Electroplating carrier

Abstract

The utility model discloses an electroplating carrier which comprises a main body support, a conductive assembly and a cover plate assembly, and a through hole and a supporting surface which surrounds the through hole and is used for supporting a plate to be electroplated are formed in the main body support; the conductive component is fixed in the main body bracket, one end of the conductive component extends out of the main body bracket and is used for being externally connected with a power supply, and the other end of the conductive component extends above the supporting surface; the cover plate assembly is detachably fixed to the main body support, the cover plate assembly comprises a fixing plate, a pressing plate and a rotating shaft, the fixing plate is rotatably and detachably connected to the main body support and is used for covering the plate, and the pressing plate is connected to the fixing plate through the rotating shaft and is extruded between the fixing plate and the plate. According to the electroplating carrier disclosed by the utility model, the pressing plate and the fixing plate are connected through the rotating shaft, so that the operation steps are reduced when a plate is mounted and replaced, the working efficiency is improved, and the surface of the plate can be prevented from being scratched by separating the pressing plate and the fixing plate to the main body bracket.

Description

Technical Field

[0001] The utility model belongs to the technical field of film coating equipment, in particular to an electroplating carrier. Background Art

[0002] Electroplating is the process of plating a thin layer of other metals or alloys on the metal surface using the principle of electrolysis. It is a process that uses electrolysis to attach a layer of metal film to the surface of metal or other material parts, which prevents metal oxidation (such as rust), improves wear resistance, conductivity, reflectivity, corrosion resistance (copper sulfate, etc.) and enhances aesthetics. The electroplating carrier in the prior art uses rubber rings and screws to seal, which is more cumbersome and the screws may slip, causing the carrier to be scrapped. The plate thickness at the location where the parts to be plated are placed is relatively thin, and this location needs to withstand a certain amount of pressure. The thin plate thickness is prone to cracks, resulting in the plate being unable to fit completely and tightly with the sealing rubber ring, affecting the sealing of the carrier. Aging of the sealing ring at the cover plate may affect the sealing.

[0003] The information disclosed in this background technology section is only intended to increase the understanding of the overall background of the present invention, and should not be regarded as acknowledging or suggesting in any form that the information constitutes the prior art already known to a person skilled in the art. Utility Model Content

[0004] The purpose of the utility model is to provide an electroplating carrier, which adopts a cover plate assembly composed of a pressure plate and a fixed plate. The fixed plate is used to be fixed to the main bracket, and the pressure plate is used to press the plate to the supporting surface, which is convenient for replacing the plate during work and improves work efficiency.

[0005] In order to achieve the above purpose, the technical solution provided by a specific embodiment of the utility model is as follows:

[0006] The utility model provides an electroplating carrier, including a main body bracket, a conductive component and a cover plate component, the main body bracket is formed with a through hole, and a supporting surface surrounding the through hole and used to support a plate to be electroplated; the conductive component is fixed in the main body bracket, one end of which extends to the outside of the main body bracket for an external power supply, and the other end extends above the supporting surface; the cover plate component is detachably fixed to the main body bracket, and the cover plate component includes a fixed plate, a pressure plate and a rotating shaft, the fixed plate is rotatably and detachably connected to the main body bracket, and is used to cover the plate, and the pressure plate is connected to the fixed plate through a rotating shaft and is squeezed between the fixed plate and the plate.

[0007] In one or more embodiments of the present invention, the cover plate assembly is fixed to the main bracket by a snap-on structure, and the snap-on structure includes a plurality of first snaps arranged on the main bracket, and a plurality of second snaps protruding from the fixing plate and cooperating with the first snaps, the plurality of first snaps are arranged around the supporting surface, and the number of the second snaps is the same as that of the first snaps and corresponds one to one.

[0008] In one or more embodiments of the present invention, the first buckle protrudes above the supporting surface, the second buckle protrudes on the side wall of the fixing plate and has a stopper protruding from one end, all of the stoppers are arranged at the same end of the corresponding second buckle along the circumference of the fixing plate, and the first buckle abuts against the second buckle and the protrusion.

[0009] In one or more embodiments of the present invention, the conductive component includes a conductive ring extending above the supporting surface, the conductive ring protruding with a plurality of contact points contacting the plate, and the contact points are equidistantly distributed on the conductive ring.

[0010] In one or more embodiments of the present invention, the conductive component further includes a plurality of wires connected to the conductive ring and extending outside the main support, the contact positions of the wires with the conductive ring are equidistantly distributed on the conductive ring, and the lengths of the wires are the same.

[0011] In one or more embodiments of the present invention, a waterproof component is further included which is fixed to the main support. The waterproof component includes a first gasket which is arranged on one side of the cover plate component. The first gasket surrounds the outside of the through hole.

