Pin connecting device and electrostatic discharge testing device

Abstract

The utility model discloses a pin connecting device and an electrostatic discharge testing device. The pin connecting device comprises a pin header plate, a pin header is arranged on the first surface of the pin header plate, a wire is connected to the second surface of the pin header plate, and the first end of each contact pin in the pin header is located in the pin header plate; the first end of the wire is located in the pin header plate; in the pin header plate, the first ends of all the pins are connected with the first ends of all the wires in a one-to-one mode, and the second end of each wire is connected with a conductive pin clamp. According to the pin connecting device provided by the embodiment of the invention, the pin clamp is suitable for clamping various types of pins such as long pins and short pins of an electronic device, the application range is wide, and the connection test requirements of different types of pin devices can be well met; the pin clamps are connected with the wires, and the wires can be bent and deformed, so that the pin clamps have a larger movement range, can be connected with the pins of the devices with the pins distributed in two rows and the pins of the devices distributed around the pins, and are wide in application range.

Description

Technical Field

[0001] The present application relates to the technical field of electronic device testing, and in particular to a pin connection device and an electrostatic discharge testing device. Background Art

[0002] Electrostatic discharge is a common phenomenon in everyday environments. It can be generated by friction between the human body, equipment surfaces, or other objects, resulting in instantaneous high voltage pulses. For sensitive electronic devices, even a small electrostatic discharge may cause damage or performance degradation. Electrostatic discharge testing is a test used to evaluate the immunity and reliability of electronic devices or electronic components when subjected to electrostatic discharge.

[0003] When conducting an electrostatic discharge test, each pair of pins of the electronic device under test needs to be stress tested. For multi-pin devices, the pin socket of the test device in the related art is only suitable for connecting devices with long straight-insert pins, but not for connecting devices with other types of pins. The scope of application is small and it is difficult to meet the connection test requirements of devices with different types of pins.

[0004] The above statements are only used to provide background information related to the present application and do not necessarily constitute prior art. Utility Model Content

[0005] In view of the fact that the pin socket of the test device in the above-mentioned related technology is only suitable for connecting devices with long straight-plug pins, but is not suitable for connecting devices with other types of pins, the scope of application is small and it is difficult to meet the connection test requirements of devices with different types of pins, the present application provides a pin connection device and an electrostatic discharge test device.

[0006] According to a first aspect of an embodiment of the present application, a pin connection device is provided, comprising a pin header plate, a pin header is arranged on a first surface of the pin header plate, a wire is connected to a second surface of the pin header plate, a first end of each pin in the pin header is located in the pin header plate; a first end of the wire is located in the pin header plate; in the pin header plate, the first ends of all the pins are connected one-to-one with the first ends of all the wires, and a conductive pin clip is connected to the second end of each of the wires.

[0007] The pin connection device of the embodiment of the present application, the pin clamp is suitable for clamping various types of pins such as long pins and short pins of electronic devices, has a wide range of applications, and can better meet the connection test requirements of different types of pin devices; the pin clamp is connected to a wire, and the wire can be bent and deformed, so the pin clamp has a larger range of motion, which can not only conveniently connect the pins of devices with pins distributed in two rows, but can also be used to connect the pins of devices with pins distributed all around, and has a wide range of applications.

[0008] In some embodiments of the present application, the pin clip and the wire connected to it are integrally formed of the same flexible conductive material. Since it is made of flexible conductive material, the pin clip and the wire connected to it can be bent, deformed and stretched, so that the pin clip has a larger range of motion. The flexible pin clip is convenient for clamping the pins of electronic devices. It can not only conveniently connect the pins of devices with pins distributed in two rows, but also be used to connect the pins of devices with pins distributed around them. Therefore, the pin connection device of the embodiment of the present application has a wide range of application.

[0009] In some embodiments of the present application, the pin clamp includes a clamp body and an insulating layer, the material of the clamp body is a conductive material, the clamp body includes a first clamp and a second clamp, one end of the first clamp is rotatably connected to one end of the second clamp, a clamping opening is formed between two opposite sides of the first clamp and the second clamp, and the insulating layer covers the first clamp and the second clamp except for the two opposite sides. The pin clamp can connect devices with long pins and devices with short pins and other types of pins, has a wide range of applications, and can better meet the connection test requirements of different types of pin devices. The insulating layer can protect the clamp body.

