side with the bag loading mechanism, and located on the side of the bag loading mechanism away from the bag folding mechanism.

13. The silicon wafer bagging mechanism according to claim 12, characterized in that: The bag loading mechanism includes: a bag loading platform, a bag storage position arranged on the bag loading platform, a bag suction plate for taking and placing bin bags, and a bag loading transfer machine. The bag loading transfer machine can drive the bag suction plate to transfer the bin bags in the bag storage position to the bag loading position.

14. A packaging machine, characterized in that: It is equipped with a bagging mechanism as described in any one of claims 1-13.

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