[0012] In one or more embodiments of the present invention, the first gasket is an inflatable sealing ring, and the inflatable sealing ring is connected to an air pipe, the air pipe extends to the main body support and the other end of the air pipe extends to the outside of the main body support.

[0013] In one or more embodiments of the present invention, one end of the air pipe located outside the main support is connected to an air valve for opening or closing the air pipe and the first gasket.

[0014] In one or more embodiments of the present invention, the waterproof component also includes a second gasket arranged at the other end of the through hole, the conductive component includes a conductive ring extending above the supporting surface, the conductive ring protruding with a plurality of contacts that contact the plate, and the second gasket is squeezed between the contacts and the supporting surface.

[0015] In one or more embodiments of the present invention, a convex ring is formed on one side of the inner ring of the second gasket, and the height of the convex ring is not less than the thickness of the contact.

[0016] Compared with the prior art, the electroplating carrier of the utility model connects a pressing plate and a fixing plate through a rotating shaft. The pressing plate is used to press the plate to the supporting surface on the main body bracket, and the fixing plate is used to fix it between the main bodies. This reduces the operating steps when installing and replacing the plates and improves work efficiency. At the same time, the arrangement of the two plates separates the operation of pressing the plate and fixing it to the main body bracket, which can avoid scratching the surface of the plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is a disassembled diagram of an electroplating carrier in one embodiment of the utility model;

[0019] Figure 2 A schematic diagram of an electroplating carrier in one embodiment of the utility model;

[0020] Figure 3 It is a rear side view of a fixing plate in one embodiment of the utility model;

[0021] Figure 4 It is a schematic diagram of a wire, a conductive ring and a contact in one embodiment of the utility model;

[0022] Figure 5 This is a schematic diagram of the main body support at the through hole in one embodiment of the utility model;

[0023] Figure 6 It is a schematic diagram of the second gasket in one embodiment of the utility model.

[0024] Description of main reference numerals:

[0025] 100-electroplating carrier, 10-main frame, 11-through hole, 12-support surface, 13-first buckle, 14-limiting ring, 15-annular groove, 16-handle, 21-conductive ring, 22-contact, 23-wire, 24-copper sheet, 25-pressing block, 31-fixing plate, 311-second buckle, 312-stopper, 32-pressing plate, 33-rotating shaft, 41-first gasket, 42-trachea, 43-air valve, 44-second gasket, 441-convex ring, 45-hole plug, 46-plug. DETAILED DESCRIPTION

[0026] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0027] like Figure 1-6 As shown, the electroplating carrier 100 in one embodiment of the utility model includes a main support 10, a conductive component and a cover plate component. A through hole 11 is formed on the main support 10, and an annular support surface 12 is formed on the periphery of the through hole 11 for placing the component to be plated (a wafer is used as an example here, but it can also be other plates). The conductive component is fixed in the main support 10, one end of which extends to the outside of the main support 10 for an external power supply, and the other end extends to the top of the support surface 12 for connecting the wafer and supplying power to it. The cover plate component is detachably fixed to the main support 10, including a fixed plate 31, a pressure plate 32 and a rotating shaft 33. The fixed plate 31 is fixed to the main support 10 in a rotatable and detachable manner, and is used to cover the wafer. The pressure plate 32 is connected to the fixed plate 31 through the rotating shaft 33, and it is squeezed between the fixed plate 31 and the wafer. The fixed plate 31 can produce relative rotation with the pressure plate 32 through the rotating shaft.

[0028] In this embodiment, after the wafer is placed on the support surface 12, the fixed plate 31 is fixed to the main support 10 by rotating and fixing, and the pressure plate 32 directly contacts the wafer to keep it fixed. Then, the electroplating carrier 100 loaded with the wafer is placed in the electrolyte, and the power supply energizes the wafer through the conductive component to complete the electroplating operation. When the wafer needs to be replaced, the fixed plate 31 is rotated in the opposite direction to release the fixation with the main support 10. Since the pressure plate 32 and the fixed plate 31 can rotate relative to each other, the disassembly and assembly operation between the fixed plate 31 and the main support 10 will not cause the pressure plate 32 to rotate or move, and the surface of the wafer can be avoided from being scratched during disassembly and assembly. And during operation, there is no need to operate and fix the pressure plate 32 and the fixed plate 31 separately, thereby reducing the operation steps and improving work efficiency.

[0029] Since one side of the wafer is blocked by the cover assembly and only the other side is exposed to the electrolyte through the through hole 11 , the electroplating carrier 100 is used for single-sided electroplating operation.