[0010] In some embodiments of the present application, the pin header is provided with multiple different numbers, and the multiple numbers correspond to the pin clips one by one. In each pin clip, a number corresponding to the pin clip is provided near the position where the wire connected to the pin clip is connected to the pin header. In this way, the number marking of all pins is realized, which is convenient for marking and recording when the pin clip is connected to the pin, and helps to accurately identify the corresponding connection relationship between each pin and the pin clip during testing.

[0011] In some embodiments of the present application, the pin header includes a printed circuit board. In the printed circuit board, the first ends of all pins are connected one-to-one with the first ends of all wires. The printed circuit board has good shielding effect and good heat dissipation performance, and is suitable for connecting pins with corresponding wires in the printed circuit board.

[0012] In some embodiments of the present application, all the pin headers in the pin header are arranged in multiple rows, and the number of pins in each row ranges from 8 to 24. This can meet the pin connection requirements of most devices, and can better meet the size requirements and pin quantity requirements of the pin header in practical applications, and is helpful to control the manufacturing cost of the pin header.

[0013] In some embodiments of the present application, the spacing between two adjacent pins in each column ranges from 2.4 mm to 2.60 mm. This spacing range can meet the pin connection requirements of most devices, and can better meet the requirements for the size of the pin header and the pin spacing in practical applications, which helps to control the manufacturing cost of the pin header.

[0014] In some embodiments of the present application, the spacing between two adjacent pins in each column is 2.54 mm. This spacing can meet the pin connection requirements of most devices, and can better meet the requirements for the size of the pin header and the pin spacing in practical applications, and helps to control the manufacturing cost of the pin header.

[0015] In some embodiments of the present application, the spacing between any two adjacent columns in the plurality of columns is in the range of 11.0 mm to 12 mm. This spacing range can meet the pin connection requirements of most devices, and can better meet the size requirements of the pin header board and the spacing requirements of the pins of two adjacent columns in practical applications, and is helpful to control the manufacturing cost of the pin header board.

[0016] In some embodiments of the present application, the spacing between the two columns is 11.5 mm, which can meet the pin connection requirements of most devices, and can better meet the size requirements of the pin header board and the spacing requirements of two adjacent columns of pins in practical applications, and helps to control the manufacturing cost of the pin header board.

[0017] According to a second aspect of an embodiment of the present application, an electrostatic discharge testing device is provided, including a socket board and a pin connection device of any embodiment of the present application; a female header is provided on the socket board, and the arrangement of the socket holes on the female header is the same as the arrangement of the pins on the pin connection device.

[0018] The second aspect of the embodiment of the present application provides an electrostatic discharge testing device, in which the pin clamp of the pin connecting device is suitable for clamping various types of pins such as long pins and short pins of electronic devices. It has a wide range of applications and can better meet the connection testing requirements of different types of pin devices. The pin clamp is connected to a wire that can be bent and deformed, so the pin clamp has a larger range of motion, which not only makes it convenient to connect the pins of devices with pins distributed in two rows, but can also be used to connect the pins of devices with pins distributed around them. Therefore, the electrostatic discharge testing device has a wide range of applications.

[0019] The above description is only an overview of the technical solution of the embodiment of the present application. In order to more clearly understand the technical means of the embodiment of the present application, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the embodiment of the present application more obvious and easy to understand, the specific implementation methods of the present application are listed below. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] By reading the detailed description of the following embodiments, various other advantages and benefits will become clear to those of ordinary skill in the art. The accompanying drawings are only used to illustrate the embodiments of the present application and are not to be considered as limitations of the present application. In addition, the same reference numerals are used to represent the same components throughout the drawings.

[0021] Figure 1 is a schematic structural diagram of a pin connection device according to one or more embodiments.

[0022] Figure 2 FIG. 4 is a schematic diagram of the structure of a pin clip and a wire according to one or more embodiments.

[0023] Figure 3 FIG. 4 is a schematic diagram of the structure of an electrostatic discharge testing device according to one or more embodiments.