[0030] In one embodiment, the cover assembly is fixed to the main frame 10 by a snap-fit ​​structure, such as Figure 5As shown, a plurality of first buckles 13 are provided on the main frame 10, and a plurality of second buckles 311 are correspondingly provided on the fixing plate 31. The number of the first buckles 13 and the second buckles 311 are the same and correspond to each other. When fixing, the fixing plate 31 is pressed toward the through hole 11 to move the second buckles 311 to the rear of the first buckles 13, and then the fixing plate 31 is rotated by a certain angle to make the corresponding second buckles 311 abut against the first buckles 13, and the fixing operation is completed.

[0031] Preferably, the first buckle 13 protrudes above the support surface 12, and the second buckle 311 protrudes on the side wall of the fixed plate 31. The second buckle 311 is an L-shaped structure, and a stopper 312 is provided at one end thereof, and all the stoppers 312 are provided at the same end of the corresponding second buckle 311 along the circumference of the fixed plate 31. Therefore, when the first buckle 13 is rotated to abut against the protrusion 312, the fixed plate 31 is fixed in place, and the protrusion 312 is used to prevent the cover plate assembly and the wafer from accidentally detaching when the rotation angle is too large and the first buckle 13 does not completely abut against the second buckle 311.

[0032] Furthermore, the first buckles 13 are evenly distributed above the support surface 12 , and similarly, the second buckles 311 are evenly distributed on the fixing plate 31 , so as to average the fixing position and force, thereby improving the fixing effect.

[0033] In one embodiment, the conductive component includes a conductive ring 21 extending to the support surface 12, and a plurality of contacts 22 protruding from the conductive ring 21, and the wafer directly contacts the contacts 22. The contacts 22 are evenly distributed on the conductive ring 21 to ensure uniformity when the wafer is powered on, so as to avoid affecting the electroplating effect due to the potential difference.

[0034] Furthermore, the conductive assembly also includes a plurality of wires 23, one end of which is connected to the conductive ring 21, and the other end of which passes through the interior of the main frame 10 and extends to the outside of the main frame 10 to be connected to an external power source. To further ensure the uniformity of the power supply, the connection positions of the wires 23 and the conductive ring 21 are evenly distributed on the conductive ring 21, and the lengths of all the wires 23 are the same.

[0035] like Figure 1 As shown, the wire 23 passes through the inside of the main support 10, a window is opened on the main support 10, a copper sheet 24 is fixed on the window, the wire 23 is connected to the copper sheet 24, and the copper sheet is fixed to the main support 10 through a pressing block 25, and its external power supply is used to power the wafer.

[0036] In one embodiment, in order to improve the overall waterproof effect and prevent the electrolyte from penetrating into the other side of the wafer, the electroplating carrier 100 is also provided with a waterproof component, specifically including a first gasket 41 arranged on one side of the cover plate component, and the first gasket 41 surrounds the outside of the through hole 11 to prevent the electrolyte from penetrating into the through hole 11 from one side of the cover plate component.

[0037] Preferably, the first gasket 41 is an inflatable sealing ring, which is connected to an air pipe 42. The air pipe 42 passes through the inside of the main frame 10 and extends to the outside of the main frame 10. The inflatable sealing ring can be used to replenish air when the waterproof effect decreases, thereby restoring the waterproof effect.

[0038] The main frame 10 is provided with an annular groove 15, and the first gasket 41 is disposed in the annular groove 15. Figure 2 In the illustrated embodiment, the air pipe 42 extends upward to the side of the main frame 10 and is fixed to the main frame 10 via a plug 46 .

[0039] Furthermore, an air valve 43 is connected to one end of the air pipe 42 exposed from the main support 10 . The air valve 43 is closed under normal conditions and is opened when air is required to be replenished or released.

[0040] It is conceivable that, in order to improve the waterproof effect on the other side of the through hole 11, the waterproof component also includes a second gasket 44, which is squeezed between the support surface 12 and the conductive ring 21 and the contact 22 to prevent the electrolyte from penetrating from one side of the wafer. When installing the wafer, a certain degree of pressure can be applied to the wafer to press the contact 22 into the second gasket 44 to further improve the waterproof effect. Of course, the second gasket 44 can also be selected as an inflatable sealing ring, which is not limited in this embodiment.

[0041] Preferably, the second gasket 44 is formed with a convex ring 441 on one side of its inner ring, and the protruding height of the convex ring 441 is not less than the thickness of the contact 22, so that the wafer first contacts the convex ring 441 rather than the contact 22. Since the convex ring 441 is formed in the circle formed by the contact 22, its diameter is smaller than the diameter of the circle formed by the far end of the contact 22. Therefore, the electrolyte is first blocked by the convex ring 441 and then blocked by other parts of the second gasket 44, thereby improving the waterproof effect.

[0042] like Figure 1 and 2 As shown, a hole for placing the rotating shaft 33 is opened on the fixing plate 31. In order to prevent the electrolyte from penetrating from the hole, the waterproof component also includes a hole plug 45 for blocking the hole.

[0043] In one embodiment, a limit ring 14 is also fixed on the support surface 12. The limit ring 14 is fixed above the conductive ring 21. The wafer is placed in the limit ring 14 and is limited by it to prevent abnormal displacement or rotation during the electroplating process, which may affect the coating effect.

[0044] In one embodiment, a handle 16 is further provided on the top of the main support 10. By inserting a hanging rope or other equipment into the handle 16, the electroplating component 100 can be suspended above the electrolyte, leaving only the portion where the through hole 11 is immersed in the electrolyte.

[0045] In summary, if Figure 5 As shown, the electroplating carrier 100 in the utility model has a stepped structure at the through hole 11, and the supporting surface 12, the second gasket 44 and the contact 22 are at the first level for carrying the wafer; the limiting ring 14 is arranged above the first level, which is the second level, and is used to limit the abnormal movement of the wafer during coating; the first clip 13 is arranged above the limiting ring 14, which is the third level, and is used to fix the cover plate assembly; finally, there is a first gasket 41 surrounding the first clip 13, which is used to cooperate with the fixing plate 31 to prevent the electrolyte from seeping in.

[0046] The above embodiments are described by taking a wafer as the component to be coated, but those skilled in the art can understand that the electroplating carrier of the present invention is not only applicable to wafers, but also to other components.

[0047] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0048] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. An electroplating carrier, characterized in that: include: A main body support, wherein the main body support is formed with a through hole and a supporting surface surrounding the through hole and used for supporting the plate to be electroplated; A conductive component is fixed in the main frame, one end of which extends outside the main frame for connecting to an external power source, and the other end of which extends above the support surface; as well as The cover plate assembly is detachably fixed to the main support, and includes a fixed plate, a pressure plate and a rotating shaft. The fixed plate is rotatably and detachably connected to the main support and is used to cover the plate. The pressure plate is connected to the fixed plate through the rotating shaft and is squeezed between the fixed plate and the plate.

2. The electroplating carrier according to claim 1, characterized in that: The cover assembly is fixed to the main bracket by a snap-on structure, which includes a plurality of first snaps arranged on the main bracket and a plurality of second snaps protruding from the fixing plate and cooperating with the first snaps. The plurality of first snaps are arranged around the supporting surface, and the second snaps are the same in number and correspond one to one with the first snaps.

3. The electroplating carrier according to claim 2, characterized in that: The first buckle protrudes above the supporting surface, the second buckle protrudes on the side wall of the fixing plate and has a stopper protruding from one end, all the stoppers are arranged at the same end of the corresponding second buckle along the circumference of the fixing plate, and the first buckle abuts against the second buckle and the protrusion.

4. The electroplating carrier according to claim 1, characterized in that: The conductive component comprises a conductive ring extending above the supporting surface, wherein the conductive ring is provided with a plurality of contact points contacting the plate, and the contact points are equidistantly distributed on the conductive ring.

5. The electroplating carrier according to claim 4, characterized in that: The conductive component also includes a plurality of conductive wires connected to the conductive ring and extending outside the main support, the contact positions of the conductive wires and the conductive rings are equidistantly distributed on the conductive rings, and the lengths of the conductive wires are the same.

6. The electroplating carrier according to claim 5, characterized in that: It also includes a waterproof component fixed to the main frame, and the waterproof component includes a first gasket arranged on one side of the cover plate component, and the first gasket surrounds the outside of the through hole.

7. The electroplating carrier according to claim 6, characterized in that: The first gasket is an inflatable sealing ring, and the inflatable sealing ring is connected to an air pipe, the air pipe extends to the main body support and the other end of the air pipe extends to the outside of the main body support.

8. The electroplating carrier according to claim 7, characterized in that: One end of the air pipe located outside the main support is connected with an air valve for opening or closing the air pipe and the first gasket.

9. The electroplating carrier according to claim 6, characterized in that: The waterproof component also includes a second gasket arranged at the other end of the through hole, and the conductive component includes a conductive ring extending above the supporting surface, the conductive ring protruding with multiple contacts in contact with the plate, and the second gasket is squeezed between the contacts and the supporting surface.

10. The electroplating carrier according to claim 9, characterized in that: A convex ring is formed on one side of the inner ring of the second gasket, and the height of the convex ring is not less than the thickness of the contact point.

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