[0024] The meanings of the reference numerals in the above drawings are as follows:

[0025] 1: Pin header; 2: Wire; 3: Pin; 4: Pin clamp; 41: First clamp; 42: Second clamp; 43: Clamp; 5: Socket board; 6: Electronic device; 61: Pin. DETAILED DESCRIPTION

[0026] The following embodiments of the technical solution of the present application are described in detail in conjunction with the accompanying drawings. The following embodiments are only used to more clearly illustrate the technical solution of the present application, and are therefore only used as examples, and cannot be used to limit the scope of protection of the present application.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by technicians in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" in the specification and claims of this application and the above-mentioned figure descriptions and any variations thereof are intended to cover non-exclusive inclusions.

[0028] In the description of the embodiments of the present application, the technical terms "first", "second", etc. are only used to distinguish different objects, and cannot be understood as indicating or implying relative importance or implicitly indicating the number, specific order or primary and secondary relationship of the indicated technical features. In the description of the embodiments of the present application, the meaning of "multiple" is more than two (including two), unless otherwise clearly and specifically defined.

[0029] Reference to "embodiments" herein means that a particular feature, structure, or characteristic described in conjunction with the embodiments may be included in at least one embodiment of the present application. The appearance of the phrase in various locations in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment that is mutually exclusive with other embodiments. It is explicitly and implicitly understood by those skilled in the art that the embodiments described herein may be combined with other embodiments.

[0030] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to the specific circumstances.

[0031] Electrostatic discharge test is a test used to evaluate the immunity and reliability of electronic devices when subjected to electrostatic discharge. For multi-pin electronic devices, the electrostatic discharge test process requires cross-corresponding input pulses to be tested one by one as needed. The socket of the test device in the related art is used for device pin insertion. The test device controls whether the pin pulse is input to achieve a one-to-one corresponding test of the pins. However, the socket of the test device can only be used for the test of devices with long direct-insert pins. With the improvement of the degree of circuit integration, more and more surface mount devices appear in electronic devices, and their pins are all short pins, which cannot be inserted into the sockets in the related art. The sockets of the test device in the related art are difficult to meet the test requirements.

[0032] In response to the technical problems existing in the related art, an embodiment of the present application provides a pin connection device, including a pin header plate, a pin header is arranged on the first surface of the pin header plate, a wire is connected to the second surface of the pin header plate, the first end of each pin in the pin header is located in the pin header plate; the first end of the wire is located in the pin header plate; in the pin header plate, the first ends of all the pins are connected one-to-one with the first ends of all the wires, and the second end of each wire is connected to a conductive pin clamp, which is suitable for clamping various types of pins such as long pins and short pins of electronic devices, has a wide range of applications, and can better meet the connection test requirements of different types of pin devices; the pin clamp is connected to the wire, and the wire can be bent and deformed, so the pin clamp has a larger range of motion, which can not only conveniently connect the pins of devices with pins distributed in two rows, but also can be used to connect the pins of devices with pins distributed around, and has a wide range of applications.

[0033] The pin connection device provided in the embodiment of the present application is suitable for use in application scenarios where electrostatic discharge testing is performed on electronic devices, and is used to connect the pins of electronic devices so as to perform electrostatic discharge testing on the electronic devices.

[0034] A pin connection device and an electrostatic discharge testing device proposed according to an embodiment of the present application are described below in conjunction with the accompanying drawings.

[0035] refer to Figure 1 As shown, an embodiment of the present application provides a pin connection device, including a pin header board 1, a pin header is arranged on the first surface of the pin header board 1, a wire 2 is connected to the second surface of the pin header board 1, the first end of each pin 3 in the pin header is located in the pin header board 1; the first end of the wire 2 is located in the pin header board 1; in the pin header board 1, the first ends of all the pins are connected to the first ends of all the wires 2 one-to-one, and the second end of each wire 2 is connected to a conductive pin clip 4. For the convenience of display, Figure 1 Only part of the wires, part of the pin clips and part of the pins 3 are shown.

[0036] The pin clamp 4 is suitable for clamping various types of pins of electronic devices, for example, it can clamp long pins and short pins. Compared with the test device in the related art that connects the pins by inserting the pins of the electronic device into the pin socket, which is only suitable for long pins, the pin clamp 4 of the embodiment of the present application can connect not only devices with long pins, but also devices with short pins and other types of pins, and has a wide range of applications, and can better meet the connection test requirements of devices with different types of pins.

[0037] Exemplarily, the first surface and the second surface of the pin header plate 1 may be two opposite surfaces.

[0038] The test device in the related art connects the pins of the electronic device by inserting the pins into the pin socket, and has a small scope of application, and is only applicable to devices with pins distributed in two rows, and is not applicable to devices with pins distributed all around. The pin clamp 4 in the embodiment of the present application is connected to the wire 2, and the wire 2 can be bent and deformed, so the pin clamp 4 has a larger range of motion, which can not only conveniently connect the pins of the device with pins distributed in two rows, but also can be applied to the pins of the device with pins distributed all around, so the pin connection device in the embodiment of the present application has a wider scope of application.

[0039] Exemplarily, the pin clamp 4 and the wire 2 connected to it can be integrally formed of the same flexible conductive material. Since it is made of a flexible conductive material, the pin clamp 4 and the wire 2 connected to it can be bent, deformed and stretched, so that the pin clamp 4 has a large range of motion, which is convenient for clamping the pins of electronic devices. It can not only conveniently connect the pins of devices with two-row pin distribution, but also can be used to connect the pins of devices with pins distributed around. Therefore, the pin connection device of the embodiment of the present application has a wide range of application. Flexible conductive materials include but are not limited to metal-based flexible conductive materials, polymer-based flexible conductive materials, and nano-composite flexible conductive materials.

[0040] For example, reference Figure 2 As shown, the pin clamp 4 includes a clamp body and an insulating layer. The material of the clamp body is a conductive material. The clamp body includes a first clamp plate 41 and a second clamp plate 42. One end of the first clamp plate 41 is rotatably connected to one end of the second clamp plate 42. A clamping opening 43 is formed between two opposite sides of the first clamp plate 41 and the second clamp plate 42. The insulating layer covers the first clamp plate 41 and the second clamp plate 42 except for the two opposite sides. One end of the first clamp plate 41 and one end of the second clamp plate 42, which are rotatably connected together, are both connected to the wire 2. The pin clamp 4 can connect devices with long pins and devices with short pins and other types of pins. It has a wide range of applications and can better meet the connection test requirements of different types of pin devices. The insulating layer protects the clamp body.

[0041] Exemplarily, the pin clip 4 includes but is not limited to a spring clip or other clips that can be used to clamp the pins of electronic components. Taking the pin clip 4 as an example, the spring clip can conveniently clamp the pins, can connect devices with long pins, and can connect devices with short pins and other types of pins. It has a wide range of applications and can better meet the connection test requirements of different types of pin devices.

[0042] The pin header 1 is provided with a plurality of different numbers, which correspond to each pin clip 4 one by one. In each pin clip 4, a number corresponding to the pin clip 4 is provided near the position where the wire 2 connected to the pin clip 4 is connected to the pin header 1. In this way, the number marking of all pins is realized, which is convenient for marking and recording when the pin clip 4 is connected to the pin, and helps to accurately identify the corresponding connection relationship between each pin and the pin clip 4 during testing.

[0043] For example, a number is printed near the connection point between each wire 2 and the pin header 1, and the number uniquely corresponds to the pin clip 4 connected to the wire 2, so that all pins are numbered and marked, which is convenient for marking and recording when the pin clip 4 is connected to the pin. In order to accurately test the electronic device, the number of the pin 3 corresponding to the wire 2 connected to the pin clip 4 is consistent with the number of the socket in the socket board 5.

[0044] The pin header 1 includes but is not limited to a printed circuit board. Exemplarily, the pin header 1 is made of a printed circuit board, and the first end of each pin 3 is located in the printed circuit board; the first end of the wire 2 is located in the printed circuit board; in the printed circuit board, the first ends of all pins 3 are connected one-to-one with the first ends of all wires 2, and a plurality of conductive points can be provided in the printed circuit board so that each pin 3 is connected to the corresponding wire 2 through the corresponding conductive point. The printed circuit board has good shielding effect and good heat dissipation performance, and is suitable for connecting the pins 3 with the corresponding wires 2 in the printed circuit board.

[0045] The arrangement of all the pins 3 of the pin header can be set according to the actual application requirements, and the number of the pins 3 in each column can be set according to the actual application requirements. The English word for the pin in this embodiment is pin. For example, all the pins 3 in the pin header can be arranged in multiple columns, and the number of the pins 3 in each column can range from 8 to 24. This arrangement can meet the pin connection requirements of most devices, and can better meet the size requirements and pin number requirements for the pin header board 1 in actual applications, and help control the manufacturing cost of the pin header board 1.

[0046] For example, all the pins 3 in the pin header can be arranged into two columns, and the number of pins 3 in each column can be 16. This arrangement can meet the pin connection requirements of most devices and can better meet the size requirements and pin quantity requirements for the pin header board 1 in practical applications.

[0047] The spacing range between two adjacent pins 3 in each column can be set according to the actual application needs. If the spacing between two adjacent pins 3 in each column is set too large, the size of the pin header board 1 and the pin header matching the pin header board 1 will be too large, and the space will be larger; if the spacing between two adjacent pins 3 in each column is set too small, conductive interference may occur between adjacent pins 3. Therefore, the spacing range between two adjacent pins 3 in each column is set according to the actual application needs. Exemplarily, the spacing range between two adjacent pins 3 in each column can be 2.4mm-2.60mm, which can meet the pin connection requirements of most devices, and can better meet the size requirements of the pin header board 1 and the spacing requirements of the pins 3 in actual applications, and help control the manufacturing cost of the pin header board 1. For example, the spacing r between two adjacent pins 3 in each column can be set to 2.54mm, which can meet the pin connection requirements of most devices, and can better meet the size requirements of the pin header board 1 and the spacing requirements of the pins 3 in actual applications, and help control the manufacturing cost of the pin header board 1.

[0048] The spacing range between any two adjacent columns of the aforementioned multiple columns of pins 3 can be set according to actual application requirements. For example, the spacing range between any two adjacent columns of the multiple columns can be 11.0mm-12mm. This spacing range can meet the pin connection requirements of most devices, and can better meet the size requirements of the pin header 1 and the spacing requirements of two adjacent columns of pins 3 in actual applications, and help control the manufacturing cost of the pin header 1.

[0049] For example, the spacing w between any two adjacent columns can be set to 11.5 mm. This spacing can meet the pin connection requirements of most devices, and can better meet the size requirements of the pin header board 1 and the spacing requirements of two adjacent columns of pins 3 in practical applications, and is helpful to control the manufacturing cost of the pin header board 1.

[0050] refer to Figure 3 As shown, another embodiment of the present application provides an electrostatic discharge testing device, including a socket board 5 and a pin connecting device of any embodiment of the present application; a female header is provided on the socket board 5, and the arrangement of the sockets on the female header is the same as the arrangement of the pins on the pin connecting device.

[0051] Exemplarily, the electrostatic discharge testing device may include a socket board 5 and one or more pin connecting devices, each pin connecting device corresponding to a female header on the socket board 5, the arrangement of the socket holes on the female header is the same as the arrangement of the pin headers on the corresponding pin connecting device, and the pin headers of the pin connecting device can be inserted into the sockets of the female header corresponding to the pin header. Figure 3 The socket board 5 and two pin connection devices are shown in the figure. For the convenience of display, Figure 3Only part of the wires, part of the pin clips and part of the pins 3 in the pin connection device are shown. The electronic device 6 is an electronic device with two rows of pins, and has a plurality of pins 61. Each pin 61 on the first side of the electronic device 6 is connected to a pin clip 4 in one pin connection device, and each pin 61 on the second side of the electronic device 6 is connected to a pin clip 4 in another pin connection device.

[0052] The electrostatic discharge test device of the embodiment of the present application, the pin clamp 4 of the pin connection device is suitable for clamping various types of pins such as long pins and short pins of electronic devices, has a wide range of applications, and can better meet the connection test requirements of different types of pin devices; the pin clamp 4 is connected to the wire 2, and the wire 2 can be bent and deformed, so the pin clamp 4 has a larger range of motion, which can not only conveniently connect the pins of devices with pins distributed in two rows, but also can be used to connect the pins of devices distributed around the pins, so the electrostatic discharge test device has a wide range of applications.

[0053] When an electrostatic discharge test is performed on an electronic device using the electrostatic discharge test device of the embodiment of the present application, the pin header plate 1 is installed on the socket plate 5, the pins on the pin header plate 1 are inserted into the corresponding female headers, and the pin clips 4 are used to connect one by one with the pins of the electronic device under test, and the numbers of the pin clips 4 corresponding to the pin numbers of the electronic device are recorded. According to the test needs of the electronic device, the voltage range from low to high and the pin test sequence are set, and the anti-static discharge level of the electronic device under test is determined by detecting the leakage current.

[0054] The above description of various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced to each other, and for the sake of brevity, they will not be repeated herein.

[0055] In a specific example, the pin connection device includes a pin header board 1, a pin header is arranged on the first surface of the pin header board 1, a wire 2 is connected to the second surface of the pin header board 1, the first end of each pin 3 in the pin header is located in the pin header board 1; the first end of the wire 2 is located in the pin header board 1; in the pin header board 1, the first ends of all the pins are connected one-to-one with the first ends of all the wires 2, and the second end of each wire 2 is connected to a conductive pin clip 4.

[0056] The pin clamp 4 is suitable for clamping various types of pins of electronic devices, for example, it can clamp long pins and short pins. The pin clamp 4 of this example can connect devices with long pins and devices with short pins. It has a wide range of applications and can better meet the connection test requirements of devices with different types of pins. The pin clamp 4 in this example is connected to a wire 2, which can be bent and deformed. Therefore, the pin clamp 4 has a larger range of motion, which can not only conveniently connect the pins of devices with two-row pin distribution, but also can be used to connect the pins of devices with pins distributed around. Therefore, the pin connection device of the embodiment of the present application has a wide range of application.

[0057] The pin clamp 4 and the wire 2 connected to it can be integrally formed from the same flexible conductive material. Since it is made of flexible conductive material, the pin clamp 4 and the wire 2 connected to it can be bent, deformed and stretched, so that the pin clamp 4 has a larger range of motion. The flexible pin clamp 4 is convenient for clamping the pins of electronic devices. It can not only conveniently connect the pins of devices with two-row pin distribution, but also be used to connect the pins of devices with pins distributed around. It can connect devices with long pins and devices with short pins and other types of pins. It has a wide range of applications and can better meet the connection test requirements of different types of pin devices. Therefore, the pin connection device of the embodiment of the present application has a wide range of applications.

[0058] The pin clip 4 includes a clip body and an insulating layer. The clip body is made of a conductive material. The clip body includes a first clamping plate 41 and a second clamping plate 42. One end of the first clamping plate 41 is rotatably connected to one end of the second clamping plate 42. A clamping opening 43 is formed between two opposite sides of the first clamping plate 41 and the second clamping plate 42. The insulating layer covers the first clamping plate 41 and the second clamping plate 42 except for the two opposite sides. The insulating layer protects the clip body.

[0059] The pin header 1 is provided with multiple different numbers, which correspond to each pin clip 4 one by one. In each pin clip 4, a number is printed near the connection point between each wire 2 and the pin header 1, and the number uniquely corresponds to the pin clip 4 connected to the wire 2, so that all pins are numbered and marked, which is convenient for marking and recording when the pin clip 4 is connected to the pin. In order to accurately test the electronic device, the number of the pin 3 corresponding to the wire 2 connected to the pin clip 4 is consistent with the number of the socket in the socket board 5.

[0060] The pin header 1 in this example is made of a printed circuit board (PCB), and the first end of each pin 3 is located in the printed circuit board; the first end of the wire 2 is located in the printed circuit board; in the printed circuit board, the first ends of all pins 3 are connected one-to-one with the first ends of all wires 2, and multiple conductive points can be set in the printed circuit board so that each pin 3 is connected to the corresponding wire 2 through the corresponding conductive point. The printed circuit board has good shielding effect and good heat dissipation performance, and is suitable for connecting the pins 3 with the corresponding wires 2 in the printed circuit board.

[0061] In this example, all the pins 3 in the pin header are arranged in two columns, and the number of pins 3 in each column can range from 16, with a total of 32 pins 3. This arrangement can meet the pin connection requirements of most devices, and can better meet the size requirements and pin quantity requirements for the pin header board 1 in practical applications.

[0062] The spacing between two adjacent pins 3 in each column is set to 2.54 mm, which can meet the pin connection requirements of most devices, and can better meet the size requirements of the pin header board 1 and the spacing requirements of the pins 3 in practical applications, and help control the manufacturing cost of the pin header board 1.

[0063] The spacing between any two adjacent columns is set to 11.5 mm, which can meet the pin connection requirements of most devices, and can better meet the requirements for the size of the pin header 1 and the spacing between two adjacent columns of pins 3 in practical applications, and helps to control the manufacturing cost of the pin header 1.

[0064] An electrostatic discharge test device includes a socket board 5 and two pin connection devices of this example; a female header is provided on the socket board 5, and the arrangement of the socket holes on the female header is the same as the arrangement of the pin headers on the pin connection devices. Each pin connection device matches a female header on the socket board 5, and the arrangement of the socket holes on the female header is the same as the arrangement of the pin headers on the corresponding pin connection device, and the pin headers of the pin connection device can be inserted into the sockets of the female header corresponding to the pin header.

[0065] In the related art, the test device realizes the connection of the pins by inserting the pins of the electronic device into the pin socket, which is only applicable to electronic devices with long pins and two-row pin distribution, and is not applicable to electronic devices with short pins and pins distributed around. In this example, the pin clamp 4 and the wire 2 connected to it are made of the same flexible conductive material as one piece. Due to the soft characteristics of its structure, the position of the pin clamp 4 can be easily changed, so that the pin clamp 4 can adapt to the size of various pin distribution types. In addition, the pin clamp 4 can clamp small pins, so the pin clamp 4 of this example is suitable for clamping electronic devices with long pins and short pins, improving the flexibility of electrostatic discharge testing and reducing testing costs. During the electrostatic discharge test, all pin clamps 4 of the electronic device can be clamped at one time, and the corresponding numbers of the pins and the pin clamps 4 can be recorded, and then the electrostatic discharge test of the electronic device can be performed, which can realize the electrostatic discharge test of each group of pins of the multi-pin device at one time, greatly improving the test efficiency and reducing the test cost.

[0066] The above description of various embodiments tends to emphasize the differences between the various embodiments. The same or similar aspects can be referenced to each other, and for the sake of brevity, they will not be repeated herein.

[0067] It should be noted that the above embodiments only express the implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A pin connection device, characterized in that: It comprises a pin header board, a pin header is arranged on the first surface of the pin header board, a wire is connected to the second surface of the pin header board, the first end of each pin in the pin header is located in the pin header board; the first end of the wire is located in the pin header board; in the pin header board, the first ends of all the pins are connected one-to-one with the first ends of all the wires, and the second end of each wire is connected to a conductive pin clip.

2. The pin connection device according to claim 1, characterized in that: The pin clip and the wire connected to it are integrally formed of the same flexible conductive material.

3. The pin connection device according to claim 1, characterized in that: The pin clip includes a clip body and an insulating layer. The material of the clip body is a conductive material. The clip body includes a first clamping plate and a second clamping plate. One end of the first clamping plate is rotatably connected to one end of the second clamping plate. A clamping opening is formed between two opposite side surfaces of the first clamping plate and the second clamping plate. The insulating layer covers the first clamping plate and the second clamping plate except for the two opposite side surfaces.

4. The pin connection device according to any one of claims 1 to 3, characterized in that: The pin header plate is provided with a plurality of different numbers, and the plurality of numbers correspond to the pin clips one by one. In each of the pin clips, a number corresponding to the pin clip is provided near the position where the wire connected to the pin clip is connected to the pin header plate.

5. The pin connection device according to any one of claims 1 to 3, characterized in that: The pin header board includes a printed circuit board.

6. The pin connection device according to any one of claims 1 to 3, characterized in that: All the pin headers in the pin header are arranged in multiple rows, and the number of pins in each row ranges from 8 to 24.

7. The pin connection device according to claim 6, characterized in that: The distance between two adjacent pins in each column ranges from 2.4 mm to 2.60 mm.

8. The pin connection device according to claim 6, characterized in that: The distance between two adjacent pins in each column is 2.54 mm.

9. The pin connection device according to claim 6, characterized in that: The spacing between any two adjacent columns in the plurality of columns ranges from 11.0 mm to 12 mm.

10. The pin connection device according to claim 9, characterized in that: The spacing between the two columns is 11.5 mm.

11. An electrostatic discharge testing device, characterized in that: It comprises a socket board and a pin connection device as described in any one of claims 1 to 10; a female header is arranged on the socket board, and the arrangement of the sockets on the female header is the same as the arrangement of the pins on the pin connection device.

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